CN101771027A - 大功率led模块组件及其制造方法 - Google Patents

大功率led模块组件及其制造方法 Download PDF

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CN101771027A
CN101771027A CN200910000360A CN200910000360A CN101771027A CN 101771027 A CN101771027 A CN 101771027A CN 200910000360 A CN200910000360 A CN 200910000360A CN 200910000360 A CN200910000360 A CN 200910000360A CN 101771027 A CN101771027 A CN 101771027A
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led module
power led
heat sink
module assembly
pedestal
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CN101771027B (zh
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何锡源
叶泽生
茹千佑
陈志文
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PATRA Patent Treuhand Munich
Osram Sylvania Inc
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    • F21Y2115/00Light-generating elements of semiconductor light sources
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Abstract

本发明涉及一种LED发光装置,更具体地涉及一种包含柔性管的大功率LED模块组件及其制造方法。该柔性管包括与大功率LED模块相接合的基座和包围该基座的盖,其中该盖通过挤出工艺制造成使得除了设置在大功率LED模块下方的散热件的底部暴露于周围环境以外,基座和大功率LED模块以及散热件的其它部分均被盖包覆并与盖密封接合。由于具有这种结构,本发明在改善了LED模块的散热性能的同时,还进一步提高了LED模块组件的防水性能,从而大幅度地延长了LED模块组件的使用寿命。

