CN101771185B - Three-dimensional defect grounding structure - Google Patents
Three-dimensional defect grounding structure Download PDFInfo
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- CN101771185B CN101771185B CN201010119932.XA CN201010119932A CN101771185B CN 101771185 B CN101771185 B CN 101771185B CN 201010119932 A CN201010119932 A CN 201010119932A CN 101771185 B CN101771185 B CN 101771185B
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Abstract
The invention relates to a three-dimensional defect grounding structure, wherein two grounding plates and two different mediums are adopted to form the integrated waveguide of the grounding plates; based on the traditional DGS, a layer of medium plate (22) and a grounding plate (32) is additionally arranged on the lower grounding plate; a one-dimensional periodic dumbbell-structure unit (4) is etched on a first grounding plate (21); and the two layers of the grounding plates are connected by a metal through hole (5). The structure has the two grounding plates and the two different mediums, thereby not only having good trapped-wave effect and slow wave property, but also having the advantage of modeling, analyzing and calculating the simple traditional DGS by adopting a simple LC equivalent circuit, and greatly solving the problem that the grounding plate of the DGS needs to be suspended in the air in the engineering application; moreover, the structure can not only improve the freedom degree of the design, but also greatly relieving the problem of difficult processing. The structure is applicable in a microwave/millimeter-wave integrated circuit module with the requirements of small size, low loss and wide band.
Description
Technical field
The present invention relates to synthetic electromagnetic material---the three-dimensional defect grounding structure (3D-DGS) of a kind of novel artificial, belong to microwave communication device technical field.
Background technology
Fast development along with modern communication and Radar Technology, RF/Microwave system has proposed more urgent requirement to miniaturization, modularization, reliability, research meets the microwave&millimeter-wave IC module of miniaturization, low-loss, broadband requirement, is one of the most key technology of development future broadband wireless communication systems.Yet traditional electromagnetic material can not meet the needs of growing mobile communication and Personal Communications Services.Under this background, the proposition of the synthetic electromagnetic material of novel artificial and in the application of microwave, millimeter wave field, will open up brand-new field and approach for miniaturization and the high reliability of Next-Generation Wireless Communication Systems.
The people such as calendar year 2001 Korea S scholar Ahn have taken the lead in proposing a kind of new etching structure-defect aground plane structure (Defected Ground Sructure, DGS).The synthetic electromagnetic material of DGS novel artificial has advantages of miniaturization, in addition also there is good trap effect and slow wave characteristic, and DGS calculates simple, without introducing Numerical Calculation of Electromagnetic Fields, by adopting simple LC equivalent electric circuit modeling analysis, it takies less circuit area, is more suitable for microwave&millimeter-wave IC practical application.Studies have shown that, adopt DGS technology, can significantly improve the performance of a microwave circuit device, thereby drive the raising of entire system performance, meanwhile, DGS is reduction circuit size effectively, thereby reduces consumables cost.But DGS has a mortal wound---ground plate needs unsettled.This be due to the microstrip line of DGS form around electromagnetic field distribute, result microstrip line distributed constant changes.Such condition has seriously undermined the practicality of DGS in engineering.
Fig. 1 is traditional DGS structural representation, i.e. defect aground plane structure, and traditional DGS structure is comprised of microstrip line (1), dielectric-slab (2), ground plate (3), need on ground plate (3), carry out structure etching.But the ground plate of this structure must be unsettled and can not ground connection, otherwise can cause the change of microstrip line distributed constant.
Notification number CN201307641 is disclosed is a kind of co-planar waveguide cross-finger-type defected grounding structure and co-planar waveguide antenna, is the application of defect grounding structure on radiating guide, in the both sides, base of antenna aerofoil profile ground plate, is provided with cross-finger-type defected grounding structure.
The present invention proposes a kind of novel three-dimensional defect grounding structure, on the basis of original traditional DGS, increased one deck dielectric-slab and ground plate.So greatly having solved the mortal wound of DGS---ground plate needs unsettled problem, and in addition, this structure has two ground plates and two kinds of different media, not only can increase the degree of freedom of design, has also greatly alleviated the problem of difficult processing.
