CN101846890B - Parallel photoetching write-through system - Google Patents

Parallel photoetching write-through system Download PDF

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CN101846890B
CN101846890B CN2010101709784A CN201010170978A CN101846890B CN 101846890 B CN101846890 B CN 101846890B CN 2010101709784 A CN2010101709784 A CN 2010101709784A CN 201010170978 A CN201010170978 A CN 201010170978A CN 101846890 B CN101846890 B CN 101846890B
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light
light source
focus
optical system
sensor
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CN101846890A (en
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浦东林
胡进
朱鹏飞
魏国军
陈林森
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Suzhou University
Suzhou Sudavig Science and Technology Group Co Ltd
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Suzhou University
SVG Optronics Co Ltd
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Abstract

The invention discloses a parallel photoetching write-through system which comprises a light source, a pattern generating system, an optical system, a control system, a moving system and a workpiece platform. The parallel photoetching write-through system is characterized by also being provided with a focusing servo system, the focusing servo system comprises a detection light path, a sensor and a focusing device, the optical system comprises a micro-system and a detection light path, wherein the micro-system adopts a double axifugal optical system, the detection light path comprises a detection light source, a first light splitter arranged in the double axifugal optical system and a second light splitter arranged between the detection light source and the first light splitter; detection light enters the double axifugal optical system through the first light splitter and irradiates on a workpiece of the workpiece platform; reflective light is received by the sensor through the first light splitter and the second light splitter; and the control system controls the action of the focusing device according to signals of the sensor to realize servo focusing. The invention can realize accurate photoetching of a submicron micro-structure by combining with a focusing imaging servo system.

