CN106842606B - A kind of optical diffraction device and preparation method thereof and three-dimensional display apparatus - Google Patents
A kind of optical diffraction device and preparation method thereof and three-dimensional display apparatus Download PDFInfo
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- CN106842606B CN106842606B CN201710222207.7A CN201710222207A CN106842606B CN 106842606 B CN106842606 B CN 106842606B CN 201710222207 A CN201710222207 A CN 201710222207A CN 106842606 B CN106842606 B CN 106842606B
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/42—Diffraction optics, i.e. systems including a diffractive element being designed for providing a diffractive effect
- G02B27/46—Systems using spatial filters
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70058—Mask illumination systems
- G03F7/7015—Details of optical elements
- G03F7/70158—Diffractive optical elements
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70408—Interferometric lithography; Holographic lithography; Self-imaging lithography, e.g. utilizing the Talbot effect
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- Optics & Photonics (AREA)
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- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Abstract
The invention discloses a kind of nanoscale structures optical diffraction devices based on Random Laser speckle.The diffraction structure unit of the structure optical diffraction device only has several hundred nanometers or even tens nanometers, has high resolution, the advantages such as contrast height and field angle are big.On this basis, the invention also provides a kind of production method of nanoscale diffractive optical element, phase of ascending the throne optical interference photoetching process.The depth perception structure optical diffraction device of high-quality can be prepared using this method.Compared to traditional optical element processing technology, there is phase optical interference photoetching process in position proposed by the present invention high resolution and position to match the advantages such as precision height, compared with the photoetching techniques such as UV projection exposure and electron-beam direct writing, photoetching technique proposed by the present invention advantages such as fast, at low cost with speed.
Description
Technical field
The present invention relates to display equipment technical fields, more specifically to a kind of optical diffraction device towards depth perception
Part and preparation method thereof and three-dimensional display apparatus.
Background technique
Vision is how mankind's observation and the cognition most direct approach in the world with the continuous improvement that the mankind pursue allow machine
Device or smart machine have the 3D visual ability of similar human eye, to realize man-machine natural interaction, people and network
Interaction between the virtual interacting in the world, even machine and machine becomes hot technology at present.The precondition of human-computer interaction
The 3-D image that machine or smart machine can establish real scene, this just need machine or smart machine to real scene into
Row depth perception, obtains the depth information of real scene, wherein the key technology utilized is known as depth perception technology.Depth perception
Technology as obtain 3-D image key common technology, to push virtual reality, augmented reality, intelligent robot, unmanned plane,
The deep development of the new industries such as smart phone, intelligent monitoring, shaping medical treatment plays indispensable role.The sense of depth of mainstream
Know that technology includes three kinds, stereovision technique, flight time law technology and structured light technique.Compared to first two depth perception skill
Art, structured light technique has not by environment shadow sound, Stereo Matching Algorithm is simple, the depth information that obtains is more stable accurate etc. excellent
Gesture in current and future a very long time, will become the mainstream technology in the fields such as human-computer interaction, the acquisition of smart machine depth.
Kinect series depth camera that the typical products of currently employed structure light depth perception technology have Microsoft to produce, Google
Structure light depth perception mould group and Microsoft Hololens depth camera head etc. used in Project tango project.
According to the difference of Forming Mechanism, structure light can be divided into illuminating projection type and laser diffraction type.Illuminating projection type structure
Resolution ratio, field angle and the depth of focus of light all have the limitation of itself, and compared to the former, laser diffraction type structure light is because of its optics
The diffraction characteristic of structure and the structure light image that higher quality can be obtained.With augmented reality, machine vision, smart phone etc.
Requirement of the depth perception application field to high quality three-dimensional depth information is higher and higher, and laser diffraction type structured light technique is just gradually
As acquisition high-resolution, the mainstream technology means of high matching precision three-dimensional depth information.Microsoft body feeling interaction equipment Kinect
The depth perception mould group of a generation is exactly that laser speckle image is formed by diffraction optical element to obtain the depth letter of real-world object
Breath.
