CN101809718A - Sticking method and sticking device of sticking material - Google Patents
Sticking method and sticking device of sticking material Download PDFInfo
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- CN101809718A CN101809718A CN200880109523A CN200880109523A CN101809718A CN 101809718 A CN101809718 A CN 101809718A CN 200880109523 A CN200880109523 A CN 200880109523A CN 200880109523 A CN200880109523 A CN 200880109523A CN 101809718 A CN101809718 A CN 101809718A
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- adsorption
- adsorption plane
- semiconductor crystal
- protective tapes
- crystal wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
A porous member (38), which is formed planarly while having a large number of adsorption holes and has an adsorption surface (12) formed to be large enough to cover the surface of a member to be stuck, i.e. a semiconductor wafer (16), is provided. An adsorption plate (18) sealed hermetically an the entire surface thereof excepting the adsorption surface (12) while holding the porous member (38), and a suction pump (42c) for causing a negative pressure in the adsorption holes of the adsorption surface (12) by sucking air in the porous member (38) are provided. A protective tape (14) is stuck to the surface of the semiconductor wafer (16) and the adsorption surface (12) of the adsorption plate (18) is made to abut against the protective tape (14). The surface of the protective tape (14) is sucked to ward the adsorption surface (12) side by means of the pump (42c) so that the protective tape (14) on the surface of the semiconductor wafer (16) is allowed to follow the profile of the adsorption surface (12).
Description
Technical field
The invention relates in the manufacturing step of for example semiconductor article; for the component surface that get adhered such as semiconductor crystal wafer of protecting formation such as carrying out the particular electrical circuit pattern to handle, will stick together felting method that sticks together material and mount device that material is attached to this member that gets adhered.
Background technology
In manufacturing field of semiconductor subassembly etc., in recent years, MEMS (micro electro mechanical system)) etc. along with semi-conductive densification, (Micro-Electro-Mechanical System: the concavo-convex bigger wafer on surface increases day by day to be formed with the wafer of concavo-convex bigger projection etc. or MEMS on the surface.On the other hand, along with the progress of small-sized, the slimming of semiconductor package body, and then require the slimming of semiconductor crystal wafer itself.
So, in the manufacturing step of semiconductor article, be formed with the semiconductor crystal wafer of majority circuit pattern or assembly etc. as mentioned above in the surface, according to need and after grinding (back grinding) step of attenuation with grinding back surface, via the cutting step that is cut off by each functional unit, and be divided into each semiconductor chip.With the grinding back surface of semiconductor crystal wafer or etching the time,, paste protective tapes at this semiconductor wafer surface with tackness in order to protect semiconductor surface.By the semiconductor crystal wafer that this protective tapes is protected, be under state by the sucker absorption face side that maintains, the back side is implemented the processing of grinding etc.
As the known felting method that protective tapes is attached to semiconductor wafer surface; be that known technology as patent documentation 1 discloses; have the semiconductor crystal wafer mounting in mounting table; the face that makes the protective tapes of coiling tubular be provided with adhesive agent disposes towards semiconductor wafer surface; and mounting is sticked together roller on this protective tapes; apply specific pushing force on one side; the rotation that makes is on one side moved; so that protective tapes is attached to semiconductor wafer surface; protective tapes cut into the method for the toroidal of semiconductor crystal wafer thereafter.
Again; the invention as patent documentation 1 similarly discloses; motion is arranged: use cutter (cutter) that protective tapes is cut into specific size in advance; the protective tapes absorption of being downcut is remained on the formed non-adsorption plane that sticks together the absorptive table of face side of porous ceramic; and it is indoor to move to vacuum treatment together with absorptive table under this state; on one side make the adsorption plane of absorptive table swing into flat-hand position from inclination attitude, in absorption remain in the method for semiconductor wafer surface pushing splice protection adhesive tape wafer mounting table on one side.
Patent documentation 1: TOHKEMY 2001-148412 communique
Summary of the invention
Yet; in sticking together the situation of protective tapes while applying certain force by the above-mentioned roller that sticks together; because semiconductor wafer surface concavo-convex a lot of because of due to the majority circuit pattern etc.; so be attached to the protective tapes surface of semiconductor wafer surface, can become the get adhered concavo-convex male and fomale(M﹠F) of semiconductor wafer surface of member of profiling emulating.Moreover, when sticking together roller rotation when being displaced on the protective tapes, put on protective tapes pushing force can because of above-mentioned concavo-convex or mechanical rock etc. inconsistent.Thereby, poor in generation inclination of protective tapes surface or segment section, cause the protective tapes surface that is attached to semiconductor wafer surface can't become the plane of homogeneous in parallel finished machined down with the semiconductor wafer back that is ground.
If the protective tapes surface is not parallel equably to the semiconductor wafer plane; or when the semiconductor crystal wafer of the protective tapes surface section of having difference imported grinding steps; owing to this semiconductor crystal wafer is to stick together prone state with protective tapes to be adsorbed to remain on the mounting table and to grind; the former power meeting generating unit that puts on semiconductor crystal wafer by grinding is divided different, causes semiconductor crystal wafer to produce distortion.In addition, have semiconductor crystal wafer to be adsorbed securely and remain on the mounting table, cause the misgivings of semiconductor die circular vibration because of the abrasive power of grinding stone.Its result especially to requiring semiconductor crystal wafer to have than minimal thickness person in recent years, has the worker's thickness that adds in the finishing of semiconductor crystal wafer and produces deviation, or in grinding problems such as semiconductor crystal wafer breaks.
On the other hand; in the situation of the felting method that is disclosed in above-mentioned patent documentation 1, absorption keeps the wafer mounting table of semiconductor crystal wafer, is flexibly to move up and down towards the direction that reverts to lifting position; can make the absorptive table swing on one side, on one side the protective tapes pushing is engaged in semiconductor wafer surface.Moreover pendulum roller (swing roller) is to be pushed on the absorptive table and to move.Therefore, can't apply certain pushing force to the whole face in protective tapes surface, protective tapes surface and semiconductor die disk can not become the plane of correctly parallel homogeneous.Its result with above-mentioned same, have in the finished machined thickness of semiconductor crystal wafer and produces deviation, or in grinding problem such as semiconductor crystal wafer breakage.
Moreover in the situation of the felting method of patent documentation 1, can produce to possess has: be attached to the absorptive table of semiconductor crystal wafer or roller, and in order to cover the problem of these members with most complex appts that constitute such as vacuum processing chamber of making vacuum environment.
The present invention develops in view of the aforementioned technical background, and its purpose is to provide a kind of and can simply constitutes, and will be attached to the felting method that sticks together material and the mount device that the material finished machined becomes certain face that stick together of the members that get adhered such as semiconductor crystal wafer.
