CN101771185A - Three-dimensional defect grounding structure - Google Patents
Three-dimensional defect grounding structure Download PDFInfo
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- CN101771185A CN101771185A CN201010119932A CN201010119932A CN101771185A CN 101771185 A CN101771185 A CN 101771185A CN 201010119932 A CN201010119932 A CN 201010119932A CN 201010119932 A CN201010119932 A CN 201010119932A CN 101771185 A CN101771185 A CN 101771185A
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Abstract
The invention relates to a three-dimensional defect grounding structure, wherein two grounding plates and two different mediums are adopted to form the integrated waveguide of the grounding plates; based on the traditional DGS, a layer of medium plate (22) and a grounding plate (32) is additionally arranged on the lower grounding plate; a one-dimensional periodic dumbbell-structure unit (4) is etched on a first grounding plate (21); and the two layers of the grounding plates are connected by a metal through hole (5). The structure has the two grounding plates and the two different mediums, thereby not only having good trapped-wave effect and slow wave property, but also having the advantage of modeling, analyzing and calculating the simple traditional DGS by adopting a simple LC equivalent circuit, and greatly solving the problem that the grounding plate of the DGS needs to be suspended in the air in the engineering application; moreover, the structure can not only improve the freedom degree of the design, but also greatly relieving the problem of difficult processing. The structure is applicable in a microwave/millimeter-wave integrated circuit module with the requirements of small size, low loss and wide band.
Description
Technical field
The present invention relates to synthetic electromagnetic material---the three-dimensional defect grounding structure (3D-DGS) of a kind of novel artificial, belong to the microwave communication device technical field.
Background technology
Fast development along with modern communication and Radar Technology, the RF system has proposed more urgent requirement to miniaturization, modularization, reliability, the microwave and millimeter wave integrated circuit modules of miniaturization, low-loss, broadband requirement is satisfied in research, is one of the most key technology of development future broadband wireless communication systems.Yet traditional electromagnetic material can not satisfy the needs of growing mobile communication and Personal Communications Services.Under this background, the proposition of the synthetic electromagnetic material of novel artificial and in the application of microwave, millimeter wave field will have been opened up brand-new field and approach for the miniaturization and the high reliability of next generation wireless communication system.
People such as calendar year 2001 Korea S scholar Ahn taken the lead in proposing a kind of new etching structure-defective aground plane structure (Defected Ground Sructure, DGS).The synthetic electromagnetic material of DGS novel artificial has the advantage of miniaturization, in addition also have good trap effect and slow wave characteristic, and DGS calculates simple, need not to introduce Numerical Calculation of Electromagnetic Fields, by adopting simple LC equivalent electric circuit modeling analysis to get final product, it takies less circuit area, is more suitable for the practical application of microwave and millimeter wave integrated circuit.Studies have shown that, adopt the DGS technology, can significantly improve the performance of a microwave circuit device, thereby drive the raising of entire system performance, meanwhile, DGS is the reduction circuit size effectively, thereby reduces consumables cost.But DGS has a mortal wound---ground plate needs unsettled.This be since the microstrip line of DGS form around electromagnetic field distribute, the microstrip line distributed constant changes as a result.Such condition has seriously undermined the practicality of DGS in engineering.
Fig. 1 is traditional DGS structural representation, i.e. defective aground plane structure, and traditional DGS structure is made up of microstrip line (1), dielectric-slab (2), ground plate (3), need carry out the structure etching on ground plate (3).But the ground plate of this structure must be unsettled and can not ground connection, otherwise can cause the change of microstrip line distributed constant.
Notification number CN201307641 is disclosed to be interdigitated defect grounding structure of a kind of co-planar waveguide and co-planar waveguide antenna, is the application of defect grounding structure on radiating guide, is provided with interdigitated defect grounding structure in the both sides, base of antenna aerofoil profile ground plate.
The present invention proposes a kind of novel three-dimensional defect grounding structure, on the basis of original traditional DGS, increased one deck dielectric-slab and ground plate.Having solved the mortal wound of DGS so greatly---ground plate needs unsettled problem, and in addition, this structure has two ground plates and two kinds of different media, not only can increase the degree of freedom of design, has also alleviated problem of difficult processing greatly.
Summary of the invention
The objective of the invention is, can not satisfy the problem that modern communication requires in order to solve traditional electromagnetic material, and a kind of novel artificial electromagnetism synthetic material---three-dimensional defect grounding structure (3D-DGS) is proposed, solve traditional DGS ground plate in engineering is used effectively and needed unsettled mortal wound, etching structure on the ground floor ground plate, the direct ground connection of second layer ground plate like this.