In structure light cognition technology, the structure light image obtained from testee surface is reflection target object three-dimensional appearance
Information source, therefore the characteristics such as the resolution ratio of structure light image, contrast, field angle are directly related to the reliability of depth information
With accuracy.Resolution ratio, contrast and the field angle of laser diffraction type structure light image depend on the diffraction list of structured optical elements
Elemental size and position match precision.So far, using kinect depth camera as representative structure light application in, structure optical diffraction
The diffraction element size of element is only capable of being confined to micron dimension, which greatly limits the resolution ratio of structure light image, contrast and
The characteristics such as field angle, it is difficult to sufficiently show the advantage of diffraction type structure light.
Summary of the invention
In order to obtain the structure light image of higher quality, the invention proposes a kind of nanoscales based on Random Laser speckle
Optical diffraction device.The optical diffraction device has high resolution, the advantages such as contrast height and field angle are big.Photoetching proposed by the present invention
Technology advantages such as fast, at low cost with speed.
In order to achieve the above objectives, technical scheme is as follows:
A kind of production method of optical diffraction device, comprising the following steps:
S1 calculates the second order frequency spectrum bitmap of random speckle using Fourier Transform Algorithm；
S2, by second order frequency spectrum bitmap pattern feature machining to transparent substrates surface, forming position phase depth is embossment structure
Phase-type diffraction optical element.
The production method that the present invention proposes a kind of nanoscale diffractive optical element, phase of ascending the throne optical interference photoetching process.Utilize the party
Method can prepare the depth perception optical diffraction device of high-quality.Compared to traditional optical element processing technology, the present invention is mentioned
There is position phase optical interference photoetching process out high resolution and position to match the advantages such as precision height, with UV projection exposure and electronics
The photoetching techniques such as beam direct write are compared, photoetching technique proposed by the present invention advantages such as fast, at low cost with speed.
Preferably, step s2 the following steps are included:
S21 prepares micron order phase-type diffraction optical element first, i.e., by the second order frequency spectrum bitmap of the random speckle
Black and white distribution is worked into transparent substrates surface, forms the micron order phase-type diffraction of the surface relief type of micron order phase-type second order
Optical element；
S22 coats photoresist layer on transparent substrates surface, micron order phase-type diffraction optical element is placed in a Xiang Guang
Direct-write photoetching is carried out in the interference lithography direct-writing device of field, this micron order phase-type diffraction optical element graphic structure is turned in proportion
It is carved into the photoresist layer on transparent substrates surface, forms nanoscale optical diffraction element after etching.
Preferably, in step s22, according to grating equation:
Λ sin θ=± m λ, m=0,1,2 ...
If the minimum diffraction element of diffraction optical element having a size of D1, carries out position phase optical interference light under projection objective
It carves, obtained minimum diffraction element size meets the relational expression of D2=(D1/a)/2, and wherein a is the miniature multiplying power of projection objective.
In general it is preferred that a=5-100 times of miniature multiplying power.
If the minimum diffraction element of micron order phase-type diffraction optical element is having a size of D1, in miniature multiplying power a=5-100d
Projection objective under carry out the optical interference photoetching of position phase, obtained minimum diffraction element size meets the relationship of D2=(D1/a)/2
Formula.Such as when D1=10 μm, a=50, according to above-mentioned relation formula, D2=0.1 μm is obtained.
Preferably, in step s22, it is miniature by lens for turning to carve in proportion and laser interference lithography combines and meets and receives
The photolithography method of the resolution ratio of meter level.
So as to reach nanoscale resolution ratio and a high position matches precision, the high position precision that matches determines structure light
High contrast；By grating equation it is found that in the case that wavelength is certain, the angle of diffraction and diffraction element size of diffraction optical element
It is inversely proportional, diffraction element size is smaller, and the angle of diffraction is bigger, so nanoscale structures optical diffraction device can be realized big field angle
Structure light image.
