CN101821755A - 多部分分布式天线排列 - Google Patents

多部分分布式天线排列 Download PDF

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CN101821755A
CN101821755A CN200880104645A CN200880104645A CN101821755A CN 101821755 A CN101821755 A CN 101821755A CN 200880104645 A CN200880104645 A CN 200880104645A CN 200880104645 A CN200880104645 A CN 200880104645A CN 101821755 A CN101821755 A CN 101821755A
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CN101821755B (zh
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J·阿里维奥里
A·阿尔科
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G06K19/07756—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna the connection being non-galvanic, e.g. capacitive

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Abstract

一种多部分分布式天线排列(10)，包括：天线排列(2)，作为第一部分；以及半导体芯片(4)，作为第二部分，其与第一部分电化分隔，其中半导体芯片包括集成射频电路(6)和用于将集成射频电路与天线元件无线耦合的耦合元件(8)。

Description

多部分分布式天线排列
技术领域
本发明的实施方式涉及天线排列。
背景技术
现在，天线排列包括印刷线路板(PWB)是很常见的，在该PWB上安装有天线元件以及相连接的射频部件，使得能够使用天线元件进行接收和/或发射。
天线元件和射频部件可以占据与PWB相邻的大量体积。这一限制可能影响可以将哪些其他部件定位在PWB上或其附近，以及由此可能影响无线电通信装置的功能。
因此，期望提供改进的天线排列。
发明内容
根据本发明的各种实施方式，提供了一种多部分分布式天线排列，包括：天线排列，作为第一部分；以及半导体芯片，作为第二部分，其与第一部分电化分隔，其中半导体芯片包括集成射频电路和用于将集成射频电路与天线元件无线耦合的无线耦合元件。
将射频部件集成在半导体芯片内节省了空间，而第一部分和第二部分之间的电磁耦合在对这些部分进行定位方面提供了更大的设计自由度。
根据本发明的各种实施方式，提供了一种半导体芯片，包括：集成射频电路和配置用于将集成射频电路与片外天线元件电磁耦合的耦合元件。
根据本发明的各种实施方式，提供了一种天线排列，包括：芯片；片外天线元件；片载射频电路；和片载耦合元件，用于将片载射频电路与片外天线元件无线耦合。
根据本发明的各种实施方式，提供了一种制造无线电通信装置的方法，包括：在半导体芯片附近定位天线元件，其中半导体芯片包括射频电路和用于将射频电路与天线元件无线耦合的耦合元件。天线元件可以与无线电通信装置的外壳集成在一起，并且可以通过组装该外壳来定位天线元件。
附图说明
为了更好地理解本发明的各种实施方式，现在仅通过示例的方式来参考附图，其中：
图1、图2和图3示意性地示出了多部分分布式天线排列10，其包括作为第一部分的天线元件和作为第二部分的半导体芯片；
图4示意性地示出了用于该分布式天线排列的可能插入损耗(S11)曲线图；
图5示意性地示出了用于与天线元件耦合的螺旋形导体；以及