Description

大功率LED模块组件及其制造方法
技术领域
本发明涉及一种LED发光装置,更具体地涉及一种包括柔性管的大功率LED模块组件及其制造方法。
背景技术
当前,LED灯的应用变得越来越广。众所周知,对于现有技术的LED模块尤其是小功率LED模块(功率为0.1-0.5W),通常采用的技术方案是将其封闭在柔性塑料管中,以获得防水功能。然而,由于塑料材料本身的特性,对于大功率LED模块(功率大于0.5W)来说,这种方案不能为LED模块提供良好的散热。因此,大功率LED模块的使用寿命将受到严重影响并且无法获得稳定的光输出。
在传统的LED封装结构中,一般在由金属丝完成电子元器件内外连接之后用环氧树脂封装而成,其热阻高达250~300℃/W,如果大功率芯片若采用传统的LED封装形式,将会因为散热不良而导致芯片结温迅速上升和环氧碳化变黄,从而造成电子元器件的加速光衰直至失效,甚至因为迅速的热膨胀所产生的热应力造成开路而失效。
由此可见,对于大功率LED模块来说,最好能够采用既具有防水功能又具有良好的散热能力的封装结构。
本发明旨在解决现有技术中存在的上述问题。
发明内容
鉴于上述问题,本发明的目的是提供一种包括改进的封装结构的大功率LED模块组件及其相应的制造方法,该封装结构使得该大功率LED模块组件不但具有良好的防水功能还具有良好的散热能力。
根据本发明的一个方面,提供一种大功率LED模块组件,该LED模块组件包括:至少一个大功率LED模块,其包括金属芯印刷电路板和设置在所述金属芯印刷电路板上的大功率LED;柔性管,其包括与所述大功率LED模块相接合的基座和包围所述基座的盖。所述大功率LED模块组件还包括至少一个散热件,每个所述散热件对应地连接在每个所述大功率LED模块的下方,并且所述盖与所述散热件接合,并包覆所述基座、所述大功率LED模块以及所述散热件的除散热底面之外的其它侧面。
根据本发明的另一个方面,提供一种用于制造上述大功率LED模块组件的方法,该方法的特征在于包括下列步骤:(a)通过挤出工艺制造基座,然后在所述基座上冲出至少一个孔;(b)将包括金属芯印刷电路板和大功率LED的至少一个大功率LED模块和至少一个散热件分别从所述孔的上侧和下侧嵌入,并且通过螺钉进行固定;(c)通过挤出工艺用盖来包覆所述基座以及与其固定在一起的大功率LED模块和散热件,使得除了所述散热件的底部暴露于周围环境以外,所述基座和所述大功率LED模块以及所述散热件的其它部分均被所述盖包覆并与所述盖密封接合。
由于本发明的LED模块具有上述形式的柔性管封装结构,该柔性管并没有完全封闭LED模块,而是在与LED模块、散热件密封接合的同时使散热件的底部暴露于周围环境中。这样一来,不仅使本发明的LED模块组件具有良好的防水功能,还能利用散热件对LED模块进行充分散热,并且该LED模块组件还具有良好的柔性。
附图说明
下面参照附图描述本发明的作为示例的非限制性实施方式,附图中相同的附图标记指代相同的构件,其中:
图1是根据本发明的LED模块组件的示意性立体图;
图2是图1所示LED模块组件的局部截面图;
图3是图1所示LED模块组件的示意性截面图;
图4是用于图1所示LED模块组件中的LED模块和散热件的立体图;
图5是用于图1所示LED模块组件中的基座的示意性立体图,该基座上已冲出了若干孔;
图6A是示出了图4中的LED模块和散热件与图5中的基座组装在一起的状态的立体图;
图6B是示出了图4中的LED模块和散热件在组装过程中的位置关系的立体图;
图7是示出了由盖包覆之后的本发明的LED模块组件的局部截面放大图。
具体实施方式
如图1和图2所示,根据本发明的示例性实施方式的大功率LED模块组件总体上用1标示。该大功率LED模块组件1包括:至少一个大功率LED模块12,其包括MCPCB(即,金属芯印刷电路板)12b和设置在MCPCB 12b上的大功率LED 12a;柔性管11,其包括与大功率LED模块12相接合的基座11b和包围基座11b的盖11a;以及至少一个散热件13,每个散热件13对应地连接在每个大功率LED模块12的下方。在本发明的LED模块组件中,盖11a通过挤出工艺制造成使得除了散热件13的底部暴露于周围环境以外,基座11b和大功率LED模块12以及散热件13的其它部分均被盖11a包覆并与盖11a密封接合。
由于盖11a通过现有的挤出工艺制造而成,并且除了散热件13的底部暴露于周围环境以外,基座11b和大功率LED模块12以及散热件13的其它部分均被盖11a包覆并与盖11a密封接合,因此,一方面本发明的大功率LED模块组件具有一体化的外部轮廓,从而能够有效防止水进入模块组件的内部;另一方面在底部暴露于周围环境的散热件13与LED模块12直接连接的情况下,LED模块12产生的热量能够被有效地散发出去,从而稳定LED模块的性能并提高其使用寿命。
如图3所示,盖11a包括管状部11a1和从管状部11a1一体地向下延伸的两个侧部11a2,盖11a的两个侧部11a2中的每个的内侧形成有向内凸起的凸耳11a21,并且散热件13的外侧相应地形成有形状与凸耳11a21相匹配的凹槽13a21。在该示例性实施方式中,凸耳11a21的截面形状为水平放置的乒乓球拍形。事实上,在本发明的制造过程中,凹槽13a21先于凸耳11a21而形成,更准确地说凸耳11a21通过挤出工艺相应地形成为与凹槽13a21相匹配的形状,下文中将对这点作进一步描述。这种结构有助于防止水从盖11a的侧部11a2与散热件13的侧部的接合处进入该LED模块组件中,从而改善本发明的大功率LED模块组件的防水性能。