Summary of the invention
The object of the invention is, in order to solve traditional electromagnetic material, can not meet the problem that modern communication requires, and a kind of novel artificial electromagnetism synthetic material---three-dimensional defect grounding structure (3D-DGS) is proposed, effectively solve traditional DGS ground plate in engineering application and needed unsettled mortal wound, etching structure on ground floor ground plate, the so direct ground connection of second layer ground plate.
The present invention is that the technical scheme that its technical problem of solution adopts is: the present invention has increased one deck dielectric-slab and ground plate below traditional DGS ground plate, this material has solved the mortal wound of DGS---and ground plate needs unsettled, this structure has two ground plates and two kinds of different media in addition, not only can increase the degree of freedom of design, also greatly alleviate the problem of difficult processing.Two-layer ground plate directly can connect by metal throuth hole, etching structure on ground floor ground plate, and second layer ground plate directly ground connection is used.
Three-dimensional defect grounding structure of the present invention (3D-DGS) as shown in Figure 2 and Figure 8, the end view that Fig. 2 is three-dimensional defect grounding structure, the vertical view that Fig. 8 is three-dimensional defect grounding structure.
Three-dimensional defect grounding structure of the present invention has adopted two ground plates and two kinds of different media, has formed ground plate integrated waveguide; On traditional DGS basis, on the ground plate below DGS, increased one deck dielectric-slab and ground plate, and on ground floor ground plate etching the dumbbell-shaped structure unit of One Dimension Periodic, between two-layer ground plate, by metal throuth hole, connect.
Three-dimensional defect grounding structure (3D-DGS) is comprised of microstrip line, two layer medium layer and two-layer ground plate, topmost microstrip line, be ground floor dielectric-slab, ground floor ground plate, second layer dielectric-slab, second layer ground plate below successively, they are closely overlapped into one.Microstrip line is positioned at the middle part of ground floor dielectric-slab, on ground floor ground plate etching One Dimension Periodic dumbbell shaped construction unit, on second layer dielectric-slab, be provided with metal throuth hole, between two-layer ground plate, by metal throuth hole, connect guaranteeing.
The introducing of two-layer ground plate and two layer medium layer is key of the present invention, because traditional DGS only has one deck dielectric-slab and ground plate, and in engineering application, needs ground plate unsettledly, will take very large space like this.The present invention has been owing to having adopted two layer medium layer and two-layer ground plate structure, wherein second layer ground plate the unsettled problem that can solve ground floor ground plate is set, between two-layer ground plate, by metal throuth hole, connect.
The present invention's beneficial effect is compared with prior art, the present invention is keeping on the advantage basis of traditional DGS, adopt three-dimensional defect grounding structure, not only there is good trap effect and slow wave characteristic, and by adopting simple LC equivalent electric circuit modeling analysis to calculate the advantage of simple traditional DGS, greatly having solved DGS ground plate in engineering application needs a unsettled difficult problem.Meanwhile, traditional DGS is layering processing, and difficulty of processing is large, and the last shaping of circuit needs position correction technique, has therefore increased process complexity and processing cost.This structure has two ground plates and two kinds of different media, not only can increase the degree of freedom of design, has also greatly alleviated the problem of difficult processing.
The present invention is applicable to the microwave&millimeter-wave IC module requiring in miniaturization, low-loss, broadband.Can significantly improve the performance of whole microwave circuit device, thus the raising of the system of drive overall performance.
Accompanying drawing explanation
Fig. 1 is traditional DGS structure chart;
Fig. 2 is the end view of three-dimensional defect grounding structure;
Fig. 3 is the vertical view of three-dimensional defect grounding structure microstrip line;
Fig. 4 is the vertical view of three-dimensional defect grounding structure ground floor dielectric-slab;
Fig. 5 is the vertical view of three-dimensional defect grounding structure ground floor ground plate;
Fig. 6 is the vertical view of three-dimensional defect grounding structure second layer dielectric-slab;
Fig. 7 is the vertical view of three-dimensional defect grounding structure second layer ground plate;
Fig. 8 is the amplification plan view of three-dimensional defect grounding structure.
In figure: (1) microstrip line; (2) dielectric-slab; (21) ground floor dielectric-slab; (22) second layer dielectric-slab; (3) ground plate; (31) ground floor ground plate; (32) second layer ground plate; (4) on ground plate etching dumbbell structure unit; (5) metal throuth hole.