Description

Parallel photoetching write-through system
Technical field
The present invention relates to a kind of micro-nano processing unit (plant), be specifically related to a kind of photoetching write-through system, be applied to research and manufacturing fields such as precision mask photoetching, MEMS device, 3D photoetching, diffraction optics, micro-optic with a plurality of coordinate axis.
Background technology
The development of industrial technology be unable to do without the micro-nano process technology; Microelectric technique is the sign of new technology revolution, and in decades in the past, the development of micro-nano process technology has promoted the great-leap-forward progress of integrated circuit; At present; The micro-nano process technology not only just plays an important role in microelectronic, is also promoting the exploitation and new subject development of new device, like MEMS (MEMS), light integrated technology, micro-optic etc.
Micro-nano processing is the process technology general name of making micro-meter scale and nanoscale micro-structure, and physical dimension all belongs to the scope of micro-nano processing from several nanometers to 100um.The minimum dimension of the direct manufacturing process of laser energy such as laser boring, cut, laser marking is more than 10um; The manufacturing process of the following size of 1um has optical projection micro photolithography (stepper), electron-beam direct writing (e-beam), I.B.M. (Ion Beam Machining), laser interference lithography (holography); Little processing of 1~10um size, laser direct-write photoetching are considered to the most effectively means.
The laser direct-writing technology belongs to a kind of emerging maskless micro-nano process technology means.The resolution of laser optical system can calculate that (1.22 λ/NA), can estimate at sub-micron, micro-meter scale are adapted at the little processing under this size according to laser wavelength lambda and optical system numerical aperture NA.In addition, laser also has the advantage that energy is big, can in air ambient, process, and the laser direct-writing technology can be to high speed, large format development.So development laser direct-writing technology has great importance.
China utility model patent CN201035320Y discloses a kind of micro-optical device high-speed parallel straight-writing system; It comprises light source, spatial light modulator, Fourier transform lens, spatial filter, object lens and two-dimentional precision surface plate, and integrated graphics generates the computing machine of software.Figure in the computing machine generates software and spatial light modulator cooperates formation figure generation systems, and Fourier transform lens, spatial filter, object lens constitute optical system, realize the parallel direct-writing photoetching thus.But in general, the fluctuating of surface of the work is more than 10 microns; And high-resolution optical system depth of focus is below 1 micron, and also there is fluctuation in work stage when doing the two dimension operation, therefore; When said system is used in reality, the out of focus phenomenon can take place, influence the quality of photoetching workpiece thus.
Summary of the invention
The object of the invention provides a kind of parallel photoetching write-through system, through the improvement to optical system, solves the out of focus problem that exists in the prior art.
For achieving the above object, the technical scheme that the present invention adopts is:
A kind of parallel photoetching write-through system; Comprise light source, figure generation systems, optical system, control system, kinematic system and work piece platform; Also be provided with focus servosystem, said focus servosystem comprises detection light path, sensor and focus control, and said optical system is made up of miniature system and detection light path; Miniature system wherein adopts two telecentric optical systems; Detect light path and comprise detection light source, first light-splitting device in two telecentric optical systems, second light-splitting device between the detection light source and first light-splitting device, detection light warp first light-splitting device gets into two telecentric optical systems and is radiated on the workpiece at work piece platform place, and reflected light is received by sensor through first light-splitting device and second light-splitting device; Control system realizes servo-focus according to the signal controlling focus control action of sensor.
In the preceding text; The figure generation systems generally comprises the figure of being located in the computing machine and generates software and spatial light modulator (SLM); Spatial light modulator is between light source and miniature system; When reality is used, can between light source and spatial light modulator, be provided with and expand bundle and colimated light system, to spatial light modulator even illumination light is provided; Two telecentric optical systems be used for the figure high resolving power on the spatial light modulator be imaged on photoetching material; The luminous point that formation shape variable, inside have the gray scale light intensity; The relative motion of lens combination can be regulated the position of micro imaging in the two telecentric optical systems of control; Have the constant characteristic of micro multiplying power and resolution during motion, realize providing condition for the servo-focus function; Said focus control is used for regulating the position of two telecentric optical system lens combination; Control system according to sensor to signal judge the distance of object lens and surface of the work in two telecentric optical systems; And control focus control in view of the above, to realize the automatic focus of two telecentric optical systems; Detection light source adopts the photostable light source of recording materials.Between work piece platform and the optical system; The degree of freedom that should have relative motion; Be included in the relative motion degree of freedom of the X-Y direction on plane, work piece platform place, and, also counterrotating freedom of motion can be set perpendicular to the relative motion degree of freedom of the Z-direction on work piece platform surface.
During practical implementation, figure generation systems, optical system, kinematic system and sensor are installed in the mechanical framework, form one and install whole.
Light source is ultraviolet or blue light monochromatic light, can be laser instrument, also can be non-laser light sources such as the mercury lamp that adds optical filter, LED.Detection light source adopts to the photostable light source of recording materials, like the 650nm red light semiconductor laser.Preferably, the light wavelength that said light source sends is less than 450 nanometers, and the light wavelength that said detection light source is sent is greater than 550 nanometers.
The figure generation systems is used to produce litho pattern, adopts the amplitude type spatial light modulator system, for example; The LCD of transmission-type, reflective DMD, LCOS, the Pixel Dimensions of these spatial light modulators generally are the 10-30um magnitudes; Have the above resolution of VGA, GTG modulation capability; Displaying contents can refresh with programmed control through computer control in real time, realizes the figure of shape-variable and gray scale.
Optical system can comprise three parts:
(1) expands bundle and colimated light system, between light source and spatial light modulator, even illumination light is provided to spatial light modulator;
(2) miniature system, the figure on the micro spatial light modulator is imaged on the photoetching material with making it high resolving power, the luminous point that formation shape variable, inside have the gray scale light intensity, optical system image resolution is superior to 1um.The micro optical system is based on two telecentric optics principles, and is by TUBE LENS with directly write two groups of lens combination of object lens and form, as shown in Figure 2; Figure 21 and directly write micro multiplying power between the luminous point 24 by TUBE LENS 22 with directly write the ratio control of both focal lengths of object lens 23 on the spatial light modulator, as, TUBE LENS focal length is 200mm; Directly writing objective focal length is 4mm, can realize 50 times of figure micros, under the 405nm wavelength; If the numerical aperture of object lens reaches more than 0.5, graphics resolution can be less than 1um.In addition; The relative motion of control lens combination can be regulated the position of micro imaging, has the constant characteristic of micro multiplying power and resolution during motion, realizes providing the condition foundation for the servo-focus function; As shown in Figure 3; When the fluctuating of record surface 31 during greater than the depth of focus of object lens, can regulate two groups of distances 32 between the lens, spatial light modulator is constant from the distance of TUBE LENS, record surface is also constant from the distance of object lens.In practical implementation, this micro optical system should be designed to flat field, little distortion optical system;
(3) the feedback capture system provides light signal to photoelectric sensor, make control system can monitoring system the state of imaging.