应当指出,图中示出的仅仅是本发明的示例,在通过挤出工艺获得一体化外轮廓从而提高防水性能的前提下,可以根据具体应用场合对管状部11a1和侧部11a2的形状和尺寸进行调整。此外,盖11a的每个侧部11a2的内侧可设置有一个以上的凸耳11a21,以进一步提高防水性能,并且只要能够防止水从盖11a的侧部11a2与散热件13的侧部的接合处进入LED模块组件中,凸耳11a21也可以设置成其它任何合适的形状。另外,也可以将凸耳设置在散热件13上,而将凹槽设置在盖11a上。
在本发明的LED模块组件中,基座11b也通过挤出工艺制成。并且如图3所示,基座11b具有大体上竖直延伸的两个侧部和水平延伸的中间部,从而使得基座11b的截面形状类似于水平放置的工字。而且,图3中示出的基座11b的两个侧部中的一个中设置有母线电路14,用于电连接大功率LED模块12。应当指出,尽管附图中示出的母线电路14都设置在基座11b的左侧部中,但是在不会对大功率LED模块12的电连接造成影响的情况下,也可以将母线电路14设置在基座11b的右侧部中,或者在左、右侧部中均设置。
此外,如图5所示,基座11b的中间部上形成有至少一个通孔,并且在组装过程中大功率LED模块12和散热件13分别从上侧和下侧嵌入所述孔中,使得LED模块12与散热件13能够直接接触从而增大散热能力。尽管图中仅示出了6个孔,但是所述孔的数目可根据具体应用的需要而进行调整。在任何情况下,所述孔的数目都与大功率LED模块12和散热件13的数目相等。
在本发明的大功率LED模块组件中,基座11b和/或盖11a通常由塑料制成,优选地由PVC(聚氯乙烯)制成,其具有光学功能,例如能够使LED模块12发出的光进行散射。散热件13通常由金属材料制成,优选地由铝制成。散热件13可以制成薄片状,例如图中所示为具有多个翅片的散热片,以增加散热面积。
并且在本发明的大功率LED模块组件中,大功率LED模块12、散热件13以及基座11b通过螺钉相互接合。应当指出,在能够确保LED模块12产生的热量充分、有效地传递给散热件13的情况下,LED模块12、散热件13以及基座11b可以通过任何合适的方式相互接合。例如,可以先通过螺钉将散热件13连接至LED模块12,然后再通过螺钉在MCPCB12b处将LED模块12连接至基座11b,从而使LED模块12、散热件13以及基座11b固定连接起来。也可以在确保热传递的情况下,通过螺钉将LED模块12和散热件13分别连接至基座11b。当然,还可以采用不同于螺钉的其它连接件或连接方式,例如粘结。
在本发明的大功率LED模块组件中,热传递路径为:LED12a(发热件)-MCPCB12b(导热、导电件)-散热件13。
另外,本发明还涉及在上文所述的大功率LED模块组件1中使用的柔性管11。该柔性管11包括与大功率LED模块12相接合的基座11b和包围基座11b的盖11a,并且该盖11a通过挤出工艺制造成使得除了散热件13的底部暴露于周围环境以外,基座11b和大功率LED模块12以及散热件13的其它部分均被盖11a包覆并与盖11a密封接合,从而在提高防水功能的同时改善了LED模块的散热性能。
再者,本发明还涉及包含于上述柔性管11中的盖11a。如上所述,该盖11a通过挤出工艺制造成使得除了散热件13的底部暴露于周围环境以外,基座11b和大功率LED模块12以及散热件13的其它部分均被盖11a包覆并与盖11a密封接合,从而在提高防水功能的同时改善了LED模块的散热性能。
本发明还提供一种用于制造上文所述的大功率LED模块组件的方法,该方法的特征在于包括下列步骤:
首先,如图5所述,通过挤出工艺制成基座11b,并且在基座11b上冲出至少一个通孔。该基座11b优选地具有大体上竖直延伸的两个侧部和水平延伸的中间部,并且所述孔的数目与相应的LED模块和散热件的数目相等。与此同时,母线电路14根据具体应用情形同步地形成在基座11b的两个侧部中的一个中。
其次,将至少一个包括MCPCB12b和大功率LED12a的大功率LED模块12和至少一个散热件13分别从所述孔的上侧和下侧嵌入,并且通过螺钉进行固定。如上文中所述,在能够确保LED模块12产生的热量充分、有效地传递给散热件13的情况下,LED模块12、散热件13以及基座11b可以通过任何合适的方式相互固定或接合。
最后,通过挤出工艺用盖11a来包覆基座11b以及与其固定在一起的大功率LED模块12和散热件13,使得除了散热件13的底部暴露于周围环境以外,基座11b和大功率LED模块12以及散热件13的其它部分均被盖11a包覆并与盖11a密封接合。
这样一来便完成了本发明的大功率LED模块组件的组装,该大功率LED模块组件不仅具有良好的防水功能,还具有良好的散热性能,因此具有更稳定的工作性能和更长的使用寿命。
综上所述,根据本发明的LED模块组件具有下列优点:首先,LED模块12的散热性能和防水功能得到了改进;其次,由于采用了PVC制成的盖11a和基座11b,使LED模块组件1的柔性增强;最后,本发明的LED模块组件1易于制造和组装且成本低廉。
尽管本发明是针对大功率LED模块而设计的,但是其也可应用于小功率的LED模块,即功率小于0.5W的LED模块。另外,尽管本文描述了LED模块组件1的示例性优选实施方式,但是本领域普通技术人员应当理解的是,在不偏离本发明的保护范围的情况下,可以作出该LED模块组件的多种变型和改型。这些改型和变形均落入本发明的保护范围之内。

