CN101851777A - Electrolysis device for removing excessive metals on substrate surface and method for removing excessive metals by utilizing same - Google Patents
Electrolysis device for removing excessive metals on substrate surface and method for removing excessive metals by utilizing same Download PDFInfo
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- CN101851777A CN101851777A CN200910133259A CN200910133259A CN101851777A CN 101851777 A CN101851777 A CN 101851777A CN 200910133259 A CN200910133259 A CN 200910133259A CN 200910133259 A CN200910133259 A CN 200910133259A CN 101851777 A CN101851777 A CN 101851777A
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Abstract
The invention relates to an electrolysis device for removing excessive metals on a substrate surface, which comprises an electrolysis bath, electrolyte, a transportation system, an anode roller, a cathode roller and at least one shielding plate, wherein the transportation system is arranged at the electrolysis bath to convey a substrate to move to a downstream end from an upstream end of the transportation system, and the substrate is immersed into the electrolyte; the anode roller is correspondingly arranged at the electrolysis bath and is positioned at the upstream end of the transportation system; the cathode roller is positioned above the transportation system and is arranged at the downstream position opposite to that of the anode roller, and the bottom part of the cathode roller is immersed into the electrolyte; and the at least one shielding plate is positioned at the downstream position of the cathode roller and shields the downstream end of the transportation system. When the electrolysis device is utilized to remove the excessive metals, the anode roller contacts one surface of the substrate, and a distance is reserved between the cathode roller and the substrate surface. When the substrate surface contacting the anode roller is moved to the downstream end of the transportation system, an electric field can generate between the substrate surface and the cathode roller before the substrate surface is moved to the shielding plate so as to perform electrolysis.
Description
Technical field
The invention relates to a kind ofly to remove the electrolyzer of excessive metals on substrate surface and use this device removing the method for excess metal, and particularly can remove the electrolyzer of excessive metals on substrate surface continuous and contactlessly and remove method relevant for a kind of.
Background technology
Along with global Personal Computer, consumption electronic products and communication product constantly require compactly more will possess under the dynamical trend, electronic chip is required that not only characteristic electron will be got well, function wants many, overall volume is also little.Along with the maturation of chip-scale encapsulation (CSP) technology, (System in Package SiP) becomes the main flow of encapsulation technology to system in package already at present.System in package can be carried out chip, passive component or other module of difference in functionality the structure dress, so that electronic product possesses more function.System in package has also comprised the multi-chip module encapsulation of different technologies such as flush type or for saving area the 3D storehouse that difference in functionality chip stack (Stack) gets up has been encapsulated or the like, all belonged to the development category of system in package (SiP) technology.In addition, dwindling under the product trend of overall volume, long-pending body line pitch is more and more littler, want on substrate, to arrange expeditiously that cabling also becomes more and more difficult, therefore with bury in passive component or the line design to the substrate design in response to and give birth to, this kind has the support plate of electrical functionality, is called conformability substrate (Integrated Substrate) or functional base plate (Functional Substrate).
Though be to use conventional substrate (as printed circuit board (PCB)) or in be embedded with the electronic product of the embedded line substrate of passive component and/or line design, in a succession of step of making the product process, removes unnecessary electro-conductive material so that electro-conductive material attenuate or planarization belong to common and one of steps necessary.The mode of the unnecessary electro-conductive material of several removals of widespread use at present, for example mechanical type grinding (mechanical grinding), chemical liquids etch, cmp (chemical mechanical polishing, CMP) or mode such as contact electrolysis.Yet these existing operating method respectively have its shortcoming.
Below explain with the traditional technology of two kinds of planarization modes of a kind of application, its step comprises: first application machine formula grinding method carries out the attenuate of unnecessary electro-conductive material, applied chemistry liquid etch mode etching residual metallic part again is to reach planarization.
Please refer to Fig. 1～3B.Fig. 1 illustrates tradition and utilizes the mechanical type grinding to cross the synoptic diagram of thick metal layers.Fig. 2 A～2D illustrates among Fig. 1 metal level through repeatedly grinding the synoptic diagram of attenuate step.Shown in Fig. 1 and 2 A～2D, dielectric layer pattern 120 on the substrate 110 (as printing board PCB) is covered by thick metal level 130, utilize 140 pairs of metal level 130 surperficial high speed rotating of an emery wheel (grinding wheel), to carry out repeatedly the grinding of the small degree of depth.Wherein represent the not homogeneous abrasion site of emery wheel 140 on metal level 130 surfaces respectively along Fig. 1 center line 2A～2D, the layer on surface of metal after the grinding is shown in 130a～130d of Fig. 2 A～2D respectively accordingly.After the mechanical type grinding, the convex-concave surface of script shown in Fig. 1,2A, 2B, though in Fig. 2 C, presented smooth, but for making easier the carrying out of subsequent planarization technology (as chemical milling), continue abrasive metal laminar surface 130c and make its thickness attenuate again, and present the layer on surface of metal 130d shown in Fig. 2 D.Afterwards, to soak through Fig. 2 D assembly of mechanical type grinding and place the groove device that contains chemical etching liquor 150, as shown in Figure 3A, utilize chemical liquids etch mode etching excess metal layer, at last shown in Fig. 3 B, reach planarization through the metal level after the chemical milling, i.e. layer on surface of metal 130d and dielectric layer pattern 120 flush.
