CN101784161A - Method for manufacturing circuit board containing step holes - Google Patents
Method for manufacturing circuit board containing step holes Download PDFInfo
- Publication number
- CN101784161A CN101784161A CN 201010115219 CN201010115219A CN101784161A CN 101784161 A CN101784161 A CN 101784161A CN 201010115219 CN201010115219 CN 201010115219 CN 201010115219 A CN201010115219 A CN 201010115219A CN 101784161 A CN101784161 A CN 101784161A
- Authority
- CN
- China
- Prior art keywords
- wiring board
- stepped hole
- central layer
- prepreg
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
The invention relates to a method for manufacturing a circuit board containing step holes, which comprises the following steps of: determining the positions of the step holes: determining the positions of the step holes in core plates of the circuit board and prepregs; manufacturing the step holes: respectively manufacturing the step holes at the step hole positions determined by the core plates of the circuit board and the prepregs; and pressing after bonding the core plates of the circuit board and the prepregs: pressing after bonding the core plates of the circuit board and the prepreg of the manufactured step holes. The step holes are respectively manufactured at the step hole positions determined by the core plates of the circuit board and the prepregs before pressing the core plates of the circuit board and the prepregs, and therefore, the step surfaces of the circuit board are flat; meanwhile, the core plates of the circuit board at the lower layer cannot be damaged because of high quality of the circuit board. In the method, an end-mill is required to manufacture steps along vacant milling positions at the edges of the steps, the manufacturing efficiency is high, and the manufacturing cost is greatly reduced.
Description
Technical field
The present invention relates to a kind of wiring board manufacture method, relate in particular to a kind of manufacture method that contains the wiring board manufacture method step of stepped hole.
Background technology
Along with the development of wiring board manufacturing technology, the wiring board that contains stepped hole is more and more.For the wiring board that contains stepped hole, traditional manufacture method is: earlier with wiring board central layer and prepreg pressing, directly gong goes out step then.Because in the process of gong step, the bad control of the degree of depth of step, the common coarse injustice of step that goes out of gong like this.In addition, because prepreg has adhesive effect, in the process of gong step, the whole gong cutter that adopts in position that needs to contain stepped hole carries out the gong sky, complicated operation, the cost height of gong stepped hole, inefficiency, and the step out-of-flatness that goes out of gong.These out-of-flatness steps have a strong impact on the wiring board quality that contains stepped hole in wiring board manufacturing process.
Summary of the invention
The technical problem that the present invention solves is: overcomes and earlier the prepreg pressing made step when making the wiring board step in the prior art again and caused step surface out-of-flatness, wiring board quality low, and the high technical problem of cost of manufacture.
Technical scheme of the present invention is: a kind of wiring board manufacture method that contains stepped hole is provided, comprises the steps:
Determine the stepped hole position: the position of on wiring board central layer and prepreg, determining stepped hole;
Make stepped hole: make stepped hole at wiring board central layer and the definite stepped hole position of prepreg respectively;
Wiring board central layer and prepreg are carried out pressing after bonding: the described wiring board central layer of making stepped hole and prepreg are carried out pressing after bonding.
Further technical scheme of the present invention is: in the step of definite stepped hole position, the step position of described prepreg is bigger 0.05 millimeter to 0.4 millimeter than every limit, step position of described wiring board central layer.
Further technical scheme of the present invention is: make in the stepped hole step in the stepped hole position of determining, adopt gong cutter gong to go out the room in the step position of described wiring board central layer and prepreg.
Further technical scheme of the present invention is: make in the stepped hole step in the stepped hole position of determining, adopt mould to go out the room in the step position of described wiring board central layer and prepreg.
Further technical scheme of the present invention is: make in the stepped hole step in the stepped hole position of determining, adopt the edge gong room making stepped hole of gong cutter along wiring board central layer step position in the step position of described wiring board central layer and prepreg.
Technique effect of the present invention is: adopt before wiring board central layer and prepreg pressing and make stepped hole respectively at wiring board central layer and the definite stepped hole position of prepreg earlier, the wiring board step surface of Zhi Zuoing is smooth like this, can not damage simultaneously lower floor's wiring board central layer, wiring board quality height.The wiring board manufacture method that the present invention contains stepped hole only need adopt the edge gong room making step of gong cutter along step when step is made, the make efficiency height reduces cost of manufacture greatly.
Description of drawings
Fig. 1 is a flow chart of the present invention.
Fig. 2 is the structural representation of wiring board step of the present invention position.
Fig. 3 is the stepped hole section of structure before the pressing of the present invention.