Technical scheme of the present invention is:
The present invention is a kind of felting method that sticks together material, wherein, in the surface mount of the member that gets adhered thin stick together material, and make the adsorbent that has most adsorption holes and have the adsorption plane of given shape be connected to the surface that this sticks together material, by the described material that sticks together of described adsorbent absorption, and make the described adsorption plane shape that material surface scan (emulating) becomes described adsorbent of sticking together.
Again; the present invention is a kind of felting method that sticks together material; wherein; the protective tapes that sticks together material of protecting the assembly of semiconductor wafer surface and semiconductor wafer surface is attached to the border of described semiconductor wafer surface; be after will temporarily being attached to the surface of described semiconductor crystal wafer by the adhesive agent that thermoplastic resin constituted of described protective tapes; to be formed with the surface has most adsorption holes and is the adsorbent of the plane adsorption plane of the size that covers described semiconductor wafer surface or the size big than its size; be disposed at towards the position parallel with described semiconductor crystal wafer; and make the described adsorption plane of described adsorbent be connected to described protective tapes surface with specific load; make described adsorption plane produce negative pressure; and described protective tapes surface and part and the described adhesive agent that described adsorption plane joins are aspirated towards described adsorption plane side, so that the plane of the described adsorption plane of described protective tapes profiling (emulating) and sticking together.
The described adsorption plane of described adsorbent is to be arranged at the position that is parallel to each other with described semiconductor wafer surface.Even described adsorbent can be heated to the temperature that the thermoplastic resin of described adhesive agent is softened, and makes described protective tapes be connected to described adsorbent, so that described adhesive agent is softening.
In addition, the present invention is a kind of mount device, wherein, possesses: the adsorbent of porous member etc. is formed with and has most adsorption holes, and forms plane and cover the adsorption plane of the size of the material component surface that gets adhered; Adsorption element keeps described adsorbent and airtight surface integral body except described adsorption plane; And suction pump, aspirate the interior air of described adsorbent so that the adsorption hole of described adsorption plane becomes negative pressure, and, the described material that sticks together is attached to the described component surface that gets adhered, make the described adsorption plane of described adsorption element be connected to the described material that sticks together, by described pump described surface of sticking together material is aspirated towards described adsorption plane side, so that the described shape of sticking together the described adsorption plane of material profiling (emulating) one-tenth of the described material component surface that gets adhered.
Even, possess: airtight retaining member, in the described material that sticks together is attached to the described component surface that gets adhered, and the described adsorption plane that makes described adsorption element is connected under the described state that sticks together material, is connected to described outer peripheral edges portion of sticking together material and with the outer peripheral edges portion that surrounds the described member that gets adhered described adsorption plane sealed together with the described material that sticks together.
The present invention is a kind of mount device, it is protective tapes with the assembly of protection surface of semiconductor crystal wafer and semiconductor wafer surface, via sticking together the mount device that material is attached to described semiconductor wafer surface, wherein, possess: the adsorption plate of adsorption element, have most adsorption holes by being formed with, and form plane and cover the adsorbent of adsorption plane of the size of described semiconductor wafer surface, and be provided with the side wall portion of the lateral circle surface that covers described adsorbent and airtightly have the framework of the surface integral body except the described adsorption plane of described adsorbent to constitute, and possess: pump is used in suction, aspirates the interior air of described adsorbent so that the adsorption hole of described adsorption plane becomes negative pressure; And airtight retaining member; described adsorption plane is connected under the state on the described protective tapes surface that temporarily is attached to described semiconductor wafer surface in advance; the outer peripheral edges portion that is connected to described semiconductor crystal wafer that makes; and the while is connected to described adsorption plate directly or indirectly; with the described outer peripheral edges portion that surrounds the described semiconductor crystal wafer relative described adsorption plane is sealed with described adsorption plane; and; sticking together at described semiconductor wafer surface has under described protective tapes and the state relative with described adsorption plate; the surface of described protective tapes is aspirated towards described adsorption plane side, so that the described protective tapes profiling (emulating) of described semiconductor wafer surface is the plane of described adsorption plane.
Described airtight retaining member is to be installed on ring-type frame member, and is connected to the circumference of described adsorption plate and described semiconductor crystal wafer and with described adsorption plane sealing.Again, described airtight retaining member be the described semiconductor crystal wafer of pushing circumference and with the sealing of described adsorption plane.
Described adsorbent is made of porous material.Moreover described adsorbent possesses and has: the heater that described adsorption plane is heated to the temperature that the described adhesive agent of described protective tapes softened.
In addition, described adsorbent is to have with the corresponding respectively profile of the described semiconductor crystal wafer of different sizes and be concentric shape to dispose a plurality of, and described adsorption plate possesses: framework, it forms and each peripheral shape of each semiconductor crystal wafer of different sizes corresponding shape respectively, and separating part with the lateral circle surface that covers a plurality of described adsorbents, and airtight surface integral body except the described adsorption plane of described adsorbent, and described airtight retaining member is the ad-hoc location that is disposed at described adsorption plane subtend, and has with the corresponding respectively profile of the described semiconductor crystal wafer of different sizes and be provided with a plurality of.
Even; possess: the semiconductor crystal wafer transport mechanism; to carry out described protective tapes temporarily stick together stick together platform, and the described adsorption plate of described protective tapes of the described semiconductor crystal wafer of suction be configured in different position in horizontal direction; and will temporarily stick together the described semiconductor crystal wafer that described protective tapes is arranged, conveyance to the position of the described adsorption plane subtend of described adsorption plate.
Effect of the present invention is:
According to felting method and the mount device that sticks together material of the present invention,,, can not cause bad influence to the member that gets adhered so can not apply load improperly to the member that gets adhered owing to, stick together equably so that stick together material only to sticking together the near surface application of force of material.Moreover, because also load that can be big, so the situation that the adhesive agent due to the pressurization of the member that can prevent to get adhered etc. are extruded from the side to effect below the member that gets adhered.By the face shape of the adsorption plane that changes adsorbent, also can stick together material in geometry shape face arbitrarily again.
Especially; in this felting method and mount device; by using plane adsorbent; stick together with the protective tapes that is used in semiconductor crystal wafer; the micro concavo-convex that can suppress to result from the protective tapes surface comes across the protective tapes surface, and the absorption of semiconductor crystal wafer keeps can stablizing really in grinding steps.Simultaneously, can guarantee the flatness of the abradant surface of semiconductor wafer back, can not give power improperly to semiconductor crystal wafer, the bad situation that can suppress to break etc. takes place.