Preferably, in step s22, institute's rheme phase optical interference photoetching direct-writing device includes:
Generating device of laser；
Extender lens, the laser beam that the generating device of laser occurs form collimated light beam by extender lens；
Spatial light modulator, collimated light beam carry out spot shaping by spatial light modulator, form a hot spot beam；
4f optical module, hot spot beam image in the diffraction optical element plane of back focal plane by 4f optical module, are formed more
Beam diffraction light；
Projection objective, diffraction light carry out interference exposure by the photoresist layer that projection objective converges at transparent substrates surface,
Form nanoscale structures optical diffraction figure.
Preferably, in step s22, micron order phase-type diffraction optical element is placed in institute's rheme phase optical interference photoetching
In direct-writing device, it is then turned on generating device of laser；
The laser beam that the generating device of laser occurs forms collimated light beam by extender lens；
Collimated light beam carries out spot shaping by spatial light modulator, forms the hot spot beam an of specific shape；
Hot spot beam images in the diffraction optical element plane of back focal plane by 4f optical module, forms multi beam diffraction light；
Diffraction light carries out interference exposure by the photoresist layer that projection objective converges at transparent substrates surface, forms nanoscale
Structure light diffraction pattern.
Preferably, in step s22, photoetching offset plate figure is transferred in transparent substrates by dry etching, ultimately forms position
Phase depth is the nanoscale optical diffraction element of relief type.
The present invention also provides a kind of micron order phase-type diffraction optical elements, i.e. the surface relief type diffraction optics member of second order
Part, the black and white distribution of the random speckle frequency spectrum bitmap including transparent substrates and setting transparent substrates surface, the random speckle frequency
The black and white of spectrum bitmap is distributed as the surface relief of micron order second order.
The present invention also provides a kind of optical diffraction devices, the random speckle frequency including transparent substrates and setting transparent substrates surface
The black and white distribution of bitmap is composed, the black and white of the random speckle frequency spectrum bitmap is distributed as the surface relief of nanoscale second order.
The present invention also provides a kind of three-dimensional display apparatus, and optical diffraction device or above-mentioned light including above method preparation spread out
Emitter part.
Detailed description of the invention
It in order to more clearly illustrate the technical solutions in the embodiments of the present invention, below will be in embodiment technical description
Required attached drawing is briefly described, it should be apparent that, the accompanying drawings in the following description is only some realities of the invention
Example is applied, it for those of ordinary skill in the art, without creative efforts, can also be according to these attached drawings
Obtain other attached drawings.
Fig. 1 is that the signal for generating the bitonal bitmap of random speckle is calculated using the fast fourier transform algorithm of laser diffraction
Figure；
Fig. 2 is the schematic diagram using Fourier Transform Algorithm by speckle bitmap-converted for second order frequency spectrum bitmap；
Fig. 3 is by second order frequency spectrum bitmap pattern feature machining to transparent substrates surface, and forming position phase depth is embossment structure
Nanoscale phase-type diffraction optical element schematic diagram；
Fig. 4 is the schematic diagram of the visual field angular dependence of diffraction angle and nanoscale structures optical diffraction device；Fig. 5 is to utilize position phase
The schematic diagram of optical diffraction device of the optical interference photoetching direct-writing device preparation towards depth perception；
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
A kind of production method of optical diffraction device, comprising the following steps:
S1 is calculated using the fast fourier transform algorithm (being also possible to other Fourier Transform Algorithms) of laser diffraction
The second order frequency spectrum bitmap of random speckle；As depicted in figs. 1 and 2.
S2, by second order frequency spectrum bitmap pattern feature machining to transparent substrates surface, forming position phase depth is embossment structure
Phase-type diffraction optical element.As shown in Figure 3.
The production method that the present invention proposes a kind of nanoscale diffractive optical element, phase of ascending the throne optical interference photoetching process.Utilize the party
Method can prepare the depth perception structure optical diffraction device of high-quality.Compared to traditional optical element processing technology, this hair
There is the position phase optical interference photoetching process of bright proposition high resolution and position to match the advantages such as precision height, with UV projection exposure and
The photoetching techniques such as electron-beam direct writing are compared, photoetching technique proposed by the present invention advantages such as fast, at low cost with speed.