Yet, carry out the mechanical type grinding may produce when removing unnecessary electro-conductive material grind residue, to produce stress unequal and concentrate the somewhere to make the assembly distortion or fray even produce problem such as slight crack.And utilize the uniformity coefficient (uniformity) of its planarization of chemical liquids etch mode limited, and be difficult to control etching end point and can't optionally carry out regional etching.
As for cmp (CMP) then is to combine mechanical type grinding and two kinds of characteristics of chemical liquids etch, its practice mainly is with on to be processed the elastic insert (grinding pad) that is pressed in rotation, utilize the polishing technology of relative movement processing, to have corrosive working fluid supplies on to be processed, when workpiece carries out corrosion processing (chemical), supply with ultra micro abrasive particle (diameter 100 nanometers are following) polishing (mechanicalness) material simultaneously, protuberance to machined part carries out optionally grinding operation, so claim cmp.Therefore, the shortcoming that cmp occurs combines the problem of aforementioned dual mode, comprise generation particulate (Particle), grinding residue, grind shortcomings such as slurry (slurry) residue, fray (scratch), slight crack (crack), indenture (recess), etch (erosion), cavity (void) and technology instability, all can influence the assembly yield.
Summary of the invention
The present invention removes the electrolyzer of excessive metals on substrate surface and uses this device to remove the method for excess metal relevant for a kind of, utilize continuous but contactless electrolyzer to carry out electrolytic reaction, excess metal is removed serially, and substrate can not produce distortion, and metal can be by over etching yet.
According to the present invention, a kind of electrolyzer that removes excessive metals on substrate surface is proposed, comprising: an electrolyzer (electrolysis bath) comprises an electrolytic solution; One delivery system (transportation system) is arranged at the electrolyzer place, moves toward a downstream end from a upstream extremity of delivery system in order to transmit a substrate, and wherein substrate is immersed in this electrolytic solution; One anode roller (anode roller), correspondence is arranged at the electrolyzer place, and the anode roller is positioned at the upstream extremity of delivery system; One negative electrode roller (cathode roller) is positioned at delivery system top and is arranged at the downstream part of phase antianode roller, and the base section of negative electrode roller impregnated in the electrolytic solution; At least one masking shield (shielding plate) is positioned at the downstream of negative electrode roller and covers the downstream end of delivery system.When carrying out electrolysis, the anode roller contacts with a surface of substrate, and the negative electrode roller then is a distance with substrate surface.Wherein, with substrate surface after the anode roller contacts toward the downstream end of delivery system the time, before moving to masking shield can and the negative electrode roller between produce an electric field, to carry out electrolysis.
According to the present invention, reintroduce a kind of electrochemical apparatus that removes excessive metals on substrate surface, comprise two groups of continous way electrolyzers at least.Every group of continous way electrolyzer comprises: an electrolyzer that comprises an electrolytic solution; Be arranged at a delivery system at electrolyzer place, move toward downstream end from the upstream extremity of delivery system in order to transmit a substrate, wherein substrate soaks and places electrolytic solution; One anode roller is arranged at delivery system top and part and soaks and place in the electrolyzer, and the anode roller is positioned at the upstream extremity of delivery system; One negative electrode roller is positioned at delivery system top and is arranged at the downstream part of phase antianode roller, and the base section of negative electrode roller impregnated in the electrolytic solution; With at least one masking shield, be positioned at the downstream of negative electrode roller and cover the downstream end of carrying system.When carrying out electrolysis, the anode roller contacts with substrate surface, and the negative electrode roller then is a distance with substrate surface.Wherein, two groups of continous way electrolyzers independently are provided with, and substrate moves to another group electrolyzer again and carries out re-electrolysis behind the once electrolytic in one group of electrolyzer.
According to the present invention, a kind of method that removes excessive metals on substrate surface is proposed, comprise step:
One electrolyzer is provided, comprises:
One electrolyzer comprises an electrolytic solution;
One delivery system is arranged at the electrolyzer place and has a upstream extremity and a downstream end;
One anode roller is arranged at delivery system top and part and soaks and place in the electrolyzer, and the anode roller is positioned at the upstream extremity of delivery system;
One negative electrode roller is positioned at delivery system top and is arranged at the downstream part of phase antianode roller, and the base section of negative electrode roller impregnated in the electrolytic solution; With
At least one masking shield is positioned at the downstream of negative electrode roller and covers the downstream end of delivery system;
Put a substrate in the delivery system place, and substrate is immersed in the electrolytic solution;
This substrate is moved toward downstream end from the upstream extremity of delivery system; With
Make the anode roller contact making it be anode electrical with the surface of substrate, and be positioned at the negative electrode roller at anode roller rear and the surface of substrate is a distance, negative electrode roller and be between the electrical substrate surface of anode and form an electric field is to remove the excess metal electrolysis on the substrate surface.
