CN104439723B - A kind of laser boring method and device thereof - Google Patents
A kind of laser boring method and device thereof Download PDFInfo
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- CN104439723B CN104439723B CN201410627239.1A CN201410627239A CN104439723B CN 104439723 B CN104439723 B CN 104439723B CN 201410627239 A CN201410627239 A CN 201410627239A CN 104439723 B CN104439723 B CN 104439723B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
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Abstract
The invention discloses a kind of laser boring method and device thereof.The laser beam that laser instrument produces incides on LCOS successively after beam expander, polarizer; Reverberation incidence after zoom system, pancreatic system and diaphragm of LCOS focuses on base material to be processed, and LCOS is connected with presentation manager by video data interface.During laser boring, first on presentation manager according to the gray-scale map of parameter designing some width circular arcs images such as the diameter in hole to be processed, then be converted to phase hologram successively, be loaded on LCOS through video data interface by width; Laser instrument produces laser beam and incides on LCOS through expanding, after polarization manipulation, and reverberation incidence after zoom system, pancreatic system and diaphragm of LCOS focuses on base material, realizes the perforation processing to base material.The present invention adopts LCOS diffractive optical element to carry out beam flying, overcomes vibration mirror scanning that laser boring prior art adopts or optical element rotatable parts move the deficiency of existence, ensure that the precision that laser boring is processed.
Description
Technical field
The present invention relates to a kind of laser drilling device and drilling method thereof, particularly a kind of laser boring method based on LCOS and device thereof, be applicable to be shaped to the aperture of base material, belong to laser application technique field.
Background technology
At present, the method that the base materials such as silicon chip adopt laser beam to punch, the general circular trajectory scan being realized light beam focus point by the rotation of optics, there is certain limitation, main manifestations is: 1, machinery is rotated in the process of long-term running and can causes structural wear, precise decreasing, has a strong impact on drilling quality the most at last; 2, mechanical rotary punching apparatus is complicated, needs spacious working environment.Document " research of laser boring on crystal silicon chip " (money is pretty. and [J]. semiconductor technology, 2012,37 (5): 375-389) report employing vibration mirror scanning mode and catadioptric system rotation mode; Its system architecture is complicated, and relate to moving component in system, its scanning accuracy proposes very high required precision to tumbler, and long-term running can cause structural wear, and precise decreasing has a strong impact on drilling quality the most at last.
Spatial light modulator (Spatiallightmodulator is called for short SLM) is the Primary Component in the contemporary optics fields such as wavefront shaping, Real-Time Optical information processing, adaptive optics and optical oomputing.Liquid crystal on silicon (LiquidCrystalonSiliconLCOS) is a kind of reflective spatial light modulator, utilizes the image information of Practical computer teaching or optical function to be directly loaded on LCOS by video interface.Because pixel is little, filling rate is high, LCOS has the advantages that diffraction efficiency is high, space-bandwidth product is large, is desirable phase-only modulation device, can be applied in wave-front phase modulation, light tweezer, pulsed light beam shaping, dynamic diffractive optical element, match the fields such as imaging.In imaging research, document " LCOS panel phase-modulation analyze and for reconstruction of hologram system " (Zhang Gongrui. [J]. laser and optoelectronics is in progress, 2009, (1): 94-98) a kind of reconstruction of hologram system based on reflection-type liquid crystal on silicon (LCOS) panel is provided, reproduce the hologram that computer simulation generates, and effectively improved the quality of reproduced image by optimized algorithm.There is the research about aberration correction, see document " reflective LCOS display panel used in human eyes wave-front optical aberration correct research " (Cai Dongmei. [J]. optoelectronic laser, 2008,19 (7): 992-995), theory analysis has been carried out to the optical modulation characteristic of LCOS display device, under suitable Parameter Conditions, under LCOS can be operated in phase-only modulation state.LCOS is bonded a self-adapting closed loop corrective system as wave-front corrector and Hartmann sensor, correct the Static wavefront distortion with human eyes wave-front optical aberration feature introduced in imaging optical path, LCOS device corrects at human eyes wave-front optical aberration as phase correction component and has a good application prospect in retina imaging system.