The technical scheme that the present invention is adopted for its technical problem of solution is: the present invention has increased one deck dielectric-slab and ground plate below traditional DGS ground plate, this material has solved the mortal wound of DGS---and ground plate needs unsettled, this in addition structure has two ground plates and two kinds of different media, not only can increase the degree of freedom of design, also alleviate problem of difficult processing greatly.Two-layer ground plate directly can connect by metal throuth hole, and etching structure on the ground floor ground plate, second layer ground plate directly ground connection use.
Three-dimensional defect grounding structure of the present invention (3D-DGS) is as Fig. 2 and shown in Figure 8, and Fig. 2 is the end view of three-dimensional defect grounding structure, and Fig. 8 is the vertical view of three-dimensional defect grounding structure.
Three-dimensional defect grounding structure of the present invention has adopted two ground plates and two kinds of different media, has formed the ground plate integrated waveguide; On traditional DGS basis, increased one deck dielectric-slab and ground plate on the ground plate below DGS, and on the ground floor ground plate etching the periodic dumbbell-shaped structure of one dimension unit, connect by metal throuth hole between the two-layer ground plate.
Three-dimensional defect grounding structure (3D-DGS) is made up of microstrip line, two layer medium layer and two-layer ground plate, be microstrip line topmost, be ground floor dielectric-slab, ground floor ground plate, second layer dielectric-slab, second layer ground plate below successively, they closely are overlapped into one.Microstrip line is positioned at the middle part of ground floor dielectric-slab, on the ground floor ground plate etching one dimension dumbbell shaped construction unit periodically, on second layer dielectric-slab, be provided with metal throuth hole, connect by metal throuth hole between the two-layer ground plate guaranteeing.
The introducing of two-layer ground plate and two layer medium layer is a key of the present invention, because traditional DGS has only one deck dielectric-slab and ground plate, and needs ground plate unsettledly in engineering is used, and will take very large space like this.The present invention has been owing to adopted two layer medium layer and two-layer ground plate structure, wherein second layer ground plate the unsettled problem that can solve the ground floor ground plate is set, connect by metal throuth hole between the two-layer ground plate.
The present invention's beneficial effect compared with prior art is, the present invention is on the advantage basis that keeps traditional DGS, adopt three-dimensional defect grounding structure, not only have good trap effect and slow wave characteristic, and by adopting simple LC equivalent electric circuit modeling analysis to calculate the advantage of simple traditional DGS, having solved DGS ground plate in engineering is used greatly needs a unsettled difficult problem.Simultaneously, traditional DGS is layering processing, and difficulty of processing is big, and the last shaping of circuit needs position correction technology, has therefore increased process complexity and processing cost.This structure has two ground plates and two kinds of different media, not only can increase the degree of freedom of design, has also alleviated problem of difficult processing greatly.
The present invention is applicable to the microwave and millimeter wave integrated circuit modules that requires in miniaturization, low-loss, broadband.Can significantly improve the performance of whole microwave circuit device, thus the raising of the system of drive complete machine performance.
Description of drawings
Fig. 1 is traditional DGS structure chart;
Fig. 2 is the end view of three-dimensional defect grounding structure;
Fig. 3 is the vertical view of three-dimensional defect grounding structure microstrip line;
Fig. 4 is the vertical view of three-dimensional defect grounding structure ground floor dielectric-slab;
Fig. 5 is the vertical view of three-dimensional defect grounding structure ground floor ground plate;
Fig. 6 is the vertical view of three-dimensional defect grounding structure second layer dielectric-slab;
Fig. 7 is the vertical view of three-dimensional defect grounding structure second layer ground plate;
Fig. 8 is the amplification plan view of three-dimensional defect grounding structure.
Among the figure: (1) microstrip line; (2) dielectric-slab; (21) ground floor dielectric-slab; (22) second layer dielectric-slab; (3) ground plate; (31) ground floor ground plate; (32) second layer ground plate; (4) on the ground plate etching the dumbbell construction unit; (5) metal throuth hole.
