CN101826409A - Side control structure of electronic structure and circuit board manufacturing method thereof - Google Patents
Side control structure of electronic structure and circuit board manufacturing method thereof Download PDFInfo
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- CN101826409A CN101826409A CN200910118812A CN200910118812A CN101826409A CN 101826409 A CN101826409 A CN 101826409A CN 200910118812 A CN200910118812 A CN 200910118812A CN 200910118812 A CN200910118812 A CN 200910118812A CN 101826409 A CN101826409 A CN 101826409A
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- circuit board
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- mobile unit
- sidewall
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Abstract
The invention relates to a side control structure of an electronic structure and a circuit board manufacturing method thereof. Particularly, the side control structure comprises a circuit board, a plurality of electrically conductive sections and a mobile unit. The circuit board comprises a side wall; the electrically conductive sections are formed on the side wall of the circuit board; and the mobile unit is provided with at least one conductive section which moves between a first position and a second position. When the conductive section of the mobile unit is located in the first position, the electrically conductive sections are electrically insulated mutually; when the conductive section of the mobile unit is located in the second position, at least two electrically conductive sections among the electrically conductive sections are electrically connected. The mobile unit is arranged related to the electrically conductive sections and can be selectively moved so that the mobile unit is in mutual contact with the electrically conductive sections to realize conduction, and thus, the function of a switch can be realized. The design realizes the function of the circuit board switch by using the self structure of the circuit board, and the space occupied by the circuit board switch can be saved.
Description
Technical field
The present invention relates to a kind of side control structure of electronic installation; Particularly, the present invention relates to a kind of board switch that is made on the circuit board sidewall.
Background technology
Electronic equipment is now stressed compact on volume, relatively the volume of circuit board also is restricted, make the line design of circuit board and the trend that employed electronic building brick also has microminiaturization, flexible circuit board (Flexible Printed Circuit board, FPC) and propagating its belief on a large scale of related application be exactly an example.
Yet in general design, board switch is a kind of electronic building brick that quite takes up space all the time.In order to reduce the shared space of board switch, many different ways have appearred at present.Fig. 1 is traditional rigid circuit board (Rigid Printed Circuitboard, RPC) board switch design diagram, as shown in Figure 1, known circuits switching plate 1 is with surface mount technology (Surface Mount Technology, SMT) or dual in-line package (Dual in-line package, DIP) mode is arranged on circuit board 2 surfaces, touches it by pressing button 3 again.
Fig. 2 is the board switch design diagram of soft or hard convolution circuit board (Rigid-Flexible Printed Circuit Board), as shown in Figure 2, this kind design touches crown cap (metal dome) 6 on the circuit board 5 to finish the function of switch by pressing button 4.Except the needs added metal lid, soft or hard convolution circuit board still has the restriction in many designs, such as the bent angle of soft board its minimum limit is arranged, and the length of soft board also has the restriction of shortest length.
Summary of the invention
The object of the present invention is to provide a kind of side control structure and method of manufacturing circuit board thereof of electronic installation, improve above-mentioned the problems of the prior art, save the shared space of board switch.
The side control structure of electronic installation of the present invention comprises circuit board, conductive part and mobile unit.A plurality of conductive parts are formed at the sidewall of circuit board, and mutually insulated; Mobile unit is provided with respect to a plurality of conductive parts, optionally moves and mobile unit and a plurality of conductive part are in contact with one another and conducting, with the function of realization board switch.This kind design utilizes the structure of circuit board itself to realize the function of board switch, can save the shared space of board switch, and can save the cost of known circuits switching plate or crown cap.
Particularly, the side control structure of electronic installation of the present invention comprises a circuit board, comprises a sidewall; A plurality of conductive parts are formed at described sidewall; And a mobile unit has at least one conducting part, moves between a primary importance and a second place, and wherein when the described conducting part of described mobile unit was positioned at described primary importance, described these conductive parts were electrically insulated mutually; When the described conducting part of described mobile unit is positioned at the described second place, in described these conductive parts that electrically conduct at least two.
The manufacture method of board switch of the present invention comprises the following step: form the side of a plurality of conductive parts in circuit board, make a plurality of conductive part mutually insulateds; With respect to a plurality of conductive parts mobile unit is set, mobile unit is optionally moved and mobile unit and a plurality of conductive part are in contact with one another and conducting, with the function of realization board switch.