Liquid crystal on silicon (LCOS) and imaging technique are applied to laser boring field have not been reported.
Summary of the invention
Problem to be solved by this invention is the deficiency of the machining accuracy decline of moving existence for existing laser boring due to vibration mirror scanning or optical element rotatable parts, provides a kind of laser boring method and the device thereof that can keep high accuracy, high efficiency, high stable.
The technical scheme realizing the object of the invention is to provide a kind of laser drilling device, its structure is: the laser beam that laser instrument produces incides on LCOS successively after beam expander, polarizer process, and the polarization direction of polarizer is consistent with the direction of the long axis of liquid crystal molecule of LCOS; The reverberation of LCOS incides on base material to be processed after zoom system, pancreatic system and diaphragm; Described LCOS is connected with presentation manager by video data interface.
A kind of laser drilling device provided by the invention, the distance of its base material place plane to be processed and zoom system, pancreatic system image space principal plane calculates by Gauss formula:
；
Wherein:
for the distance of base material place plane to be processed and zoom system, pancreatic system image space principal plane,
for the focal length of zoom system, pancreatic system,
for the divergence point of laser beam is to the distance of zoom system, pancreatic system object space principal plane.
If the laser beam natural daylight that laser instrument of the present invention produces, then polarizer is devating prism; If the laser beam that laser instrument produces is polarised light, then polarizer can be 1/2nd wave plates, also can select devating prism.
Laser drilling device of the present invention, can also arrange a collimation lens between beam expander and polarizer.
Technical solution of the present invention also comprises a kind of laser boring method, comprises the steps:
1, according to each parameter, presentation manager arranges the doughnut picture that a diameter is Φ pixel number, described parameter comprises the aperture that W is hole to be processed, D is the pixel dimension of LCOS, I is the pixel number that LCOS contains compared with minor face, λ is the wavelength of the laser beam that laser instrument produces, and f is the focal length of zoom system, pancreatic system; Described annulus average mark is slit into the circular arc of 2n section, n is positive integer, and described circular arc is that the center of circle is symmetrical; With every two sections of symmetrical circular arc composition piece images, obtain the gray-scale map of n width circular arc image;
2, the laser beam that laser instrument produces incides on LCOS through expanding, after polarization manipulation; The gray-scale map of every width circular arc image that step 1 obtains by presentation manager is converted to phase hologram successively, is loaded on LCOS through video data interface by width; Reverberation incidence after zoom system, pancreatic system and diaphragm of LCOS focuses on base material, base material obtaining the focusing circular arc for processing, carrying out perforation processing to base material.
In the method for above-mentioned laser boring, the laser beam that step 2 also can produce for laser instrument incides on LCOS through expanding, collimating, after polarization manipulation; The gray-scale map of every width circular arc image that step 1 obtains by presentation manager is converted to phase hologram successively, is loaded on LCOS through video data interface by width; Reverberation incidence after zoom system, pancreatic system and diaphragm of LCOS focuses on base material, base material obtaining the focusing circular arc for processing, carrying out perforation processing to base material.
Laser boring method as above, the annular width of its doughnut picture is 1 ~ 10 pixel; N can be 1 ~ 10 section.
In technical solution of the present invention, in order to obtain the focusing circular arc for processing on base material to be processed, the following two kinds scheme can be adopted:
The first, intended diameter is the doughnut picture of Φ pixel number, and formula is pressed in the determination of its diameter of phi:
，
Wherein, W is the aperture in hole to be processed, and D is the pixel dimension of LCOS, and I is the pixel number that LCOS contains compared with minor face, and λ is the wavelength of the laser beam that laser instrument produces, and f is the focal length of zoom system, pancreatic system, thus on base material to be processed, obtain the focusing circular arc for processing;
It two is that the diameter first setting doughnut picture is Φ pixel number, and the focal distance f of zoom system, pancreatic system presses following formula adjustment:
，
Wherein, W is the aperture in hole to be processed, and D is the pixel dimension of LCOS, and I is the pixel number that LCOS contains compared with minor face, and λ is the wavelength of the laser beam that laser instrument produces, thus on base material to be processed, obtain the focusing circular arc for processing.
