CN101794744A - Packaging structure of radiating block and convex surface for chip of printed circuit board - Google Patents
Packaging structure of radiating block and convex surface for chip of printed circuit board Download PDFInfo
- Publication number
- CN101794744A CN101794744A CN 201010108626 CN201010108626A CN101794744A CN 101794744 A CN101794744 A CN 101794744A CN 201010108626 CN201010108626 CN 201010108626 CN 201010108626 A CN201010108626 A CN 201010108626A CN 101794744 A CN101794744 A CN 101794744A
- Authority
- CN
- China
- Prior art keywords
- chip
- radiating block
- circuit board
- printed circuit
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73215—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a packaging structure of a radiating block and a convex surface for a chip of a printed circuit board, which comprises a chip (3), a single-layer or multi-layer printed circuit board (9), a wire (5), a conductive or non-conductive heat-conducting bonding substance I (2) and a plastic packaging body (8), wherein the single-layer or multi-layer printed circuit board (9) is supported below the chip; the wire (5) is used for communicating signals between the chip and the single-layer or multi-layer printed circuit board; and the conductive or non-conductive heat-conducting bonding substance I (2) is arranged between the chip and the single-layer or multi-layer printed circuit board (9), The invention is characterized in that a radiating block (7) is arranged above the chip (3); a conductive or non-conductive heat-conducting bonding substance II (6) is nested between the radiating block (7) and the chip (3); and the surface of the radiating block (7) protrudes out of the outer surface of the plastic packaging body (8). By additionally arranging the radiating block above the chip to radiate high heat, the invention can provide strong radiating capacity so that the heat of the chip can be quickly conducted to the outside of the packaging body, thereby preventing the chip from being quickly aged or even burnt or burnt out.
Description
(1) technical field
The present invention relates to a kind of packaging structure of radiating block and convex surface for chip of printed circuit board.Belong to the semiconductor packaging field.
(2) background technology
The radiating mode of traditional Chip Packaging form mainly be to have adopted the Metal Substrate island of chip below as heat radiation conduction instrument or approach, and there is following not enough point in the heat radiation of this conventional package mode conduction:
1, Metal Substrate island volume is too little
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and in limited packaging body, to imbed the interior pin (as shown in Figures 1 and 2) of metal of Metal Substrate island and signal, power supply conduction usefulness simultaneously, very the little so effective area on Metal Substrate island and volume just seem, and the function of the heat radiation of high heat also will be served as in the Metal Substrate island simultaneously, will seem deficiency more.
2, baried type Metal Substrate island (as shown in Figures 1 and 2)
The Metal Substrate island is in the conventional package form, in order to pursue the reliability safety of packaging body, nearly all adopted the Metal Substrate island to be embedded in the packaging body, and the Metal Substrate island is about dependence or four fine support bars in corner fix or support metal Ji Dao, also because the characteristic of this fine support bar, the heat that has caused the Metal Substrate island to be absorbed from the chip, can't conduct out from fine support bar fast, so the heat of chip can't or be transmitted to the packaging body external world fast, caused the life-span quick aging of chip even burn or burnt out.
3, Metal Substrate island exposed type (as shown in Figures 3 and 4)
Though expose on the Metal Substrate island, can provide also will good heat-sinking capability than the heat sinking function of baried type, because the volume on Metal Substrate island and area still very little in packaging body, so heat dissipation capability can be provided, still very limited.
(3) summary of the invention
The objective of the invention is to overcome above-mentioned deficiency, providing a kind of can provide heat dissipation capability strong packaging structure of radiating block and convex surface for chip of printed circuit board.
The object of the present invention is achieved like this: a kind of packaging structure of radiating block and convex surface for chip of printed circuit board, include the single or multiple lift printed substrate that is carried of chip, chip below, conduction or nonconducting heat conduction bonding material I and the plastic-sealed body between wire, chip and the described single or multiple lift printed substrate that chip is used to the signal interconnection of single or multiple lift printed substrate, above described chip, be provided with radiating block, be equipped with conduction or nonconducting heat conduction bonding material II between this radiating block and the described chip; The plastic packaging material outside is protruded on the surface of described radiating block.
