CN101840873A - Method based on flip chip process for connecting chip and antenna - Google Patents
Method based on flip chip process for connecting chip and antenna Download PDFInfo
- Publication number
- CN101840873A CN101840873A CN200910056958A CN200910056958A CN101840873A CN 101840873 A CN101840873 A CN 101840873A CN 200910056958 A CN200910056958 A CN 200910056958A CN 200910056958 A CN200910056958 A CN 200910056958A CN 101840873 A CN101840873 A CN 101840873A
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- China
- Prior art keywords
- chip
- antenna
- flip chip
- antenna substrate
- conducting resinl
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Abstract
The invention relates to a method based on flip chip process for connecting a chip and an antenna. The method comprises the following steps of: firstly, carrying out flip chip on the chip to an antenna base material coated with conductive adhesive by utilizing the flip chip process; secondly, uniformly preheating the antenna base material with the chip, wherein the heating temperature is 45 to 70 DEG C, and the heating time is 8 to 20 seconds; and thirdly, solidifying the conductive adhesive of the antenna base material. In the invention, the solidification intensity of the conductive adhesive is enhanced, and the problem of reducing practical bonded area of the chip because of the existence of air is reduced, thereby ensuring bonding power of the chip to achieve design requirements.
Description
Technical field
The present invention relates to a kind of chip encapsulation technology, particularly disclose a kind of method of attachment of chip and the antenna based on flip chip process.
Background technology
Along with the continuous reduction of RFID continuous advancement in technology and chip cost, the link cost that needs chip also reduces significantly, under this market demand, uses flip chip process to carry out bare chip and is connected with antenna and is at present economy the most and is suitable for large-scale production.
Flip chip process is exactly on a kind of base material (normally polymer such as paper and PET), by modes such as metal etch or printing, vacuum evaporations, form conductive path (being antenna) thereon, then conducting resinl is coated on the antenna, to place on the conducting resinl by the mode of losing money instead of making money sheet without any the bare chip of encapsulation at last, and conducting resinl is solidified by heating and pressurizing, form conduction and connect.
After bare chip is lost money instead of making money sheet, conducting resinl (anisotropy conductiving glue or isotropic conductive adhesive) need be heating and curing, thereby make conducting resinl play fixed chip and make chip and antenna set up the effect that conduction is connected.The decision of this technology chip exposed outside without any protection, so how to improve the bonding strength of chip and antenna, be the most important thing of this technology.
Conducting resinl is produced at it, and can and transit link are all inevitably understood entrained air; Conducting resinl comprises when being coated onto on the antenna substrate with frictioning or some glue isotype in its use, also can contain some air; And, lost money instead of making money sheet on conducting resinl the time when bare chip, the salient point root on the chip also can bring air to conducting resinl.
If these air of sneaking in the conducting resinl can not be excluded, when carrying out hot pressing, conducting resinl is owing to be heated in the short time of 0.5s about 180 ℃, and air wherein will sharply expand tens of times, goes out a no-man's-land in the chip lower impact.This no-man's-land does not have conducting resinl, so can cause the actual bond area of chip less than chip area, the cohesive force of chip and antenna substrate does not reach designing requirement, thereby has reduced the ability of bare chip opposing external force.
Summary of the invention
The objective of the invention is to overcome the defective that exists in the prior art, a kind of method of attachment of chip and the antenna based on flip chip process is provided, the solidification intensity of conducting resinl is improved, reduce because the existence of air makes the problem of the actual bond area minimizing of chip, thereby guarantee that chip attach power reaches designing requirement.
The present invention is achieved in that a kind of method of attachment of chip and the antenna based on flip chip process, comprises the steps:
(1) using flip chip process to lose money instead of making money chip scribbles on the antenna substrate of conducting resinl;
(2) antenna substrate of losing money instead of making money chip is carried out even preheating, preheat temperature is 45～70 ℃, and be 8～20s warm-up time;
(3) conducting resinl on the antenna substrate is heating and curing, is connected thereby make chip and antenna form conduction.
In the described step 2 antenna substrate of losing money instead of making money chip is carried out even preheating, make the temperature difference at any two places on the antenna substrate less than 5 ℃.
Evenly the mode of preheating is the contact heating described in the step 2, radiant type heats or the convection type heating.
When in the above-mentioned steps 2 antenna substrate of losing money instead of making money chip being carried out even preheating, can adopt multiple preheating form, as directly heating to antenna substrate with pyrotoxin; Or a heated sealed case is set outside antenna substrate controls heating-up temperature.When the mode that adopts heating cabinet heats, can adopt the form of machine stepping to come antenna substrate is heated; Also the continuous operation mode of available machines used heats, and the adjustment of heating cabinet remains unanimity by the mode of operation of active adjustment or passive adjusting with the preheat temperature that guarantees antenna substrate.
The invention has the beneficial effects as follows: the present invention is by reduce the air in the conducting resinl as far as possible, increase the bond area of chip, increased the adhesion strength of chip and the ability of opposing external force accordingly, the air pocket of chip bottom is greatly reduced and reduced, the largest air bubbles area is by original 0.15mm
2, be reduced to 0.10mm
2Below; The chip rate of bubble is contained in the bottom, reduces to below 35% by original 40%.The chip cross shear on average increases 3N/mm
2About.