Fig. 4 is the stepped hole section of structure after the pressing of the present invention.
Embodiment
Below in conjunction with specific embodiment, technical solution of the present invention is further specified.
As shown in Figure 1 and Figure 2, the specific embodiment of the present invention is: a kind of wiring board manufacture method that contains stepped hole 6 is provided, comprises the steps:
Step 100: determine stepped hole position 3: on wiring board central layer 1, determine the position of stepped hole 6, determine the stepped hole position 3 of wiring board central layer on the surface of wiring board central layer 1.
Step 200: make stepped hole 6: make stepped holes 6 at wiring board central layer 1 and prepreg 5 definite stepped hole positions 3 respectively.According to determine stepped hole position 3 make stepped holes 6, when making stepped hole 6, adopt the gong cutter to wiring board central layer 1 and prepreg 5 respectively gong go out stepped hole 6.Adopt the edge gong room making stepped hole 6 of gong cutter along wiring board central layer 1 step position 3, only need once fall the whole gongs of central layer of wiring board central layer 1 step position, the stepped hole 6 of the wiring board central layer 1 of Zhi Zuoing was both smooth like this, saved the time of making the room again, improve efficient greatly, also can not damage the wiring board central layer of lower floor simultaneously.When making stepped hole, can also adopt mould respectively wiring board central layer 1 and prepreg 5 to be gone out stepped hole 6.
Step 300: wiring board central layer 1 and prepreg 5 are carried out pressing after bonding, that is: the described wiring board central layer 1 of making stepped hole and prepreg 5 are carried out pressing after bonding.The specific implementation process of step of the present invention is: elder generation is bonding with institute's prepreg 5 with the wiring board central layer 1 of making stepped hole 6 respectively, and then bonding described wiring board central layer 1 and described prepreg 5 are carried out pressing.
Wiring board manufacture method employing elder generation before wiring board central layer 1 and prepreg 5 pressings that the present invention contains stepped hole 6 makes stepped hole 6 respectively at wiring board central layer 1 and prepreg 5 definite stepped hole positions, then wiring board central layer 1 and prepreg 5 is carried out pressing.It is smooth that the present invention contains the wiring board step surface that the wiring board manufacture method of stepped hole 6 makes, and wiring board quality height can not damage lower floor's wiring board central layer simultaneously.The wiring board manufacture method that the present invention contains stepped hole 6 only need adopt the edge gong room making stepped hole 6 of gong cutter along step when step is made, the make efficiency height reduces cost of manufacture greatly.
The preferred embodiments of the present invention: the present invention contains the wiring board manufacture method of stepped hole 6, in definite stepped hole 6 position steps, the step position 2 of described prepreg 5 is bigger 0.05 millimeter to 0.4 millimeter than described 3 every limits, step position of stating wiring board central layer 1, as Fig. 2, shown in Figure 3.Specifically, just go out 0.05 millimeter to 0.4 millimeter room at the many gongs in each edge of step of prepreg, this part prepreg limit 4 is earlier by the gong sky, is exactly in order to prevent gummosis when pressing wiring board central layer 1 and the prepreg 5, the quality of reduction stepped hole 6 like this.
Above content be in conjunction with concrete preferred implementation to further describing that the present invention did, can not assert that concrete enforcement of the present invention is confined to these explanations.For the general technical staff of the technical field of the invention, without departing from the inventive concept of the premise, can also make some simple deduction or replace, all should be considered as belonging to protection scope of the present invention.
Claims (5)
1. a wiring board manufacture method that contains stepped hole comprises the steps:
Determine the stepped hole position: the position of on wiring board central layer and prepreg, determining stepped hole;
Make stepped hole: make stepped hole at wiring board central layer and the definite stepped hole position of prepreg respectively;
Wiring board central layer and prepreg are carried out pressing after bonding: the described wiring board central layer of making stepped hole and prepreg are carried out pressing after bonding.
2. according to the described wiring board manufacture method that contains stepped hole of claim 1, it is characterized in that in the step of definite stepped hole position, the step position of described prepreg is bigger 0.05 millimeter to 0.4 millimeter than every limit, step position of described wiring board central layer.
3. according to the described wiring board manufacture method that contains stepped hole of claim 1, it is characterized in that, in making the stepped hole step, adopt gong cutter gong to go out the room in the step position of described wiring board central layer and prepreg.
4. according to the described wiring board manufacture method that contains stepped hole of claim 1, it is characterized in that, in making the stepped hole step, adopt mould to go out the room in the step position of described wiring board central layer and prepreg.