Again; by the heating adsorbent; make the temperature increase of protective tapes; the viscosity of thermoplastic resin reduces; flow into easily and intersperse among the concavo-convex of semiconductor wafer surface, the power of part can not act on semiconductor crystal wafer, can suppress semiconductor crystal wafer break or damaged; yields (yield rate) is promoted, and it is good that operating efficiency becomes.
Moreover, according to mount device of the present invention,, can prevent that air from sewing from the outer peripheral portion of the members that get adhered such as semiconductor crystal wafer, the sticking together material and can positively aspirate of protective tapes etc. by negative pressure in the border of sticking together the material surface by adsorbent absorption.Again, can positively suppress to occur in the surface of the protective tapes that sticks together material etc. fine concavo-convex.Especially, be the situation of semiconductor crystal wafer in the member that gets adhered, the absorption that can stably carry out semiconductor crystal wafer in the grinding steps at the back side keeps.Even, can guarantee the flatness of the abradant surface of semiconductor wafer back, can not give power improperly to semiconductor crystal wafer, the bad situation that can suppress to break etc. takes place.
Description of drawings
Fig. 1 is the fragmentary cross-sectional view of the protective tapes mount device of expression first embodiment of the invention;
Fig. 2 is the internal organs view that sticks together platform of expression first embodiment of the invention;
Fig. 3 is the flow chart of the felting method of expression first embodiment of the invention;
Fig. 4 is the fragmentary cross-sectional view of the state that temporarily sticks together of the protective tapes of expression first embodiment of the invention;
Fig. 5 is the fragmentary cross-sectional view of the protective tapes mount device of expression second embodiment of the invention;
Fig. 6 is the stereogram of the adsorption plate of expression second embodiment of the invention;
Fig. 7 is the stereogram of the frame member of expression second embodiment of the invention;
Fig. 8 is the sectional arrangement drawing of the action of the temporary transient mount device of explanation;
Fig. 9 is the sectional arrangement drawing of action of the protective tapes mount device of expression second embodiment of the invention;
Figure 10 is the sectional arrangement drawing of sealing state of the frame member of explanation second embodiment of the invention;
Figure 11 is the sectional arrangement drawing of other sealing state of the frame member of explanation second embodiment of the invention;
Figure 12 is the constructed profile of Change Example of the airtight retaining member of explanation mount device of the present invention;
Figure 13 is the constructed profile of other Change Example of the airtight retaining member of expression mount device of the present invention;
Figure 14 is the constructed profile of another other Change Example of the airtight retaining member of expression mount device of the present invention; And
Figure 15 is the constructed profile of another other Change Example of the airtight retaining member of expression mount device of the present invention.
The primary clustering symbol description
10 protective tapes mount devices
12,12a, 12b, 12c adsorption plane
14 protective tapes
The 14a adhesive band base
The 14b adhesive agent
16 semiconductor crystal wafers
The 16a protuberance
18 adsorption plates
20 device base stations
22 wafers are accepted platform
The horizontal continuing surface of 22a
24,26,28,56,60 frame members
24a, 26a, 28a, 56a frame body
24b, 26b, 28b, 56b, 58,64 airtight retaining members
24c, 26c, 28c, 56c support member
30,32,34 elasticity support sectors
36 semiconductor crystal wafer transport mechanisms
38,38a, 38b, 38c porous member
40 frameworks
The 40a side wall portion
40b, 40c separating part
42 aspirators
The 42a connector
The 42b flexible pipe
The 42c pump
48 stick together platform
The 48a mounting surface
50 kerves
52 periphery platforms
54 stick together roller
62 piston plates
66 cylinder part
Embodiment
Below, with reference to Fig. 1～Fig. 4, first embodiment that sticks together the felting method of material of the present invention is described.The protective tapes mount device 10 of the mount device of present embodiment is in order on the semiconductor crystal wafer 16 of the member that gets adhered, and sticks together the protective tapes that sticks together material 14 of protection semiconductor wafer surface.Protective tapes mount device 10 is as shown in Figure 1 and Figure 2, is provided with by what surface smoothing and smooth metallic disk were constituted to stick together platform 48.To stick together platform 48 be in order to mounting semiconductor crystal wafer 16 and stick together protective tapes 14, and it is configured to level.In the outer circumferential side that sticks together platform 48, as shown in Figure 2,, be provided with periphery platform 52 across the kerf that the gap constituted 50 by specific wide cut.The mounting surface 48a that sticks together platform 48 possesses: in order to the temperature that the adhesive agent 14b that is heated to protective tapes 14 is softened, the heater of the not icon of the temperature about for example 60 ℃～80 ℃.
Protective tapes mount device 10 possesses the adsorption plate 18 of the adsorption element that is adsorbed in protective tapes 14 surfaces of sticking together on the platform 48.Adsorption plate 18 is to be provided with sticking together platform 48 subtends, possesses the porous member 38 that adsorbent is arranged, and this adsorbent has the adsorption plane 12 that is formed with the not shown adsorption hole of majority.Porous member 38 be form discoid, constitute by the interior institutes such as porous ceramic material that are provided with countless continuous crafters, it is closely chimeric with the framework that the end is arranged 40 with shallow cylindrical lateral wall 40a of portion, and airtight surface integral body except the adsorption plane 12 of outer surface.Adsorption plane 12 is to form smooth planely, forms the shape big than semiconductor crystal wafer 16.
In the framework 40 of adsorption plate 18, be connected with by: the flexible pipe 42b that is connected with connector 42a, and the aspirator 42 that constituted with pump 42c of suction via connector 42a.Pump 42c is by the air in the decompression action pulls porous member 38.Because the outer surface of adsorption plate 18 except adsorption plane 12 is airtight by framework 40 formation, so the suction force of pump 42c is adsorption plane 12 integral body that act on porous member 38 equably.
Be attached to the protective tapes 14 on semiconductor crystal wafer 16 surfaces; be the resin glue tape base material 14a about the tens of μ m that constituted by for example PETG (PET) etc.; be coated with the thermoplastic resin adhesive agent 14b of hundreds of μ m left and right thicknesses via thin knitting layer, and be formed with adhesion layer.The thickness of this adhesive agent 14b is thick than the protuberance 16a on semiconductor crystal wafer 16 surfaces, and the thermoplastic resin of adhesive agent 14b becomes gel under about for example 60 ℃～80 ℃ temperature under the softening temperature.Again, as shown in Figure 2, it is wide that the width of protective tapes 14 sticks together platform 48, and it forms in the mode of two-end part on periphery platform 52.