Particularly, the manufacture method of circuit board of the present invention comprises that superimposed one first circuit layer, a second circuit layer and a tertiary circuit layer are to form a circuit board, and described second circuit layer is between described first circuit layer and described tertiary circuit layer, and the sidewall sections that described first circuit layer, described second circuit layer and described tertiary circuit layer are respectively had is combined into a sidewall of described circuit board; Respectively at the described sidewall sections of described first circuit layer and described tertiary circuit layer, form one first conductive part and one the 3rd conductive part; And, adjust described circuit board, make described first conductive part and described the 3rd conductive part that are positioned at described circuit board optionally be electrically insulated or electrically conduct.
Description of drawings
Fig. 1 is the board switch design diagram of traditional rigid circuit board;
Fig. 2 is the board switch design diagram of soft or hard convolution circuit board;
Fig. 3 a is an embodiment exploded view of the side control structure of electronic installation of the present invention;
Fig. 3 b is the end view of the circuit board section among the embodiment of side control structure of the electronic installation of the present invention shown in Fig. 3 a;
Fig. 3 c is that body among the embodiment of side control structure of the electronic installation of the present invention shown in Fig. 3 a is at primary importance P
1The time schematic diagram;
Fig. 3 d is that body among the embodiment of side control structure of the electronic installation of the present invention shown in Fig. 3 a is at second place P
2The time schematic diagram;
Fig. 4 a is horizontally placed on the end view of the embodiment on the groove for the conductive part of the side control structure of electronic installation of the present invention;
Fig. 4 b uprightly is arranged at the end view of the embodiment on the groove for the conductive part of the side control structure of electronic installation of the present invention;
Fig. 4 c is horizontally placed on the end view of the embodiment on the flange for the conductive part of the side control structure of electronic installation of the present invention;
Fig. 4 d uprightly is arranged at the end view of the embodiment on the flange for the conductive part of the side control structure of electronic installation of the present invention;
Fig. 4 e is horizontally placed on the end view of the embodiment on the sidewall for the conductive part of the side control structure of electronic installation of the present invention;
Fig. 4 f uprightly is arranged at the end view of the embodiment on the sidewall for the conductive part of the side control structure of electronic installation of the present invention;
Fig. 5 a is the exploded view of another embodiment of the mobile unit part of the side control structure of electronic installation of the present invention;
Fig. 5 b is the exploded view of the another embodiment of the mobile unit part of the side control structure of electronic installation of the present invention;
Fig. 6 is the end view of an embodiment again of the mobile unit part of the side control structure of electronic installation of the present invention;
Fig. 7 a is the exploded view of the another embodiment of the mobile unit part of the side control structure of electronic installation of the present invention;
Fig. 7 b for the sheet metal among the another embodiment of the mobile unit part of the side control structure of electronic installation of the present invention at primary importance P
1The time schematic diagram;
Fig. 7 c for the sheet metal among the another embodiment of the mobile unit part of the side control structure of electronic installation of the present invention at second place P
2The time schematic diagram;
Fig. 8 is the step schematic diagram of first embodiment of method of manufacturing circuit board of the present invention;
Fig. 9 is the step schematic diagram of second embodiment of method of manufacturing circuit board of the present invention;
Figure 10 is the step schematic diagram of the 3rd embodiment of method of manufacturing circuit board of the present invention;
Figure 11 is the step schematic diagram of the 4th embodiment of method of manufacturing circuit board of the present invention;
Figure 12 is the step schematic diagram of the 5th embodiment of method of manufacturing circuit board of the present invention;
Figure 13 is the step schematic diagram of the 6th embodiment of method of manufacturing circuit board of the present invention;
Figure 14 is the step schematic diagram of the 7th embodiment of method of manufacturing circuit board of the present invention;
Figure 15 is the step schematic diagram of the 8th embodiment of method of manufacturing circuit board of the present invention;
Figure 16 is the step schematic diagram of the 9th embodiment of method of manufacturing circuit board of the present invention; And
Figure 17 is the step schematic diagram of the tenth embodiment of method of manufacturing circuit board of the present invention.
The primary clustering symbol description:
10 circuit boards, 20 bodies
11 sidewalls, 201 conducting surfaces
111 grooves, 2011 conductive coatings
1112 projections, 21 sheet metals
112 flanges, 30 shells
113 conductive parts
Embodiment
The invention provides a kind of side control structure and method of manufacturing circuit board thereof of electronic installation.In preferred embodiment, the side control structure of electronic installation of the present invention is applied to various printed circuit board (PCB)s, and (Printed Circuit Board PCB), comprises soft circuit board, rigid circuit board, soft or hard convolution circuit board etc.
