CN101792896B - 溅射设备及制造电子器件的方法 - Google Patents

溅射设备及制造电子器件的方法 Download PDF

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Publication number
CN101792896B
CN101792896B CN2009102663592A CN200910266359A CN101792896B CN 101792896 B CN101792896 B CN 101792896B CN 2009102663592 A CN2009102663592 A CN 2009102663592A CN 200910266359 A CN200910266359 A CN 200910266359A CN 101792896 B CN101792896 B CN 101792896B
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rotating member
terminal
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feed terminal
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Chinese (zh)
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CN101792896A (zh
Inventor
泷口庄次
上野秀挥
高野广司
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Canon Anelva Corp
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Canon Anelva Corp
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32568—Relative arrangement or disposition of electrodes; moving means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
CN2009102663592A 2008-12-24 2009-12-24 溅射设备及制造电子器件的方法 Active CN101792896B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2008-327696 2008-12-24
JP2008327696A JP5289035B2 (ja) 2008-12-24 2008-12-24 スパッタリング装置

Publications (2)

Publication Number Publication Date
CN101792896A CN101792896A (zh) 2010-08-04
CN101792896B true CN101792896B (zh) 2012-09-26

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CN2009102663592A Active CN101792896B (zh) 2008-12-24 2009-12-24 溅射设备及制造电子器件的方法

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US (1) US20100155228A1 (enExample)
JP (1) JP5289035B2 (enExample)
CN (1) CN101792896B (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102268647A (zh) * 2011-06-28 2011-12-07 黄峰 旋转靶用驱动端头装置
US20160049279A1 (en) * 2014-08-14 2016-02-18 Allied Techfinders Co., Ltd. Plasma device
CN111719123B (zh) * 2019-03-21 2024-08-02 广东太微加速器有限公司 组合式靶件
JP7437525B2 (ja) * 2020-10-08 2024-02-22 株式会社アルバック 回転式カソードユニット用の駆動ブロック
JP2023069790A (ja) * 2021-11-08 2023-05-18 株式会社シンクロン スパッタ成膜装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0602526A2 (en) * 1992-12-17 1994-06-22 Siemens Aktiengesellschaft A decoded-source sense amplifier with special column select driver voltage
CN1134469A (zh) * 1995-01-23 1996-10-30 美国Boc氧气集团有限公司 圆柱形磁控管的屏蔽结构
CN101440475A (zh) * 2007-11-19 2009-05-27 小岛压力加工工业株式会社 基片支承装置及包含该基片支承装置的溅射设备

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62111770U (enExample) * 1985-12-27 1987-07-16
JPH1192924A (ja) * 1997-09-16 1999-04-06 Raiku:Kk スパッタリング装置
JP2003147519A (ja) * 2001-11-05 2003-05-21 Anelva Corp スパッタリング装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0602526A2 (en) * 1992-12-17 1994-06-22 Siemens Aktiengesellschaft A decoded-source sense amplifier with special column select driver voltage
CN1134469A (zh) * 1995-01-23 1996-10-30 美国Boc氧气集团有限公司 圆柱形磁控管的屏蔽结构
CN101440475A (zh) * 2007-11-19 2009-05-27 小岛压力加工工业株式会社 基片支承装置及包含该基片支承装置的溅射设备

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Publication number Publication date
JP2010150579A (ja) 2010-07-08
JP5289035B2 (ja) 2013-09-11
US20100155228A1 (en) 2010-06-24
CN101792896A (zh) 2010-08-04

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