For foregoing of the present invention can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. are described in detail below:
Description of drawings
Fig. 1 illustrates tradition and utilizes the mechanical type grinding to cross the synoptic diagram of thick metal layers.
Fig. 2 A～2D illustrates among Fig. 1 metal level through repeatedly grinding the synoptic diagram of attenuate step.
Fig. 3 A illustrates the synoptic diagram that utilizes chemical liquids etch mode etching excess metal layer.
Fig. 3 B illustrates the synoptic diagram that metal level after the chemical milling of Fig. 3 A reaches planarization
Fig. 4 illustrates the synoptic diagram according to the electrolyzer of first embodiment of the invention.
Fig. 5 is the local enlarged diagram of anode roller, negative electrode roller and the substrate of Fig. 4.
Fig. 6 illustrates the synoptic diagram according to the electrochemical apparatus of second embodiment of the invention, and wherein electrochemical apparatus comprises two groups of electrolyzers.
The primary clustering nomenclature:
110: substrate
120: dielectric layer pattern
130: metal level
130a～130d: layer on surface of metal
140: emery wheel
150: chemical etching liquor
20: the continous way electrolyzer
21: electrolyzer
210: electrolytic solution
22: delivery system
221: back up pad
224: conveying roller
23: the anode roller
24: the negative electrode roller
241: the bearing of negative electrode roller
25,251a～251e, 252a～252e: masking shield
26: cleaning system
261: the first nozzles
263: scraper
265a, 265b: second nozzle
27: tray
30: substrate
31: central layer
32: thick resin layer
321: groove
34: the excessive conducting metal of substrate surface
R: substrate travel direction
D2: the horizontal throw between anode roller and the negative electrode roller
A: the zone of effective electric field scope
N1, n2: electrolytic reaction stop area
Embodiment
The present invention proposes a kind of electrolyzer that removes excessive metals on substrate surface, and use this device to remove the method for excess metal, mainly utilize continuous but contactless electrolytic reaction, excess metal is removed serially, substrate can stress be concentrated and is produced distortion, and also can the over etching metal in the electrolytic process, the may command etching end point, therefore the substrate of using the inventive method still keeps good surface appearance with electrical after removing metal, can not influence the assembly yield.Moreover, continous way electrolyzer proposed by the invention, can be widely used in the substrate of various size and different aspects, comprise various substrates such as large and small, thick, thin, and the electrolysis speed in the electrolyzer also can be done suitably to set and adjust according to the metal thickness that desire is removed, to reach maximum electrolytic efficiency, ten minutes elasticity.
The following embodiment that proposes according to the present invention of the present inventionly removes the electrolyzer of excessive metals on substrate surface and uses this device to remove the method for excess metal to describe in detail.Yet the apparatus and method that proposed among the embodiment are the usefulness for illustrating only, is not the usefulness as limit protection domain of the present invention.Moreover the icon of embodiment only illustrates the associated component of the technology of the present invention, omits unnecessary assembly, with clear demonstration technical characterstic of the present invention.In addition, the present invention is applicable to the substrate of various aspects and remove different kinds of metals, for example removes the excess metal copper on an embedded line substrate surface.
First embodiment
Please refer to Fig. 4, it illustrates the synoptic diagram according to the electrolyzer of first embodiment of the invention.The present invention mainly provides at least as shown in Figure 4 a continous way electrolyzer 20 in order to the method that removes excessive metals on substrate surface, after making pending substrate in the electrolyzer 20 of particular design, carry continuously and carrying out electrolytic reaction, can reach the purpose that removes surperficial excess metal.Moreover, in first embodiment, use single group of electrolyzer to carry out electrolytic reaction.
According to the first embodiment of the present invention, horizontally disposed continous way electrolyzer 20 comprises that mainly one is filled with electrolyzer (electrolysis bath) 21, one delivery system (transportation system) 22, one anode roller (anode roller) 23, one negative electrode roller 24 and at least one masking shield (shielding plate) 25 of electrolytic solution 210.
