CN101765353B - 散热模组 - Google Patents

散热模组 Download PDF

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CN101765353B
CN101765353B CN200810306535.6A CN200810306535A CN101765353B CN 101765353 B CN101765353 B CN 101765353B CN 200810306535 A CN200810306535 A CN 200810306535A CN 101765353 B CN101765353 B CN 101765353B
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heat
rotating shaft
heat conduction
radiation module
conducting sleeve
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CN101765353A (zh
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许寿标
周世文
陈俊吉
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0208—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes using moving tubes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/34—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending obliquely
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/06—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media
    • F28F13/12—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation
    • F28F13/125—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by affecting the pattern of flow of the heat-exchange media by creating turbulence, e.g. by stirring, by increasing the force of circulation by stirring
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • General Physics & Mathematics (AREA)
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  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
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Abstract

一种散热模组，其包括一导热转轴、一用以驱动该导热转轴旋转的驱动机构以及多个散热鳍片，所述导热转轴包括一用来与热源导热连接的吸热部及一与该吸热部相连的散热部，所述多个散热鳍片设置在该导热转轴的散热部。

Description

散热模组
技术领域
本发明涉及一种散热模组，特别涉及一种无需风扇的主动式散热模组。
背景技术
电子元件工作时会产生大量的热量，这些热量如果得不到及时地散出，就会影响电子元件的工作寿命，甚至导致电子元件的损毁。
常见的一种散热装置，包括一与发热的电子元件接触的基板，设于基板上的若干间距排列的散热鳍片，以及固定于散热器片的风扇。散热装置工作时，基板与散热鳍片吸收电子元件发出的热量，然后通过风扇驱散至外界。该基板与散热鳍片对于所吸收的热量不能主动快速的传递至外界，而需借助于风扇驱动。然而，风扇的设置又必然使得整个散热装置的结构复杂、体积较大。
发明内容
有鉴于此，有必要提供一种无需风扇的主动式散热模组。
一种散热模组包括一导热转轴、一用以驱动该导热转轴旋转的驱动机构以及多个散热鳍片，所述导热转轴包括一用来与热源导热连接的吸热部及一与该吸热部相连的散热部，所述多个散热鳍片设置在该导热转轴的散热部。
与现有技术相比，对于发热电子元件所产生的热量，一方面，导热转轴的吸热部吸收热源产生的热量，并将该热量依次传递至散热部、多个散热鳍片；另一方面，导热转轴通过驱动机构的驱动进行旋转，设置在导热转轴的散热部的多个散热鳍片在导热转轴的带动下进行旋转，此时多个散热鳍片相当于多个风扇同时旋转，从而快速将导热转轴、多个散热鳍片的热量驱散至外界，很大程度上提高了散热模组的散热效率。另外，由于多个散热鳍片在旋转时相当于多个风扇，因此，该散热模组可以省去风扇，大大简化了其结构，从而可广泛应用于尺寸较小的电子装置的散热系统中。
下面参照附图，结合具体实施例对本发明作进一步的描述。
附图说明
图1为本技术方案实施例散热模组的立体组合图。
图2为图1中散热模组的立体分解图。
图3为图1中散热模组的剖示图。
具体实施方式
以下，将结合附图及实施例对本技术方案的散热模组进行详细说明。
参阅图1至图3，本实施例提供一散热模组，其包括一导热转轴、一用以驱动该导热转轴旋转的驱动机构50以及多个散热鳍片40，所述导热转轴包括一用以与热源60导热连接的吸热部及一与该吸热部相连的散热部，所述多个散热鳍片40设置在该导热转轴的散热部。本实施例中，所述导热转轴的吸热部通过一导热基座10与热源60导热连接。该导热转轴包括一导热套筒20及一套设于该导热套筒20内的热管30。所述导热基座10、导热套筒20、热管30以及多个散热鳍片40均由导热材料制成。本实施例中，所述导热基座10、导热套筒20以及热管30均由金属铜制成，所述多个散热鳍片40由金属铝制成。
