CN101803477A

CN101803477A - Electronic component package and method for producing the same

Info

Publication number: CN101803477A
Application number: CN200880107976A
Authority: CN
Inventors: 北贵之; 胜又雅昭; 中尾惠一
Original assignee: Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Holdings Corp
Priority date: 2007-09-21
Filing date: 2008-09-05
Publication date: 2010-08-11
Anticipated expiration: 2028-09-05
Also published as: WO2009037807A1; TW200921867A; CN101803477B; JPWO2009037807A1; JP5234001B2

Abstract

Disclosed is an electronic component package comprising a first wiring board, an electronic component mounted on the upper surface of the first wiring board, an adhesive layer arranged on the upper surface of the first wiring board, a second wiring board arranged on the upper surface of the adhesive layer, and a metal cap covering the upper surface of the first wiring board, the second wiring board and the electronic component. The second wiring board is smaller than the first wiring board. In this electronic component package, unnecessary stress does not occur in the electronic component even when the metal cap is deformed.

Description

Electronic component package and manufacture method thereof

Technical field

The present invention relates to electronic units such as coil, semiconductor are installed in electronic component package on the distributing board (joining the Line plate, wiring plate) (パ Star ケ one ジ, encapsulation, assembly) and manufacture method thereof.

Background technology

In recent years, be accompanied by miniaturization, the multifunction of electronic equipments such as portable phone, be not subjected to from the electric field of outside and/or the influence in magnetic field in order to suppress electronic units such as coil, semiconductor, perhaps do not influence circuit on every side, these a plurality of electronic units need be shielded together (シ one Le De) in order to make from the electric field and/or the magnetic field of coil and/or semiconductor generation.

Figure 22 A is the exploded perspective view of the electronic component package in the past 107 shown in the patent documentation 1.Figure 22 B is the cutaway view of electronic component package 107.

Shown in Figure 22 A, a plurality of electronic units 103 are installed on printing distributing board 104 (printed circuit board).Be formed with ground connection dish 105 (ア one スパ Star De) in the end of printing distributing board 104.Shown in Figure 22 B, the end 102 of crown cap 101 is by mounting and be fixed on by scolding tin 106 on the ground connection dish 105 of printing distributing board 104, becomes electronic component package 107.Crown cap 101 also is fixed on the end face (courtyard face) of the highest electronic unit 103 by scolding tin 106, the thickness of control electronic component package 107.

In electronic component package 107 in the past,, need the highest electronic unit 103 is installed in the substantial middle portion of electronic component package 107 for the height of adjusting electronic component package 107 or the intensity of guaranteeing packaging body 107.Strain by the generations such as thermal expansion of crown cap 101 is directly transmitted to the electronic unit 103 that is fixed in crown cap 101.This strain meeting partly produces stress in the soldering of electronic unit 103, has the possibility of bringing influence to the reliability of electronic unit 103.

In addition, in electronic component package 107 in the past, the deviation of the height of the electronic unit 103 after the deviation of the thickness of electronic unit 103 and/or the installation brings influence for the deviation of the height of crown cap 101.And then, when the height of electronic unit 103 becomes higher than design load, between the ground connection dish 105 of the end 102 of crown cap 101 and printing distributing board 104, produce the gap.This gap brings influence can for the shielding character of crown cap 101, has the possibility of the installation strength decline that makes crown cap 101.

In addition, in electronic component package 107 in the past, can only electronic unit 103 be installed at the single face of printing distributing board 104.

Figure 23 is other the stereogram of electronic component package in the past 301 that patent documentation 2 is put down in writing.Be installed on seal 304 sealings of electronic units 303 such as coil, semiconductor by constituting on the surface of substrate 302 by insulating resins such as epoxy resin.Be formed with nickel coating 305 on the surface of seal 304.

In order to improve the productivity ratio of electronic component package 301 in the past, need to increase the area of substrate 302, make a plurality of electronic component packages 301 together.(ダイシ Application グ dicing) is divided into predetermined size to a plurality of electronic component packages 301 by die-cut.

If it is big that the area of substrate 302 becomes, the bending of substrate 302, fluctuating become big, are easy to generate inequality on the thickness of the sealing 304 in substrate 302.Exist liquid insulating resin from the surface of substrate 302 situation to external leaks.

When the liquid insulating resin that will be filled in substrate 302 is heating and curing a few hours, if substrate 302 maintenance levels that improperly will be bigger, then have on sealing 304 thickness, produce uneven and then liquid insulating resin from the surface of substrate 302 situation to external leaks.

In order to fill the insulating resin that becomes sealing 304 and it is solidified on a plurality of substrates 302, drying machine need have more shelf.But in fact be difficult to these shelfs are all remained level, have the situation that shelf itself tilts, is out of shape during heating.

When heating, have the situation of substrate 302 deformation own, bending owing to thermal expansion, produce the uneven thickness of sealing 304 thus.

In addition, in electronic component package 301, need form the operation of the nickel coating 305 that obtains shield effectiveness and form, increase man-hour.In addition, because by becoming the operation of sealing 304 insulating resin encapsulated electronic components 303 such as epoxy resin, cost improves.

And then, in electronic component package 301 in the past, by be punched in will be bigger on 2 directions substrate 302 cut off, the cost that is caused by die-cut needed time and/or equipment becomes big.

Patent documentation 1: the spy opens the 2003-309397 communique

Patent documentation 2: the spy opens flat 11-163583 communique

Summary of the invention

Electronic component package possesses: the 1st distributing board, be installed in the electronic unit on the 1st distributing board top, be arranged on the adhesive linkage on the 1st distributing board top, be arranged on the 2nd distributing board on adhesive linkage top and cover top, the 2nd distributing board of the 1st distributing board and the crown cap of electronic unit.The 2nd distributing board is littler than the 1st distributing board.

In this electronic component package,, can on electronic unit, not produce unwanted stress even on crown cap, produce strain yet.

Description of drawings

Figure 1A is the exploded perspective view of the electronic component package in the execution mode 1.

Figure 1B is the stereogram of the electronic component package in the execution mode 1.

Fig. 1 C is other the stereogram of crown cap in the execution mode 1.

Fig. 2 is the face upwarding stereogram of the electronic component package in the execution mode 1.

Fig. 3 is the stereogram of the manufacture method of the electronic component package in the expression execution mode 1.

Fig. 4 is the stereogram of the manufacture method of the electronic component package in the expression execution mode 1.

Fig. 5 is the stereogram of the manufacture method of the electronic component package in the expression execution mode 1.

Fig. 6 A is the exploded perspective view of the electronic component package in the execution mode 2.

Fig. 6 B is the stereogram of the electronic component package in the execution mode 2.

Fig. 6 C is other the stereogram of crown cap in the execution mode 2.

Fig. 7 A is the face upwarding stereogram of the electronic component package in the execution mode 2.

Fig. 7 B is other the face upwarding stereogram of electronic component package in the execution mode 2.

Fig. 8 is the stereogram of the manufacture method of the electronic component package shown in the presentation graphs 6B.

Fig. 9 is the exploded perspective view of the electronic component package in the embodiments of the present invention 3.

Figure 10 A is the stereogram of the electronic component package in the execution mode 3.

Figure 10 B is the face upwarding stereogram of the electronic component package in the execution mode 3.

Figure 11 is the stereogram of the manufacture method of the electronic component package in the expression execution mode 3.

Figure 12 is the stereogram of the manufacture method of the electronic component package in the expression execution mode 3.

Figure 13 A is of the present invention to be the stereogram of the electronic component package in the execution mode 4.

Figure 13 B is the cutaway view on the line 13B-13B of the electronic component package shown in Figure 13 A.

Figure 14 is the face upwarding stereogram of the electronic component package in the execution mode 4.

Figure 15 is the stereogram of the manufacture method of the electronic component package in the expression execution mode 4.

Figure 16 is the stereogram of the manufacture method of the electronic component package in the expression execution mode 4.

Figure 17 is the stereogram of the manufacture method of the electronic component package in the expression execution mode 4.

Figure 18 is the stereogram of the manufacture method of the electronic component package in the expression execution mode 4.

Figure 19 A is the cutaway view of the manufacture method of the electronic component package in the expression execution mode 4.

Figure 19 B is the cutaway view of the manufacture method of the electronic component package in the expression execution mode 4.

Figure 20 is the stereogram of the manufacture method of the electronic component package in the expression execution mode 4.

Figure 21 is the stereogram of the manufacture method of the electronic component package in the expression execution mode 4.

Figure 22 A is the exploded perspective view of electronic component package in the past.

Figure 22 B is the cutaway view of electronic component package in the past.

Figure 23 is the stereogram of other electronic component package in the past.