Step s2 the following steps are included:
S21 prepares micron order phase-type diffraction optical element first, i.e., by the black and white of the random speckle frequency spectrum bitmap point
Cloth is worked into transparent substrates surface, forms the micron order phase-type diffraction optical element of the surface relief type of second order；
S22 coats photoresist layer on transparent substrates surface, micron order phase-type diffraction optical element is placed in a Xiang Guang
Direct-write photoetching is carried out in the interference lithography direct-writing device of field, this micron order phase-type diffraction optical element graphic structure is turned in proportion
It is carved into the photoresist layer on transparent substrates surface, forms nanoscale optical diffraction element after etching.Preferably, in step s22, according to light
Grid equation:
Λ sin θ=± m λ, m=0,1,2 ...
If the minimum diffraction element of micron order phase-type diffraction optical element is having a size of D1, such as in miniature multiplying power a=5-
Phase optical interference photoetching in position is carried out under 100 projection objective, obtained minimum diffraction element size meets D2='s (D1/a)/2
Relational expression.Such as when D1=10 μm, a=50, according to above-mentioned relation formula, D2=0.1 μm is obtained.
Preferably, in step s22, it is miniature by lens for turning to carve in proportion and laser interference lithography combines and meets and receives
The photolithography method of the resolution ratio of meter level.So as to reach nanoscale resolution ratio and a high position matches precision, a high position matches
Precision determines the high contrast of structure light；By grating equation it is found that in the case that wavelength is certain, the diffraction of diffraction optical element
Angle and diffraction element size are inversely proportional, and diffraction element size is smaller, and diffraction angle is bigger, so nanoscale optical diffraction device can
Realize the structure light image of big field angle, such as Fig. 4.The position phase depth that wherein transparent substrates 7 and its surface are formed is embossment structure
71。
As shown in figure 5, in step s22, institute's rheme phase optical interference photoetching direct-writing device includes:
Generating device of laser 1 (laser)；
Extender lens 2, the laser beam that the generating device of laser 1 occurs form collimated light beam by extender lens 2；
Spatial light modulator SLM element 3, collimated light beam by SLM element 3 (Spatial Light Modulator) into
Row spot shaping forms the hot spot beam an of characteristic shape；
4f optical module 4 (4f optical system), hot spot beam image in the micro- of back focal plane by 4f optical module 4
5 plane of meter level phase-type diffraction optical element forms multi beam diffraction light；
Projection objective 6 (Objective lens), diffraction light converge at the light on 7 surface of transparent substrates by projection objective 6
Photoresist layer carries out interference exposure, forms nanoscale optical diffraction figure.
The reflector (Reflector) 82 and 82 for changing beam direction is additionally provided in Fig. 5, this can according to need
It chooses whether to need or how much needs setting.
Preferably, in step s22, the micron order phase-type diffraction optical element 5 made is placed in a phase light field and is done
It relates in photoetching direct-writing device, as shown in figure 5, being then turned on generating device of laser 1；
The laser beam that the generating device of laser 1 occurs forms collimated light beam by extender lens 2；
Collimated light beam is whole by SLM element 3 (Spatial Light Modulator, spatial light modulator) progress hot spot
Shape forms the hot spot beam an of specific shape；
Hot spot beam images in 5 plane of micron order phase-type diffraction optical element of back focal plane by 4f optical module 4, is formed
Multi beam diffraction light；
Diffraction light carries out interference exposure by the photoresist layer that projection objective 6 converges at 7 surface of transparent substrates, forms nanometer
Grade optical diffraction figure.
Finally, photoetching offset plate figure is transferred in transparent substrates by dry etching, ultimately forming a phase depth is embossment
The nanoscale optical diffraction element of type, i.e., towards the optical diffraction device of depth perception.
In conclusion compared with the prior art, production method provided by the invention improves the precision of minimum diffraction element,
To improve resolution ratio, field angle, and the regularity of the minimum diffraction element of production can be made relatively good, to ensure that light
Sharpness after diffraction, improves contrast.