Fig. 3 a is an embodiment exploded view of the side control structure of electronic installation of the present invention.Shown in Fig. 3 a, this board switch comprises circuit board 10, mobile unit 20 and shell 30.Fig. 3 b is the end view of the circuit board section among the embodiment of side control structure of the electronic installation of the present invention shown in Fig. 3 a.Shown in Fig. 3 b, circuit board 10 comprises sidewall 11, forms groove 111 on the sidewall 11, forms two conductive parts 113 that insulate mutually each other on the groove 111, and conductive part 113 can be pin (pin).
The set-up mode of conductive part can have multiple choices.At first, conductive part can be formed on the groove.Shown in Fig. 4 a, two conductive parts 113 can be horizontally placed on the last lower edge of groove 111 respectively; Or shown in Fig. 4 b, two conductive parts 113 can uprightly be set up in parallel on groove 111 and across the last lower edge of groove 111.Secondly, conductive part can be formed on the flange of circuit board 10 sidewalls 11.Shown in Fig. 4 c, two conductive parts 113 can be horizontally placed on the last lower edge of flange 112 respectively; Or shown in Fig. 4 d, two conductive parts 113 can uprightly be set up in parallel on flange 112 and across the last lower edge of flange 112.Moreover conductive part also can be formed directly on the sidewall of circuit board and do not need to form especially groove or flange on sidewall.Shown in Fig. 4 e, two conductive parts 113 can be horizontally placed on the sidewall 11; Or shown in Fig. 4 f, two conductive parts 113 can uprightly be arranged on the sidewall 11.
Shown in Fig. 3 a, mobile unit 20 comprises a body, for example button.Body 20 is arranged on the shell 30, and with respect to two conductive parts 113.Fig. 3 c and Fig. 3 d are the embodiment of side control structure, and wherein body 20 is respectively at primary importance P
1And second place P
2Shown in Fig. 3 c, 3d, when pushing body 20, body 20 is from primary importance P
1Toward second place P
2Move, the conducting surface 201 on the body 20 is contacted with two conductive parts 113, and make two conductive part 113 mutual conduction.In the present embodiment, body 20 can be conductive material such as metal, conductive rubber or graphite.Yet in different embodiment, body 20 can be non-conductive material, and a conductive component 2011 is set thereon.Conductive component 2011 is contacted with two conductive parts 113, and then make two conductive part 113 mutual conduction and realize the function of switch.Conductive component 2011 can be the conductive coating on the non-conductive material or attach to sheet metal on the non-conductive material.Shell 30 can be fixed on body 20 position with respect to two conductive parts 113, and assists body 20 actions, to realize the function of switch.
In order to reach the purpose that makes the conductive part mutual conduction, the form of conducting surface 201 can depending on circumstances correspondingly adjust.Shown in Fig. 3 a, the surface of the groove 111 at conductive part 113 places is smooth, so body 20 is also relatively made smooth form with respect to the conducting surface 201 of two conductive parts 113.Yet in other embodiments, the shape of body 20 and the conducting surface 201 of conductive part 113 can make corresponding changes along with the shape on the surface at conductive part 113 places.Fig. 5 a is the exploded view of another embodiment of the mobile unit part of the side control structure of electronic installation of the present invention.Shown in Fig. 5 a, the middle body of groove 111 remains with a projection 1112, this moment, the shape of conducting surface 201 can be corresponding with projection 1112 and form recess, that is form one and be absorbed in portion on body 20, when pushing body 20, projection 1112 is inserted be absorbed in portion, and conducting surface 201 and two conductive parts 113 on the body 20 are in contact with one another, and then make two conductive part 113 mutual conduction.In addition, the distribution situation of the visual conductive part of shape of body and making corresponding changes.Fig. 5 b is the exploded view of the another embodiment of the mobile unit part of the side control structure of electronic installation of the present invention.Shown in Fig. 5 b, two conductive parts 113 uprightly are arranged on the groove 111, so body 20 can be designed to long shape, make body 20 to contact with a plurality of conductive parts 113 simultaneously, and make two conductive part 113 mutual conduction.
The design of mobile unit can adopt a part to be electrically connected at the mode of conductive part.Fig. 6 is the end view of an embodiment again of the mobile unit part of the side control structure of electronic installation of the present invention.As shown in Figure 6, the part of body 20 is electrically connected at one of two conductive parts 113, and another part then optionally moves.Body 20 is contacted with another conductive part 113, and make two conductive part 113 mutual conduction.In the present embodiment, body 20 can be to form a conductive component 2011 on non-conductive material, and push body 20 conductive component 2011 is contacted with two conductive parts 113, and makes two conductive part 113 mutual conduction and realize the function of switch.Yet in different embodiment, body 20 can be conductive material such as metal, conductive rubber or graphite.