The protective tapes felting method of present embodiment is shown in the flow chart of Fig. 3, in the mounting surface 48a that sticks together platform 48, and mounting semiconductor crystal wafer 16.At this moment, semiconductor crystal wafer 16 is to be formed with the facing up and mounting (S12) of protuberance 16a of circuit unit etc.Then, the protective tapes volume that is wound into not shown drum is pulled out, face that protective tapes 14 is provided with adhesive agent 14b is disposed towards the surface of semiconductor crystal wafer 16.
Continue it, protective tapes 14 is attached to the surface (S14) that semiconductor crystal wafer 16 has protuberance 16a.In sticking together step S14; as shown in Figure 4; to stick together roller 54 and be arranged on the protective tapes 14 of pulling out from protective tapes volume, while on semiconductor crystal wafer 16, apply specific pushing force rotate mobile, protective tapes 14 temporarily is attached to the surface of semiconductor crystal wafer 16.
Then, by the shearing device of icon not,, protective tapes 14 is cut the circle that becomes semiconductor crystal wafer 16 from laminar protective tapes 14.Mode according to this, protective tapes 14 can be on semiconductor crystal wafer 16 surfaces, stick together into smooth planar under the situation that gauffer or bubble can residually not arranged.
Secondly, make the face that sticks together 12 of adsorption plate 18 be connected to the surface (butt step S16) of protective tapes 14 with specific load.Adsorption plate 18 is to be installed on the not driving mechanism of icon, and the mode parallel with the mounting surface 48a that sticks together adhesive tape 48 with adsorption plane 12 drives, Yi Bian keep parallel pass be, Yi Bian by the driving mechanism of icon not be arranged at mounting surface 48a directly over.Then, adsorption plate 18 descends, and is connected on the protective tapes 14.At this moment, its butt load is to be specific value by driving mechanisms control.Again, be provided with not shown heater, can be heated to the temperature that adhesive agent 14b is softened, the temperature about for example 60 ℃～80 ℃ in the porous member 38 of adsorption plate 18.
Under this state, by the action of pump 42c, the air in the porous member 38 of suction adsorption plate 18, making in the porous member 38 becomes negative pressure state, and adsorption plane 12 also becomes negative pressure, makes the surface of protective tapes 14 be adsorbed to adsorption plane 12 (S18).In drawing step S18, by the adsorption plane 12 of porous member 38, the surface of aspirating protective tapes 14 equably is whole.
Continue it, be illustrated with regard to the effect due to the felting method of the protective tapes mount device 10 of present embodiment.If when sticking together step S14 and make protective tapes 14 be attached to semiconductor crystal wafer 16, protective tapes 14 is formed with smooth face by temporarily sticking together under the situation that gauffer or bubble can residually not arranged.Yet owing to have most protuberance 16a on semiconductor crystal wafer 16, so rotate when being displaced on the protective tapes 14 when sticking together roller 54, the pushing force that puts on protective tapes 14 can unanimity.Moreover; the high situation of viscosity in the adhesive agent 14b of protective tapes 14 can produce the part that adhesive agent 14b does not flow into the thin portion in protuberance 16a gap each other etc., as shown in Figure 4; on the surface of protective tapes 14, have a part or the poor part of generation section to the surface tilt of semiconductor crystal wafer 16.
Under this state, protective tapes mount device 10, aspirates the surface of protective tapes 14 according to drawing step S18 via butt step S16 by adsorption plate 18.According to this, the negative pressure by the adsorption element 38 of adsorption plate 18 makes the surface of protective tapes 14 be attracted to adsorption plane 12, and the surperficial whole driving fit that makes adhesive band base 14a is in smooth adsorption plane 12.Simultaneously, adsorption plane 12 is flatly pressed towards semiconductor crystal wafer 16 thrusters, so adhesive agent 14b is the mode flow deformation that becomes parastate with the surface of the surface of protective tapes 14 and semiconductor crystal wafer 16 each other by specific butt load.At this moment, owing to stick together the mounting surface 48a of platform 48 and the adsorption plane 12 of adsorption plate 18 is to be set in about 60 ℃～80 ℃, and make it softening adhesive agent 14b heating, so adhesive agent 14b's is mobile good, and adhesive agent 14b can flow to the thin portion in the protuberance 16a gap each other on the semiconductor crystal wafer 16 etc. and can not produce inequality.According to these effects, can with the surface of protective tapes 14 in the surperficial parallel situation of semiconductor crystal wafer 12 under finished machined become the plane of homogeneous.
As described above, according to the protective tapes felting method and the mount device of this enforcement kenel, can not produce concavo-convexly etc. in the surface of protective tapes 14, the absorption of semiconductor crystal wafer 16 keeps being able to really in the grinding steps of semiconductor crystal wafer 16.Simultaneously, the collimation on the back side (abradant surface) with the surface of protective tapes 14 of semiconductor crystal wafer 16 can be guaranteed, generation bad or that break can be suppressed to grind.Again; protective tapes 14 can be by sticking together platform 48 or adsorption plate 18 heating, and the viscosity of adhesive agent 14b reduces and makes mobile lifting the, adhesive agent 14b flow into the thin portion between the protuberance 16a that intersperses among semiconductor crystal wafer 16 easily; can form smooth face at short notice equably, operating efficiency is good.
Continue it, second embodiment with regard to mount device of the present invention is illustrated with reference to Fig. 5～Figure 11.Herein, member same as the previously described embodiments is the identical symbol of note, with the explanation of clipped.Protective tapes mount device 10 shown in Figure 5 is devices that semiconductor crystal wafer 16 (herein being 6,8,12 o'clock size) in three overall dimensions sticks together protective tapes 14.Protective tapes mount device 10 possesses and has: adsorption plate 18 has slim cylindrical in shape, and is formed with adsorption plane 12 in plane on one side.Adsorption plate 18 is to make adsorption plane 12 be disposed at the top of device base station 20 down, can be installed on not shown adsorption plate elevating mechanism up or down.
On device base station 20,, be equipped with and have the wafer that level meets bearing surface 22a and connect cushion cap 22 with the position of the central portion subtend of adsorption plate 18.In wafer connect cushion cap 22 around, be provided with the different each other ring- type frame member 24,26,28 of diameter.Frame member the 24,26, the 28th, connecing cushion cap 22 with wafer is that center configuration becomes concentric circles, is installed on the upper end that the elasticity support sectors such as spring 30,32,34 on the device base station 20 are fixed in the lower end, and by following support.
Side in protective tapes mount device 10 is provided with: temporarily stick together protective tapes 14 to cut conglobate not shown platform or the temporary transient mount device of sticking together.Even, be provided with: in order to semiconductor crystal wafer 16 is moved into to the adsorption plane 12 of adsorption plate 18 and wafer connect cushion cap 22 between the semiconductor crystal wafer transport mechanism 36 of carrying arm etc. in space.