In the technique scheme, kinematic system is made up of the Z axle perpendicular to X, Y axle, the R axle that rotatablely moves and the parallel axis movement of axis movement, and the little stroke controlled motion device of nanometer resolution is arranged in Z axle direction of motion.
X, Y, the R axle is used for objective table and optical head relatively moves, make luminous point on recording medium the subregion by area exposure or vector scan exposure.The motion of Z axle realizes that luminous point makes public, like sphere on the on-plane surface recording medium.X, Y, Z, R axle can be formed multiple three-dimensional system of coordinate, and like rectangular coordinate system, polar coordinate system, etching system is in operation, and can converted coordinate be to realize the complex figure photoetching.The little stroke motion device of Z direction has tens to hundreds of micron stroke, nanoscale Motion Resolution rate, and the above full stroke reciprocating frequency of 100Hz is used for the motion of object lens servo-focus, and this device can adopt piezoelectric ceramics or voice coil motor to drive.Under the situation that needs the high precision photoetching, kinematic system generally adopts close-loop control mode.
Control system is used to receive outside input instruction, carries out man-machine conversation, each system works of united and coordinating, and control system is made up of computing machine, multi-axis controller, control card, control program etc.
Because the technique scheme utilization, the present invention compared with prior art has advantage:
1. the present invention is through servo-focus control, can realize on plane and curved surface that high graphics directly writes; The photolithographicallpatterned of parallel exposure can increase exponentially the efficient of photoetching than the direct writing means of simple scan; The gray scale Exposure mode can be realized the making of photoresist base material three-dimensional structure.
2. because the setting of focus servosystem, rise and fall and motion rises and falls when exceeding the depth of focus of optical system at the photoetching surface of the work, can follow the tracks of focusing, guarantee directly to write the high resolving power of figure all the time;
3. device of the present invention can be provided with multi-coordinate shaft mechanical kinematic system, but plane, curved surface photoetching are carried out in multi-coordinate, dot matrix and vector operation.
Description of drawings
Fig. 1 is that the laser direct-writing device system in the embodiment of the invention forms synoptic diagram;
Fig. 2 is a micro optical system schematic diagram involved in the present invention;
Fig. 3 is a micro optical system imaging invariant feature synoptic diagram involved in the present invention;
Fig. 4 is that the embodiment of the invention 1 system forms synoptic diagram;
Fig. 5 is that the embodiment of the invention 2 systems form synoptic diagram;
Fig. 6 is that the embodiment of the invention 3 systems form synoptic diagram.
Embodiment
Below in conjunction with accompanying drawing and embodiment the present invention is further described:
Embodiment 1:
A kind of multiaxis parallel photoetching write-through system referring to shown in Figure 4, includes light source, optical system, spatial light modulator, kinematic system, sensor in the mechanical framework 41, there are control computer 417 and control drive unit 418 in the mechanical framework outside.Specifically describe as follows:
A) light that sends of light source 42 is through expanding bundle and collimation back lighting spatial light modulator 43; Light after spatial light modulator modulation gets into tube lens (Tube lens) 45 through partially reflecting mirror 44, behind the permeation parts catoptron 46 through object lens 47; Be imaged onto on the work stage workplace that is positioned at multiaxis platform 48; Again get into optical system from the light of surface of the work reflection, successively through 47,46,45,44, lens combination 49, get into ccd sensor 410; Ccd signal can be kept watch on the image quality of directly writing luminous point after getting into computing machine.
Above-mentioned light source can be a laser instrument, and like 405nm semiconductor laser, 441.6nm helium cadmium laser, 374nm semiconductor laser, the 355nm solid-state laser also can be the mercury lamp light source through filter light, like 365nm.
The lighting system of spatial light modulator need design according to the particular type of modulator, as, DMD adopts the off axis reflector lighting system, and LCOS adopts coaxial indirect illumination mode, and LCD adopts coaxial transillumination mode.
Tubelens45 and object lens 47 are formed two telecentric optical systems; These two groups of lens all need to proofread and correct the aberration design with infinity; Directly writing luminous point is the micro of spatial modulator epigraph, and the micro multiple is the ratio of the focal length of these two groups of lens, and light is directional light between 45 and 47; Variable in distance between 45 and 47, the multiple of micro does not have influence.
CCD410 and directly write and also constitute imaging relations between the luminous point constitutes two telecentric optical systems between lens combination that lens 45,49 are formed and the object lens 47, the parameter of lens 49 specifically designs according to the sensitization size of CCD410.
B) light that sends of detection light source 413 is through semi-transparent semi-reflecting 414 of second light-splitting device; Through the first light-splitting device partially reflecting mirror 46, get into object lens 47, focus on surface of the work; Surface reflection gets into optical system again; Successively through 47,46, see through 414, astigmatism optical device 415 gets into sensor 416.
Detect gloss and use the photostable light source of recording materials, like the 650nm red light semiconductor laser, the light that returns from the recording materials surface forms astigmatism hot spot, the distance dependent between the shape facility of hot spot and object lens 47 and the recording materials at sensor.Sensor can be 4 quadrant detector, CCD etc.; The signal that sensor obtains gets into computing machine, and computing machine can be analyzed the distance of surface of the work and object lens 47, and computing machine sends instruction and drives object lens 47 axial (Z direction) motion; The parameter of locking astigmatism hot spot can realize servo-focus.
C) in the kinematic system, the 48th, X, Y, three (in the plane of vertical optical axis, moving) precision movement platforms of R, the 411st, Z is to (along optical axis direction) kinematic axis, and the 412nd, Z constitutes the four axes motion system altogether to little stroke motion mechanism.
Because optical system can be supported the blunt luminous point of writing of resolution of submicron order; So precision movement platform should have the repetitive positioning accuracy of submicron order; Generally need to adopt linear electric motors or ceramic motor-driven, grating chi, laser interference positioning system are used for location positioning, do closed-loop control.411 are used for the motion of Z axle, realize the curved surface photolithographicallpatterned.The 412nd, high-resolution motion is used for the servo motion of object lens, because the depth of focus of high magnification object lens is sub-micron orders of magnitude, so the resolution of motion should a high one magnitude, adopts piezoelectric ceramics or voice coil motor to drive.
D) in the said system, control system is used to control each parts coordinated operation, the control of all controlled system of light source, spatial light modulator, kinematic system, sensor.Control system is made up of computing machine, program, multi-axis controller, driver.The typical exposure method of operation has: the static exposure-platform motion of (1) spatial light modulator display image-platform; (2) spatial light modulator demonstration-platform motion scan exposure; Carry out in the process in the exposure operation, the running background servo programe, control system is constantly gathered the signal that receives from sensor, and analytic signal also sends the servocontrol instruction.
Embodiment 2:
As shown in Figure 5, the quantity of increase or minimizing motion platform 58 kinematic axiss, other configurations are identical with embodiment 1.
Reduce the kinematic axis number, for example, can constitute X, Y flat sided straight one-writing system, in like manner, can constitute X, R plane polar coordinates straight-writing system, X, Y, Z system etc. by X, Y motion platform and little stroke servo motion parts.
Increase the number of kinematic axis, bring more freedom, can make straight-writing system realize the more method of operation.For example, adding makes worktable make the axle of luffing, and when being implemented in Machining of Curved Surface, the vertical all the time workpiece of light improves machining precision.
Embodiment 3:
As shown in Figure 6, the system of gantry structure.The optics configuration is constant; Light source, spatial light modulator, optical system, CCD and Z axle etc. as a whole optical head 61, are installed on the one dimension mechanical motion axle 619, move along Y direction; 68 is the directions X motion platform; Place the photoetching workpiece, constitute X, Y, the three parallel etching systems in Z gantry, this structure is fit to the type of big (greater than 500mm) of design photoetching breadth.