The present invention relates to the new pattern laser cheesing techniques that a kind of LCOS of employing realizes beam flying, the open circles light beam needed for punching is divided into segment circular arc, to improve laser beam energy density.Because LCOS exists-1 order diffraction, its phenomenon showed is that diffraction light can be in a center of symmetry with 0 grade of luminous point, in order to get rid of the impact of-1 order diffraction light, annulus is divided into about two sections of equal circular arcs of center of circle length in a center of symmetry, is conducive to the aperture edge problem of rough that elimination-1 order diffraction light may cause.
Technical solution of the present invention comprises three aspects, its operation principle is respectively: 1, computer produces phase diagram part: this part is in conjunction with downhole parameter, as the diameter in hole, special shape require, required energy density, draw out corresponding original gradation figure, then by discrete fourier iterative algorithm, original gradation figure is converted to the phase hologram be loaded on LCOS.2, LCOS is upper loads phase diagram and reflection diffraction light beam part: the phase hologram that LCOS loading calculation machine generates, laser beam (can use angle pencil of ray) is by inciding LCOS surface and producing reverberation after polarizer, the polarization direction of polarizer is consistent with the optical axis of LCOS liquid crystal molecule.3, set of lenses imaging moiety: LCOS reverberation set of lenses is carried out to inverse Fourier transform and is focused into light pencil, reproduces at silicon chip surface and forms circular arc light beam, for punching.
The present invention adopts LCOS diffractive optical element to realize beam flying, LCOS only need load a series of gray level image and not need parts to move just to reach to rotate same effect with vibration mirror scanning or optical element, thus the problem of the precise decreasing due to wearing and tearing can not be there is, the method can also use angle pencil of ray, uses angle pencil of ray can reduce device failure equally because of the feature that energy density is low.
LCOS is used in laser drilling by the present invention, utilizes circular arc light beam to replace a some light beam, avoids mechanical part and to move the precise decreasing problem caused, and improves perforating efficiency and facilitates the miniaturization of perforating device.Meanwhile, the present invention's hole knockout used is easy to the size and shape of adjustment aperture, easy to operate.
The present invention produces serial circular arc diffracted beam by loading different phase holograms on LCOS, and circular arc light beam cuts out series of arc shape on silicon chip, is finally spliced to form circular aperture.This hole knockout can keep high accuracy, significantly improve perforating efficiency in Long-Time Service, can use the angle pencil of ray less to device infringement.Be conducive to ensureing the work of laser drilling device stability and high efficiency.LCOS device by means of small volume produces the punching of circular arc light beam and is conducive to perforating device miniaturization.
Compared with prior art, the present invention has following effect:
1, the laser boring mode based on LCOS better can keep drilling precision;
2, the more convenient and device of operation can be miniaturized.
Accompanying drawing explanation
Fig. 1 is the structural representation of the LCOS laser drilling device that the embodiment of the present invention provides;
In figure, 1, laser instrument; 2, beam expanding lens; 3, convex lens (collimation lens); 4, computer-controlled presentation manager; 5, LCOS; 6, zoom system, pancreatic system; 7, base material; 8, laser beam; 9, video data line; 10, aperture adjustable diaphragm; 11, polarizer (1/2nd wave plates or devating prism)
Fig. 2-Fig. 4 adopts the LCOS laser drilling device that provides of the embodiment of the present invention, in the design of punching circular parameters, phase hologram process and obtain for the image in each step of light beam of the light beam that punches; Wherein, Fig. 2 is the gray-scale map of the Symmetrical Circular Arc by downhole parameter design, and Fig. 3 is the phase hologram obtained after the process of discrete Fourier transform method, and Fig. 4 is the circular arc light beam through LCOS reflection collected with CCD, the light beam namely for punching.