Symbol description

112: crown cap

112A: top part

112B: side surface part (the 1st side surface part)

112C: side surface part (the 1st side surface part)

113: distributing board (the 1st distributing board)

113C: end (the 1st end)

113D: end (the 2nd end)

114: distributing board (the 2nd distributing board)

115: adhesive linkage (the 1st adhesive linkage) (following Layer, adhesive layer)

116: electronic unit (the 1st electronic unit)

120A: through hole

154: distributing board (the 3rd distributing board)

155: adhesive linkage (the 2nd adhesive linkage)

212: crown cap

212A: top part (day face)

212B: side surface part (the 1st side surface part)

212C: side surface part (the 1st side surface part)

213: distributing board (the 1st distributing board)

213C: end (the 1st end)

213D: end (the 2nd end)

214: distributing board (the 2nd distributing board)

215: adhesive linkage (the 1st adhesive linkage)

216A: electronic unit (the 1st electronic unit)

216B: electronic unit (the 2nd electronic unit)

220A: through hole

254: distributing board (the 3rd distributing board)

255: adhesive linkage (the 2nd adhesive linkage)

264: distributing board (the 4th distributing board)

265: adhesive linkage (the 3rd adhesive linkage)

274: distributing board (the 5th distributing board)

275: adhesive linkage (the 4th adhesive linkage)

312: packed layer

313: distributing board (the 1st distributing board)

313C: end (the 1st end)

313D: end (the 2nd end)

314: distributing board (the 2nd distributing board)

315: adhesive linkage (the 1st adhesive linkage)

316: electronic unit

320A: through hole

323: packing material

354: distributing board (the 3rd distributing board)

355: adhesive linkage (the 2nd adhesive linkage)

412: crown cap

412A: top part

412B: side surface part (the 1st side surface part)

412C: side surface part (the 1st side surface part)

413: distributing board (the 1st distributing board)

413C: end (the 1st end)

413D: end (the 2nd end)

414: distributing board (the 2nd distributing board)

415: adhesive linkage (the 1st adhesive linkage)

416A: electronic unit (the 1st electronic unit)

416B: electronic unit (the 2nd electronic unit)

429A: through hole

453: distributing board (the 7th distributing board)

454: distributing board (the 3rd distributing board)

455: adhesive linkage (the 2nd adhesive linkage)

464: distributing board (the 4th distributing board)

465: adhesive linkage (the 5th adhesive linkage)

474: distributing board (the 5th distributing board)

475: adhesive linkage (the 6th adhesive linkage)

485: adhesive linkage (the 3rd adhesive linkage)

495: adhesive linkage (the 4th adhesive linkage)

1112B: limit (the 1st limit)

1212B: limit (the 1st limit)

1412B: limit (the 1st limit)

1112C: limit (the 2nd limit)

1212C: limit (the 2nd limit)

1412C: limit (the 2nd limit)

Embodiment

(execution mode 1)

Figure 1A is the exploded perspective view of the electronic component package 111 in the execution mode 1.Crown cap 112 is bent into コ word shape with the metallic plate punch process and forms, and has pawl 118.Specifically, crown cap 112 has top part 112A,

side surface part

112B, 112C and pawl 118.Top part 112A has rectangular-shaped, and it has limit 1112B, the 1112C of mutual opposition side and limit 1112D, the 1112E of mutual opposition side.

Side surface part

112B, 112C extend downwards respectively from limit 1112B, the 1112C of top part 112A.Pawl 118 extends downwards from limit 1112D.Pawl 118 positions crown cap 112 when crown cap 112 is fixed in distributing board 113, is the smaller projection shape, and perhaps the part bending with metallic plate forms.Pawl 118 also can have hook shape.

On distributing board 113, on the 113A, a plurality of electronic units 116 are installed.Electronic unit 116 is high-frequency semiconductor, chip coil chip parts such as (チ Star プコイ Le), also can be the parts that produce electromagnetic noise or be subjected to the influence of electromagnetic noise on every side easily.

On distributing board 113 113A and below be provided with wiring graph and/or scolder resist (ソ Le ダ one レジスト) on the 113B.On distributing board 114 114A and below be provided with wiring graph and/or scolder resist on the 114B.On distributing board 154 154A and below be provided with wiring graph and/or scolder resist on the 154B.Electronic unit 116 has the outer electrode portion that is connected in the top 113A of distributing board 113 by soldering.Distributing board 113,114,154 is a printing distributing board, but also can be other distributing board.

Distributing board 114 is via adhesive linkage 115 113A on the end of distributing board 113 113C is fixed in.That is, the end of distributing board 113 113C in the above 113A be provided with adhesive linkage 115, on adhesive linkage 115, be fixed with distributing board 114.113A above distributing board 154 is fixed on the end 113D of the opposition side of the end of distributing board 113 113C via adhesive linkage 155.That is, the end of distributing board 113 113D in the above 113A be provided with adhesive linkage 155, on adhesive linkage 155, be fixed with distributing board 154.Distributing board 114,154 extends parallel to each other.

Figure 1B is the stereogram of electronic component package 111.The top 114A that the top part 112A of crown cap 112 is positioned at distributing board 114 goes up on the top 154A with distributing board 154, the top 113A and the electronic unit 116 of covering distributing board 113.

Crown cap 112 is that

side surface part

112B, 112C have height 117B.Height 117B is preferably below the total 117C of thickness of distributing board 113,114 and adhesive linkage 115.In addition, preferably be provided with the height of electronic unit 116 113A above distributing board 113 littler from the height of top 113A than 114A, 154A above the distributing board 114,154.Can prevent that thus electronic unit 116 from directly contacting with crown cap 112.

Shown in Figure 1B, by making the pawl 118 contact distributing boards 114 that are formed at crown cap 112, can prevent the dislocation of crown cap 112, can easily locate crown cap 112 accurately with respect to distributing board 114.

By pawl 118 is strengthened, can access the shield effectiveness that produces by pawl 118.Fig. 1 C is other the stereogram of crown cap 612 in the execution mode 1.In Fig. 1 C, give identical symbol for the part identical with Figure 1A, its explanation is omitted.Crown cap 612 replaces the pawl 118 of the crown cap 112 shown in Figure 1A, the side surface part 112E that has the side surface part 112D that extends from the limit 1112D of top part 112A downwards and extend downwards from the limit 1112E of the opposition side of limit 1112D.Side surface part 112D links to each other with

side surface part

112B, 112C, and side surface part 112E links to each other with side surface part 112B, 112C.Side surface part 112D, 112E cover the side of distributing board 114,154 and the side of adhesive linkage 115,155, and the screening electron parts 116 effectively.

Like this, electronic component package 111 is for shielding the small-sized Chip Size/Scale Package (CSP) (wafer-level package) of electronic unit 116 such as a plurality of semiconductors.

Fig. 2 is the face upwarding stereogram of electronic component package 111.Below distributing board 113, be provided with a plurality of electrode 119B on the 113B.Constituting electrode 119B is connected in motherboard (printed substrate, motherboard), electronic component package 111 is installed on motherboard.A plurality of electrode 119B shown in Figure 2 are Land Grid Array (LGA) (grid welding table array) or Fine Pitch LGA (FLGA) (narrow pitch grid welding table array).According to purposes, a plurality of electrode 119B also can be Ball GridArray (BGA) (ball grid display (encapsulation)) and/or Fine Pitch BGA (FBGA) in addition.Electrode 119B can be formed by Copper Foil and/or the scolder resist of the following 113B that is formed at distributing board 113, with the packing density raising of electronic component package 111.

Distributing board 113 by glass epoxy resin (ガラスエ Port キシ Trees fat), used the multi-layer wiring boards such as multi-layer sheet of combination (built-up) technology to form, the following 113B that can make electronic component package 111 thus is corresponding to high-density installation.

By being provided with distributing board 114,154 littler, can increase the area that electronic unit 116 can be installed among the top 113A of distributing board 113 than distributing board 113.

In electronic component package 111, on be arranged at distributing board 113, be respectively equipped with distributing board 114,155 on the adhesive linkage 115,155 of 113A.By crown cap 112 being arranged on top 114A, the 154A of distributing board 114,154, can control the height of crown cap 112 accurately, so can suppress the uneven thickness of electronic component package 111, electronic component package 111 also is installed in thin part.Fixing metal lid 112 on the distributing board 114,154 of the end of the mutual opposition side that is arranged at distributing board 113 113C, 113D.By this structure, can make crown cap 112 parallel accurately with respect to the top 113A of distributing board 113, can improve the rigidity of electronic component package 111.In addition,, can easily crown cap 112 be embedded, be fixed in distributing board 114,154, can improve the productivity ratio of electronic component package 111 by automaton by this structure.

Crown cap 112 is bent into コ word shape with metallic plate and forms.The height 117B of crown cap 112 (

side surface part

112B, 112C) is identical or littler than it with the height 117C of the total of distributing board 114 with distributing board 113, adhesive linkage 115.Thus, can prevent that the stress that the installation by crown cap 112 causes from producing at electronic unit 116.Crown cap 112 can be installed on distributing board 113,114,154 by soldering and/or machining.

Next, the manufacture method to electronic component package 111 describes.Fig. 3 to Fig. 5 is the stereogram of the manufacture method of expression electronic component package 111.