图6示意性地示出了包括分布式天线排列的无线电通信装置。
具体实施方式
图1、图2和图3示意性地示出了多部分分布式天线排列10，其包括：作为分离的第一部分的天线元件2；和作为分离的第二部分的半导体芯片4，其通过间隙14与第一部分电化(galvanically)分隔。电化分隔的意思是天线元件2和半导体芯片4并不由提供携带电流通路的信号的连接来进行连接。它们可以由例如可以是气隙或居间材料的电介质分隔。在某些实施方式中，天线元件2和半导体芯片4可以“电化隔离”。电化隔绝的意思是天线元件2和半导体芯片4并不由提供直流电流通路的连接来连接。
半导体芯片4可以包括衬底，诸如单片半导体衬底。该衬底可以是绝缘体上硅。
术语“片载”将用于描述位于衬底中或衬底上的部件。术语“集成在芯片上”将用于描述在半导体芯片制造期间集成在衬底中或衬底上的部件，这与在制造之后附接于半导体芯片的部件形成对比。术语“片外”将用于描述物理上与衬底分隔的部件。
半导体芯片4包括连接至片载导体8的片载射频电路6。导体8被配置用于将集成射频电路6与片外天线元件2电磁耦合12。天线元件2可以是片外的、唯一的射频部件。
导体8操作为对片外天线元件2的寄生馈电(feed)。导体8可以具有如图5所示的螺旋形状。片外天线可以例如被配置为偶极带或贴片。
射频电路6集成在芯片上。根据实现，导体8可以位于芯片上，或者可以集成在芯片上。
当导体8集成在芯片上时，其操作为耦合元件，该耦合元件被配置用于将集成射频电路6与片外天线元件2电磁耦合12。
当导体8位于芯片上时，集成在芯片上的节点9用于与导体8电化连接。节点9操作为耦合元件，该耦合元件被配置用于使用导体8来将集成射频电路6与片外天线元件2电磁耦合12。
集成射频电路6包括放大电路16、18。如果射频电路6操作为接收器，则其可以在接收器电路(Rx)中包括低噪声放大器16。如果射频电路6操作为发射器，则其可以在发射器电路(Tx)中包括低功率放大器18。射频电路可以包括一个接收器电路(Rx)，如图1和图2所示，或者可以包括不止一个接收器电路(Rx1，Rx2)，如图3所示。射频电路可以包括一个发射器电路(Tx)，如图2和图3所示，或者可以包括不止一个发射器电路(未示出)。
图4示意性地示出了具有操作频带22的天线排列10的可能的插入损耗(S11)曲线图20。根据天线排列10的设计，其可以具有不止一个操作频带。然而，只示出了一个频带。
该附图具有第一曲线24，其代表在片外天线元件2如图1至图3所示那样出现时，天线排列的插入损耗。天线排列10具有与可操作频带相符的操作带宽。天线排列在此频带处足以有效地操作为接收器和/或发射器。
该频带可以例如覆盖以下一个或多个频带：AM无线电(0.535-1.705MHz)；FM无线电(76-108MHz)；蓝牙(2400-2483.5MHz)；WLAN(2400-2483.5MHz)；HLAN(5150-5850MHz)；GPS(1570.42-1580.42MHz)；US-GSM 850(824-894MHz)；EGSM 900(880-960MHz)；EU-WCDMA 900(880-960MHz)；PCN/DCS 1800(1710-1880MHz)；US-WCDMA 1900(1850-1990MHz)；WCDMA2100(Tx：1920-1980MHz Rx：2110-2180MHz)；PCS 1900(1850-1990MHz)；较低UWB(3100-4900MHz)；较高UWB(6000-10600MHz)；DVB-H(470-702MHz)；DVB-H US(1670-1675MHz)；DRM(0.15-30MHz)；WiMax(2300-2400MHz，2305-2360MHz，2496-2690MHz，3300-3400MHz，3400-3800MHz，5250-5875MHz)；DAB(174.928-239.2MHz，1452.96-1490.62MHz)；RFID LF(0.125-0.134MHz)；RFID HF(13.56-13.56MHz)；RFID UHF(433MHz，865-956MHz，2450MHz).