Detailed description of the invention
Below in conjunction with drawings and Examples, technical solution of the present invention is further elaborated.
Embodiment 1
See accompanying drawing 1, it is the structural representation of the LCOS laser drilling device that the embodiment of the present invention provides; The laser beam 8 that laser instrument 1 produces incides on LCOS5 through beam expander 2, convex lens (collimation lens) 3, polarizer 11 after processing successively; The reverberation of LCOS incides on base material 7 to be processed after zoom system, pancreatic system 6 and aperture adjustable diaphragm 10; LCOS is connected with computer image treatment device 4 by video data line 9 and interface.In the present embodiment, base material to be processed is silicon chip.If the laser beam that laser instrument produces is natural daylight, then polarizer is devating prism; If the laser beam that laser instrument produces is polarised light, then polarizer adopts 1/2nd wave plates, also can adopt devating prism.
The commercialization LCOS that the present embodiment adopts Beijing RealLight Technology Co., Ltd. to provide, model is RL-SLM-R2, and parameter is as follows:
Resolution ratio (the pixel number of LCOS: long * is wide): 1280*1024,
Target surface size: 0.78inch,
Pixel dimension: 12.3 μm,
Fill factor, curve factor: 90%,
Phase-modulation ability: 0 ~ 1.4 π (532nm),
Reflectivity: >=70%,
Refreshing frequency: 60Hz,
Operation wavelength: 400nm ~ 700nm,
Gray scale exponent number: 8,256 rank.
The concrete steps of punching are as follows:
The Matlab software of U.S. MathWorks Company is installed on computers, as presentation manager, applies this software, the diameter of phi by formula (1) design doughnut picture:
（1）；
Wherein, W is the aperture in hole to be processed, 100 μm; D is LCOS pixel dimension, 12.3 μm; I is the pixel number that LCOS contains compared with minor face, is 1024 pixels; λ is the wavelength of the laser beam that laser instrument produces, 532nm; F is the focal length of zoom system, pancreatic system, 50mm; The diameter of phi calculating doughnut picture is 47 pixels.
The size design circular arc hop count in the energy density size needed for punching and hole, determine circular arc hop count 2n by formula (2):
（2）；
Wherein, W is the aperture (unit: μm) in hole to be processed; D is the width (unit: μm) focusing on circular arc; P
0for the laser energy density threshold value (unit: W/ μm that punches under certain pulse frequency
2; ), P is laser power (unit: W); η is energy conversion efficiency; N rounds up number.
In the present embodiment, the aperture W in hole to be processed is 100 μm, and base material is the silicon chip of thickness 200 μm, laser pulse frequency is 30kHz, pulse width < 22ns30kHz, repetition rate is 20 ~ 100kHz, and required laser energy density generally needs P
0be 1.27 × 10
-3w/ μm
2above, laser power P is 5W, device energy conversion efficiency η=60%, and the width d focusing on circular arc is 10 μm, and substitution formula (2) can calculate n ≈ 1.3, n and get 2, annulus can be divided into 2n=4 section circular arc (saving as 2 width figure).In the present embodiment, the width getting annulus is 4 pixels, annulus average mark is slit into 4 sections of circular arcs, to improve the energy density of laser beam, namely the circular arc energy density of unit length is kept to reach the threshold value of punching, the required energy density of punching is larger, and the circular arc quantity that needs are divided into is more, and general n can be got in 1 ~ 10.Annulus is divided into 4 sections of circular arcs by the present embodiment, and the circular arc obtained is that the center of circle is symmetrical, with every two sections of symmetrical circular arc composition piece images, obtains the gray-scale map of 2 width circular arc images, is stored in computer; See accompanying drawing 2, for pressing the gray-scale map of the width in the Symmetrical Circular Arc of downhole parameter design.Because LCOS bears the existence of 1 order diffraction, so the two sections of Symmetrical Circular Arc discrete methods that will take during annular segments about center of circle symmetry, with the light punching of the two sections of circular arcs produced simultaneously.