The present invention also provides a kind of micron order phase-type diffraction optical elements, i.e. the surface relief type diffraction optics member of second order
Part, the black and white distribution of the random speckle frequency spectrum bitmap including transparent substrates and setting transparent substrates surface, the random speckle frequency
The black and white of spectrum bitmap is distributed as the surface relief of micron order second order.
The present invention also provides a kind of optical diffraction devices towards depth perception, including transparent substrates and setting transparent substrates table
The black and white of the random speckle frequency spectrum bitmap in face is distributed, and the black and white of the random speckle frequency spectrum bitmap is distributed as the table of nanoscale second order
Face embossment.
It is the light towards depth perception the invention proposes a kind of nanoscale optical diffraction device based on Random Laser speckle
Diffractive optical element.The diffraction structure unit of the optical diffraction device only has several hundred nanometers or even tens nanometers, has high resolution, right
The advantages such as bigger than Du Gao and field angle.
The present invention also provides a kind of three-dimensional display apparatus, the optical diffraction device towards depth perception including preceding method preparation
Part or the optical diffraction device and video generation device above-mentioned towards depth perception.How the correlation of three-dimensional display apparatus is constructed
Technical solution, first patent and the prior art have related description, repeat no more.
Above-mentioned transparent substrates 7 can choose the preparation of the transparent materials such as quartz glass, transparent resin.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, similar portion may refer to each other between each embodiment.To being stated in the disclosed embodiments
It is bright, it enables those skilled in the art to implement or use the present invention.Various modifications to these embodiments are to this field
It will be apparent for professional technician, the general principles defined herein can not depart from spirit of the invention
Or in the case where range, realize in other embodiments.Therefore, the present invention will not be by limitation and these implementations shown in this article
Example, and it is to fit to the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. a kind of production method of optical diffraction device, which comprises the following steps:
S1 calculates the second order frequency spectrum bitmap of random speckle using Fourier Transform Algorithm；
Second order frequency spectrum bitmap pattern feature machining to transparent substrates surface is formed the position phase that position phase depth is embossment structure by s2
Type diffraction optical element；Wherein, step " s2 " specifically:
S21 prepares micron order phase-type diffraction optical element first, i.e., by the black and white of the second order frequency spectrum bitmap of the random speckle
Distribution is worked into transparent substrates surface, forms the micron order phase-type diffraction optical element of the surface relief type of second order；
S22 coats photoresist layer on transparent substrates surface, micron order phase-type diffraction optical element is placed in a phase light field and is done
It relates to and carries out direct-write photoetching in photoetching direct-writing device, this micron order phase-type diffraction optical element graphic structure is turned to be carved into proportion
The photoresist layer on transparent substrates surface forms nanoscale optical diffraction element after etching.
2. the production method of optical diffraction device according to claim 1, which is characterized in that in step s22, according to grating side
Journey:
Λ sin θ=± m λ, m=0,1,2 ...
Wherein, Λ is expressed as grating constant, and θ is expressed as the angle of diffraction, and λ is expressed as wavelength；
If the minimum diffraction element of diffraction optical element having a size of D1, phase optical interference photoetching in position is carried out under projection objective, is obtained
To minimum diffraction element size meet the relational expression of D2=(D1/a)/2, wherein a is the miniature multiplying power of projection objective.
3. the production method of optical diffraction device according to claim 2, which is characterized in that in step s22, turn to carve in proportion
It is by the way that lens are miniature and laser interference lithography combines and meet the photolithography method of nanoscale resolution ratio.
4. the production method of optical diffraction device according to claim 1, which is characterized in that in step s22, institute's rheme phase light
Interference lithography direct-writing device includes:
Generating device of laser；
Extender lens, the laser beam that the generating device of laser occurs form collimated light beam by extender lens；
Spatial light modulator, collimated light beam carry out spot shaping by spatial light modulator, form a hot spot beam；
4f optical module, hot spot beam image in the diffraction optical element plane of back focal plane by 4f optical module, form multi beam and spread out
Penetrate light；
Projection objective, diffraction light carry out interference exposure by the photoresist layer that projection objective converges at transparent substrates surface, are formed
Nanoscale structures optical diffraction figure.