该附图具有第二曲线26，其代表在移除片外天线元件2时，天线排列的插入损耗。所得到的结构并不具有与可操作频带相符的操作带宽。该结构在此频带22处并不足以有效地操作为接收器和/或发射器。导体8与天线元件2的紧密相邻使得导体8能够在频带22处操作为对寄生天线元件2的有效电磁(寄生)无线馈电12。在天线元件2与导体8经由诸如空气的电介质(而不是电化连接)相耦合的意义上来说，馈电12是“无线的”。在没有寄生天线元件2的情况下，导体6本身不能在期待的频带22处操作为天线。
寄生天线元件2提高了效率。在不具有寄生天线元件2的情况下，频带22中的效率可以小于5％，而在具有寄生天线元件2的情况下，频带22中的效率可以大于60％，即，效率超出十倍还多。
导体8可以是片载谐振电路的一部分。谐振电路定义导体8与宽带天线元件2之间的耦合频率。如果在天线2处存在大的带宽(带宽～1GHz到6GHz)，则通过改变谐振电路的相对窄带谐振频率，天线排列10的可操作带宽可以调谐到该大的带宽范围的任何一处。
如果天线元件2具有例如多谐振结构，则片载谐振电路可以动态地适用于无线地耦合12至天线元件2谐振的任何一个。
参考图2，集成射频电路6包括低噪声放大电路16和功率放大电路18。半导体芯片4还包括与天线元件2的第一部分19A相邻的第一导体8A，其将低噪声放大电路16与天线元件2电磁耦合，以用于无线电接收。半导体芯片4还包括与第一导体8A分隔且不同的第二导体8B。第二导体8B与天线元件2的第二部分19B相邻，并且将功率放大电路18与天线元件2电磁耦合，以用于无线电发射。
尽管将单个天线元件2描述为由分隔的导体8A和8B共享，但是在其他实施方式中，可以为各个分隔且不同的导体8A、8B的每一个提供分隔且不同的天线元件。
参考图3，该天线排列类似于图2中所示的天线排列。然而，集成射频电路6包括两个低噪声放大电路161和162。放大电路161、162和18的每一个电化连接至其各自不同且分隔的导体8A、8B和8C，这些导体分别与同一天线元件2的第一部分19A、第二部分19B和第三部分19C相邻。提供两个接收器Rx1和Rx2，以用于分集接收。
天线元件2可以在天线元件2的第二部分19B和第三部分19C之间具有槽，以便在天线元件2的用于接收的部分与用于发射的部分之间提供隔离。
尽管将单个天线元件2描述为由分隔的导体8A、8B和8C共享，但是在其他实施方式中，可以为各个分隔且不同的导体8A、8B和8C的每一个提供分隔且不同的天线元件。
图6示意性地示出了包括一个或多个所描述天线排列10的装置40。装置40是无线电通信装置，其可以被配置用于操作为接收器或发射器或收发器。
装置40可以是手持式装置或者手机。
装置40包括外壳44，其定义该装置的内腔48。该腔不需要是完全封闭的，即，在该外壳中可以有孔。腔48提供了用于至少容纳半导体芯片4的容积。
在所示实施方式中，印刷线路板(PWB)42在腔48内得到支撑。半导体芯片4附接到PWB 42。
天线元件2是外壳44的一部分。在此实施方式中，该外壳具有定义腔48的内表面46。外壳44的内表面46与半导体芯片4相对的部分承载寄生天线元件2。这使得在组装该外壳时，天线元件2能够与芯片4的导体8紧密相邻。将天线元件2集成在外壳44内还在PWB42上释放了用于其他部件的空间。
尽管在上文中针对各种示例描述了本发明的实施方式，但是应当理解，可以在不脱离本发明范围的前提下对给出的示例做出改进。
除了明确描述的组合之外，在上文中描述的特征可以在其他组合中使用。
尽管在上文中将注意力集中于本发明中被认为尤其重要的那些特征，但是应当理解，申请人要求保护附图中示出的和/或上文涉及的任何可取得专利的特征或特征的组合，无论特别强调与否。