Adopt the laser drilling device that the present embodiment provides, the laser beam that laser instrument produces incides on LCOS after beam expanding lens, collimation convex lens, polarizer process, and the polarization direction of polarizer is consistent with the direction of the long axis of liquid crystal molecule of LCOS; The gray-scale map of the every width circular arc image obtained is converted to phase hologram by computer successively, see accompanying drawing 3, is the phase hologram that Fig. 2 obtains after the process of discrete Fourier transform method, is loaded on LCOS by video data line through interface by width; The reverberation of LCOS incides in silicon wafer substrate after zoom system, pancreatic system and aperture adjustable diaphragm lens, due to the existence of positive 2 grades and the above order of diffraction, so add the adjustable diaphragm of aperture at 1mm ~ 20mm between base material and imaging len, by the diffraction light elimination except 0 grade and positive and negative 1 order diffraction light.See accompanying drawing 4 figure, be the circular arc light beam through LCOS reflection collected with CCD, this focal circle arc light bundle can be used in perforation processing is carried out to silicon chip.In the present embodiment, laser beam incides LCOS, punches, phase hologram is loaded into LCOS by width with the reverberation of LCOS, LCOS reverberation can be regulated and controled by the phase hologram loaded thereon through set of lenses imaging, when phase hologram loaded can form circular hole.
Embodiment 2
The LCOS laser drilling device that reference example 1 provides, the structure of the LCOS laser drilling device that the present embodiment provides is: the laser beam that laser instrument produces incides on LCOS successively after beam expander, polarizer process; The reverberation of LCOS incides on base material to be processed after zoom system, pancreatic system and aperture adjustable diaphragm; LCOS is connected with computer image treatment device by video data line and interface.In the present embodiment, the distance of base material place plane to be processed and zoom system, pancreatic system image space principal plane calculates by Gauss formula (3):
（3）；
Wherein:
for the distance of base material place plane to be processed and zoom system, pancreatic system image space principal plane,
for the focal length of zoom system, pancreatic system,
for the divergence point of laser beam is to the distance of zoom system, pancreatic system image space principal plane.
In the present embodiment, base material to be processed is silicon chip.The LCOS product adopted is identical with embodiment 1.
During punching, the diameter of phi first setting doughnut picture is 50 pixels, and the focal distance f of zoom system, pancreatic system calculates by formula (4):
（4）；
Wherein, W is the aperture in hole to be processed, 100 μm; D is the pixel dimension of LCOS, 12.3 μm; I is the pixel number that LCOS contains compared with minor face, 1024 pixels; λ is the wavelength of the laser beam that laser instrument produces, and 532nm, as calculated, the present embodiment zoom system, pancreatic system focal distance f is 47mm.Regulate the focal distance f of zoom system, pancreatic system, base material to be processed obtains the focusing circular arc for processing;
Still be 2n=4 section circular arc by parameter determination circular arc hop counts such as the energy density sizes needed for the formula (2) in embodiment 1 and laser power and punching.In the present embodiment, the width getting annulus is 4, annulus average mark is slit into 4 sections of circular arcs, and the circular arc obtained is that the center of circle is symmetrical, with every two sections of symmetrical circular arc composition piece images, obtains the gray-scale map of 2 width circular arc images, is stored in computer.Zoom system, pancreatic system focal distance f is regulated to be 47mm; The gray-scale map of the every width circular arc image obtained is converted to phase hologram by computer successively, is loaded on LCOS by video data line through interface by width; The reverberation of LCOS through zoom system, pancreatic system and aperture adjustable diaphragm (due to the existence of positive 2 grades and the above order of diffraction, so add the adjustable diaphragm of aperture at 1mm ~ 20mm between base material and imaging len), incidence after diffraction light elimination lens except 0 grade and positive and negative 1 order diffraction light is focused in silicon wafer substrate, obtain the focusing circular arc for processing, perforation processing is carried out to base material; Treat phase hologram loaded, base material can form required circular hole.