In addition, also can a sheet metal be set between body and conductive part, utilize sheet metal to realize the mutual conduction of conductive part.Its advantage be to utilize the elasticity of sheet metal produce body by pressure sensitivity.Shown in Fig. 7 a, the part of sheet metal 21 is electrically connected at one of two conductive parts 113, and another part then is fixed on the sidewall 11.Shown in Fig. 7 b, 7c, push body 20 and can touch sheet metal 21, make sheet metal 21 deformation and from primary importance P
1Toward second place P
2Move, and contact, make two conductive part 113 mutual conduction with another conductive part 113.In the present embodiment, the material of body 20 is not defined as conductive material.
Fig. 8 is the step schematic diagram of first embodiment of method of manufacturing circuit board of the present invention.Steps A 1 comprises superimposed first, second and tertiary circuit layer, make the second circuit layer this first and the tertiary circuit layer between, wherein first and a side of tertiary circuit layer have groove, make each circuit layer have the sidewall of the corresponding built-up circuit plate of a side of groove.Steps A 2 comprises the formation coat of metal on sidewall.Steps A 3 comprises the coat of metal that keeps in the groove, removes the coat of metal of other parts, to form the first and the 3rd conductive part of two mutually insulateds.In this embodiment, the part that is positioned at groove in the second circuit layer is removed, and removed the coat of metal on it simultaneously.Steps A 4 comprises body is arranged on the shell to adjust circuit board, makes body corresponding to the first and the 3rd conductive part, when pushing body body and the first and the 3rd conductive part is in contact with one another and conducting.When pushing body 20, body 20 is from primary importance P
1Toward second place P
2Move, the conducting surface 201 on the body 20 is contacted with two conductive parts 113, and make two conductive part 113 mutual conduction (please participating in simultaneously shown in Fig. 3 c and Fig. 3 d).In preferred embodiment, the mode that forms the coat of metal is for electroplating; The mode of removing the coat of metal is laser engraving, etching or drilling; The material of body can be metal, conductive rubber or graphite, or there is the non-conductive material of the conductive coating of metal, conductive rubber or graphite material on the surface.
In addition, in different embodiment, the part that the second circuit layer is positioned at groove also can not add removal with the formation projection, yet prerequisite is independent and insulation for keeping first and second conductive part.Shown in Fig. 5 a, when remaining with projection in the groove, steps A 2 also is included in the corresponding with it portion that is absorbed in is set on the body, can make the projection insertion be absorbed in portion when pushing body, and body and other conductive parts are in contact with one another and conducting.
Fig. 9 is the step schematic diagram of second embodiment of method of manufacturing circuit board of the present invention.Step B1 comprises superimposed first, second and tertiary circuit layer, make the second circuit layer this first and the tertiary circuit layer between, wherein first and a side of tertiary circuit layer have flange, make each circuit layer have the sidewall of the corresponding built-up circuit plate of a side of flange.Step B2 comprises the formation coat of metal on sidewall.Step B3 comprises the coat of metal that keeps in the flange, removes the coat of metal of other parts, to form the first and the 3rd conductive part of two mutually insulateds.In preferred embodiment, the mode of removing the coat of metal is laser engraving, etching or drilling.Step B4 comprises body is arranged on the shell to adjust circuit board, makes body corresponding to the first and the 3rd conductive part, when pushing body body and the first and the 3rd conductive part is in contact with one another and conducting.In preferred embodiment, the mode that forms the coat of metal among the step B2 is for electroplating.The mode of removing the coat of metal among the step B3 is laser engraving, etching or drilling.Body in the steps A 4 can be metal, conductive rubber or graphite material, or there is the non-conductive material body of the conductive coating of metal, conductive rubber or graphite material on the surface.
Figure 10 is the step schematic diagram of the 3rd embodiment of method of manufacturing circuit board of the present invention.Step C1 comprises provides circuit board; Wherein circuit board is made up of first, second and tertiary circuit layer.Three overlapped settings of circuit layer, make the second circuit layer this first and the tertiary circuit layer between, and make the sidewall of a side built-up circuit plate of each circuit layer.Step C2 comprises and runs through this superposing circuit layer, to form groove in the sidewall of circuit board.Step C3 comprises the formation coat of metal on groove.Step C4 comprises the coat of metal of removing a part, to form the first and the 3rd conductive part of two mutually insulateds.The first and the 3rd conductive part can adopt the form of uprightly (shown in Fig. 4 a) or level (shown in Fig. 4 b) to be arranged on the groove.Step C5 comprises body is arranged on the shell to adjust circuit board, makes body corresponding to the first and the 3rd conductive part, when pushing body, body and the first and the 3rd conductive part is in contact with one another and conducting.In preferred embodiment, the mode that forms groove is drilling.