The maximum outside diameter of porous member 38 in each semiconductor crystal wafer 16 of 6,8,12 o'clock of diameter of the member that gets adhered, has the big slightly profile of diameter on the surface of 12 o'clock semiconductor crystal wafers 16 that cover maximum outside diameter.
Be divided in the porous member 38 of concentric circles corresponding to each semiconductor crystal wafer 16 of 6,8,12 o'clock of diameter, inboard porous member 38a forms discoidly, forms than 6 o'clock big slightly external diameters of semiconductor crystal wafer 16.Clip the separating part 40b of framework 40, the ring-type porous member 38b that has big slightly external diameter than 8 o'clock semiconductor crystal wafers 16 be arranged at framework 40 separating part 40b, 40c between.In the outside of separating part 40c, the chimeric ring-type porous matter shape member 38c that has than 12 o'clock big slightly external diameters of semiconductor crystal wafer 16.Each porous matter shape member 38a, 38b, 38c are embedded in framework 40, and it is except the face that becomes adsorption plane 12, by shape side wall portion 40a and separating part 40b, 40c surround and seal with one heart.And adsorption plane 12 also is divided into three adsorption plane 12a, 12b, 12c in regular turn from the inboard.
Each porous matter shape member 38a, 38b, 38c, be via with space that each separating part 40b, 40c by framework 40 separated in communicate three connector 42a, and be connected to the flexible pipe 42b of each connector 42a respectively, and be connected to pump 42c respectively.Owing to each porous matter shape member 38a, 38b, the 38c outer surface except adsorption plane 12a, 12b, 12c are airtight separations of separating part 40b, 40c by framework 40,, can produce negative pressure to each adsorption plane 12a, 12b, 12c equably so but the suction force independent action of pump 42c is whole in each face of each adsorption plane 12a, 12b, 12c.
The wafer that is installed on the device base station 20 connects cushion cap 22, be with the level of top meet adsorption plane 12a, the 12b of bearing surface 22a and adsorption plate 18, the mode that 12c is parallel to each other is provided with.Herein, the level profile that meets bearing surface 22a is the small circular of the degree that do not contact with frame member 24.
Frame member 26,28 in protective tapes 14 is attached to respectively 8 o'clock semiconductor crystal wafers 16, and the situation of 12 o'clock semiconductor crystal wafers 16 brought into play function; with frame member 24 similarly; have frame body 26a, 28a, airtight retaining member 26b, 28b, and support member 26c, 28c respectively, and cooperate the profile of corresponding semiconductor crystal wafer 16 and determine internal diameter or the external diameter and other the shape of each member.Moreover, airtight retaining member 24b, 26b, 28b and support member 24c, the 26c of frame member 24,26,28,28c connect cushion cap 22 with wafer to be formed centrally concentrically ringed mode in being and to be disposed at roughly with on the one side, and be installed on the upper end that the elasticity support sector 30,32,34 on the device base station 20 is fixed in the lower end, can support into level up or down.And airtight retaining member 24b, 26b, 28b are to the end face of the divider wall parts 40b of top adsorption plate 18,40c, side wall portion 40a, are configured in position opposite to one another.Again, the Yu Weicong top applies under the A-stage of load frame member 24,26,28, be to be positioned at the highest position above support member 24c, 26c, the 28c, continue, be adjusted into lower position by the upper end of airtight retaining member 24b, 26b, 28b, the order that meets the horizontal plane part 22a of cushion cap 22.
Semiconductor crystal wafer transport mechanism 36 is that semiconductor crystal wafer 16 is moved into to the space between the adsorption plane 12 of adsorption plate 18 and frame member 24,26,28; mid point consistent location in the mid point and the adsorption plane 12 of semiconductor crystal wafer 16; the mounting that makes meets bearing surface 22a in the level that wafer connects cushion cap 22, is provided with in the mode of adsorbable protective tapes 14 face side.
Secondly, just describe by the felting method of the protective tapes 14 of protective tapes mount device 10.Suppose that the member that gets adhered is 8 o'clock semiconductor crystal wafers 16 herein.Semiconductor crystal wafer 16 is to be formed with majority circuit pattern or assembly etc. in the surface, and as above-mentioned embodiment shown in Figure 4, have most protuberance 16a.
Shown in above-mentioned embodiment, temporarily stick together protective tapes 14 in the surface of semiconductor crystal wafer 16 in advance.This protective tapes 14 also similarly is the resin glue tape base material 14a about the tens of μ m that are made of for example PETG (PET) etc., be coated with via thin knitting layer the thickness about hundreds of μ m thermoplastic resin adhesive agent 14b and form.The thickness of this adhesive agent 14b is thick than the protuberance 16a on semiconductor crystal wafer 16 surfaces, and softening and become gel by the temperature of about for example 60 ℃～80 ℃ of specified temps.
Temporarily stick together the semiconductor crystal wafer 16 that protective tapes 14 is arranged and moved into, as shown in Figure 8, met bearing surface 22a in the level that wafer connects cushion cap 22 by mounting by semiconductor crystal wafer transport mechanism 36.At this moment, be positioned over the central point of semiconductor crystal wafer 16 and the central point consistent location that level meets bearing surface 22a.Then, behind mounting semiconductor crystal wafer 16,36 of semiconductor crystal wafer transport mechanisms are kept out of the way to the outside of adsorption plate 18.
Then, support to have the wafer of semiconductor crystal wafer 16 to connect cushion cap 22 declines, make the outer peripheral edges portion at the back side of semiconductor crystal wafer 16 be connected to support member 24c, 26c.At this moment, the peripheral end face of semiconductor crystal wafer 16 is the inboards that are positioned at airtight retaining member 26b.
Continue, as shown in Figure 9, adsorption plate 18 moves down by not shown adsorption plate elevating mechanism, makes semiconductor crystal wafer 16 be connected to support member 26c and pushes.Figure 10 is the enlarged drawing of appearance that is connected to the peripheral part of semiconductor crystal wafer 16 above the support member 26c.
As shown in figure 10, because support member 26c is the material of rubber-like softness, thus put on top and be compressed from the butt pressure of semiconductor crystal wafer 16, and the upper end that is compressed to the airtight retaining member 26b of rubber-like is connected to till the locating of separating part 40c.Be that on one side elasticity of compression support sector 32 moves down Yi Bian be adsorbed with the adsorption plate 18 of semiconductor crystal wafer 16, and connect and become static state under the bearing surface 22a in being connected to level that wafer connects cushion cap 22 again.At this moment, as shown in figure 10, interior all sides of airtight retaining member 26b partly are the outer circumferential side of driving fit in semiconductor crystal wafer 16.That is, be exposed to the peripheral part of adsorption plane 12b in the outside from semiconductor crystal wafer 16 peripheries, be to become air-tight state by semiconductor crystal wafer 16, airtight retaining member 26b and separating part 40c.Moreover, support member 26c also can in airtight conditions down and semiconductor crystal wafer 16 join.