As shown in Figure 3, filled conductive cream (Guide Electricity ペ one スト) and form through hole 120A, 120B in the hole that is formed at adhesive linkage 115,155.The adhesive linkage 115 that will have through hole 120A is stacked with distributing board 114, and the adhesive linkage 155 that will have through hole 120B is stacked with distributing board 154.Then, by instruments such as mould, stamping machines adhesive linkage 115,155 is laminated in distributing board 113.Like this, by the adhesive linkage 115,155 that has through hole 120A, 120B respectively distributing board 114,154 is fixed in distributing board 113.Adhesive linkage 115 has the following 115B of top 115A and its opposition side.Adhesive linkage 155 has the following 155B of top 155A and its opposition side.Following 115B, 155B are positioned at the top 113A of distributing board 113.Top 115A, 155A lay respectively at following 114B, the 154B of distributing board 114,154.

On distributing board 113, be formed with a plurality of electrode 119A on the 113A.Below distributing board 114, be formed with electrode 131A on the 114B.Below distributing board 154, be formed with electrode 131B on the 154B.Through hole 120A is connected the electrode 119A of distributing board 113 with the electrode 131A of distributing board 114.Through hole 120B is connected the electrode 119A of distributing board 113 with the electrode 131B of distributing board 154.

Also distributing board 114,154 can be fixed in distributing board 113 simultaneously by the adhesive linkage 115,155 with through hole 120A, 120B.By like this, can cut down man-hour.

When adhesive linkage 115,155 is not harder solid, adhesive linkage 115,155 is pasted on distributing board 113 in advance.By adhesive linkage 115,155 is pasted on distributing board 114,154 in advance, can easily handle adhesive linkage 115,155.

Fig. 4 is the stacked distributing board 113,114,154 and the stereogram of adhesive linkage 115,155.The top 113A of distributing board 113 has and exposes from adhesive linkage 115,155 and the effective area 121 of electronic unit 116 can be installed.Electronic unit 116 is installed on the effective area 121 of 113A on distributing board 113.By on end 113C, the 113D of the mutual opposition side of distributing board 113 via adhesive linkage 115,155 permanent wiring plates 114,154, can increase effective area 121, electronic unit 116 can be installed to high-density arrive adhesive linkage 115,155 and/or distributing board 114,154 places up to soon.

By enlarging effective area 121, can enlarge the printing area of solder paste 113A above distributing board 113, can reduce the uneven thickness of solder paste, can improve the printing precision of solder paste.As a result, improve manufacturability, suppressed the production cost of electronic component package 111.By stacked distributing board 113,114,154 and adhesive linkage 115,155 being cut off, can produce a plurality of electronic component packages 111 together at cut-off rule 111A.

Fig. 5 is by the stereogram of distributing board after cutting apart 113,114,154 and adhesive linkage 115,155.Stacked distributing board 113,114,154 and adhesive linkage 115,155 can pass through to be cut off by the method for the machinery of realizations such as milling cutter (Le one タ one PVC Star ト, router bit).In addition, also can be by be pre-formed joint-cutting and/or V groove and/or the machine line (ミシ Application order, eyelet) in distributing board 113,114,154, distributing board 113,114,154 that dividing layer gathers into folds and adhesive linkage 115,155 along cut-off rule 111A.

By electronic unit 116 is installed on the 113A before the distributing board 113,114,154 that gathers into folds at dividing layer and the adhesive linkage 115,155, can suppress installation cost on distributing board 113.Even with distributing board 113 is folding and when cutting apart, distributing board 114,154 keeps the rigidity of distributing boards 113, so can make and when the cut-out of distributing board 113, be difficult to produce unwanted stress at electronic unit 116.By above-mentioned method, can stablize the manufacturing electronic component package 111 of screening electron parts 116 reliably.

Through hole 120A, 120B have shield effectiveness.By forming through hole 120A, 120B, can and dispel the heat to electronic unit 116 effectively in addition to the heat of crown cap 112 transmission distributing boards 113 and/or electronic unit 116 by the higher member of pyroconductivity (coefficient of heat conduction, Hot Den Guide degree).

Adhesive linkage 115,155 preferably has (approaching) plate shape, is made of thermosetting resin and inorganic fillers such as the aluminium oxide that is scattered in thermosetting resin, silica.By adhesive linkage 115,155 is made as sheet, can suppress the uneven thickness of adhesive linkage 115,155.In addition, can on adhesive linkage 115,155, form the hole, therein filled conductive cream and easily form through hole 120A, 120B by laser etc.Use epoxy resin by thermosetting resin, can improve the reliability of electronic component package 111 as adhesive linkage 115,155.

In addition, also can to add with respect to thermosetting resin be polyphenylene sulfide (PPS), polyether-ether-ketone (PEEK), the polyether sulfone thermoplastic resins such as (PES) of 5 weight %～30 weight % to this thermosetting resin.Flowability in the time of can suppressing to heat thus can prevent that thermoplastic resin is softening and outwards flows out, oozes out from adhesive linkage 115.At the amount of thermoplastic resin with respect to thermosetting resin during less than 5 weight %, the effect that can not obtain adding sometimes.If the amount of thermoplastic resin greater than 30 weight %, then influences bonding force, the reliability of adhesive linkage 115,155 with respect to thermosetting resin sometimes.

The thickness of adhesive linkage 115,155 is preferably the above 300 μ m of 30 μ m following (30 μ m～300 μ m).At the thickness of adhesive linkage 115,155 during, sometimes by the concavo-convex influence on the surface of distributing board 113,114,154 and can not obtain sufficient bonding force less than 30 μ m., be difficult to be provided with electronic component package 111 thinner during at the thickness of adhesive linkage 115,155 greater than 300 μ m.In addition, the particle diameter of inorganic filler is preferably more than the 1 μ m less than 30 μ m.During less than 1 μ m, the inorganic filler price raises, and is difficult to be scattered in thermosetting resin in addition at the particle diameter of inorganic filler.If particle diameter greater than 30 μ m, then is difficult to be provided with adhesive linkage 115 thinner, be difficult to sometimes form the hole by laser to adhesive linkage 115 in order to form through hole 120A, 120B.

The containing ratio of the inorganic filler in the adhesive linkage 115,155 is preferably below the above 80 volume % of 30 volume %.During less than 30 volume %, has the possibility that thermosetting resin flows out, oozes out to the part that electronic unit 116 is installed in the bonding process of adhesive linkage 115,155 at the containing ratio of inorganic filler.If the containing ratio of inorganic filler greater than 80 volume %, then has the possibility of the bonding force that reduces adhesive linkage 115,155.

The thermal coefficient of expansion of adhesive linkage 115,155 is preferably under less than the temperature of the vitrification point of thermosetting resin to more than 4ppm/ ℃ below 65ppm/ ℃.In order to make thermal coefficient of expansion littler, need to use inorganic filler special and high price than 4ppm/ ℃.When thermal coefficient of expansion being provided with bigger than 65ppm/ ℃, electronic component package 111 deformation sometimes, bending.The thermal coefficient of expansion of adhesive linkage 115 is preferably little than distributing board 113,114,154 in addition.Can suppress thus that heat by electronic component package 111 causes crooked and/or rise and fall.

In addition, vitrification point can be measured by TMA method shown in JIS C 6481 grades and/or DSC method.In the TMA method, test film is heated up from the ratio of room temperature with 10 ℃/minute, measure the thermal coefficient of expansion of thickness direction by apparatus for thermal analysis.In the DSC method, test film is heated up, from the ratio of room temperature with 20 ℃/minute by differential operation calorimeter measurement caloric value.

In addition, by to using the higher member of reliability of FR4 level (grade) and/or FR5 level in adhesive linkage 115,155 and/or the distributing board 113,114,154, can improve the reliability of electronic component package 111.

In the size of distributing board 113 is 10mm * 10mm when following, can guarantee the intensity of electronic component package 111 by the structure shown in Figure 1A.When the size of distributing board 113 surpasses 10mm * 10mm, also the central authorities between the adhesive linkage 115,155 on the 113A are provided with other adhesive linkage with adhesive linkage 115,155 same configuration in the above, at this bonding other distributing board that is provided with on layer by layer with distributing board 114,154 same configuration.Touch top part 112A above this distributing board in crown cap 112.Thus, can improve intensity on the thickness direction of electronic component package 111.In addition, by this distributing board and crown cap 112 is fixing, can improve the rigidity of electronic component package 111 by soldering, bonding agent etc.

Crown cap 112 is preferably formed by the metallic plate below the above 1.0mm of thickness 0.1mm.During less than 0.1mm, has the possibility of distortion when handling at thickness.If thickness is greater than 1.0mm in addition, then the processing of metallic plate becomes difficult, and it is big that weight becomes.By crown cap 112,, can also obtain radiating effect and/or heat propagation effect except shield effectiveness.At this moment, also the shape of crown cap 112 can be made as fin shape, perhaps the fin with heat transmission is installed on crown cap 112.

In addition this moment,, can and dispel the heat to electronic unit 116 effectively to the heat of crown cap 112 transmission distributing boards 113 and/or electronic unit 116 by forming through hole 120A, 120B by the higher member of pyroconductivity.

By at least a portion of crown cap 112 is electroplated, can prevent the variable color of metal part in addition.By carrying out nickel plating, plating scolder (half field めつ I) etc., can firmly crown cap 112 be connected in distributing board 114,154 in addition by scolding tin.