As shown in Figure 4, delivery system 22 is arranged at the electrolyzer place, for example soak and be located in the electrolytic solution 210, move toward a downstream end (as the right-hand member among the figure) from a upstream extremity (as the left end among the figure) of this delivery system 22 in order to transmit a substrate 30, travel direction is shown in arrow R among the figure.The member of delivery system 22 and numerous species is arranged explains with common continuous mode of movement in this embodiment, for example comprises: in order to a back up pad (supporting plate) 221 of carrying a pending substrate 30; One group of guide rail (guiding rail) (not shown) that corresponding back up pad 221 both sides are provided with; With many groups of spaced conveying rollers (guiding rollers) 224.Conveying roller 224 correspondences are arranged at back up pad 221 belows, and back up pad 221 can be moved and horizontal transmission substrate 30 continuously along guide rail.Wherein, the substrate 30 that is positioned on the back up pad 221 is immersed in the electrolytic solution.Yet the detailed member of delivery system 22 is not limited to the explanation of this embodiment with design, carries out following illustrated reaction as long as can make substrate 30 can carry continuously in electrolyzer 20 and cooperate, and promptly can be applicable to the present invention.
In addition, because when carrying out electrolysis, anode roller 23 contacts with substrate 30, but the negative electrode roller keeps a distance (promptly not contact with substrate 30 with substrate 30 surfaces, follow-uply have a detailed description), therefore in electrolyzer 20, anode roller 23 arrives the vertical range of back up pad 221 less than negative electrode roller 24 to the vertical range of back up pad 221.Decide on different application conditions as for the real standard distance D 2 between anode roller 23 and the negative electrode roller 24, for example can be adjusted to an optimum value, to reach its predetermined effect according to voltage that imposes on electrolyzer 20 and the big young pathbreaker's horizontal throw of total current D2.
Please be simultaneously with reference to Fig. 4 and Fig. 5.Fig. 5 is the local enlarged diagram of anode roller, negative electrode roller and the substrate of Fig. 4.When carrying out electrolysis, make the substrate 30 that is soaked in the electrolytic solution 210 under the transmission of delivery system 22, move continuously toward downstream end from upstream extremity, and anode roller 23 contacts with the pending surface (promptly having metal to be removed) of substrate 30, it is electrical to make the metal of substrate surface be anode.At least a portion impregnated in the electrolytic solution 210 negative electrode roller 24 then with the pending surface of substrate 30 at a distance of a distance D 1 (both do not contact).When moving near the below of negative electrode roller 24, electrical substrate 30 surfaces of tool anode locate, then can and negative electrode roller 24 between form an electric field (shown in the dotted line arrow), so that substrate 30 lip-deep excess metal 34 dissolvings are removed, and reduce deposition (claims back-electrolysis again on the surface of negative electrode roller 24, de-plating), reach the purpose that removes excessive metals on substrate surface.
In Fig. 5, the substrate aspect when illustrating as embodiment with an embedded line substrate.When making embedded line substrate, for example be that thick resin layer 32 places on central layer 31 define groove 321, and cover conducting metal 34 in thick resin layer 32 tops to fill up groove, the metal in groove 321 then constitutes the line pattern of substrate.Therefore, the application embodiments of the invention can be rapidly and are not damaged under the situation of circuit and substrate in making processes, successfully remove the excessive conducting metal of substrate surface 34, make metal and resin layer 32 surfaces in the groove can be positioned at same plane, as the board structure (having removed excessive metals on substrate surface) shown in right-hand among Fig. 5, and form an embedded line substrate of surfacing and thin thickness.Certainly, the present invention can be applicable to the substrate of various aspects, comprise as shown in the figure embedded line substrate 30 or the substrate of other aspect, the substrate that is not specially limited which kind of structure just can be used the present invention to remove excessive metals on substrate surface.
In addition, when carrying out electrolysis, negative electrode roller 24 is inversely proportional to back-electrolysis speed with substrate 30 surfaces distance D 1 apart, and promptly distance D 1 is more little, and back-electrolysis speed is fast more.Certainly, the current density I of feeding is big more, and back-electrolysis speed is fast more.In addition, the back-electrolysis speed that the translational speed V of substrate 30 in delivery system can be required according to practical application (want remove metal thickness) calculates a preferred values.Therefore, multiple parameters such as distance D 1, current density I and translational speed V are not limited to certain value at this, and application is required suitably to be set but look.
Moreover, reduce deposition is at the negative electrode place owing to past negative electrode roller 24 directions of meeting after the substrate 30 lip-deep excess metals dissolvings move, when therefore negative electrode roller 24 being set, make its bearing 241 preferably be higher than the liquid level of electrolytic solution 210, do not contact with electrolytic solution 210 liquid levels, at bearing 241 places caking and block bearing, influence the rotation of negative electrode roller 24 with the metallic crystal after avoiding reducing.