Under this state, the surface of protective tapes 14 is to continue by pump 42c suction air, and the surperficial whole driving fit that makes adhesive band base 14a is in smooth adsorption plane 12a, 12b.Negative pressure due to the air suction is to be set at equally in adsorption plane 12a, 12b, and be equalization in the face of each adsorption plane 12a, 12b.Especially, with regard to adsorption plane 12b,, comprise from the peripheral part of adsorption plane 12b that semiconductor crystal wafer 16 peripheries are exposed to the outside, can produce impartial negative pressure integral body interior by the obturation effect due to the above-mentioned sealing annular component 26b.
In addition, as shown in figure 11, when just being cut off, the upper end of the airtight retaining member 26b of rubber-like is to be connected to separating part 40c via protective tapes 14 from the periphery of semiconductor crystal wafer 16 is significantly outstanding when protective tapes 14.That is the adsorption plane 12b peripheral part in the thoughtful outside outside semiconductor crystal wafer 16 is to become air-tight state by semiconductor crystal wafer 16, airtight retaining member 26b, protective tapes 14 and separating part 40c.Therefore, with similarly above-mentioned, can be to the whole negative pressure that produces equalization of adsorption plane 12b.
Protective tapes felting method and mount device according to present embodiment; can produce impartial negative pressure to whole of adsorption plane 12; adsorption plane 12 can correctly flatly be pushed into semiconductor crystal wafer 16, and adhesive agent 14b is the mode flow deformation that the surface with protective tapes 14 becomes the state that the plane with semiconductor crystal wafer 12 is parallel to each other.Adhesive agent 14b can flow into the thin portion in the gap between the protuberance 16a that intersperses among on the semiconductor crystal wafer 16 and can not produce inequality, and can be with the surface of protective tapes 14 in becoming the plane of homogeneous with the surperficial parallel finished machined down of semiconductor crystal wafer 12.
Again, in porous member 38 not shown heater etc. is installed, as long as adsorption plane 12 is heated to about 60 ℃～80 ℃, then the viscosity of adhesive agent 14b reduces, and can finish above-mentioned flow deformation at short notice.
In addition, frame member 28 is the situation of above-mentioned 8 o'clock semiconductor crystal wafer 16b in the member that gets adhered, and has neither part nor lot in the action of sticking together of protective tapes 14.That is, be 12 o'clock situation in semiconductor crystal wafer 16, frame member 28 can be brought into play function, is 6 o'clock situation in semiconductor crystal wafer 16, and only frame member 24 can be brought into play function.
As described above; according to protective tapes mount device 10 of the present invention; owing to be by the outer peripheral portion of semiconductor crystal wafer 16 is airtight to prevent escape of air; and the surperficial integral body of protective tapes 14 is sucked equably; so can positively suppress to result from the appearance of the micro concavo-convex on protective tapes 14 surfaces, the absorption that can stably carry out semiconductor crystal wafer 16 in grinding steps keeps.Simultaneously, can guarantee the flatness of the abradant surface at semiconductor crystal wafer 16 back sides, can not give power improperly, can suppress the generation of unfavorable conditions such as breaking semiconductor crystal wafer 16.
Again,, constitute, be connected to the border of support member 24c, 26c, 28c, can relax the impact that puts on semiconductor crystal wafer 16 in semiconductor crystal wafer 16 with rubber- like support member 24c, 26c, 28c by support part with frame member 24,26,28.
By can being propped up up or down, frame member 24,26,28 is held in elasticity support sector 30,32,34; be connected to the border of the horizontal plane part that connects cushion cap in semiconductor crystal wafer; can relax the impact that puts on semiconductor crystal wafer; simultaneously; in frame member 24,26,28; can select the corresponding frame member of semiconductor crystal wafer with the given configuration of the member that gets adhered automatically, can carry out in order to stick together the specific action of protective tapes 14.
Continue it, the Change Example with regard to the airtight retaining member of mount device of the present invention is illustrated with reference to Figure 12.Herein, be that the same symbol of note is to omit explanation with the same member of the foregoing description.In the present embodiment, adsorption plate 18 is to be arranged at not shown base station, and adsorption plane 12 is to dispose up.And, temporarily stick together the semiconductor crystal wafer 16 that protective tapes is arranged on the adsorption plane 12, be so that protective tapes 14 mode mounting down.
Moreover, circumference in semiconductor crystal wafer 16, ring-type frame member 56 is from the top mounting, and the airtight retaining member 56b of O type ring of lower surface that is arranged at the frame body 56a periphery wall of frame member 56 is the side wall portion 40a that is connected to the framework 40 of adsorption plate 18, and support member 56c in week is the circumference that is connected to semiconductor crystal wafer 16 under airtight conditions in it.
Constitute according to this, between the side wall portion 40a of the circumference of semiconductor crystal wafer 16 and adsorption plane 12, can not produce air and sew, can positively make adsorption plane 12 be connected to the surface of protective tapes 14 and complanation equably.
Continue it, other Change Example with regard to the airtight retaining member of mount device of the present invention is illustrated with reference to Figure 13.Herein, be that the same symbol of note is to omit explanation with the same member of the foregoing description.Also similarly, adsorption plate 18 is to be arranged at not shown base station in the present embodiment, and adsorption plane 12 is to dispose up.And, temporarily stick together the semiconductor crystal wafer 16 that protective tapes is arranged on the adsorption plane 12, be so that protective tapes 14 mode mounting down.
Moreover, circumference in semiconductor crystal wafer 16, constituted and had concurrently the airtight retaining member 58 of frame member by the elastomer of ring-shaped rubber etc., be the side wall portion 40a that is connected to the framework 40 of adsorption plate 18, and under airtight conditions, be connected to the ora terminalis outer peripheral face of the semiconductor crystal wafer 16 of its top simultaneously.
Structure according to this by simple formation, can not produce air and sew between the side wall portion 40a of the circumference of semiconductor crystal wafer 16 and adsorption plane 12, can positively make adsorption plane 12 be connected to the surface of protective tapes 14 and complanation equably.
Continue it, another other Change Example with regard to the airtight retaining member of mount device of the present invention is illustrated with reference to Figure 14.Herein, be that the same symbol of note is to omit explanation with the same member of the foregoing description.Also similarly, adsorption plate 18 is to be arranged at not shown base station in the present embodiment, and adsorption plane 12 is to dispose up.And, temporarily stick together the semiconductor crystal wafer 16 that protective tapes is arranged on the adsorption plane 12, be so that protective tapes 14 mode mounting down.