Figure 11 is the step schematic diagram of the 4th embodiment of method of manufacturing circuit board of the present invention.Step D1 comprises provides circuit board.Circuit board is made up of first, second and tertiary circuit layer, three overlapped settings of circuit layer, make the second circuit layer this first and the tertiary circuit layer between, and make the sidewall of a side built-up circuit plate of each circuit layer.Step D2 runs through a side of each superposing circuit layer, removes other parts and forms the sidewall of flange in circuit board.Step D3 comprises the formation coat of metal on flange.Step D4 comprises the coat of metal of removing a part, to form the first and the 3rd conductive part of two mutually insulateds.The first and the 3rd conductive part can adopt the form of uprightly (shown in Fig. 4 c) or level (shown in Fig. 4 d) to be arranged on the flange.Step D5 comprises body is arranged on the shell to adjust circuit board, makes body corresponding to the first and the 3rd conductive part, when pushing body body and the first and the 3rd conductive part is in contact with one another and conducting.In preferred embodiment, the mode that forms flange among the step D2 is drilling.
Figure 12 is the step schematic diagram of the 5th embodiment of method of manufacturing circuit board of the present invention.Step e 1 comprises provides circuit board.Circuit board is made up of first, second and tertiary circuit layer, three overlapped settings of circuit layer, make the second circuit layer this first and the tertiary circuit layer between, and make the sidewall of a side built-up circuit plate of each circuit layer.Step e 2 comprises at least two grooves of formation in the part of the sidewall of circuit board.In this embodiment, this two groove is respectively from first and tertiary circuit layer drilling and form groove two opposite edges up and down in the sidewall of circuit board.Step e 3 comprises formation one coat of metal on the sidewall of circuit board.Step e 4 comprises the coat of metal that keeps in the groove, removes the coat of metal of other parts, to form the first and the 3rd conductive part of two mutually insulateds.Step e 5 comprises body is arranged on the shell to adjust circuit board, makes body corresponding to the first and the 3rd conductive part, when pushing body body and the first and the 3rd conductive part is in contact with one another and conducting.
Figure 13 is the step schematic diagram of the 6th embodiment of method of manufacturing circuit board of the present invention.Step F 1 comprises provides circuit board, comprises sidewall.Circuit board is made up of first, second and tertiary circuit layer, three overlapped settings of circuit layer, make the second circuit layer this first and the tertiary circuit layer between, and make the sidewall of a side built-up circuit plate of each circuit layer.Step F 2 comprises other parts of removal and forms the part of at least two flanges in the sidewall of circuit board.In this embodiment, this step be respectively from first and the drilling of tertiary circuit layer form flange in two opposite edges up and down of the sidewall of circuit board.Step F 3 comprises the formation coat of metal on the sidewall of circuit board.Step F 4 comprises the coat of metal that keeps in the flange, removes the coat of metal of other parts, to form the first and the 3rd conductive part of two mutually insulateds.Step F 5 comprises body is arranged on the shell to adjust circuit board, makes body corresponding to the first and the 3rd conductive part, when pushing body body and the first and the 3rd conductive part is in contact with one another and conducting.
Figure 14 is the step schematic diagram of the 7th embodiment of method of manufacturing circuit board of the present invention.Step G1 comprises provides circuit board.Circuit board is made up of first, second and tertiary circuit layer, three overlapped settings of circuit layer, make the second circuit layer this first and the tertiary circuit layer between, and make the sidewall of a side built-up circuit plate of each circuit layer.Step G2 comprises a side that runs through each superposing circuit layer, forms groove in the sidewall of circuit board.Step G3 comprise form two mutually insulateds the first and the 3rd conductive part in groove.Step G4 comprise respective slot be provided with body on shell to adjust circuit board, make the part of body be electrically connected at one of the first and the 3rd conductive part, another that push that body can make body and the first and the 3rd conductive part is in contact with one another and conducting.In preferred embodiment, the mode that forms the first and the 3rd conductive part among the step G3 is for electroplating.