In addition, electrolyzer 20 of the present invention more comprises at least one masking shield 25, to cover the downstream end of this delivery system 22.Ask for an interview Fig. 5, this masking shield 25 is an insulation material, and it is provided with the position can hide the substrate 30 that has moved by negative electrode roller 24 belows and past delivery system 22 downstream end.As shown in Figure 5, with be the electrical substrate of anode 30 surface metals 34 after anode roller 23 contacts when the downstream end toward delivery system 22 moves, the regional A of this section before moving to masking shield 25 can and negative electrode roller 24 between produce an electric field, so that the substrate 30 too much metal part electrolysis in surface are removed.When substrate 30 enters masking shield 25 belows by regional A, then be the insulating effect that the electrical substrate of anode 30 surfaces are subjected to masking shield, slight electrolytic effect is only arranged, along with electrolysis more and more far and gradually can't be carried out from negative electrode roller 24 in substrate 30 surfaces, as the n1 and the n2 location of arrow indication among Fig. 5, electrolytic reaction can stop automatically.Therefore, masking shield 25 can avoid the metal part on substrate 30 surfaces by the overelectrolysis etching.
In an embodiment, as shown in Figure 4, continous way electrolyzer 20 is equiped with polylith masking shield (shielding plates) 25,251a～251e, 252a～252e, and the upper and lower sides and the compartment of terrain that lay respectively at back up pad 221 are arranged between the conveying roller 224.Wherein, those masking shields one of them (being masking shield 251c) also can preferably be arranged between anode roller 23 and the negative electrode roller 24, and the effective electric field scope that is produced between electrical substrate 30 surfaces of anode this moment and the negative electrode roller 24 is regional A shown in Figure 5.Moreover, masking shield 25,251d, 251e with respect to substrate 30 tops among Fig. 4 have the bridging effect of avoiding substrate 30 surface metal over etchings as above-mentioned, masking shield 252a～252e with respect to substrate 30 belows then can adopt identical or different material with substrate top masking shield 25,251a～251e, and the present invention is not specially limited.
In an embodiment, electrolyzer disposes a rectifier (rectifier) (electrically connecting with anode roller 23, negative electrode roller 24 respectively), and can preferably monitor and control its electrolytic reaction via a microprocessor (not shown), so that being provided, suitable current density carries out electrolysis, remove excess metal equably, and do not have the anxiety of excessively removing metal.Wherein, the metal thickness that can remove according to the contact area of substrate, concentration of electrolyte and desire of current density ... or the like multiple parameters calculate a numerical value, to reach maximum electrolytic efficiency.
In addition, the electrolyzer 20 of first embodiment of the invention preferably is provided with a cleaning system 26 (cleaningsystem) in adjacent cathodes roller 24 places, to clean and to remove the metal refining attached to negative electrode roller 24 surfaces.In this embodiment, cleaning system 26 comprises one first nozzle 261, a scraper 263 and one second nozzle 265a and 265b at least.First nozzle 261 is arranged at the side that negative electrode roller 24 produces electrolyzer 21, but surface sprinkling one scavenging solution of anticathode roller 24.It is other that scraper (squeeze knife) 263 is arranged at first nozzle 261, and scraper 263 front ends can be pressed the surface of touching negative electrode roller 24.Second nozzle then is arranged at the side that this negative electrode roller 24 changes this electrolyzer 21 over to, but surface sprinkling one micro-etching solution of anticathode roller 24.(negative electrode roller 24 is rotation counterclockwise) as shown in Figure 4, when negative electrode roller 24 produces from electrolytic solution, scraper 263 can strike off the metal deposit at this place, roller 24 surface earlier, then negative electrode roller 24 is rotated further, its surperficial should processing and after with resistates etching totally, enter electrolyzer 21 again and impregnated in the electrolytic solution 210 through the micro-etching solution of the second nozzle 265a and 265b ejection again in the place.Wherein, the scavenging solution of first nozzle, 261 ejections for example is a deionized water, and the micro-etching solution of the second nozzle 265a and 265b ejection for example is to comprise that dilute sulphuric acid (dilute sulfuric acid) and one of hydrogen peroxide (hydrogenperoxide) mix liquid.Therefore; when the unnecessary metal in substrate 30 surfaces is removed continuously; cleaning system 26 is also constantly removed negative electrode roller 24 surfaces and is gone up sedimentary metal; and do not need to carry out the cleaning and the maintenance of device with regard to shutting down especially after for some time the time saving and energy saving running cost that yet reduces as traditional electrolysis procedure.
Moreover, electrolyzer 20 more preferably comprises a for example tray 27 of a recovery system, being adjacent to cleaning system 26 is provided with, to collect the metal deposit that strikes off from these negative electrode roller 24 surfaces (as copper ashes, copper debris), and the settling that reclaims carried out aftertreatment or utilize again, in order to avoid produce pollutent and waste resource.
Second embodiment
According to the present invention, also can use the electrolyzer of many groups shown in first embodiment to reach the purpose that removes excessive metals on substrate surface.Fig. 6 illustrates the synoptic diagram according to the electrochemical apparatus of second embodiment of the invention, and wherein electrochemical apparatus comprises two groups of electrolyzers.Wherein, the thin portion member of every group of electrolyzer please refer to first embodiment, no longer repeats to give unnecessary details at this.