Embodiment
The present invention is based on the method for attachment of the chip and the antenna of flip chip process, comprise the steps:
(1) using flip chip process to lose money instead of making money chip scribbles on the antenna substrate of conducting resinl;
(2) antenna substrate of losing money instead of making money chip is carried out even preheating, the air of conducting resinl inside is overflowed, for fear of the conducting resinl premature setting, preheat temperature is controlled to be 45～70 ℃, and be 8～20s heating time.In order to keep temperature even, the temperature difference that should make any two places on the antenna substrate is less than 5 ℃ when preheating.Evenly the mode of preheating is contact heating, radiant type heating or convection type heating.
(3) conducting resinl on the antenna substrate is heated and pressurization makes its curing, be connected thereby make chip and antenna form conduction.
The present invention is further elaborated with regard to specific embodiment below:
As above-mentioned step, the antenna substrate to chip on losing money instead of making money in step 2 carries out even preheating, and preheat temperature is controlled to be 50 ℃, 60 ℃, 70 ℃ respectively, is controlled to be 8s, 15s, 20s warm-up time respectively, all the other steps such as above-mentioned, and its result such as following table:
| Temperature | Warm-up time | The chip rate that has bubble | The largest air bubbles area | |
| The prior art Comparative Examples | 25 ℃ of normal temperature | Do not have | ??36～40％ | About 0.15mm 2 |
| Embodiment 1 | ??50℃ | ??8s | ??33～35％ | About 0.10mm 2 |
| Embodiment 2 | ??60℃ | ??15s | ??16～20％ | About 0.08mm 2 |
| Embodiment 3 | ??70℃ | ??20s | ??10～12％ | About 0.02mm 2 |
As can be seen from the table, in the existing chip flip chip process, the bubble ratio that chip bottom contains is 40%, and bubble area is generally 0.15mm
2, by the explanation of above-mentioned facility example, the gentle bubble area of the bubble ratio that the invention enables chip bottom to contain all is lower than prior art, thereby makes the bond area of chip increase the adhesion strength of having strengthened chip.
Claims (3)
1. the method for attachment based on the chip and the antenna of flip chip process comprises the steps:
(1) using flip chip process to lose money instead of making money chip scribbles on the antenna substrate of conducting resinl;
(2) antenna substrate of losing money instead of making money chip is carried out even preheating, preheat temperature is 45～70 ℃, and be 8～20s warm-up time;
(3) conducting resinl on the antenna substrate is heating and curing.
2. the method for attachment of chip and the antenna based on flip chip process according to claim 1 is characterized in that: in the described step 2 antenna substrate of losing money instead of making money chip is carried out even preheating, make the temperature difference at any two places on the antenna substrate less than 5 ℃.
3. the method for attachment of stating according to claim 1 or 2 based on the chip and the antenna of flip chip process is characterized in that: described in the step 2 evenly the mode of preheating be contact heating, radiant type heating or convection type heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910056958A CN101840873A (en) | 2009-03-19 | 2009-03-19 | Method based on flip chip process for connecting chip and antenna |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910056958A CN101840873A (en) | 2009-03-19 | 2009-03-19 | Method based on flip chip process for connecting chip and antenna |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101840873A true CN101840873A (en) | 2010-09-22 |
Family
ID=42744167
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910056958A Pending CN101840873A (en) | 2009-03-19 | 2009-03-19 | Method based on flip chip process for connecting chip and antenna |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101840873A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101980255A (en) * | 2010-10-14 | 2011-02-23 | 上海中卡智能卡有限公司 | Anti-counterfeiting electronic tag and manufacturing method thereof |
| CN102254837A (en) * | 2011-04-29 | 2011-11-23 | 永道无线射频标签(扬州)有限公司 | Packaging process of electronic tag inversely stuck sheet packaging production line |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6077382A (en) * | 1997-05-09 | 2000-06-20 | Citizen Watch Co., Ltd | Mounting method of semiconductor chip |
| CN2626064Y (en) * | 2003-07-11 | 2004-07-14 | 上海鲁能中卡智能卡有限公司 | Contactless IC card antenna |
| CN101145212A (en) * | 2007-11-02 | 2008-03-19 | 上海鲁能中卡智能卡有限公司 | Non-contact smart card and its production method |
-
2009
- 2009-03-19 CN CN200910056958A patent/CN101840873A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6077382A (en) * | 1997-05-09 | 2000-06-20 | Citizen Watch Co., Ltd | Mounting method of semiconductor chip |
| CN2626064Y (en) * | 2003-07-11 | 2004-07-14 | 上海鲁能中卡智能卡有限公司 | Contactless IC card antenna |
| CN101145212A (en) * | 2007-11-02 | 2008-03-19 | 上海鲁能中卡智能卡有限公司 | Non-contact smart card and its production method |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101980255A (en) * | 2010-10-14 | 2011-02-23 | 上海中卡智能卡有限公司 | Anti-counterfeiting electronic tag and manufacturing method thereof |
| CN101980255B (en) * | 2010-10-14 | 2012-12-26 | 上海中卡智能卡有限公司 | Anti-counterfeiting electronic tag and manufacturing method thereof |
| CN102254837A (en) * | 2011-04-29 | 2011-11-23 | 永道无线射频标签(扬州)有限公司 | Packaging process of electronic tag inversely stuck sheet packaging production line |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100922 |