In electronic component package 111, distributing board 114,154 is fixed in distributing board 113 via adhesive linkage 115,155 respectively, is fixed with crown cap 112 on distributing board 114,154.Crown cap 112 do not touch in be installed in distributing board 113 above on the 113A electronic unit 116 and separate with it.Thus, do not transmit,, can access electronic component package 111 small-sized and that reliability is higher so can on electronic unit 116, not produce stress to electronic unit 116 to the external force that crown cap 112 transmits.In addition, the inequality of the height of electronic unit 116 or height brings influence can for the height 117B of crown cap 112 and/or the height of electronic component package 111.

(execution mode 2)

Fig. 6 A is the exploded perspective view of the electronic component package 211 in the execution mode 2.Can the wiring graph that be formed at the top 213A of distributing board 213 be connected with crown cap 212 via the electrode 232A and the electrode 232B that is formed at the top 254A of distributing board 254 of the top 214A that is formed at distributing board 214.Distributing board 213,214,254 is a printing distributing board, but also can be other distributing board.

Crown cap 212 is bent into コ word shape with the metallic plate punch process and forms, and has pawl 218.Specifically, crown cap 212 has top part 212A,

side surface part

212B, 212C and pawl 218.Top part 212A has rectangular-shaped, and it has limit 1212B, the 1212C of mutual opposition side and limit 1212D, the 1212E of mutual opposition side.

Side surface part

212B, 212C extend downwards respectively from limit 1212B, the 1212C of top part 212A.Pawl 218 extends downwards from limit 1212D.Pawl 218 positions crown cap 212 when crown cap 212 is fixed in distributing board 213, is the smaller projection shape, and perhaps the part bending with metallic plate forms.Pawl 218 also can have hook shape.

On distributing board 213, on the 213A, a plurality of electronic unit 216A are installed.Electronic unit 216A is chip parts such as high-frequency semiconductor, chip coil, also can be the parts that produce electromagnetic noise or be subjected to the influence of electromagnetic noise on every side easily.Below distributing board 213, on the 213B, a plurality of electronic unit 216B are installed.Electronic unit 216B is chip parts such as high-frequency semiconductor, chip coil, also can be the parts that produce electromagnetic noise or be subjected to the influence of electromagnetic noise on every side easily.

By form distributing board 213 by multi-layer wiring board, electronic unit 216A can be connected with electronic unit 216B.Electronic unit 216A and electronic unit 216B can be connected to each other via top 213A that is connected in distributing board 213 and the through hole of following 213B, thus, have improved the degree of freedom of design of the circuitous pattern of electronic component package 211.

β (ベタ) figure or shielding figure that distributing board 113 also can be built-in be made of Copper Foil etc.By this figure, electronic unit 216A, the separation of 216B mutual electromagnetic can be able to be prevented to interfere.

On distributing board 213 213A and below be formed with wiring graph and/or scolder resist on the

213B.Electronic unit

216A, 216B have the outer electrode portion that is connected in the top 213A and/or the following 213B of distributing board 213 by soldering.

Distributing board 214 is via adhesive linkage 215 213A on the end of distributing board 213 213C is fixed in.That is, the end of distributing board 213 213C in the above 213A be provided with adhesive linkage 215, on adhesive linkage 215, be fixed with distributing board 214.213A above distributing board 254 is fixed on the end 213D of the opposition side of the end of distributing board 213 213C via adhesive linkage 255.That is, the end of distributing board 213 213D in the above 213A be provided with adhesive linkage 255, on adhesive linkage 255, be fixed with distributing board 254.

Distributing board 264 is via adhesive linkage 265 213B below the end of distributing board 213 213C is fixed in.That is, the end of distributing board 213 213C below 213B be provided with adhesive linkage 265, on adhesive linkage 265, be fixed with distributing board 264.213B below distributing board 274 is fixed on the end 213D of the opposition side of the end of distributing board 213 213C via adhesive linkage 275.That is, the end of distributing board 213 213D below 213B be provided with adhesive linkage 275, on adhesive linkage 275, be fixed with distributing board 274.Distributing board 214,254,264,274 extends parallel to each other.

Fig. 6 B is the stereogram of electronic component package 211.The top 214A that the top part 212A of crown cap 212 is positioned at distributing board 214 goes up on the top 254A with distributing board 254, the top 213A and the electronic unit 216A of covering distributing board 213.The side surface part 212B of crown cap 212,212C extend to distributing board 264,274, surround electronic unit 216B.

Crown cap 212 is that

side surface part

212B, 212C have height 217B.Height 217B is preferably below the total 217C of thickness of distributing board 213,214,264 and adhesive linkage 215,265.In addition, preferably be provided with the height of electronic unit 216A 213A above distributing board 213 littler from the height of top 213A than 214A, 254A above the distributing board 214,254.Can prevent that thus electronic unit 216 from directly contacting with crown cap 212.In addition by this structure, can guarantee crown cap 212 with the installation electronic component package 211 motherboard between insulation distance.

By pawl 218 is strengthened, can access the shield effectiveness that produces by pawl 218.Fig. 6 C is other the stereogram of crown cap 712 in the execution mode 2.In Fig. 6 C, give identical symbol for the part identical with Fig. 6 A, its explanation is omitted.Crown cap 712 replaces the pawl 218 of the crown cap 212 shown in Fig. 6 A, the side surface part 212E that has the side surface part 212D that extends from the limit 1212D of top part 212A downwards and extend downwards from the limit 1212E of the opposition side of limit 1212D.Side surface part 212D links to each other with

side surface part

212B, 212C, and side surface part 212E links to each other with side surface part 212B, 212C.

Side surface part

212D, 212E cover side and the side of adhesive linkage 215,255,265,275, screening electron parts 216A, the 216B effectively of distributing board 213,214,254,264,274.

Like this, electronic component package 211 is for shielding the small-sized Chip Size/Scale Package (CSP) of electronic unit such as a plurality of semiconductors.

Fig. 7 A is the face upwarding stereogram of electronic component package 211.Below distributing board 264, be provided with a plurality of electrode 232C on the 264B.Below distributing board 274, be provided with a plurality of electrode 232D on the 274B.Constitute

electrode

232C, 232D and be connected in motherboard, electronic component package 211 is installed on motherboard.A plurality of

electrode

232C, 232D shown in Fig. 7 A is Land Grid Array (LGA) or FinePitch LGA (FLGA).According to purposes, a plurality of

electrode

232C, 232D also can be Ball Grid Array (BGA) and/or Fine Pitch BGA (FBGA) in

addition.Electrode

232C, 232D can be formed by Copper Foil and/or the scolder resist of the following 264B, the 274B that are formed at distributing board 264,274, with the packing density raising of electronic component package 211.

Fig. 7 B is other the face upwarding stereogram of electronic component package 211A in the execution mode 2.In Fig. 7 B, give identical symbol for the part identical with the electronic component package 211 shown in Fig. 7 A, its explanation is omitted.Electronic component package 211A shown in Fig. 7 B replaces the crown cap 212 of the electronic component package 211 shown in Fig. 7 A, possesses the crown cap 712 shown in Fig. 6 C.

Shown in Fig. 6 A, Fig. 6 B, Fig. 7 A, Fig. 7 B,, can increase the top 213A of distributing board 213 and the area that

electronic unit

216A, 216B can be installed of following 213B by being provided with distributing board 214,254,264,274 littler than distributing board 213.By 213A on distributing board 213 and below

electronic unit

216A, 216B are installed on the 213B, can carry out miniaturization, the lightweight of electronic component package 211.

Crown cap 212 is bent into コ word shape with metallic plate and forms.The height 217B of crown cap 212 (

side surface part

212B, 212C) is identical or littler than it with the height 217C of the total of distributing board 214,264 with distributing board 213, adhesive linkage 215,265.Thus, can prevent that the stress that the installation by crown cap 212 causes from producing at electronic unit 216A.Crown cap 212 can be installed on distributing board 213,214,254,264,274 by soldering and/or machining.

By making the pawl 218 contact distributing boards 214 that are formed at crown cap 212, can prevent the dislocation of crown cap 212, can easily locate crown cap 212 accurately with respect to distributing board 214.

Next, the manufacture method to electronic component package 211 describes.Fig. 8 is the exploded perspective view of the manufacture method of expression electronic component package 211.Filled conductive cream in the hole that is formed at adhesive linkage 215,255,265,275 and form through

hole

220A, 220B, 220C, 220D respectively.Then, the stacked adhesive linkage 215,255 of 214B, 254B difference below distributing board 214,254, the stacked adhesive linkage 265,275 of 264A, 274A difference on distributing board 264,274.Then, adhesive linkage 215,255 is laminated in the top 213A of distributing board 213, adhesive linkage 265,275 is laminated in the following 213B of distributing board 213 by instruments such as mould, stamping machines by instruments such as mould, stamping machines.Like this, by the adhesive linkage 215,255,265,275 that has through

hole

220A, 220B, 220C, 220D respectively that distributing board 213,214,254,264,274 is fixing.