5. according to the described wiring board manufacture method that contains stepped hole of claim 1, it is characterized in that, in making the stepped hole step, adopt the edge gong room making stepped hole of gong cutter in the step position of described wiring board central layer and prepreg along wiring board central layer step position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010115219 CN101784161A (en) | 2010-02-23 | 2010-02-23 | Method for manufacturing circuit board containing step holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010115219 CN101784161A (en) | 2010-02-23 | 2010-02-23 | Method for manufacturing circuit board containing step holes |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101784161A true CN101784161A (en) | 2010-07-21 |
Family
ID=42523901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010115219 Pending CN101784161A (en) | 2010-02-23 | 2010-02-23 | Method for manufacturing circuit board containing step holes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101784161A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102862186A (en) * | 2012-09-26 | 2013-01-09 | 景旺电子科技(龙川)有限公司 | PCB (printed circuit board) forming method |
| CN108990319A (en) * | 2018-08-01 | 2018-12-11 | 广州美维电子有限公司 | A kind of stepped plate pressing stack and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08255979A (en) * | 1995-03-15 | 1996-10-01 | Ibiden Co Ltd | Manufacture of multilayer board for mounting electronic component |
| CN101594742A (en) * | 2008-05-29 | 2009-12-02 | 华为技术有限公司 | The equipment of the manufacture method of circuit board step trough and circuit board manufacturing step trough |
-
2010
- 2010-02-23 CN CN 201010115219 patent/CN101784161A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08255979A (en) * | 1995-03-15 | 1996-10-01 | Ibiden Co Ltd | Manufacture of multilayer board for mounting electronic component |
| CN101594742A (en) * | 2008-05-29 | 2009-12-02 | 华为技术有限公司 | The equipment of the manufacture method of circuit board step trough and circuit board manufacturing step trough |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102862186A (en) * | 2012-09-26 | 2013-01-09 | 景旺电子科技(龙川)有限公司 | PCB (printed circuit board) forming method |
| CN102862186B (en) * | 2012-09-26 | 2015-02-04 | 景旺电子科技(龙川)有限公司 | PCB (printed circuit board) forming method |
| CN108990319A (en) * | 2018-08-01 | 2018-12-11 | 广州美维电子有限公司 | A kind of stepped plate pressing stack and preparation method thereof |
| CN108990319B (en) * | 2018-08-01 | 2023-12-05 | 广州美维电子有限公司 | Stepped plate pressing and stacking structure and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103124469B (en) | A kind of ladder printed circuit board (PCB) and preparation method thereof | |
| CN103687347B (en) | A kind of manufacture method of partial hybrid printed circuit board | |
| CN102548186A (en) | Hexamethylene diisocyanate (HDI) plate with symmetrically pressed structure and manufacturing method thereof | |
| CN101711094A (en) | Preparation method of flexible and hard combined circuit board and flexible and hard combined circuit board | |
| CN203661421U (en) | Circuit board bonding structure with small size thin blind slot | |
| CN203618239U (en) | Pressing structure of rigid-flex printed circuit board | |
| EP2546073A3 (en) | Methods for manufacturing laminate panels by hot-pressing | |
| CN104168711A (en) | Pressing structure of cavity circuit board and pressing method of cavity circuit board | |
| CN202293493U (en) | Anti-curling asymmetric-structure copper-clad plate | |
| CN102781173A (en) | Method for machining and molding printed circuit board (PCB) made of polytetrafluoroethylene (PTFE) material | |
| CN101784161A (en) | Method for manufacturing circuit board containing step holes | |
| CN101699930A (en) | Glue filling and laminating method of circuit board | |
| CN203407091U (en) | Milling structure for a plurality of base material sheets | |
| CN101697667A (en) | Method for making embedded hole in pad on circuit board | |
| CN102348339A (en) | Circuit board manufacturing method | |
| CN104159397A (en) | Pressing structure and method of cavity PCB | |
| CN204031575U (en) | A kind of printed circuit board (PCB) | |
| CN202282911U (en) | Anti-breakage bendable flexible-rigid board | |
| CN203590434U (en) | Loudspeaker vibration system | |
| CN201750624U (en) | Improved laminar structure of PCB (printed circuit board) | |
| CN203618216U (en) | Six-layer circuit board asymmetry improvement structure | |
| CN202269090U (en) | Gasket structure for sticking film to outer layer of three-dimensional circuit board | |
| CN202134301U (en) | CD (compact disc) type magnetic core | |
| CN203883889U (en) | Mobile phone main board jointed plate | |
| CN203574933U (en) | Novel rigid-flex combined circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20100721 |