CN101842313A - 微机械系统 - Google Patents
微机械系统 Download PDFInfo
- Publication number
- CN101842313A CN101842313A CN200880113985A CN200880113985A CN101842313A CN 101842313 A CN101842313 A CN 101842313A CN 200880113985 A CN200880113985 A CN 200880113985A CN 200880113985 A CN200880113985 A CN 200880113985A CN 101842313 A CN101842313 A CN 101842313A
- Authority
- CN
- China
- Prior art keywords
- micro mechanical
- substrate
- mechanical system
- suspension arrangement
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 66
- 239000000725 suspension Substances 0.000 claims abstract description 41
- 239000010410 layer Substances 0.000 claims description 31
- 239000002346 layers by function Substances 0.000 claims description 28
- 238000013016 damping Methods 0.000 claims description 22
- 230000033001 locomotion Effects 0.000 claims description 14
- 230000001133 acceleration Effects 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052710 silicon Inorganic materials 0.000 claims description 6
- 239000010703 silicon Substances 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 238000006243 chemical reaction Methods 0.000 claims description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 229910021419 crystalline silicon Inorganic materials 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 241000299354 Acalles micros Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000010421 standard material Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
- B81B7/0009—Structural features, others than packages, for protecting a device against environmental influences
- B81B7/0012—Protection against reverse engineering, unauthorised use, use in unintended manner, wrong insertion or pin assignment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102007052367.1 | 2007-11-02 | ||
DE200710052367 DE102007052367A1 (de) | 2007-11-02 | 2007-11-02 | Mikromechanisches System |
PCT/EP2008/063116 WO2009056420A2 (de) | 2007-11-02 | 2008-10-01 | Mikromechanisches system |
Publications (1)
Publication Number | Publication Date |
---|---|
CN101842313A true CN101842313A (zh) | 2010-09-22 |
Family
ID=40514303
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200880113985A Pending CN101842313A (zh) | 2007-11-02 | 2008-10-01 | 微机械系统 |
Country Status (4)
Country | Link |
---|---|
CN (1) | CN101842313A (de) |
DE (1) | DE102007052367A1 (de) |
TW (1) | TWI471258B (de) |
WO (1) | WO2009056420A2 (de) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102530827A (zh) * | 2010-11-23 | 2012-07-04 | 霍尼韦尔国际公司 | 振动隔离内插器管芯 |
CN103213934A (zh) * | 2012-01-23 | 2013-07-24 | 罗伯特·博世有限公司 | 微机械结构和用于制造微机械结构的方法 |
CN104418285A (zh) * | 2013-08-26 | 2015-03-18 | 罗伯特·博世有限公司 | 微机械构件和用于制造微机械构件的方法 |
CN104422436A (zh) * | 2013-08-26 | 2015-03-18 | 罗伯特·博世有限公司 | 微机械结构元件和用于制造微机械结构元件的方法 |
CN108872638A (zh) * | 2017-05-08 | 2018-11-23 | 株式会社村田制作所 | 电容式微电子机械加速度计 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104891419B (zh) * | 2015-06-29 | 2016-11-09 | 歌尔股份有限公司 | 一种mems惯性传感器及其制造方法 |
DE102021202573B3 (de) | 2021-03-16 | 2022-07-07 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung eingetragener Verein | Mems-schallwandler mit ausnehmungen und auskragungen |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5536988A (en) * | 1993-06-01 | 1996-07-16 | Cornell Research Foundation, Inc. | Compound stage MEM actuator suspended for multidimensional motion |
DE19526903B4 (de) * | 1995-07-22 | 2005-03-10 | Bosch Gmbh Robert | Drehratensensor |
US6330102B1 (en) * | 2000-03-24 | 2001-12-11 | Onix Microsystems | Apparatus and method for 2-dimensional steered-beam NxM optical switch using single-axis mirror arrays and relay optics |
US6632698B2 (en) * | 2001-08-07 | 2003-10-14 | Hewlett-Packard Development Company, L.P. | Microelectromechanical device having a stiffened support beam, and methods of forming stiffened support beams in MEMS |
KR100431004B1 (ko) * | 2002-02-08 | 2004-05-12 | 삼성전자주식회사 | 회전형 비연성 멤스 자이로스코프 |
US20050066728A1 (en) * | 2003-09-25 | 2005-03-31 | Kionix, Inc. | Z-axis angular rate micro electro-mechanical systems (MEMS) sensor |
US7187100B2 (en) * | 2004-04-20 | 2007-03-06 | Advanced Numicro Systems, Inc. | Dimensions for a MEMS scanning mirror with ribs and tapered comb teeth |
KR100652952B1 (ko) * | 2004-07-19 | 2006-12-06 | 삼성전자주식회사 | 커플링 스프링을 구비한 멤스 자이로스코프 |
-
2007
- 2007-11-02 DE DE200710052367 patent/DE102007052367A1/de not_active Withdrawn
-
2008
- 2008-10-01 WO PCT/EP2008/063116 patent/WO2009056420A2/de active Application Filing
- 2008-10-01 CN CN200880113985A patent/CN101842313A/zh active Pending
- 2008-10-31 TW TW97141910A patent/TWI471258B/zh not_active IP Right Cessation
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102530827A (zh) * | 2010-11-23 | 2012-07-04 | 霍尼韦尔国际公司 | 振动隔离内插器管芯 |
CN103213934A (zh) * | 2012-01-23 | 2013-07-24 | 罗伯特·博世有限公司 | 微机械结构和用于制造微机械结构的方法 |
CN104418285A (zh) * | 2013-08-26 | 2015-03-18 | 罗伯特·博世有限公司 | 微机械构件和用于制造微机械构件的方法 |
CN104422436A (zh) * | 2013-08-26 | 2015-03-18 | 罗伯特·博世有限公司 | 微机械结构元件和用于制造微机械结构元件的方法 |
CN108872638A (zh) * | 2017-05-08 | 2018-11-23 | 株式会社村田制作所 | 电容式微电子机械加速度计 |
CN108872638B (zh) * | 2017-05-08 | 2020-12-01 | 株式会社村田制作所 | 电容式微电子机械加速度计 |
Also Published As
Publication number | Publication date |
---|---|
DE102007052367A1 (de) | 2009-05-07 |
TWI471258B (zh) | 2015-02-01 |
WO2009056420A3 (de) | 2009-10-22 |
TW200927637A (en) | 2009-07-01 |
WO2009056420A2 (de) | 2009-05-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C12 | Rejection of a patent application after its publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100922 |