Second embodiment mainly provides at least two group continous way electrolyzers 20, after pending substrate is carried in first group of electrolyzer continuously and being carried out electrolytic reaction, enter again in second group of electrolyzer and make continuous electrolysis, to reach the purpose that removes surperficial excess metal.Wherein, two groups of continous way electrolyzers independently operate, and as each self-configuring rectifier (rectifier), respectively organize the situation of electrolyzer with independent control.Moreover required according to practical situations, two groups of electrolyzers can be adjusted to has identical or different electrolysis speed, to remove the excess metal of substrate surface.For example make two groups of continous way electrolyzers have different concentration of electrolytes or relevant electrolytic parameter, make two groups of electrolyzers have different electrolysis speed.Yet as long as can reach the purpose of removing excess metal fully, the present invention is not specially limited the electrolysis speed and the related setting thereof of multiple stack electrolyser in the electrochemical apparatus.
In addition, the employed electrolytic solution of above-mentioned first and second embodiment of the present invention can comprise metal ion (metal ion), sulfuric acid (sulfuric acid), phosphoric acid salt (phosphate), pH-value buffer reagent (pH buffer) and organic inhibitor (organic leveler).When substrate surface has excess metal copper when to be removed, the metal ion of electrolytic solution is cupric ion (copper ion).Wherein, phosphoric acid salt can be protected the product conductive pattern, avoids excessive back-electrolysis metal and causes the etching of conductive pattern; Organic inhibitor then is to utilize organic substance to improve the electric field distribution of metallic surface, makes the back-electrolysis effect between negative electrode roller and the positive metallic surface more even.But use when of the present invention, the actual composition of electrolytic solution is not limited to above-mentioned substance, and it is required and do the suitable selection and the allotment of composition to look applicable cases.Moreover electrolytic solution also can replenish or adjust component proportions according to the electrolytic reaction situation.
Compare tradition and remove the mode of excessive metals on substrate surface and electrolyzer and the method that the foregoing description is proposed, the present invention has multiple advantages, for example:
(1) negative electrode roller and substrate surface are kept a distance (contactless electrolysis), directly impose a stress when not having tradition to use the mechanical type grinding and cause problems such as unbalanced stress and base plate deformation in substrate, therefore the substrate of using the inventive method still keeps good surface appearance with electrical after removing metal, can not influence the assembly yield;
(2) contactless electrolytic reaction of the present invention betides the substrate top, transmission system is arranged at the substrate below, see through the transmission system that embodiment proposed, the substrate that can allow a thinner thickness stably transmits in electrolyzer of the present invention and carries out excess metal and remove reaction, does not damage or cause the anxiety of curved substrate distortion even fragmentation.
(3) negative electrode roller and substrate surface are kept a distance (contactless electrolysis), can stably supply with a current density and get final product;
(4) electrolyzer of the horizontal operate continuously that proposes of the present invention can flexibly be applied in the substrate of various size, and each parameter of the delivery system in the electrolyzer (as board transport speed) also can be done suitably to adjust according to the metal thickness that desire is removed, very elasticity.
(5) electrolyzer that disposes rectifier can carry out electrolysis so that suitable current density to be provided via a microprocessor monitors and its electrolytic reaction of control, removes excess metal equably, and does not have the anxiety of excessively removing metal; Wherein current density can calculate a numerical value according to multiple parameters such as the contact area of substrate, concentration of electrolytes, to reach maximum electrolytic efficiency.
(6) masking shield of electrolyzer can avoid substrate surface metal part by the overelectrolysis etching, and more and more far will can't carry out electrolysis gradually from the negative electrode roller when substrate surface, electrolytic reaction stops automatically, the may command etching end point.
(7) preferably dispose cleaning system in the electrolyzer, can make the normal guarantor of negative electrode roller surface totally not have metal deposit piles up residual, therefore can remove reaction continuously, need not shut down especially and clear up, time saving and energy saving, there is not tradition to produce metallic residue and the substrate or make substrate produce problems such as slight crack of fraying yet;
(8) preferably dispose recovery system in the electrolyzer, reach the purpose of resource recycling.
(9) cleaning system and recovery system preferably are disposed at electrolyzer top, can reclaim metallic residue smoothly, not only meet environmental protection and do not pollute, and electrolytic solution also can one re-uses.
(10) preferably make the bearing of negative electrode roller be higher than electrolytic solution in the electrolyzer, the metallic crystal after can avoiding reducing blocks bearing at bearing place caking, influences the rotation of negative electrode roller.
In sum, though the present invention discloses as above with preferred embodiment, so it is not in order to limit the present invention.The persond having ordinary knowledge in the technical field of the present invention, without departing from the spirit and scope of the present invention, when being used for a variety of modifications and variations.Therefore, protection scope of the present invention is as the criterion when looking the accompanying Claim book person of defining.