On distributing board 213, be formed with a plurality of electrode 219A on the 213A.Below distributing board 214, be formed with electrode 231A on the 214B.Below distributing board 254, be formed with electrode 231B on the 254B.Through hole 220A is connected the electrode 219A of distributing board 213 with the electrode 231A of distributing board 214.Through hole 220B is connected the electrode 219A of distributing board 213 with the electrode 231B of distributing board 254.Below distributing board 213, be formed with a plurality of electrode 219B on the 213B.On distributing board 264, be formed with electrode 231C on the 264A.On distributing board 274, be formed with electrode 231D on the 274A.Through hole 220C is connected the electrode 219B of distributing board 213 with the electrode 231C of distributing board 264.Through hole 220D is connected the electrode 219B of distributing board 213 with the electrode 231D of distributing board 274.Adhesive linkage 215 has the following 215B of top 215A and its opposition side.Adhesive linkage 255 has the following 255B of top 255A and its opposition side.Following 215B, 255B are positioned at the top 213A of distributing board 213.Top 215A, 255A lay respectively at following 214B, the 254B of distributing board 214,254.Adhesive linkage 265 has the following 265B of top 265A and its opposition side.Adhesive linkage 275 has the following 275B of top 275A and its opposition side.Top 265A, 275A are positioned at the following 213B of distributing board 213.Following 265B, 275B lay respectively at top 264A, the 274A of distributing board 264,274.

In addition, also can distributing board 213,214,254,264,274 is simultaneously stacked together fixing by the adhesive linkage 215,255,265,275 that has through

hole

220A, 220B, 220C, 220D respectively.By like this, can cut down man-hour.

Then, same with Fig. 4, distributing board 113,114,154 and/or adhesive linkage 115,155 shown in Figure 5, distributing board 213,214,254,264,274 and adhesive linkage 215,255,265,275 are cut apart.Then, touch the mode of 214A, 254A above distributing board 214,254, crown cap 212 is installed on distributing board 213,214,254,264,274 with crown cap 212.

Through hole 220A～220D has shield effectiveness.In addition by forming through hole 220A～220D, can and dispel the heat to

electronic unit

216A, 216B effectively to the heat of crown cap 212 transmission distributing boards 213 and/or

electronic unit

216A, 216B by the higher member of pyroconductivity.

Be electrically connected with crown cap 212 by the wiring graph that will be formed at distributing board 213,214,254,264,274, not only crown cap 212, can also make distributing board 213,214,254,264,274 have shield effectiveness and/or radiating effect with respect to

electronic unit

216A, 216B.

Adhesive linkage 215,255,265,275 by with the execution mode 1 shown in Figure 1A in adhesive linkage 115,155 identical materials constitute and have identical thickness and/or shape, have identical effect.

In addition, by to using the higher member of reliability of FR4 level and/or FR5 level in adhesive linkage 215,255,265,275, the distributing board 213,214,254,264,274, can improve the reliability of electronic component package 211.

In the size of distributing board 213 is 10mm * 10mm when following, can guarantee the intensity of electronic component package 211 by the structure shown in Fig. 6 A.When the size of distributing board 213 surpasses 10mm * 10mm, also the central authorities between the adhesive linkage 215,255 on the 213A are provided with other adhesive linkage with adhesive linkage 215,255 same configuration in the above, at this bonding other distributing board that is provided with on layer by layer with distributing board 214,254 same configuration.Touch top part 212A above this distributing board in crown cap 212.Thus, can improve intensity on the thickness direction of electronic component package 211.In addition, by this distributing board and crown cap 212 is fixing, can improve the rigidity of electronic component package 211 by soldering, bonding agent etc.

Crown cap 212 is preferably formed by the metallic plate below the above 1.0mm of thickness 0.1mm.During less than 0.1mm, has the possibility of distortion when handling at thickness.If thickness is greater than 1.0mm in addition, then the processing of metallic plate becomes difficult, and it is big that weight becomes.By crown cap 212,, can also obtain radiating effect and/or heat propagation effect (ヒ one トスプレ Star De effect) except shield effectiveness.At this moment, also the shape of crown cap 212 can be made as fin shape, perhaps the fin with heat transmission is installed on crown cap 212.

This moment in addition, by forming through

hole

220A, 220B, can and dispel the heat to

electronic unit

216A, 216B by the higher member of pyroconductivity.

By at least a portion of crown cap 212 is electroplated, can prevent the variable color of metal part in addition.By carrying out nickel plating, zinc-plated etc., can firmly crown cap 212 be connected in distributing board 214,254 in addition by scolding tin.

In electronic component package 211, distributing board 214,254 is fixed in distributing board 213 via adhesive linkage 215,255 respectively, is fixed with crown cap 212 on distributing board 214,254.Crown cap 212 do not touch in be installed in distributing board 213 above on the 213A electronic unit 216A and separate with it.Thus, do not transmit,, can access electronic component package 211 small-sized and that reliability is high so can on electronic unit 216A, not produce stress to electronic unit 216A to the external force that crown cap 2112 transmits.In addition, the inequality of the height of electronic unit 216A or height brings influence can for the height 217B of crown cap 212 and/or the height of electronic component package 211.

(execution mode 3)

Fig. 9 is the exploded perspective view of the electronic component package 411 in the execution mode 3.Crown cap 412 is bent into コ word shape with the metallic plate punch process and forms, and has pawl 418.Specifically, crown cap 412 has top part 412A,

side surface part

412B, 412C and pawl 418.Top part 412A has rectangular-shaped, has limit 1412B, the 1412C of mutual opposition side and limit 1412D, the 1412E of mutual opposition side.

Side surface part

412B, 412C extend downwards respectively from limit 1412B, the 1412C of top part 412A.Pawl 418 extends downwards from limit 1412D.Pawl 418 positions crown cap 412 when crown cap 412 is fixed in distributing board 413, is the smaller projection shape, and perhaps the part bending with metallic plate forms.Pawl 418 also can have hook shape.

On distributing board 413, on the 413A, a plurality of electronic unit 416A are installed.Electronic unit 416A is chip parts such as high-frequency semiconductor, chip coil, also can be the parts that produce electromagnetic noise or be subjected to the influence of electromagnetic noise on every side easily.

On distributing board 413 413A and below be formed with wiring graph and/or scolder resist on the 413B.On distributing board 414 414A and below be provided with wiring graph and/or scolder resist on the 414B.Electronic unit 416A has the outer electrode portion that is connected in the top 413A of distributing board 413 by soldering.

Distributing board 414 is via adhesive linkage 415 413A on the end of distributing board 413 413C is fixed in.That is, the end of distributing board 413 413C in the above 413A be provided with adhesive linkage 415, on adhesive linkage 415, be fixed with distributing board 414.413A above distributing board 454 is fixed on the end 413D of the opposition side of the end of distributing board 413 413C via adhesive linkage 455.That is, the end of distributing board 413 413D in the above 413A be provided with adhesive linkage 455, on adhesive linkage 455, be fixed with distributing board 454.

On distributing board 453, on the 453A, a plurality of electronic unit 416B are installed.Electronic unit 416B is chip parts such as high-frequency semiconductor, chip coil, also can be the parts that produce electromagnetic noise or be subjected to the influence of electromagnetic noise on every side easily.

The top 453A of distributing board 453 and following 453B are provided with wiring graph and/or scolder resist.The top 414A of distributing board 414 and following 414B are provided with wiring graph and/or scolder resist.The top 464A of distributing board 464 and following 464B are provided with wiring graph and/or scolder resist.Electronic unit 416B has the outer electrode portion that is connected in the top 453A of distributing board 453 by soldering.Distributing board 413,414,453,464 is a printing distributing board, but also can be other distributing board.

Distributing board 464 is via adhesive linkage 465 453A on the end of distributing board 453 453C is fixed in.That is, the end of distributing board 453 453C in the above 453A be provided with adhesive linkage 465, on adhesive linkage 465, be fixed with distributing board 464.453A above distributing board 474 is fixed on the end 453D of the opposition side of the end of distributing board 453 453C via adhesive linkage 475.That is, the end of distributing board 453 453D in the above 453A be provided with adhesive linkage 475, on adhesive linkage 475, be fixed with distributing board 474.Distributing board 414,454,464,474 extends parallel to each other.

On distributing board 464, be provided with adhesive linkage 485 on the 464A.On distributing board 474, be laminated with adhesive linkage 495 on the 474A.Below the 413C of the end of distributing board 413, be provided with adhesive linkage 485 on the 413B.Below the 413D of the end of distributing board 413, be laminated with adhesive linkage 495 on the 413B.Can be between the distributing board 413,453 by being formed at through hole 420E, the 420F of adhesive linkage 485,495 respectively, the through hole that is formed at the electrode of distributing board 464,474 and is formed at adhesive linkage 465,475 is electrically connected.

Figure 10 A is the stereogram of electronic component package 411.The top 414A that the top part 412A of crown cap 412 is positioned at distributing board 414 goes up on the top 454A with distributing board 454, the top 413A and the electronic unit 416A of covering distributing board 413.The side surface part 412B of crown cap 412,412C extend to distributing board 453, surround electronic unit 416B.