Embodiment
The embodiment of the invention as shown in Figure 2, present embodiment three-dimensional defect grounding structure (3D-DGS) is made up of microstrip line, two layer medium layer and two-layer ground plate, be microstrip line (1) topmost, be ground floor dielectric-slab (21), ground floor ground plate (31), second layer dielectric-slab (22), second layer ground plate (32) below successively, they successively closely are overlapped into one.Microstrip line is positioned at the middle part of ground floor dielectric-slab, as shown in Figure 8; On the ground floor ground plate etching the periodic dumbbell shaped construction unit of one dimension (4), as shown in Figure 5; Be provided with metal throuth hole (5) at second layer dielectric-slab (22), connect by metal throuth hole between the two-layer ground plate guaranteeing.Because traditional DGS has only one deck dielectric-slab and ground plate.In engineering is used, need unsettledly, will take very large space like this ground plate.The 2nd layer ground plate can address this problem, and second layer ground plate has been avoided the direct ground connection of ground floor ground plate.But can connect by metal throuth hole between the two-layer ground plate.
The present embodiment structure has realized not only having good trap effect and slow wave characteristic, by adopting simple LC equivalent electric circuit modeling analysis to calculate simple traditional DGS advantage, also having solved DGS ground plate in engineering is used greatly needs a unsettled difficult problem, is fit to be applied in the microwave and millimeter wave integrated circuit modules of miniaturization, low-loss, broadband requirement.Can significantly improve the performance of whole microwave circuit device, thus the raising of the system of drive complete machine performance.
Claims (1)
1. a three-dimensional defect grounding structure is characterized in that, described three-dimensional defect grounding structure has adopted two ground plates and two kinds of different media, has formed the ground plate integrated waveguide; On traditional DGS basis, increased one deck dielectric-slab and ground plate on the ground plate below, and on the ground floor ground plate etching the periodic dumbbell-shaped structure of one dimension unit, connect by metal throuth hole between the two-layer ground plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010119932.XA CN101771185B (en) | 2010-03-08 | 2010-03-08 | Three-dimensional defect grounding structure |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010119932.XA CN101771185B (en) | 2010-03-08 | 2010-03-08 | Three-dimensional defect grounding structure |
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| Publication Number | Publication Date |
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| CN101771185A true CN101771185A (en) | 2010-07-07 |
| CN101771185B CN101771185B (en) | 2014-02-26 |
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| CN201010119932.XA Expired - Fee Related CN101771185B (en) | 2010-03-08 | 2010-03-08 | Three-dimensional defect grounding structure |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111029696A (en) * | 2019-11-20 | 2020-04-17 | 西安电子科技大学 | Second-order filter based on miniaturized stacking of slow-wave substrate integrated groove gap waveguide |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4197544A (en) * | 1977-09-28 | 1980-04-08 | The United States Of America As Represented By The Secretary Of The Navy | Windowed dual ground plane microstrip antennas |
| WO2001084663A1 (en) * | 2000-05-03 | 2001-11-08 | Korea Advanced Institute Of Science And Technology | Microwave device using photonic band gap structure |
| US20030122634A1 (en) * | 2002-01-03 | 2003-07-03 | Goff Miles E. | Microstrip to circular waveguide transition with a stripline portion |
| US20090140823A1 (en) * | 2007-11-30 | 2009-06-04 | Samsung Electronics Co., Ltd. | Broadband microstrip balun and method of manufacturing the same |
| CN101459269A (en) * | 2009-01-04 | 2009-06-17 | 上海大学 | Low-pass filter based on defect ground structure |
-
2010
- 2010-03-08 CN CN201010119932.XA patent/CN101771185B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4197544A (en) * | 1977-09-28 | 1980-04-08 | The United States Of America As Represented By The Secretary Of The Navy | Windowed dual ground plane microstrip antennas |
| WO2001084663A1 (en) * | 2000-05-03 | 2001-11-08 | Korea Advanced Institute Of Science And Technology | Microwave device using photonic band gap structure |
| US20030122634A1 (en) * | 2002-01-03 | 2003-07-03 | Goff Miles E. | Microstrip to circular waveguide transition with a stripline portion |
| US20090140823A1 (en) * | 2007-11-30 | 2009-06-04 | Samsung Electronics Co., Ltd. | Broadband microstrip balun and method of manufacturing the same |
| CN101459269A (en) * | 2009-01-04 | 2009-06-17 | 上海大学 | Low-pass filter based on defect ground structure |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111029696A (en) * | 2019-11-20 | 2020-04-17 | 西安电子科技大学 | Second-order filter based on miniaturized stacking of slow-wave substrate integrated groove gap waveguide |
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| CN101771185B (en) | 2014-02-26 |
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