所述导热基座10大致呈四棱台体结构，即，其横截面大致呈梯形。该导热基座10具有一与热源60导热接触的底面11，一与该底面11相对的顶面12，一靠近多个散热鳍片40的第一侧面13，以及一与该第一侧面13相对的第二侧面14。该导热基座10还包括一贯通所述第一侧面13与第二侧面14的通孔15。所述导热基座10包括围合通孔15的内壁150，该内壁150包括一中间段151以及连接于该中间段151两端的二端部152。所述中间段151围合形成通孔15的第一孔段，所述每一端部152围合形成通孔15的第二孔段。该第一孔段的孔径大于该第二孔段的直径。所述内壁150的中间段151表面设置有良好润滑性能的导热填充介质16，例如导热膏，所述内壁150的二端部152的表面分别设置有密封圈17，以避免该导热填充介质16从导热基座10的通孔15的两端流出。
所述导热套筒20为一圆筒状筒体，其包括与导热基座10配合的吸热部21及与多个散热鳍片40配合的散热部22。所述吸热部21穿设在导热基座10的通孔15中，且该吸热部21的端部210伸出该通孔15与驱动机构50连接，从而该导热套筒20受驱动机构50驱动在导热基座10的通孔15中旋转。所述吸热部21与导热基座10的内壁150的中间段151之间填充有导热填充介质16，所述吸热部21与导热基座10的内壁150的二端部152之间分别设置有密封圈17，这样，导热套筒20旋转时，导热填充介质16可确保吸热部21与导热基座10的内壁150的中间段151之间形成良好的润滑、导热关系，同时，二密封圈17可确保导热填充介质16自通孔15的两端流出，造成污染。
所述热管30穿设在该导热套筒20的内部，且该热管30的外表面焊接于导热套筒20的内壁表面。也就是说，所述热管30的蒸发段与导热套筒20的吸热部21结合，所述热管30的冷凝段与导热套筒20的散热部22的结合，且热管30的蒸发段、冷凝段的外表面焊接于所述吸热部21与散热部22的内壁表面。这样，热管30的蒸发段与导热套筒20的吸热部21共同组成导热转轴的吸热部，热管30的冷凝段与导热套筒20的散热部22共同组成导热转轴的散热部。所述热管30为一圆筒状的管体，其与导热套筒20同轴设置。该热管30的外径等于或稍小于导热套筒20的内径，且该热管30沿该导热套筒20的轴线方向的长度等于或小于导热套筒20的长度。所述热管30的蒸发段的端部310伸出该通孔15与驱动机构50连接，从而该导热套筒20受驱动机构50驱动在导热基座10的通孔15中旋转。
所述驱动机构50具有一转子51，用于分别与导热套筒20的吸热部21的端部210以及热管30的蒸发段的端部310进行配合。该转子51为一环体结构，其包括一凹槽510用于收容热管30的蒸发段的端部310，及一圆环形外壁520穿设于导热套筒20的吸热部21的端部210的内部。本实施例中，转子51的凹槽510内壁与热管30的蒸发段的端部310的外壁焊接，转子51的外壁520与导热套筒20的吸热部21的端部210的内壁焊接。这样，导热套筒20与穿设在其中的热管30一端固定在驱动机构50的转子51上，从而通过该转子51的带动实现旋转。
所述多个散热鳍片40平行、间隔地套设在导热套筒20的散热部22的外壁表面。所述每一散热鳍片40包括一本体41、自该本体41的外边缘间隔延伸出的多个片体42及自该本体41的内边缘向内弯曲形成的结合部43。该本体41的中部设有通孔410，且该通孔410的孔径等于或稍大于导热套筒20的散热部22的外径，以使每一散热鳍片40的本体41恰好套设在导热套筒20的散热部22的外壁，且焊接于该散热部22的外壁表面。该片体42大致呈梯形，且在整体上呈凹面结构。该片体42朝远离导热基座10的方向凹陷。该结合部43与导热套筒20的散热部22的外壁表面紧密结合，并通过锡膏焊接固定。本实施例中，所述本体41为一圆环状结构，五个片体42等间距的自该本体41的外端缘沿该本体41的径向向外延伸。
可以理解，所述热管30与导热套筒20可组合形成一个导热转轴，该导热转轴受驱动机构50驱动旋转，以带动多个散热鳍片40绕该导热转轴的轴线旋转。
可以理解，导热套筒20与导热基座10以及驱动机构50的位置及连接关系也不限于上述描述的情况，只要导热套筒20的吸热部21可旋转地与导热基座10热连接便可。例如，驱动机构50除连接在导热套筒20的吸热部21的端部210处之外，也可以连接在导热套筒20的散热部22的端部，或者连结在吸热部21与散热部22之间。再例如，导热套筒20除穿设在导热基座10的通孔15中之外，还可以在导热基座10的第一侧面13开设圆形凹槽，或者在顶面12上开设半圆形凹槽，导热套筒20的吸热部21可旋转地收容在上述该凹槽中。当然，当导热套筒20的吸热部21的端部210收容在导热基座10的第一侧面13开设圆形凹槽时，驱动机构50需要连接在导热套筒20的吸热部21与散热部22之间。
可以理解，所述热管30也可以为螺旋状沿该导热套筒20的轴线方向旋设于导热套筒20的内壁；或者，热管30包括多个相互平行的平板型热管等间距地排列于导热套筒20的内壁，且沿导热套筒20的轴线方向延伸，又或者，热管30与导热套筒20的组合成一个热管结构。另外，所述热管30与导热套筒20又可组合形成一个导热转轴，该导热转轴受驱动机构50驱动旋转，以带动多个散热鳍片40绕该导热转轴的轴线旋转。
可以理解，所述导热基座10的顶面12也可设置有多个散热鳍片，以便更好实现散热功能。
可以理解，所述每一散热鳍片40可以为圆环形片状结构套设在导热套筒20的散热部22的外壁表面；或者多个散热鳍片40分别自导热套筒20的散热部22的外壁表面向外放射状延伸而成。
与现有技术相比，本实施例的散热模组具有以下优点：对于发热电子元件60所产生的热量，一方面，导热套筒20的吸热部21穿设在散热基座10中吸收发热电子元件60所产生的热量，热管30将吸热部21的热量依次传递至导热套筒20的散热部22、多个散热鳍片40；另一方面，导热套筒20通过驱动机构50的驱动进行旋转，设置在导热套筒20散热部22的多个散热鳍片40在导热套筒20的带动下进行旋转，此时多个散热鳍片40相当于多个风扇同时旋转，从而快速将导热套筒20、多个散热鳍片40以及散热基座10的热量驱散至外界，很大程度上提高了散热模组的散热效率。另外，由于多个散热鳍片40在旋转时相当于多个风扇，因此，该散热模组可以省去风扇，大大简化了其结构，从而可广泛应用于尺寸较小的电子装置的散热系统中。