Embodiment
The embodiment of the present invention as shown in Figure 2, the present embodiment three-dimensional defect grounding structure (3D-DGS) is comprised of microstrip line, two layer medium layer and two-layer ground plate, topmost microstrip line (1), be ground floor dielectric-slab (21), ground floor ground plate (31), second layer dielectric-slab (22), second layer ground plate (32) below successively, they are successively closely overlapped into one.Microstrip line is positioned at the middle part of ground floor dielectric-slab, as shown in Figure 8; On ground floor ground plate etching the dumbbell shaped construction unit (4) of One Dimension Periodic, as shown in Figure 5; At second layer dielectric-slab (22), be provided with metal throuth hole (5), between two-layer ground plate, by metal throuth hole, connect guaranteeing.Because traditional DGS only has one deck dielectric-slab and ground plate.In engineering application, need ground plate unsettledly, will take very large space like this.The ground plate of the 2nd layer can address this problem, and second layer ground plate has been avoided the direct ground connection of ground floor ground plate.But can connect by metal throuth hole between two-layer ground plate.
The present embodiment structure has realized not only has good trap effect and slow wave characteristic, by adopting simple LC equivalent electric circuit modeling analysis to calculate simple traditional DGS advantage, also greatly having solved DGS ground plate in engineering application needs a unsettled difficult problem, is applicable to being applied in the microwave&millimeter-wave IC module of miniaturization, low-loss, broadband requirement.Can significantly improve the performance of whole microwave circuit device, thus the raising of the system of drive overall performance.
Claims (1)
1. a three-dimensional defect grounding structure, it is characterized in that, described three-dimensional defect grounding structure is comprised of microstrip line, two layer medium layer and two-layer ground plate, topmost microstrip line (1), be ground floor dielectric-slab (21), ground floor ground plate (31), second layer dielectric-slab (22), second layer ground plate (32) below successively, they are successively closely overlapped into one; Microstrip line is positioned at the middle part of ground floor dielectric-slab; On ground floor ground plate etching the dumbbell shaped construction unit (4) of One Dimension Periodic; At second layer dielectric-slab (22), be provided with metal throuth hole (5), between two-layer ground plate, by metal throuth hole, connect guaranteeing; Described three-dimensional defect grounding structure has adopted two ground plates and two kinds of different media, has formed ground plate integrated waveguide.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010119932.XA CN101771185B (en) | 2010-03-08 | 2010-03-08 | Three-dimensional defect grounding structure |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201010119932.XA CN101771185B (en) | 2010-03-08 | 2010-03-08 | Three-dimensional defect grounding structure |
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| CN101771185A CN101771185A (en) | 2010-07-07 |
| CN101771185B true CN101771185B (en) | 2014-02-26 |
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| CN201010119932.XA Expired - Fee Related CN101771185B (en) | 2010-03-08 | 2010-03-08 | Three-dimensional defect grounding structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111029696B (en) * | 2019-11-20 | 2021-03-02 | 西安电子科技大学 | Second-order filter based on miniaturized stacking of slow-wave substrate integrated groove gap waveguide |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4197544A (en) * | 1977-09-28 | 1980-04-08 | The United States Of America As Represented By The Secretary Of The Navy | Windowed dual ground plane microstrip antennas |
| CN101459269A (en) * | 2009-01-04 | 2009-06-17 | 上海大学 | Low-pass filter based on defect ground structure |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001084663A1 (en) * | 2000-05-03 | 2001-11-08 | Korea Advanced Institute Of Science And Technology | Microwave device using photonic band gap structure |
| US6624716B2 (en) * | 2002-01-03 | 2003-09-23 | Raytheon Company | Microstrip to circular waveguide transition with a stripline portion |
| KR20090056626A (en) * | 2007-11-30 | 2009-06-03 | 삼성전자주식회사 | Broadband microstrip balun and manufacturing method thereof |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4197544A (en) * | 1977-09-28 | 1980-04-08 | The United States Of America As Represented By The Secretary Of The Navy | Windowed dual ground plane microstrip antennas |
| CN101459269A (en) * | 2009-01-04 | 2009-06-17 | 上海大学 | Low-pass filter based on defect ground structure |
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