Figure 10 B is the face upwarding stereogram of electronic component package 411.Below distributing board 453, be provided with a plurality of electrode 419D on the 453B.Constitute electrode 419D and be connected in motherboard, electronic component package 411 is installed on motherboard.Electrode 419D is Land Grid Array (LGA) or Fine PitchLGA (FLGA).According to purposes, electrode 419D also can be Ball Grid Array (BGA) and/or Fine Pitch BGA (FBGA) in addition.Electrode 419D can be formed by Copper Foil and/or the scolder resist of the following 453B that is formed at distributing board 453, with the packing density raising of electronic component package 411.

Next, the manufacture method to electronic component package 411 describes.Figure 11 and Figure 12 are the stereograms of the manufacture method of expression electronic component package 411.

Same with electronic component package 111 shown in Figure 3, the adhesive linkage 415 that will have through hole is stacked with distributing board 414.The adhesive linkage 455 that will have through hole is stacked with distributing board 454.Then, by instruments such as mould, stamping machines adhesive linkage 415,455 is laminated in distributing board 413.Like this, adhesive linkage 415, the 455 permanent wiring plates 413,414,454 by having through hole.On distributing board 414,454, be respectively equipped with

electrode

432A, 432B on 414A, the 454A.The top 413A of distributing board 413 has and exposes from adhesive linkage 415,455 and the effective area 421 of electronic unit 416A can be installed.Electronic unit 416A is installed on the effective area 421 of 413A on distributing board 413.By on end 413C, the 413D of the mutual opposition side of distributing board 413 via adhesive linkage 415,455 permanent wiring plates 414,454, can increase effective area 421, electronic unit 416A can be installed to high-density arrive adhesive linkage 415,455 and/or distributing board 414,454 up to soon.

By enlarging effective area 421, can enlarge the printing area of solder paste 413A above distributing board 413, can reduce the uneven thickness of solder paste, can improve the printing precision of solder paste.As a result, improve manufacturability, suppressed the production cost of electronic component package 411.At cut-off rule 411A stacked distributing board 413,414,454 and adhesive linkage 415,455 are cut off.

The adhesive linkage 465 that will have through hole is stacked with distributing board 464.The adhesive linkage 475 that will have through hole is stacked with distributing board 474.Then, by instruments such as mould, stamping machines adhesive linkage 465,475 is laminated in distributing board 453.Like this, adhesive linkage 465, the 475 permanent wiring plates 453,464,474 by having through hole.Filled conductive cream in the hole that is formed at adhesive linkage 485,495 and form through hole 420E, 420F.The adhesive linkage 485 that will have through hole 420E is laminated in the top 464A of distributing board 464.The adhesive linkage 495 that will have through hole 420F is laminated in the top 474A of distributing board 474.Through hole 420E, 420F expose on 485A, the 495A on adhesive linkage 485,495 respectively.The top 453A of distributing board 453 has and exposes from adhesive linkage 465,475 and the effective area 421A of electronic unit 416B can be installed.Electronic unit 416B is installed on the effective area 421A of 453A on distributing board 453.By on end 453C, the 453D of the mutual opposition side of distributing board 453 via adhesive linkage 465,475 permanent wiring plates 464,474, can increase effective area 421A, electronic unit 416B can be installed to high-density arrive adhesive linkage 465,475 and/or distributing board 464,474 up to soon.By making distributing board 414,454,464,474 littler, can increase effective area 421, the 421A of top 413A, the 453A of distributing board 413,453 than distributing board 413,453.

In addition, also can be on distributing board 464 464A and below fixed bonding layer 485, adhesive linkage 465 respectively on the 464B, on distributing board 474 474A with below distinguish fixed bonding layer 495, adhesive linkage 475 on the 474B.Then, adhesive linkage 465,475 is laminated in the top 453A of distributing board 453.

By enlarging effective area 421A, can enlarge the printing area of solder paste 453A above distributing board 453, can reduce the uneven thickness of solder paste, can improve the printing precision of solder paste.As a result, improve manufacturability, suppressed the production cost of electronic component package 411.At cut-off rule 411B stacked distributing board 453,464,474 and adhesive linkage 465,475,485,495 are cut off.

Then, via the adhesive linkage 485,495 that has through

hole

420E, 420F respectively stacked distributing board 464,474 on the 413B below distributing board 413.Adhesive linkage 415 has the following 415B of top 415A and its opposition side.Adhesive linkage 455 has the following 455B of top 455A and its opposition side.Following 415B, 455B are positioned at the top 413A of distributing board 413.

Top

415A, 455A lay respectively at following 414B, the 454B of distributing board 414,454.Adhesive linkage 465 has the following 465B of top 465A and its opposition side.Adhesive linkage 475 has the following 475B of top 475A and its

opposition side.Top

465A, 475A lay respectively at following 464B, the 474B of distributing board 464,474.Following 465B, 475B are positioned at the top 453A of distributing board 453.Adhesive linkage 485 has the following 485B of top 485A and its opposition side.Adhesive linkage 495 has the following 495B of top 495A and its opposition side.Following 485B, 495B lay respectively at top 464A, the 474A of distributing

board 464,474.Top

485A, 495A are positioned at the following 413B of distributing board 413.

Figure 12 is by the stereogram of distributing board after cutting apart 413,414,453,454,464,474 and adhesive linkage 415,455,465,475,485,495.Stacked distributing board 413,414,453,454,464,474 and adhesive linkage 415,455,465,475,485,495 can be along cut-

off rule

411A, 411B by being cut off by the method for the machinery of milling cutter etc.In addition, also can be by being pre-formed joint-cutting and/or V groove and/or machine line along cut-

off rule

411A, 411B, distributing board 413,414,453,454,464,474 that dividing layer gathers into folds and adhesive linkage 415,455,465,475,485,495 in distributing board 413,414,453,454,464,474.

In addition, by

electronic unit

416A, 416B were installed on 413A, the 453A, can suppress installation cost on distributing board 413,453 before cutting apart distributing board 413,414,453,454,464,474 and adhesive linkage 415,455,465,475,485,495.Even when cutting apart in that distributing board 413,453 is turned up, distributing board 414,454,464,474 keeps the rigidity of distributing boards 413,453, so can make be difficult to produce unwanted stress at

electronic unit

416A, 416B when the cut-out of distributing board 413,453.By above-mentioned method, can stablize the manufacturing electronic component package 411 of screening

electron parts

416A, 416B reliably.

Adhesive linkage 415,455,465,475,485,495 by with the execution mode 1 shown in Figure 1A in adhesive linkage 115,155 identical materials constitute, and be of similar shape and/or thickness, have identical effect.

In addition, by the higher member of reliability, can improve the reliability of electronic component package 411 to adhesive linkage 415,455,465,475,485,495 and/or distributing board 413,414,453,454,464,474 use FR4 levels and/or FR5 level.

In the size of distributing board 413,453 is 10mm * 10mm when following, can guarantee the intensity of electronic component package 411 by structure shown in Figure 9.When the size of distributing board 413,453 surpasses 10mm * 10mm, also the central authorities between the adhesive linkage 415,455 on the 413A are provided with other adhesive linkage with adhesive linkage 415,455 same configuration in the above, at this bonding other distributing board that is provided with on layer by layer with distributing board 414,454 same configuration.Touch top part 412A above this distributing board in crown cap 412.Thus, can improve intensity on the thickness direction of electronic component package 411.In addition, by this distributing board and crown cap 412 is fixing, can improve the rigidity of electronic component package 411 by soldering, bonding agent etc.

Crown cap 412 is preferably formed by the metallic plate below the above 1.0mm of thickness 0.1mm.During less than 0.1mm, has the possibility of distortion when handling at thickness.If thickness is greater than 1.0mm in addition, then the processing of metallic plate becomes difficult, and it is big that weight becomes.By crown cap 412,, can also obtain radiating effect and/or heat propagation effect except shield effectiveness.At this moment, also the shape of crown cap 412 can be made as fin shape, perhaps the fin with heat transmission is installed on crown cap 412.

This moment in addition, by forming through hole 420A, 420B, can and dispel the heat to

electronic unit

416A, 416B effectively to the heat of crown cap 412 transmission distributing boards 413,453 and/or

electronic unit

416A, 416B by the higher member of pyroconductivity.

By at least a portion of crown cap 412 is electroplated, can prevent the variable color of metal part in addition.By carrying out nickel plating, zinc-plated etc., can firmly crown cap 412 be connected in distributing board 414,454 in addition by scolding tin.

In electronic component package 411, distributing board 414,454 is fixed in distributing board 413 via adhesive linkage 415,455 respectively, is fixed with crown cap 412 on distributing board 414,454.Crown cap 412 do not touch in be installed in distributing board 413 above electronic unit 416A ground on the 413A separate with it.Thus, do not transmit,, can access electronic component package 411 small-sized and that reliability is higher so can on electronic unit 416A, not produce stress to electronic unit 416A to the external force that crown cap 412 transmits.In addition, the inequality of the height of electronic unit 416A or height brings influence can for the height 417C of crown cap 412 and/or the height of electronic component package 411.