Claims (2)

1. parallel photoetching write-through system; Comprise light source, figure generation systems, optical system, control system, kinematic system and work piece platform; It is characterized in that: also be provided with focus servosystem, said focus servosystem comprises detection light path, sensor and focus control, and said optical system comprises miniature system; Miniature system wherein adopts two telecentric optical systems; Detect light path and comprise detection light source, first light-splitting device in two telecentric optical systems, second light-splitting device between the detection light source and first light-splitting device, detection light warp first light-splitting device gets into two telecentric optical systems and is radiated on the workpiece at work piece platform place, and reflected light is received by sensor through first light-splitting device and second light-splitting device; Said focus control is used for regulating the position of two telecentric optical system lens combination; Control system is judged the distance of object lens and surface of the work in two telecentric optical systems according to the signal of sensor, and controls the focus control action in view of the above, the realization servo-focus.
2. parallel photoetching write-through system according to claim 1 is characterized in that: the light wavelength that said light source sends is less than 450 nanometers, and the light wavelength that said detection light source is sent is greater than 550 nanometers.
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CN106647213B (en) * 2017-01-19 2019-10-29 中国人民解放军装甲兵工程学院 The dry plate precision positioning device and method that laser hologram directly prints
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CN109901364B (en) * 2019-03-14 2021-08-20 大族激光科技产业集团股份有限公司 Focusing system and method for digital photoetching
CN112241070B (en) * 2019-07-16 2022-07-29 苏州大学 Large-breadth optical polarization pattern generation device and generation method
CN113206950B (en) * 2021-04-12 2022-05-31 中国科学院上海光学精密机械研究所 High-speed tracking method for micro-nano structure graphic sample

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997034171A2 (en) * 1996-02-28 1997-09-18 Johnson Kenneth C Microlens scanner for microlithography and wide-field confocal microscopy
US6307682B1 (en) * 2000-02-16 2001-10-23 Silicon Valley Group, Inc. Zoom illumination system for use in photolithography
CN201097106Y (en) * 2007-09-30 2008-08-06 芯硕半导体(合肥)有限公司 Novel direct writing light recording device with focusing machine

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997034171A2 (en) * 1996-02-28 1997-09-18 Johnson Kenneth C Microlens scanner for microlithography and wide-field confocal microscopy
US6307682B1 (en) * 2000-02-16 2001-10-23 Silicon Valley Group, Inc. Zoom illumination system for use in photolithography
CN201097106Y (en) * 2007-09-30 2008-08-06 芯硕半导体(合肥)有限公司 Novel direct writing light recording device with focusing machine

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