Claims (5)
1. a laser boring method, is characterized in that comprising the steps:
(1) according to each parameter, presentation manager arranges the doughnut picture that a diameter is Φ pixel number, described parameter comprises the aperture that W is hole to be processed, D is the pixel dimension of LCOS, I is the pixel number that LCOS contains compared with minor face, λ is the wavelength of the laser beam that laser instrument produces, and f is the focal length of zoom system, pancreatic system; Described annulus average mark is slit into the circular arc of 2n section, n is positive integer, and described circular arc is that the center of circle is symmetrical; With every two sections of symmetrical circular arc composition piece images, obtain the gray-scale map of n width circular arc image;
(2) laser beam that laser instrument produces incides on LCOS through expanding, after polarization manipulation; The gray-scale map of every width circular arc image that step (1) obtains by presentation manager is converted to phase hologram successively, is loaded on LCOS through video data interface by width; Reverberation incidence after zoom system, pancreatic system and diaphragm of LCOS focuses on base material, base material obtaining the focusing circular arc for processing, carrying out perforation processing to base material.
2. a kind of laser boring method according to claim 1, is characterized in that: the laser beam that step (2) produces for laser instrument incides on LCOS through expanding, collimating, after polarization manipulation; The gray-scale map of every width circular arc image that step (1) obtains by presentation manager is converted to phase hologram successively, is loaded on LCOS through video data interface by width; Reverberation incidence after zoom system, pancreatic system and diaphragm of LCOS focuses on base material, base material obtaining the focusing circular arc for processing, carrying out perforation processing to base material.
3. a kind of laser boring method according to claim 1 and 2, is characterized in that: the width of described annulus is 1 ~ 10 pixel; N is 1 ~ 10 section.
4. a kind of laser boring method according to claim 1 and 2, is characterized in that: described diameter is the doughnut picture of Φ pixel number, and formula is pressed in the determination of its diameter of phi:
，
Wherein, W is the aperture in hole to be processed, and D is the pixel dimension of LCOS, and I is the pixel number that LCOS contains compared with minor face, and λ is the wavelength of the laser beam that laser instrument produces, and f is the focal length of zoom system, pancreatic system, and base material to be processed obtains the focusing circular arc for processing.
5. a kind of laser boring method according to claim 1 and 2, is characterized in that: the diameter of setting doughnut picture is Φ pixel number, and the focal distance f of zoom system, pancreatic system is pressed following formula and regulated:
，
Wherein, W is the aperture in hole to be processed, and D is the pixel dimension of LCOS, and I is the pixel number that LCOS contains compared with minor face, and λ is the wavelength of the laser beam that laser instrument produces, and base material to be processed obtains the focusing circular arc for processing.
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| CN105397313A (en) * | 2015-12-29 | 2016-03-16 | 中国科学院西安光学精密机械研究所 | Laser drilling device for hard and brittle material and drilling method |
| CN112692453B (en) * | 2020-12-16 | 2022-07-15 | 西安中科微精光子科技股份有限公司 | Method, system and medium for identifying a gas film hole penetration area using a high speed camera |
| CN113118632B (en) * | 2021-04-08 | 2022-03-22 | 北京理工大学 | Method for shaping and processing one-way flow surface based on electronic dynamic regulation and control space |
| CN114227028B (en) * | 2021-12-29 | 2022-09-13 | 中国科学院西安光学精密机械研究所 | Spiral scanning laser punching head and punching method |
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