(execution mode 4)

Figure 13 A is the exploded perspective view of the electronic component package 311 in the execution mode 4.Figure 13 B is the cutaway view on the line 13B-13B line of the electronic component package 311 shown in Figure 13 A.

On distributing board 313, on the 313A, a plurality of electronic units 316 of semiconductor, chip part etc. are installed.

On distributing board 313 313A and below be provided with wiring graph and/or scolder resist on the 313B.On distributing board 314 314A and below be provided with wiring graph and/or scolder resist on the 314B.On distributing board 354 354A and below be provided with wiring graph and/or scolder resist on the 354B.Electronic unit 316 has the outer electrode portion that is connected in the top 313A of distributing board 313 by soldering.Distributing board 313,314,354 is a printing distributing board, but also can be other distributing board.

Distributing board 314 is via adhesive linkage 315 313A on the end of distributing board 313 313C is fixed in.That is, the end of distributing board 313 313C in the above 313A be provided with adhesive linkage 315, on adhesive linkage 315, be fixed with distributing board 314.313A above distributing board 354 is fixed on the end 313D of the opposition side of the end of distributing board 313 313C via adhesive linkage 355.That is, the end of distributing board 313 313D in the above 313A be provided with adhesive linkage 355, on adhesive linkage 355, be fixed with distributing board 354.Distributing board 314,354 extends parallel to each other.

At least a portion in a plurality of electronic units 316 covers by the packed layer 312 that is made of the resin that is filled between the distributing board 314,354.By by packed layer 312 overlay electronic parts 316, can improve the long-term reliability of electronic unit 316.

The height of packed layer 312 313A above distributing board 313 be preferably distributing board 314 above below the height of 314A 313A above distributing board 313.Thus, when handling, be difficult on packed layer 312, produce scar, can on thickness direction, pile up electronic component package 311.In addition,,, can make the thickness of this packed layer 312 that constitutes by resin even thus by the resin of distributing board 314,354 sealing liquid shapes by this structure, can attenuate packed layer 312, so can reduce the cost of electronic component package 311.

Like this, electronic component package 311 is can be by the small-sized Chip Size/Scale Package (CSP) of electronic units 316 such as a plurality of semiconductors of packed layer 312 protections.

Figure 14 is the face upwarding stereogram of electronic component package 311.Below distributing board 313, be provided with a plurality of electrode 318B on the 313B.Constitute electrode 318B and be connected in motherboard, electronic component package 311 is installed on motherboard.A plurality of electrode 318B shown in Figure 14 are Land Grid Array (LGA) or Fine Pitch LGA (FLGA).According to purposes, a plurality of electrode 318B also can be Ball Grid Array (BGA) and/or Fine Pitch BGA (FBGA) in addition.Electrode 318B can be formed by Copper Foil and/or the scolder resist of the following 313B that is formed at distributing board 313, with the packing density raising of electronic component package 311.

By being provided with distributing board 314,354 littler, can increase the area that electronic unit 316 can be installed among the top 313A of distributing board 313 than distributing board 313.

When distributing board 313,314,354 was formed by glass epoxy resin, packed layer 312 mainly contained epoxy resin, can make the matched coefficients of thermal expansion (consistent) of distributing board 313,314,354 and packed layer 312 thus.Thus, even when distributing board 313 is thin, be when having 4 layer multi-layer distributing boards of the thickness that is preferably below the 0.6mm below the 0.4mm for example at distributing board 313, distributing board 313 also can be crooked, can prevent the bending (warpage, anti-り) of electronic component package 311.

Next, the manufacture method to electronic component package 311 describes.Figure 15 to Figure 18, Figure 20, Figure 21 are the stereograms of the manufacture method of expression electronic component package 311.

As shown in figure 15, filled conductive cream and form through

hole

319A, 319B in the hole that is formed at adhesive linkage 315,355.The adhesive linkage 315 that will have through hole 319A is stacked with distributing board 314, and the adhesive linkage 355 that will have through hole 319B is stacked with distributing board 354.Then, by instruments such as mould, stamping machines adhesive linkage 315,355 is laminated in distributing board 313.Like this, by the adhesive linkage 315,355 that has through

hole

319A, 319B respectively distributing board 314,354 is fixed in distributing board 313.Especially, when adhesive linkage 315,355 is not harder solid, like this adhesive linkage 315,355 is pasted on distributing board 313 in advance.By with adhesive linkage 315,355 predetermined fixed in distributing board 314,354, can easily handle adhesive linkage 315,355.Adhesive linkage 315 has the following 315B of top 315A and its opposition side.Adhesive linkage 355 has the following 355B of top 355A and its opposition side.Following 315B, 355B are positioned at the top 313A of distributing board 313.

Top

315A, 355A lay respectively at following 314B, the 354B of distributing board 314,354.

On distributing board 313, be formed with a plurality of electrode 318A on the 313A.Below distributing board 314, be formed with electrode 331A on the 314B.Below distributing board 354, be formed with electrode 331B on the 354B.Through hole 319A is connected the electrode 318A of distributing board 313 with the electrode 331A of distributing board 314.Through hole 319B is connected the electrode 318A of distributing board 313 with the electrode 331B of distributing board 354.

Also distributing board 314,354 can be fixed in distributing board 313 simultaneously by the adhesive linkage 315,355 with through hole 319A, 319B.By like this, can cut down man-hour.

Figure 16 is the stacked distributing board 313,314,354 and the stereogram of adhesive linkage 315,355.The top 313A of distributing board 313 has and exposes from adhesive linkage 315,355 and the effective area 320 of electronic unit 316 can be installed.Electronic unit 316 is installed on the effective area 320 of 313A on distributing board 313.By on end 313C, the 313D of the mutual opposition side of distributing board 313 via adhesive linkage 315,355 permanent wiring plates 314,354, can increase effective area 320, electronic unit 316 can be installed to high-density arrive adhesive linkage 315,355 and/or distributing board 314,354 up to soon.

By enlarging effective area 320, can enlarge the printing area of solder paste 313A above distributing board 313, can reduce the uneven thickness of solder paste, can improve the printing precision of solder paste.As a result, improve manufacturability, suppressed the production cost of electronic component package 311.

Also can on distributing board 314,354, on 314A, the

354A electrode

332A, 332B be set

respectively.By electrode

332A, 332B are connected in motherboard, the top 313A of distributing board 313 can be installed on this motherboard towards this motherboard ground with electronic component package 311.

As shown in figure 17, a plurality of electronic units 316 are installed on the effective area on the 313A 320 on distributing board 313.Then, at least a portion by packed layer 312 overlay electronic parts 316.

Figure 18 represents to be used to form the wall portion 321 of packed layer 312.In wall portion 321, be formed with otch 322.As shown in figure 18, fixing wall portion 321 on distributing board 313,314,354.Wall portion 321 can unload and can utilize again from distributing board 313,314,354, can form packed layer 312 effectively.Effective area 320 on the top 313A of distributing board 313 is by distributing board 314,354, adhesive linkage 315,355 and wall portion 321 whole encirclements.Inject the packing material that becomes packed layer 312 in the effective area 320 above the distributing board 313 that surrounds by these members on the 313A.

Figure 19 A and Figure 19 B are the cutaway views that is injected with the distributing board 313 of packing material 323 in effective area 320.Packing material 323 is made of liquid resins such as for example silicones (シリコ Application Trees fat) before solidifying, epoxy resin.The viscosity of packing material 323 is preferably in 100/ second the scope more than 1/ second below 1 pool above 1000 moors in velocity gradient (ズリ speed).Low viscous packing material 323 price height less than 1 pool.Full-bodied packing material 323 greater than 1000 pools is difficult to the bubble that is involved in the inside of packing material 323 is discharged.When the velocity gradient when measuring viscosity was less than 1/ second in addition, be difficult to produce shear stress (ずり ying power), so viscosimetric analysis is difficult.In velocity gradient during greater than 100/ second, the viscometer determining viscosity of the high price of the spin stabilization in the time of need be by high speed rotating.

Figure 19 A represents to be filled in a large amount of packing material 323 of the effective area 320 that is surrounded by wall portion 321 and/or distributing board 314,354.Such packing material 323 than distributing board 314,354 above 314A, 354A when upwards bloating, the damage easily of the surface of packing material 323 brings influence for the low level of electronic component package 311.And then, have packing material 323 from the possibility that distributing board 314,354 overflows to the outside, have the peripheral part that pollutes electronic component package 311 and/or be formed at the possibility of electrode 318B of the following 313B of distributing board 313.

The end 322A of otch 322 that is formed at wall portion 321 is lower apart from the height H 302 of top 313A than top 314A, the 354A of distributing board 314,354 apart from the height H 301 of top 313A.Thus, can unnecessary packing material 323 be emitted to the outside from effective area 320 from otch 322, shown in Figure 19 B, can make packing material 323 low apart from the height of top 313A, can prevent that packing material 323 from overflowing from distributing board 314,354 apart from the aspect ratio distributing board 314,354 of top 313A.Thus, can on distributing board 314,354,

form electrode

332A, 332B respectively on 314A, the 354A as shown in figure 14.Thus, packing material 323 can be easily filled, the filling and/or the curing of packing material 323 can be carried out automatically by machinery.