Claims (29)

1.一种多部分分布式天线排列，包括：
天线元件，作为第一部分；以及
半导体芯片，作为第二部分，其与所述第一部分电化分隔，
其中所述半导体芯片包括集成射频电路和用于将所述集成射频电路与所述天线元件无线耦合的无线耦合元件。
2.如权利要求1所述的多部分分布式天线排列，其中所述无线耦合元件提供所述集成射频电路和所述天线元件之间的寄生馈电。
3.如前述任一权利要求所述的多部分分布式天线排列，其中在所述天线元件存在时，所述排列在第一频带处可操作，而如果所述天线元件被移除，则所述排列在所述第一频带处不可操作。
4.如前述任一权利要求所述的多部分分布式天线排列，其中所述集成射频电路包括放大电路。
5.如前述任一权利要求所述的多部分分布式天线排列，其中所述排列在第一频带处可操作，并且其中所述无线耦合元件是连接到导体的节点，该导体被定制并被定位为在第一频带处与所述天线元件无线耦合。
6.如前述任一权利要求所述的多部分分布式天线排列，其中所述排列在第一频带处可操作，并且其中所述无线耦合元件是导体，该导体被定制并被定位以在第一频带处与所述天线元件无线耦合。
7.如权利要求6所述的多部分分布式天线排列，其中所述导体与所述半导体芯片集成。
8.如前述任一权利要求所述的多部分分布式天线排列，其中所述集成射频电路包括第一放大电路和第二放大电路，并且所述半导体芯片包括与所述天线元件的第一部分相邻的第一无线耦合元件，以用于将所述第一放大电路与所述天线元件无线耦合，和与所述天线元件的第二部分相邻的第二无线耦合元件，以用于将所述第二放大电路与所述天线元件无线耦合。
9.如权利要求8所述的多部分分布式天线排列，其中所述第一放大电路用于接收，而所述第二放大电路用于发射。
10.如权利要求8所述的多部分分布式天线排列，其中所述第一放大电路用于接收，而所述第二放大电路用于分集接收。
11.如权利要求8所述的多部分分布式天线排列，其中所述第一放大电路用于在第一频带处接收，而所述第二放大电路用于在不同的第二频带处同时接收。
12.如权利要求8所述的多部分分布式天线排列，其中所述天线元件在所述第一部分和所述第二部分之间具有槽。
13.如前述任一权利要求所述的多部分分布式天线排列，其中所述半导体芯片是绝缘体上硅芯片。
14.一种无线电通信装置，包括如前述任一权利要求所述的多部分分布式天线排列。
15.如权利要求14所述的无线电通信装置，包括外壳，其定义容纳半导体芯片的腔，其中所述外壳在与所述半导体芯片相邻的位置处承载天线元件。
16.如权利要求14所述的无线电通信装置，包括外壳，其定义容纳半导体芯片的腔，其中所述外壳是在与所述半导体芯片相邻位置处的天线元件。
17.一种半导体芯片，包括：
集成射频电路和配置用于将所述集成射频电路与片外天线元件无线耦合的无线耦合元件。
18.如权利要求17所述的半导体芯片，其中所述集成射频电路包括放大电路。
19.如权利要求17或18所述的半导体芯片，其中所述无线耦合元件包括导体，该导体被定制并被定位以在第一频带处与天线元件无线耦合。
20.如权利要求17-19中任一所述的半导体芯片，其中所述导体集成在所述半导体芯片内。
21.如权利要求17-20中任一所述的半导体芯片，其中所述集成射频电路包括第一放大电路和第二放大电路，所述半导体芯片包括第一无线耦合元件，用于与所述天线元件的第一部分相邻定位，和第二无线耦合元件，用于与所述天线元件的第二部分或不同的天线元件相邻定位。
22.如权利要求21所述的半导体芯片，其中所述第一放大电路用于接收，而所述第二放大电路用于发射。
23.如权利要求21所述的半导体芯片，其中所述第一放大电路用于接收，而所述第二放大电路用于接收。
24.如权利要求17-23中任一所述的半导体芯片，其中所述半导体芯片是绝缘体上硅芯片。
25.一种天线排列，包括：
芯片；
片外天线元件；
片载射频电路；和
片载无线耦合元件，用于将所述片载射频电路与所述片外天线元件无线耦合。
26.一种制造无线电通信装置的方法，包括：将天线元件与半导体芯片相邻定位，其中所述半导体芯片包括射频电路和用于将所述射频电路与所述天线元件无线耦合的耦合元件。
27.如权利要求26所述的制造无线电通信装置的方法，其中所述天线元件与所述无线电通信装置的外壳集成在一起，并且通过组装所述外壳来定位所述天线元件。
28.一种多部分分布式天线排列，包括：
天线元件，作为第一部分；和
半导体芯片，作为第二部分，其与所述第一部分分隔，
其中所述半导体芯片包括集成射频电路和用于将所述集成射频电路与所述天线元件无线耦合的无线耦合元件。
29.一种多部分分布式天线排列，包括：
天线元件，作为第一部分；以及
半导体芯片，作为第二部分，其与所述第一部分电化分隔，其中所述半导体芯片包括集成射频电路和用于将所述集成射频电路与所述天线元件无线耦合的无线装置。
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