Claims (11)

1.一种大功率LED模块组件,包括:至少一个大功率LED模块,其包括金属芯印刷电路板和设置在所述金属芯印刷电路板上的大功率LED;柔性管,其包括与所述大功率LED模块相接合的基座和包围所述基座的盖;
其特征在于,所述大功率LED模块组件还包括至少一个散热件,每个所述散热件对应地连接在每个所述大功率LED模块的下方,并且
所述盖与所述散热件接合,并包覆所述基座、所述大功率LED模块以及所述散热件的除散热底面之外的其它侧面。
2.如权利要求1所述的大功率LED模块组件,其特征在于,所述盖包括管状部和从所述管状部一体地向下延伸的两个侧部,所述盖的两个侧部中的每个的内侧形成有向内凸起的至少一个凸耳,并且所述散热件的外侧相应地形成有形状与所述凸耳相匹配的至少一个凹槽,所述凸耳与所述凹槽配合以实现所述盖与所述散热件的接合。
3.如权利要求2所述的大功率LED模块组件,其特征在于,所述凸耳的截面形状为水平放置的乒乓球拍形。
4.如权利要求1所述的大功率LED模块组件,其特征在于,所述基座具有大体上竖直延伸的两个侧部和水平延伸的中间部,从而使得所述基座具有“工”字形的截面形状。
5.如权利要求4所述的大功率LED模块组件,其特征在于,所述基座的两个侧部中的一个中设置有母线电路,用于电连接所述大功率LED模块。
6.如权利要求4所述的大功率LED模块组件,其特征在于,所述基座的中间部上形成有至少一个孔,所述大功率LED模块和所述散热件通过所述至少一个孔而直接接触。
7.如前述权利要求中任一项所述的大功率LED模块组件,其特征在于,所述基座和/或所述盖由聚氯乙烯制成。
8.如前述权利要求中任一项所述的大功率LED模块组件,其特征在于,所述散热件由铝制成。
9.如前述权利要求中任一项所述的大功率LED模块组件,其特征在于,所述散热件具有多个散热翅片。
10.如前述权利要求中任一项所述的大功率LED模块组件,其特征在于,所述大功率LED模块、所述散热件以及所述基座通过螺钉相互接合。
11.一种用于制造如权利要求1至10中任一项所述的大功率LED模块组件的方法,其特征在于包括下列步骤:
(a)通过挤出工艺制造基座,然后在所述基座上冲出至少一个孔;
(b)将包括金属芯印刷电路板和大功率LED的至少一个大功率LED模块和至少一个散热件分别从所述孔的上侧和下侧嵌入,并且通过螺钉进行固定;
(c)通过挤出工艺用盖来包覆所述基座以及与其固定在一起的大功率LED模块和散热件,使得除了所述散热件的底部暴露于周围环境以外,所述基座和所述大功率LED模块以及所述散热件的其它部分均被所述盖包覆并与所述盖密封接合。
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