Moreover, stick together the circumference of the face of face opposition side at semiconductor crystal wafer 16 and protective tapes, be provided with ring-type frame member 60, below frame member 60, the retaining member 58 of airtight retaining member is to be connected to above the outer peripheral edges portion of semiconductor crystal wafer 16.Under this state, the circumference of semiconductor crystal wafer 16 can be positively in being positioned on the adsorption plate 18 under the airtight conditions.
Structure according to this can not produce air and sew between the side wall portion 40a of the circumference of semiconductor crystal wafer 16 and adsorption plane 12, can positively make adsorption plane 12 be connected to the surface of protective tapes 14 and complanation equably.
Continue it, another other Change Example with regard to the airtight retaining member of mount device of the present invention is illustrated with reference to Figure 15.Herein, be that the same symbol of note is to omit explanation with the same member of the foregoing description.Also similarly, adsorption plate 18 is to be arranged at not shown base station in the present embodiment, and adsorption plane 12 is to dispose up.And, temporarily stick together the semiconductor crystal wafer 16 that protective tapes is arranged on the adsorption plane 12, be so that protective tapes 14 mode mounting down.
Then,, dispose piston plate (piston plate) 62, the airtight retaining member 64 of O type ring etc. is installed in the outer peripheral edges portion of piston plate 62 in the rear side of semiconductor crystal wafer 16.Piston plate 62 is to be embedded in cylinder part 66, under airtight conditions, with cylinder part 66 semiconductor crystal wafer on the adsorption plane 12 16 is sealed.
In addition, also can suitable pressure-regulating valve be set in piston plate 62.By this, can make the pressure that is applied to protective tapes 14 keep certain, and adsorbable semiconductor crystal wafer 16.
The felting method that sticks together material of the present invention is not to be defined in the foregoing description; as long as temporarily stick together the felting method that sticks together material in the step; can not produce the method that forms tabular surface under the situation of gauffer or bubble for surface, then also can be other method in the protective tapes that sticks together material etc.Again, the operation that protective tapes is downcut from the protective tapes thin slice of coiling tubular, also can be attached to the preceding of semiconductor crystal wafer and after arbitrary state under carry out.
Again, the design temperature of wafer mounting table or adsorbent equipment, or adsorption plane is connected to butt load on the protective tapes, but the also material of the adhesive band base of mating protection adhesive tape or adhesion layer etc. and suitably setting.Also can obtain the situation of desired finished machined state in heated protective adhesive tape not, be provided with the heater person of electrical heater etc. in wafer mounting table or adsorbent equipment also can use not.In addition, also can make little vibration be overlapped in the butt load, with the speed of the flow deformation that speeds adhesion layer.
As long as porous member possesses the porous matter of establishing countless continuous crafters in having, and have hardness or the intensity that also can not be out of shape by above-mentioned butt load etc., then also can be synthetic resin material beyond the ceramic material or other inorganic formed body that is etc.Moreover the fine pore of material or the porosity etc. are that the mode that can make the attraction that acts on the per unit area on the protective tapes become desired value is suitably set.In addition, so long as be formed with specific adsorption plane, and can be, then also can be other face adsorbent of the structure that differs from porous member to the whole tectosome that produces impartial suction force of adsorption plane.
Again, the semiconductor crystal wafer of a plurality of sizes is not to be defined in three kinds, also can be made as the corresponding device of semiconductor crystal wafer with the size of any kind.
Frame member not necessity connects into ring-type, as long as can be arranged at the privileged site above the frame body, and for can be from the below balance good and stably support the form of semiconductor crystal wafer to get final product.
Moreover, the heating-up temperature of heating adsorption plane or adsorption plane is connected to butt pressure on the protective tapes etc., but the also material of the adhesive band base of mating protection adhesive tape or adhesive agent etc. and suitably setting.Again, also can the little vibration of superposition on butt pressure, with the speed of the flow deformation that speeds adhesion layer.In addition, the shape of each member or material etc. also can be done suitable change.
Claims (13)
1. felting method that sticks together material, it is characterized in that, in the surface mount of the member that gets adhered thin stick together material, and make the adsorbent that has most adsorption holes and have the adsorption plane of given shape be connected to the surface that this sticks together material, by the described material that sticks together of described adsorbent absorption, and make the described adsorption plane shape that the material surface scan becomes described adsorbent of sticking together.
2. felting method that sticks together material; it is characterized in that; the protective tapes that sticks together material of protecting the assembly of semiconductor wafer surface and semiconductor wafer surface is attached to the border of described semiconductor wafer surface; be after will temporarily being attached to the surface of described semiconductor crystal wafer by the adhesive agent that thermoplastic resin constituted of described protective tapes; to be formed with the surface has most adsorption holes and is the adsorbent of the plane adsorption plane of the size that covers described semiconductor wafer surface or the size big than its size; be disposed at towards the position parallel with described semiconductor crystal wafer; and make the described adsorption plane of described adsorbent be connected to described protective tapes surface with specific load; make described adsorption plane produce negative pressure; and described protective tapes surface is aspirated towards described adsorption plane side with part and the described adhesive agent that described adsorption plane joins, so that stick together on the plane that described protective tapes profiling is described adsorption plane.
3. according to the described felting method that sticks together material of claim 2, it is characterized in that the described adsorption plane of described adsorbent is to be arranged at the position that is parallel to each other with described semiconductor wafer surface.
4. according to the described felting method that sticks together material of claim 2, it is characterized in that described adsorbent can be heated to the temperature that the thermoplastic resin of described adhesive agent is softened, and makes described protective tapes be connected to described adsorbent, so that described adhesive agent is softening.
5. mount device is characterized in that possessing:
Adsorbent is formed with and has most adsorption holes, and forms plane and cover the adsorption plane of the size of the material component surface that gets adhered;
Adsorption element keeps described adsorbent and airtight surface integral body except described adsorption plane; And
Pump is used in suction, aspirates the interior air of described adsorbent so that the adsorption hole of described adsorption plane becomes negative pressure,
The described material that sticks together is attached to the described component surface that gets adhered, make the described adsorption plane of described adsorption element be connected to the described material that sticks together, by described pump described surface of sticking together material is aspirated towards described adsorption plane side, so that the described material component surface that gets adhered described sticked together the shape that material is contoured to described adsorption plane.
6. according to the described mount device of claim 5, it is characterized in that: more possess: airtight retaining member, in the described material that sticks together is attached to the described component surface that gets adhered, and the described adsorption plane that makes described adsorption element is connected under the described state that sticks together material, is connected to described outer peripheral edges portion of sticking together material and with the outer peripheral edges portion that surrounds the described member that gets adhered described adsorption plane sealed together with the described material that sticks together.