Figure 15 is the step schematic diagram of the 8th embodiment of method of manufacturing circuit board of the present invention.Step H1 comprises provides circuit board.Circuit board is made up of first, second and tertiary circuit layer, three overlapped settings of circuit layer, make the second circuit layer this first and the tertiary circuit layer between, and make the sidewall of a side built-up circuit plate of each circuit layer.Step H2 comprises a side that runs through each superposing circuit layer, removes other parts and forms the sidewall of flange in circuit board.Step H3 comprise form two mutually insulateds the first and the 3rd conductive part in flange.Step H4 comprise corresponding flange be provided with a body on shell to adjust circuit board, make the part of body be electrically connected at one of the first and the 3rd conductive part, another that push that body can make body and the first and the 3rd conductive part is in contact with one another and conducting.
Figure 16 is the step schematic diagram of the 9th embodiment of method of manufacturing circuit board of the present invention.Step I1 comprises provides circuit board.Circuit board is made up of first, second and tertiary circuit layer, three overlapped settings of circuit layer, make the second circuit layer this first and the tertiary circuit layer between, and make the sidewall of a side built-up circuit plate of each circuit layer.Step I2 comprises a side that runs through each superposing circuit layer, forms groove in the sidewall of circuit board.Step I3 comprise form two mutually insulateds the first and the 3rd conductive part in groove.Step I4 comprises respective slot one sheet metal is set, and makes the one end be electrically connected at one of the first and the 3rd conductive part, and the other end then is fixed on the sidewall of circuit board in modes such as welding.Step I5 comprise corresponding sheet metal be provided with a body on shell to adjust circuit board, can make sheet metal deformation when pushing body, and make sheet metal and the first and the 3rd conductive part another be in contact with one another and conducting.Shown in Fig. 7 b, 7c, push body 20 and can touch sheet metal 21, make sheet metal 21 deformation and from primary importance P
1Toward second place P
2Move, and contact, make two conductive part 113 mutual conduction with another conductive part 113.
Figure 17 is the step schematic diagram of the tenth embodiment of method of manufacturing circuit board of the present invention.Step J1 comprises provides circuit board.Circuit board is made up of first, second and tertiary circuit layer, three overlapped settings of circuit layer, make the second circuit layer this first and the tertiary circuit layer between, and make the sidewall of a side built-up circuit plate of each circuit layer.Step J2 comprise form two mutually insulateds the first and the 3rd conductive part in the sidewall of circuit board.The first and the 3rd conductive part can adopt the form of uprightly (shown in Fig. 4 e) or level (shown in Fig. 4 f) to be formed at the sidewall of circuit board.In preferred embodiment, the mode of available plating forms the first and the 3rd conductive part.Step J3 comprises body is arranged on the shell to adjust circuit board, makes body corresponding to the first and the 3rd conductive part, when pushing body body and the first and the 3rd conductive part is in contact with one another and conducting.
Be noted that, though the present invention illustrate as embodiment with the circuit board that the overlapping setting of a plurality of circuit layers forms, yet the single circuit board that the present invention also can adopt upper and lower surface to have different circuit layers is implemented.Design variation by on up and down different circuit layers or each circuit layer can make the conductive part of board switch utilize constructive variations directly to be formed on the side of circuit board, in order to form the flush type circuit switching plate.Can overcome so that additional circuit switching plate in the known technology takes up space very much or the problem of soft or hard convolution circuit board restriction in design, reach the function that the structure of effectively utilizing circuit board itself realizes board switch, save the required space of board switch is set.
The present invention is described by above-mentioned related embodiment, yet the foregoing description is only for implementing example of the present invention.It must be noted that disclosed embodiment does not limit the scope of the invention.On the contrary, be contained in the modification of the spirit of claims scope and scope and be equal to be provided with and all be contained in the scope of the present invention.
Claims (33)
1. the side control structure of an electronic installation comprises:
One circuit board comprises a sidewall;
A plurality of conductive parts are formed at described sidewall; And
One mobile unit has at least one conducting part, moves between a primary importance and a second place, and wherein when the described conducting part of described mobile unit was positioned at described primary importance, described these conductive parts were electrically insulated mutually; When the described conducting part of described mobile unit is positioned at the described second place, in described these conductive parts that electrically conduct at least two.
2. the side control structure of electronic installation as claimed in claim 1, wherein said conducting part is a sheet metal, and wherein when described mobile unit during in described primary importance, described sheet metal is electrically connected in described a plurality of conductive part, when described mobile unit moved to the described second place, described sheet metal produced deformation and makes described at least two in described these conductive parts to electrically conduct.
3. the side control structure of electronic installation as claimed in claim 1, wherein said mobile unit comprises a body, and described conducting part is a conducting surface of described body.
4. the side control structure of electronic installation as claimed in claim 1, wherein said mobile unit comprises a body, and described conducting part is that a conductive component is connected in described body.