5. the production method of optical diffraction device according to claim 4, which is characterized in that in step s22, by micron level
Facies pattern diffraction optical element is placed in institute's rheme phase optical interference photoetching direct-writing device, is then turned on generating device of laser；
The laser beam that the generating device of laser occurs forms collimated light beam by extender lens；
Collimated light beam carries out spot shaping by spatial light modulator, forms the hot spot beam an of specific shape；
Hot spot beam images in the diffraction optical element plane of back focal plane by 4f optical module, forms multi beam diffraction light；
Diffraction light carries out interference exposure by the photoresist layer that projection objective converges at transparent substrates surface, forms nanoscale structures
Optical diffraction figure.
6. the production method of optical diffraction device according to claim 5, which is characterized in that in step s22, carved by dry method
Photoetching offset plate figure is transferred in transparent substrates by erosion, ultimately forms the nanoscale optical diffraction element that a phase depth is relief type.
7. a kind of optical diffraction device, which is characterized in that using the production of the optical diffraction device as described in claim 1 to 6 is any
Made by method, the optical diffraction device includes the black of the random speckle frequency spectrum bitmap on transparent substrates and setting transparent substrates surface
The black and white of white distribution, the random speckle frequency spectrum bitmap is distributed as the surface relief of nanoscale second order.
8. a kind of three-dimensional display apparatus, which is characterized in that the optical diffraction device including any the method preparation of such as claim 1-6
Part or optical diffraction device as claimed in claim 7.
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| CN106842606B (en) * | 2017-04-06 | 2019-04-05 | 苏州苏大维格光电科技股份有限公司 | A kind of optical diffraction device and preparation method thereof and three-dimensional display apparatus |
| CN107229126A (en) * | 2017-07-18 | 2017-10-03 | 苏州大学 | A kind of micro-nano light field builds modulating system and method in real time |
| US10922828B2 (en) | 2017-07-31 | 2021-02-16 | Samsung Electronics Co., Ltd. | Meta projector and electronic apparatus including the same |
| KR102464366B1 (en) * | 2017-07-31 | 2022-11-07 | 삼성전자주식회사 | Meta projector and electronic apparatus including the same |
| CN109878076A (en) * | 2017-12-06 | 2019-06-14 | 苏州苏大维格光电科技股份有限公司 | Three-dimensional structure Method of printing and system |
| CN113330339B (en) * | 2019-01-31 | 2023-10-20 | Ａｇｃ株式会社 | Diffraction optical element, projection device using the diffraction optical element, and measurement device |
| CN115265425B (en) * | 2022-06-14 | 2024-09-27 | 中国科学院光电技术研究所 | Evaluation method for influence of microscopic morphology of diffraction element on macroscopic performance |
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| CN1385764A (en) * | 2002-05-31 | 2002-12-18 | 苏州苏大维格数码光学有限公司 | Optical storage method utilizing light variation image |
| JP2007155927A (en) * | 2005-12-01 | 2007-06-21 | Dainippon Printing Co Ltd | Diffraction optical element manufacturing method, diffraction optical element and reticle mask used in the manufacturing method |
| CN1949025A (en) * | 2006-10-30 | 2007-04-18 | 华中科技大学 | Process for preparing phase regulating diffraction light grating encrypted anti-false identifier |
| CN101846890A (en) * | 2010-05-13 | 2010-09-29 | 苏州苏大维格光电科技股份有限公司 | Parallel photoetching write-through system |
| CN103246195A (en) * | 2013-05-08 | 2013-08-14 | 苏州苏大维格光电科技股份有限公司 | 3D laser printing method and system |
| CN103870863A (en) * | 2014-03-14 | 2014-06-18 | 华中科技大学 | Method for preparing hidden two-dimensional image holographic anti-counterfeit label and identification device thereof |
Also Published As
| Publication number | Publication date |
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| WO2018184375A1 (en) | 2018-10-11 |
| CN106842606A (en) | 2017-06-13 |
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