CN101847164B - 一种sram版图制作方法及装置 - Google Patents
一种sram版图制作方法及装置 Download PDFInfo
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- CN101847164B CN101847164B CN2009100806727A CN200910080672A CN101847164B CN 101847164 B CN101847164 B CN 101847164B CN 2009100806727 A CN2009100806727 A CN 2009100806727A CN 200910080672 A CN200910080672 A CN 200910080672A CN 101847164 B CN101847164 B CN 101847164B
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- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004519 manufacturing process Methods 0.000 title abstract description 3
- 230000003068 static effect Effects 0.000 title description 2
- 238000004364 calculation method Methods 0.000 claims description 9
- 238000010586 diagram Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 6
- 230000008901 benefit Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012467 final product Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
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- 230000005039 memory span Effects 0.000 description 1
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Abstract
Description
SRAM容量(Kbit) | Bit | Sblk类型 | Sblk数 |
160 | 8,16,32,64 | Sblk_F | 10 |
… | … | … | … |
64 | 8,16,32 | Sblk_H | 8 |
16 | 8,16,32 | Sblk_H | 2 |
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CN2009100806727A CN101847164B (zh) | 2009-03-25 | 2009-03-25 | 一种sram版图制作方法及装置 |
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CN2009100806727A CN101847164B (zh) | 2009-03-25 | 2009-03-25 | 一种sram版图制作方法及装置 |
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CN101847164A CN101847164A (zh) | 2010-09-29 |
CN101847164B true CN101847164B (zh) | 2012-05-30 |
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Families Citing this family (1)
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CN103106294B (zh) * | 2012-12-24 | 2015-12-02 | 西安华芯半导体有限公司 | 一种用于静态随机存储器编译器的版图编程方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1719447A (zh) * | 2004-07-07 | 2006-01-11 | 华为技术有限公司 | 一种印制电路板中集成设计元件的版图设计方法和装置 |
CN101377530A (zh) * | 2007-08-31 | 2009-03-04 | 上海华虹Nec电子有限公司 | 半导体器件测试图形交互式布局的方法 |
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Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN1719447A (zh) * | 2004-07-07 | 2006-01-11 | 华为技术有限公司 | 一种印制电路板中集成设计元件的版图设计方法和装置 |
CN101377530A (zh) * | 2007-08-31 | 2009-03-04 | 上海华虹Nec电子有限公司 | 半导体器件测试图形交互式布局的方法 |
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Address after: 100084 Room 301, B building, Tsinghua Science and Technology Park, Haidian District, Beijing Applicant after: GIGADEVICE SEMICONDUCTOR Inc. Address before: 100084 Room 301, B building, Tsinghua Science and Technology Park, Haidian District, Beijing Applicant before: GigaDevice Semiconductor Inc. |
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Address after: Room 101, Floor 1-5, Building 8, Yard 9, Fenghao East Road, Haidian District, Beijing 100094 Patentee after: Zhaoyi Innovation Technology Group Co.,Ltd. Address before: 100083 12 Floors, Block A, Tiangong Building, Science and Technology University, 30 College Road, Haidian District, Beijing Patentee before: GIGADEVICE SEMICONDUCTOR(BEIJING) Inc. |