5. the side control structure of electronic installation as claimed in claim 4, wherein said conductive component is a conductive coating on the described body or a sheet metal that attaches to described body.
6. the side control structure of electronic installation as claimed in claim 1, the described sidewall of wherein said circuit board comprises groove, wherein said a plurality of conductive parts are formed in the described groove.
7. the side control structure of electronic installation as claimed in claim 6, wherein said mobile unit comprises a body, and described conducting part is a sheet metal, the corresponding described groove of described sheet metal is arranged at the described sidewall of described circuit board.
8. the side control structure of electronic installation as claimed in claim 6, comprise that also a projection is arranged in the described groove, and described mobile unit comprises having a body that is absorbed in portion, and the wherein said portion of being absorbed in has the shape of corresponding described projection, and described conducting part is positioned at the described portion that is absorbed in.
9. the side control structure of electronic installation as claimed in claim 1, the described sidewall of wherein said circuit board comprises flange, wherein said a plurality of conductive parts are formed on the described flange.
10. the side control structure of electronic installation as claimed in claim 9, wherein said mobile unit comprises a body, and described conducting part is a sheet metal, the corresponding described flange of described sheet metal is arranged at the described sidewall of described circuit board.
11. the side control structure of electronic installation as claimed in claim 1, wherein said circuit board is made up of a plurality of circuit layers, and the overlapped setting of described a plurality of circuit layer makes a sidewall sections of each described circuit layer form the described sidewall of described circuit board.
12. uprightly being separated by, the side control structure of electronic installation as claimed in claim 11, wherein said a plurality of conductive parts be arranged at described these sidewall sections of described a plurality of circuit layers.
13. being separated by, the side control structure of electronic installation as claimed in claim 11, wherein said a plurality of conductive part levels be arranged at described these sidewall sections of described a plurality of circuit layers.
14. the side control structure of electronic installation as claimed in claim 1, wherein said mobile unit comprises a body, and described body is embedded on the shell movably, and described conducting part is positioned at the corresponding described a plurality of conductive parts of described shell.
15. the side control structure of electronic installation as claimed in claim 14, the material of wherein said body comprises metal, conductive rubber, graphite or non-conducting material.
16. the manufacture method of a circuit board comprises:
Superimposed one first circuit layer, a second circuit layer and a tertiary circuit layer are to form a circuit board, and described second circuit layer is between described first circuit layer and described tertiary circuit layer, and the sidewall sections that described first circuit layer, described second circuit layer and described tertiary circuit layer are respectively had is combined into a sidewall of described circuit board;
Respectively at the described sidewall sections of described first circuit layer and described tertiary circuit layer, form one first conductive part and one the 3rd conductive part; And
Adjust described circuit board, make described first conductive part and described the 3rd conductive part that are positioned at described circuit board optionally be electrically insulated or electrically conduct.
17. the manufacture method of circuit board as claimed in claim 16, the step of the described circuit board of wherein said adjustment comprises provides the mobile unit with a conducting part, make that described first conductive part and described the 3rd conductive part are electrically insulated mutually when the described conducting part of described mobile unit is positioned at a primary importance; When the described conducting part of described mobile unit was positioned at a second place, described first conductive part and described the 3rd conductive part electrically conducted.
18. the manufacture method of circuit board as claimed in claim 17, wherein said mobile unit comprises that a body and described conducting part are a sheet metal, described method also comprises and electrically connects described sheet metal in described first conductive part and described the 3rd conductive part, when described mobile unit moved to the described second place, described sheet metal produced deformation and described first conductive part and described the 3rd conductive part is electrically conducted.
19. the manufacture method of circuit board as claimed in claim 16, the step that wherein forms described first conductive part and described the 3rd conductive part comprises:
Form the described sidewall of at least one groove in described circuit board; And
Form described first conductive part and described the 3rd conductive part in described groove.
20. the manufacture method of circuit board as claimed in claim 19, wherein said first conductive part and described the 3rd conductive part uprightly are separated by and are arranged at described groove.
21. the manufacture method of circuit board as claimed in claim 19, wherein said first conductive part and described the 3rd conductive part level are separated by and are arranged at described groove.
22. the manufacture method of circuit board as claimed in claim 19, the step that wherein forms described first conductive part and described the 3rd conductive part comprises:
Form a coat of metal on the described groove of described circuit board; And
Remove the described coat of metal of a part, to form described first conductive part and described the 3rd conductive part.
23. the manufacture method of circuit board as claimed in claim 19 wherein forms described groove and comprises in the step of the described sidewall of described circuit board: the described sidewall sections at described first circuit layer and described tertiary circuit layer respectively forms a groove respectively.