The invention has the beneficial effects as follows:
The present invention serves as the function of the heat radiation of high heat by addition radiating block above chip, can provide heat dissipation capability strong, makes the heat of chip can be transmitted to the packaging body external world fast.Can be applied in and make it become height or superelevation heat radiation (High Thermal or Super High Thermal) ability on the packaging body of general packing forms and the packaging technology, can become SHT-FBP/QFN as FBP can become SHT-QFN/BGA and can become SHT-BGA/CSP and can become SHT-CSP ...Avoided the life-span quick aging of chip even burn or burnt out.
(4) description of drawings
Fig. 1 is Metal Substrate island baried type chip-packaging structure schematic diagram in the past.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is Metal Substrate island exposed type chip-packaging structure schematic diagram in the past.
Fig. 4 is the vertical view of Fig. 3.
Fig. 5 is a packaging structure of radiating block and convex surface for chip of printed circuit board schematic diagram of the present invention.
Reference numeral among the figure:
Conduction or nonconducting heat conduction bonding material I 2, chip 3, wire 5, conduction or nonconducting heat conduction bonding material II 6, radiating block 7, plastic-sealed body 8, printed substrate 9.
(5) embodiment
Referring to Fig. 5, Fig. 5 is a packaging structure of radiating block and convex surface for chip of printed circuit board schematic diagram of the present invention.As seen from Figure 5, packaging structure of radiating block and convex surface for chip of printed circuit board of the present invention, include the single or multiple lift printed substrate 9 that is carried of chip 3, chip below, conduction or nonconducting heat conduction bonding material I 2 and the plastic-sealed body 8 between wire 5, chip and the described single or multiple lift printed substrate 9 that chip is used to the signal interconnection of single or multiple lift printed substrate, above described chip 3, be provided with radiating block 7, be equipped with conduction or nonconducting heat conduction bonding material II 6 between this radiating block 7 and the described chip 3; Plastic packaging material 8 outsides are protruded on the surface of described radiating block 7.
The material of described radiating block 7 can be copper, aluminium, pottery or alloy etc.
Claims (2)
1. packaging structure of radiating block and convex surface for chip of printed circuit board, include chip (3), the single or multiple lift printed substrate (9) that is carried of chip below, the wire that chip is used to the signal interconnection of single or multiple lift printed substrate (5), conduction between chip and the described single or multiple lift printed substrate (9) or nonconducting heat conduction bonding material I (2) and plastic-sealed body (8), it is characterized in that being provided with radiating block (7), be equipped with conduction or nonconducting heat conduction bonding material II (6) between this radiating block (7) and the described chip (3) in described chip (3) top; Plastic packaging material (8) outside is protruded on the surface of described radiating block (7).
2. a kind of packaging structure of radiating block and convex surface for chip of printed circuit board according to claim 1, the material that it is characterized in that described radiating block (7) is copper, aluminium, pottery or alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010108626 CN101794744A (en) | 2010-01-27 | 2010-01-27 | Packaging structure of radiating block and convex surface for chip of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010108626 CN101794744A (en) | 2010-01-27 | 2010-01-27 | Packaging structure of radiating block and convex surface for chip of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101794744A true CN101794744A (en) | 2010-08-04 |
Family
ID=42587319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010108626 Pending CN101794744A (en) | 2010-01-27 | 2010-01-27 | Packaging structure of radiating block and convex surface for chip of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101794744A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576568A (en) * | 2013-10-15 | 2015-04-29 | 日月光半导体制造股份有限公司 | Semiconductor packaging piece and manufacturing method thereof |
-
2010
- 2010-01-27 CN CN 201010108626 patent/CN101794744A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104576568A (en) * | 2013-10-15 | 2015-04-29 | 日月光半导体制造股份有限公司 | Semiconductor packaging piece and manufacturing method thereof |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20100804 |