Claims (13)
1. electrolyzer that removes excessive metals on substrate surface comprises:
One electrolyzer (electrolysis bath) comprises an electrolytic solution;
One delivery system (transportation system) is arranged at this electrolyzer place, moves toward a downstream end from a upstream extremity of this delivery system in order to transmit a substrate, and wherein this substrate is immersed in this electrolytic solution;
One anode roller (anode roller), correspondence is arranged at this electrolyzer place, and this anode roller is positioned at this upstream extremity of this delivery system, and when wherein carrying out electrolysis, this anode roller contacts with a surface of this substrate;
One negative electrode roller (cathode roller), be positioned at this delivery system top and be arranged at the downstream part of this anode roller relatively, and the base section of this negative electrode roller impregnated in this electrolytic solution, and when wherein carrying out electrolysis, this negative electrode roller then is a distance with this surface of this substrate; With
At least one masking shield (shielding plate) is positioned at the downstream of this negative electrode roller and covers this downstream end of this delivery system;
Wherein, with this substrate surface after this anode roller contacts toward this downstream end of this delivery system the time, before moving to this masking shield can and this negative electrode roller between produce an electric field, to carry out electrolysis.
2. electrolyzer as claimed in claim 1, wherein this delivery system comprises:
One back up pad (supporting plate) is in order to carry this substrate;
One group of guide rail (guiding rail) is provided with both sides that should back up pad; And
Several conveying rollers (guiding rollers), correspondence are arranged at this back up pad below, and this back up pad is moved with this substrate of horizontal transmission continuously along this group guide rail.
3. electrolyzer as claimed in claim 2, wherein this anode roller arrives the vertical range of this back up pad less than this negative electrode roller to the vertical range of this back up pad.
4. electrolyzer as claimed in claim 1, wherein the radius of this negative electrode roller is greater than the radius of this anode roller.
5. electrolyzer as claimed in claim 1, wherein this electrolyzing device more comprises a cleaning system, is adjacent to this negative electrode roller setting, to clean the surface of this negative electrode roller.
6. electrolyzer as claimed in claim 5, wherein this cleaning system comprises:
One first nozzle is arranged at the side that this negative electrode roller produces this electrolyzer, with surface sprinkling one scavenging solution to this negative electrode roller;
One scraper (squeeze knife) is arranged at by this first nozzle, and end is pressed the surface of touching this negative electrode roller before this scraper, to strike off the metal deposit of this negative electrode roller surface; With
One second nozzle is arranged at the side that this negative electrode roller changes this electrolyzer over to, so that this negative electrode roller surface is sprayed a micro-etching solution.
7. an electrochemical apparatus that removes excessive metals on substrate surface comprises two groups of continous way electrolyzers at least, and every group of continous way electrolyzer comprises:
One electrolyzer (electrolysis bath) comprises an electrolytic solution;
One delivery system (transportation system) is arranged at this electrolyzer place, moves toward a downstream end from a upstream extremity of this delivery system in order to transmit a substrate, and wherein this substrate soaks and places this electrolytic solution;
One anode roller (anode roller) is arranged at this delivery system top and part and soaks and place in this electrolyzer, and this anode roller is positioned at this upstream extremity of this delivery system, when wherein carrying out electrolysis, and surperficial a contact of this anode roller and this substrate;
One negative electrode roller (cathode roller), be positioned at this delivery system top and be arranged at the downstream part of this anode roller relatively, and the base section of this negative electrode roller impregnated in this electrolytic solution, and when wherein carrying out electrolysis, this negative electrode roller then is a distance with this surface of this substrate; With
At least one masking shield (shielding plate) is positioned at the downstream of this negative electrode roller and covers this downstream end of this delivery system;
Wherein, these two groups of continous way electrolyzers independently are provided with, and this substrate moves to another group electrolyzer again and carries out re-electrolysis behind the once electrolytic in one group of electrolyzer.
8. method that removes excessive metals on substrate surface comprises step:
One electrolyzer is provided, comprises:
One electrolyzer (electrolysis bath) comprises an electrolytic solution;
One delivery system (transportation system) is arranged at this electrolyzer place and has a upstream extremity and a downstream end;
One anode roller (anode roller) is arranged at this delivery system top and part and soaks and place in this electrolyzer, and this anode roller is positioned at this upstream extremity of this delivery system;
One negative electrode roller (cathode roller) is positioned at this delivery system top and is arranged at the downstream part of this anode roller relatively, and the base section of this negative electrode roller impregnated in this electrolytic solution; With
At least one masking shield (shielding plate) is positioned at the downstream of this negative electrode roller and covers this downstream end of this delivery system;
Put a substrate in this delivery system place, and this substrate is immersed in this electrolytic solution;
This substrate is moved toward this downstream end from this upstream extremity of this delivery system; With
Make this anode roller contact making it be anode electrical with the surface of this substrate, and be positioned at this negative electrode roller at this anode roller rear and the surface of this substrate is a distance, this negative electrode roller and be between this electrical substrate surface of anode and form an electric field is to remove the excess metal electrolysis on this substrate surface.