Figure 20 represent to make packing material 323 to solidify and packed layer 312.In Figure 20, wall portion 321 has been unloaded in addition.By stacked distributing board 313,314,354 and adhesive linkage 315,355 being cut off, can produce a plurality of electronic component packages 311 together at cut-off rule 311A.

Figure 21 is by the stereogram of the distributing board after cutting apart 313,314,354, adhesive linkage 315,355 and packed layer 312.Distributing board 313,314,354, adhesive linkage 315,355 and packed layer 312 can cut off by the method for the machinery that undertaken by milling cutter etc.In addition, also can be by being pre-formed joint-cutting and/or V groove and/or machine line along cut-off rule 311A, distributing board 313,314,354 that dividing layer gathers into folds and adhesive linkage 315,355 in distributing board 313,314,354.

Adhesive linkage 315,355 by with the execution mode 1 shown in Figure 1A in adhesive linkage 115,155 identical materials constitute and have identical thickness and/or shape, have identical effect.

In addition, by the higher member of reliability, can improve the reliability of electronic component package 311 to adhesive linkage 315,355 and/or distributing board 313,314,354 use FR4 levels and/or FR5 level.

Packing material 323 (packed layer 312) mainly contains resins such as epoxy resin and/or silicones in addition, has improved the reliability of packed layer 312 thus.In order to increase the intensity of packed layer 312, packing material 323 also can contain glass and/or inorganic fillers such as silica, aluminium oxide in addition.Packing material 323 also can contain the material that aluminium hydroxide etc. is difficult to burn, and can make packed layer 312 be difficult to burning thus.Aluminium hydroxide Al (OH) ₃Be the crystallization of white powder and all very stable till about 200 ℃ temperature.If be the above temperature of this temperature, then produce the dissociation reaction of the crystallization water, aluminium hydroxide is decomposed into 66% Al ₂O ₃Water with 34% can access bigger endothermic effect when this reaction, make packed layer 312 be difficult to burning.

Also can carry out the shielding of electronic component package thus by the surface of electrically conductive film overlay electronic component packages bodies 311 such as nickel coating.

In the above-described embodiment, the relative direction of position of the structure member of electronic component packages such as distributing board and/or adhesive linkage only represented to exist with ... in the term of expression directions such as " top " " following " " below ", do not represent absolute directions such as reverse up and down.

In this electronic component package,, useful so conduct is difficult to be subjected to the small-sized electronic equipment of influence of noise even also can on electronic unit, not produce unwanted stress producing stress on the crown cap.

Claims

1. electronic component package wherein, comprising:

The 1st distributing board;

The 1st electronic unit, it is installed on described the 1st distributing board top;

The 1st adhesive linkage is on it is arranged on above described the 1st distributing board described;

The 2nd distributing board, it is arranged on described the 1st adhesive linkage top, and is littler than described the 1st distributing board; With

Crown cap, it covers above described the 1st distributing board described, described the 2nd distributing board and described the 1st electronic unit.

2. electronic component package as claimed in claim 1, wherein:

Also comprise:

The 2nd adhesive linkage is on it is arranged on above described the 1st distributing board described; With

The 3rd distributing board, it is arranged on described the 2nd adhesive linkage top,

Described the 1st distributing board has the 1st end and the 2nd end of mutual opposition side,

Described the 1st adhesive linkage and described the 2nd adhesive linkage are arranged at described the 1st end and described the 2nd end of described the 1st distributing board respectively,

Described crown cap covers above described the 1st distributing board described, described the 2nd distributing board, described electronic unit and described the 3rd distributing board.

3. electronic component package as claimed in claim 1, wherein, described crown cap has:

Top part, it touches above described the 2nd distributing board, has the 1st limit and the 2nd limit of mutual opposition side;

The 1st side surface part, extend downwards on its described the 1st limit from described top part, has the following height of total height of described the 1st distributing board, described the 1st adhesive linkage and described the 2nd distributing board; With

The 2nd side surface part, extend downwards on its described the 2nd limit from described top part, has the following height of total height of described the 1st distributing board, described the 1st adhesive linkage and described the 2nd distributing board.

4. electronic component package as claimed in claim 1, wherein, described the 1st adhesive linkage has the through hole that described the 1st distributing board is electrically connected with described the 2nd distributing board.

5. electronic component package as claimed in claim 1, wherein, described the 1st adhesive linkage contains thermosetting resin and inorganic filler, and having thickness is the chip shape of 30 μ m～300 μ m.

6. electronic component package as claimed in claim 1, wherein:

Also comprise:

The 2nd adhesive linkage is on it is arranged on above described the 1st distributing board described;

The 3rd distributing board, it is arranged on described the 2nd adhesive linkage top;

The 2nd electronic unit, it was installed on described the 1st distributing board following;

The 3rd adhesive linkage is on it is arranged on below described the 1st distributing board described; With

Described the 4th distributing board, it was arranged on described the 3rd adhesive linkage following;

Described crown cap covers above described the 1st distributing board described, described the 2nd distributing board, described the 1st electronic unit and described the 3rd distributing board.

7. electronic component package as claimed in claim 6, wherein:

Also comprise:

The 4th adhesive linkage is on it is arranged on below described the 1st distributing board described; With

Described the 5th distributing board, it was arranged on described the 4th adhesive linkage following;

Described the 1st distributing board has the 1st end and the 2nd end of mutual opposition side;

Described the 1st adhesive linkage and described the 3rd adhesive linkage are arranged at described the 1st end of described the 1st distributing board;

Described the 2nd adhesive linkage and described the 4th adhesive linkage are arranged at described the 2nd end of described the 1st distributing board.

8. electronic component package as claimed in claim 1, wherein:

Also comprise:

The 3rd adhesive linkage is on it is arranged on below described the 1st distributing board described;

The 4th distributing board, it was arranged on described the 3rd adhesive linkage following;

The 4th adhesive linkage, it was arranged on described the 1st distributing board following;

The 5th distributing board, it was arranged on described the 4th adhesive linkage following;

The 5th adhesive linkage, it was arranged on described the 5th distributing board following;

The 6th adhesive linkage, it was arranged on described the 6th distributing board following;

The 7th distributing board, it is arranged on described the 5th adhesive linkage following go up and on described the 6th adhesive linkage following; With

The 2nd electronic unit, its be installed in described the 7th distributing board above,

9. electronic component package wherein, comprising:

The 1st distributing board;

The 1st adhesive linkage, it is arranged on described the 1st distributing board top;

The 2nd distributing board, it is arranged on described the 1st adhesive linkage top;

Electronic unit, its between described the 2nd distributing board and described the 3rd distributing board, be installed in above described the 1st distributing board described on; With

Packed layer, it covers above at least a portion of described electronic unit and described the 1st distributing board described between described the 2nd distributing board and described the 3rd distributing board.

10. electronic component package as claimed in claim 9, wherein,

Described the 2nd distributing board and described the 3rd distributing board are arranged at described the 1st end and described the 2nd end of described the 1st distributing board respectively.

11. electronic component package as claimed in claim 9, wherein, the thickness of described packed layer is below the aggregate thickness of described the 2nd distributing board and described the 1st adhesive linkage.

12. electronic component package as claimed in claim 9, wherein, described packed layer mainly contains resin.

13. electronic component package as claimed in claim 9, wherein, described the 1st adhesive linkage has the through hole that described the 1st distributing board is electrically connected with described the 2nd distributing board.

14. electronic component package as claimed in claim 9, wherein, described the 1st adhesive linkage contains thermosetting resin and inorganic filler, and having thickness is the chip shape of 30 μ m～300 μ m.

15. the manufacture method of an electronic component package wherein, comprising:

Fix the step of 2nd distributing board littler on the 1st distributing board than described the 1st distributing board via the 1st adhesive linkage;

The step of the 1st electronic unit is installed on described the 1st distributing board described; With

With crown cap cover above described the 1st distributing board described, the step of described the 2nd distributing board and described electronic unit.

16. the manufacture method of electronic component package as claimed in claim 15 wherein, also comprises:

Fix the step of 4th distributing board littler on below described the 1st distributing board than described the 1st distributing board via the 3rd adhesive linkage; With

The step of the 2nd electronic unit is installed on below described the 1st distributing board described.

17. the manufacture method of an electronic component package wherein, comprising:

The step of fixing the 2nd distributing board via the 1st adhesive linkage that is arranged on described the 1st distributing board top;

The step of fixing the 3rd distributing board via the 2nd adhesive linkage on described the 1st distributing board described;

Between described the 2nd distributing board and described the 3rd distributing board, the step of electronic unit being installed on described the 1st distributing board described; With

Between described the 2nd distributing board and described the 3rd distributing board, inject packing material, the step of the described top packed layer of at least a portion of the described electronic unit of formation covering and described the 1st distributing board.