24. the manufacture method of circuit board as claimed in claim 23 is wherein respectively before or after the step that the described sidewall sections of described first circuit layer and described tertiary circuit layer respectively forms described groove is executed in described superimposed step.
25. the manufacture method of circuit board as claimed in claim 23, the step that wherein forms described first conductive part and described the 3rd conductive part comprises:
Form a coat of metal on the described sidewall of described circuit board; And
Keep the described coat of metal in described these grooves, remove the described coat of metal of other parts, to form described first conductive part and described the 3rd conductive part.
26. the manufacture method of circuit board as claimed in claim 19, the step that wherein forms described groove also is included in and remains with a projection in the described groove, and the step of the described circuit board of described adjustment comprises provides a mobile unit, wherein said mobile unit comprises a body and a conducting part, described method comprises that also forming one is absorbed in portion in described body, make the described portion of being absorbed in have the shape of corresponding described projection, when the described conducting part of described mobile unit was positioned at a primary importance, described first conductive part and described the 3rd conductive part were electrically insulated mutually; When the described conducting part of described mobile unit was positioned at a second place, described first conductive part and described the 3rd conductive part electrically conducted.
27. the manufacture method of circuit board as claimed in claim 16, the step that wherein forms described first conductive part and described the 3rd conductive part comprises:
Form the described sidewall of at least one flange in described circuit board; And
Form described first conductive part and described the 3rd conductive part in described flange.
28. the manufacture method of circuit board as claimed in claim 27, wherein said first conductive part and described the 3rd conductive part uprightly are separated by and are arranged at described flange.
29. the manufacture method of circuit board as claimed in claim 27, wherein said first conductive part and described the 3rd conductive part level are separated by and are arranged at described flange.
30. the manufacture method of circuit board as claimed in claim 27, the step that wherein forms described first conductive part and described the 3rd conductive part comprises:
Form a coat of metal on the described flange of described circuit board; And
Remove a part of described coat of metal, form described first conductive part and described the 3rd conductive part.
31. the manufacture method of circuit board as claimed in claim 27 wherein forms described flange and comprises in the step of the described sidewall of described circuit board: the described sidewall sections at described first circuit layer and described tertiary circuit layer respectively forms a flange respectively.
32. the manufacture method of circuit board as claimed in claim 31 is wherein respectively before or after the step that the described sidewall sections of described first circuit layer and described tertiary circuit layer respectively forms described flange is executed in described superimposed step.
33. as the manufacture method of claim 22,25 or 30 described circuit boards, the method for wherein removing the described coat of metal comprises laser engraving, etching or drilling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910118812A CN101826409B (en) | 2009-03-02 | 2009-03-02 | Side control structure of electronic structure and circuit board manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910118812A CN101826409B (en) | 2009-03-02 | 2009-03-02 | Side control structure of electronic structure and circuit board manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101826409A true CN101826409A (en) | 2010-09-08 |
| CN101826409B CN101826409B (en) | 2012-09-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910118812A Active CN101826409B (en) | 2009-03-02 | 2009-03-02 | Side control structure of electronic structure and circuit board manufacturing method thereof |
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| Country | Link |
|---|---|
| CN (1) | CN101826409B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102458059A (en) * | 2010-10-22 | 2012-05-16 | 深圳市新国都技术股份有限公司 | Protection cover with conductive coating protection circuit and point-of-sale (POS) equipment consisting of protection cover |
| CN108666154A (en) * | 2017-03-29 | 2018-10-16 | 硬蛋科技（北京）有限公司 | Hand-held electronic equipment and its control assembly |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3099165B2 (en) * | 1993-06-28 | 2000-10-16 | セイコーインスツルメンツ株式会社 | Electronic device having switch mechanism and method of manufacturing substrate |
| KR200362288Y1 (en) * | 2004-06-07 | 2004-09-21 | 전배경 | switch module for cellular phones |
| CN201114242Y (en) * | 2007-10-09 | 2008-09-10 | 中兴通讯股份有限公司 | Sliding type side key device and mobile phones employing same |
-
2009
- 2009-03-02 CN CN200910118812A patent/CN101826409B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102458059A (en) * | 2010-10-22 | 2012-05-16 | 深圳市新国都技术股份有限公司 | Protection cover with conductive coating protection circuit and point-of-sale (POS) equipment consisting of protection cover |
| CN108666154A (en) * | 2017-03-29 | 2018-10-16 | 硬蛋科技（北京）有限公司 | Hand-held electronic equipment and its control assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101826409B (en) | 2012-09-05 |
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