9. method as claimed in claim 8, wherein be this electrical substrate surface of anode after this anode roller contacts the time toward this downstream end of this delivery system, before moving to this masking shield can and this negative electrode roller between produce this electric field, to carry out electrolysis.
10. method as claimed in claim 8, wherein this delivery system comprises: a back up pad of carrying this substrate; One group of guide rail that both sides that should back up pad are provided with; With several conveying rollers that are arranged at this back up pad below; When this back up pad moves with this substrate of horizontal transmission continuously along this group guide rail, this substrate is moved toward this downstream end from this upstream extremity of this delivery system.
11. method as claimed in claim 8, wherein this electrolyzing device more comprises a cleaning system, is adjacent to this negative electrode roller setting, and this method more comprises: when this negative electrode roller after this electrolytic solution produces, this cleaning system cleans this negative electrode roller surface, changes in this electrolyzer again.
12. method as claimed in claim 11, wherein this cleaning system comprises: one first nozzle is arranged at this negative electrode roller and produces a side of this electrolyzer and spray a scavenging solution; One scraper (squeeze knife) is arranged at by this first nozzle, and end is pressed the surface of touching this negative electrode roller before this scraper; With one second nozzle, be arranged at this negative electrode roller and change a side of this electrolyzer over to and spray a micro-etching solution;
When this negative electrode roller produces from this electrolytic solution, this first nozzle sprays this scavenging solution to this negative electrode roller surface, and this scraper strikes off the metal deposit of this negative electrode roller surface, then this negative electrode roller is rotated further, its surface should the place again after this micro-etching solution cleaning of this second nozzle ejection, enter again in this electrolytic solution.
13. method as claimed in claim 8, wherein this electrolyzing device more disposes a rectifier, electrically connects with this anode roller and this negative electrode roller, and this method more comprises: the electrolytic reaction when utilizing this rectifier monitoring and adjusting the removal excess metal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2009101332592A CN101851777B (en) | 2009-04-01 | 2009-04-01 | Electrolysis device for removing excessive metals on substrate surface and method for removing excessive metals by utilizing same |
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| Application Number | Priority Date | Filing Date | Title |
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| CN2009101332592A CN101851777B (en) | 2009-04-01 | 2009-04-01 | Electrolysis device for removing excessive metals on substrate surface and method for removing excessive metals by utilizing same |
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| CN101851777A true CN101851777A (en) | 2010-10-06 |
| CN101851777B CN101851777B (en) | 2012-06-13 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102446829A (en) * | 2011-09-23 | 2012-05-09 | 上海华力微电子有限公司 | Device for carrying out electroplating copper in through hole of silicon wafer |
| CN104087991A (en) * | 2014-06-24 | 2014-10-08 | 河北钢铁股份有限公司邯郸分公司 | Cleaning device and cleaning method for fingerprint resistant liquid of electrogalvanizing steering roller |
| CN105442013A (en) * | 2015-12-16 | 2016-03-30 | 黄权波 | Metal anodic oxidation device adopting horizontal transfer mode |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB546736A (en) * | 1940-12-20 | 1942-07-28 | Folsom Ewart Drummond | Method of and device for manufacturing composite structural members |
| CN1174252A (en) * | 1996-08-16 | 1998-02-25 | 柯建信 | Roller-conveyed back-electrolysis process for cleaning and roughening copper surface of printed circuit board |
| CN101210344B (en) * | 2006-12-29 | 2011-08-03 | 财团法人精密机械研究发展中心 | Roller type electrochemical reaction device |
-
2009
- 2009-04-01 CN CN2009101332592A patent/CN101851777B/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102446829A (en) * | 2011-09-23 | 2012-05-09 | 上海华力微电子有限公司 | Device for carrying out electroplating copper in through hole of silicon wafer |
| CN104087991A (en) * | 2014-06-24 | 2014-10-08 | 河北钢铁股份有限公司邯郸分公司 | Cleaning device and cleaning method for fingerprint resistant liquid of electrogalvanizing steering roller |
| CN104087991B (en) * | 2014-06-24 | 2016-08-17 | 河北钢铁股份有限公司邯郸分公司 | A kind of electrogalvanizing slewing rollers anti-fingerprint dope cleaning plant and method for cleaning |
| CN105442013A (en) * | 2015-12-16 | 2016-03-30 | 黄权波 | Metal anodic oxidation device adopting horizontal transfer mode |
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| Publication number | Publication date |
|---|---|
| CN101851777B (en) | 2012-06-13 |
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