7. mount device is with the protective tapes of the assembly of the surface of protection semiconductor crystal wafer and semiconductor wafer surface,, it is characterized in that possessing via sticking together the mount device that material is attached to described semiconductor wafer surface:
Adsorption plate, by be formed with have most adsorption holes and form plane and cover described semiconductor wafer surface size adsorption plane adsorbent and be provided with the side wall portion of the lateral circle surface that covers described adsorbent and airtightly have the framework of the surface integral body except the described adsorption plane of described adsorbent to be constituted;
Pump is used in suction, aspirates the interior air of described adsorbent so that the adsorption hole of described adsorption plane becomes negative pressure; And
Airtight retaining member; described adsorption plane is connected under the state on the described protective tapes surface that temporarily is attached to described semiconductor wafer surface in advance; the outer peripheral edges portion that is connected to described semiconductor crystal wafer that makes; and the while is connected to described adsorption plate directly or indirectly; with the described outer peripheral edges portion that surrounds the described semiconductor crystal wafer relative described adsorption plane is sealed with described adsorption plane
Sticking together at described semiconductor wafer surface has under described protective tapes and the state relative with described adsorption plate; the surface of described protective tapes is aspirated towards described adsorption plane side, so that the described protective tapes of described semiconductor wafer surface is contoured to the plane of described adsorption plane.
8. according to the described mount device of claim 7, it is characterized in that: described airtight retaining member is to be installed on ring-type frame member, and is connected to the circumference of described adsorption plate and described semiconductor crystal wafer and with described adsorption plane sealing.
9. according to the described mount device of claim 7, it is characterized in that, described airtight retaining member be the described semiconductor crystal wafer of pushing circumference and with the sealing of described adsorption plane.
10. according to the described mount device of claim 7, it is characterized in that described adsorbent is made of porous material.
11., it is characterized in that described adsorbent possesses and has according to the described mount device of claim 7: the heater that described adsorption plane is heated to the temperature that the described adhesive agent of described protective tapes softened.
12. according to the described mount device of claim 7, it is characterized in that, described adsorbent be have with the corresponding respectively profile of the described semiconductor crystal wafer of different sizes and be concentric shape dispose a plurality of,
Described adsorption plate possesses: framework, it forms and each peripheral shape of each semiconductor crystal wafer of different sizes corresponding shape respectively, and the separating part with the lateral circle surface that covers plural described adsorbent, and airtight surface integral body except the described adsorption plane of described adsorbent
Described airtight retaining member is the ad-hoc location that is disposed at described adsorption plane subtend, and has with the corresponding respectively profile of the described semiconductor crystal wafer of different sizes and be provided with a plurality of.
13. according to the described mount device of claim 7; it is characterized in that; more possess: the semiconductor crystal wafer transport mechanism; to carry out described protective tapes temporarily stick together stick together platform, and the described adsorption plate of described protective tapes of the described semiconductor crystal wafer of suction be configured in different position in horizontal direction, and will temporarily stick together described semiconductor crystal wafer conveyance that described protective tapes is arranged to the position of the described adsorption plane subtend of described adsorption plate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007328623 | 2007-12-20 | ||
| JP2007-328623 | 2007-12-20 | ||
| PCT/JP2008/073240 WO2009081880A1 (en) | 2007-12-20 | 2008-12-19 | Sticking method and sticking device of sticking material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101809718A true CN101809718A (en) | 2010-08-18 |
Family
ID=40801181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200880109523A Pending CN101809718A (en) | 2007-12-20 | 2008-12-19 | Sticking method and sticking device of sticking material |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2009081880A1 (en) |
| KR (1) | KR20100118558A (en) |
| CN (1) | CN101809718A (en) |
| WO (1) | WO2009081880A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105601093A (en) * | 2014-11-13 | 2016-05-25 | 三星钻石工业股份有限公司 | Scribing method and scribing device |
| CN105742212A (en) * | 2014-12-29 | 2016-07-06 | 株式会社迪思科 | Method Of Dividing Wafer Into Dies |
| TWI718633B (en) * | 2018-08-24 | 2021-02-11 | 日商迪思科股份有限公司 | Method of processing a substrate |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014038310A1 (en) * | 2012-09-07 | 2014-03-13 | 富士電機株式会社 | Semiconductor element producing method |
| JP6576786B2 (en) * | 2015-10-19 | 2019-09-18 | 株式会社ディスコ | Wafer grinding method |
| KR102499977B1 (en) | 2016-07-13 | 2023-02-15 | 삼성전자주식회사 | Adhesive tape sticking apparatus and method of manufacturing a semiconducotr package using the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004186522A (en) * | 2002-12-05 | 2004-07-02 | Renesas Technology Corp | Manufacture method of semiconductor device |
| JP4559122B2 (en) * | 2004-05-25 | 2010-10-06 | 有限会社都波岐精工 | Tape bonding apparatus and tape bonding method |
| JP4559183B2 (en) * | 2004-10-13 | 2010-10-06 | 有限会社都波岐精工 | Tape bonding device |
| JP2006222231A (en) * | 2005-02-09 | 2006-08-24 | Tsubaki Seiko:Kk | Tape bonding device and tape bonding method |
| JP4698452B2 (en) * | 2006-03-20 | 2011-06-08 | 日東電工株式会社 | Substrate bonding method and apparatus using the same |
-
2008
- 2008-12-19 KR KR1020107007969A patent/KR20100118558A/en not_active Application Discontinuation
- 2008-12-19 CN CN200880109523A patent/CN101809718A/en active Pending
- 2008-12-19 JP JP2009547085A patent/JPWO2009081880A1/en not_active Ceased
- 2008-12-19 WO PCT/JP2008/073240 patent/WO2009081880A1/en active Application Filing
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105601093A (en) * | 2014-11-13 | 2016-05-25 | 三星钻石工业股份有限公司 | Scribing method and scribing device |
| CN105742212A (en) * | 2014-12-29 | 2016-07-06 | 株式会社迪思科 | Method Of Dividing Wafer Into Dies |
| CN105742212B (en) * | 2014-12-29 | 2019-08-30 | 株式会社迪思科 | The method for dividing the wafer into bare die |
| TWI718633B (en) * | 2018-08-24 | 2021-02-11 | 日商迪思科股份有限公司 | Method of processing a substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009081880A1 (en) | 2009-07-02 |
| KR20100118558A (en) | 2010-11-05 |
| JPWO2009081880A1 (en) | 2011-05-06 |
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Open date: 20100818 |