Claims (11)

1.一种散热模组，其特征在于：该散热模组包括一导热转轴、一用以驱动该导热转轴旋转的驱动机构以及多个散热鳍片，所述导热转轴包括一用以与热源导热连接的吸热部及一与该吸热部相连的散热部，所述多个散热鳍片设置在该导热转轴的散热部，所述导热转轴包括一导热套筒及套设于该导热套筒内并与导热套筒焊接的热管，所述导热套筒包括吸热部与散热部，所述热管包括蒸发段与冷凝段，所述导热套筒的吸热部与热管的蒸发段共同组成导热转轴的吸热部，所述导热套筒的散热部与热管的冷凝段共同组成导热转轴的散热部，所述驱动机构包括一环形转子，该转子包括一内壁及一外壁，所述导热套筒的吸热部的端部套设于该转子的外壁表面，所述热管的蒸发段的端部的外表面与该转子的内壁表面结合。
2.如权利要求1所述的散热模组，其特征在于：所述散热模组进一步包括一与热源导热连接的散热基座，该导热转轴的吸热部可旋转地导热连接于该散热基座。
3.如权利要求2所述的散热模组，其特征在于：所述散热基座具有一用以与热源导热接触的底面，所述导热转轴的吸热部与该底面平行、间隔设置。
4.如权利要求3所述的散热模组，其特征在于：所述散热基座具有一与底面平行、间隔的通孔，所述导热转轴的吸热部穿过该通孔与所述驱动机构连接。
5.如权利要求4所述的散热模组，其特征在于：所述散热基座包括围合所述通孔的内壁，该内壁包括一中间段以及连接于该中间段两端的二端部，所述中间段围合形成通孔的第一孔段，所述每一端部围合形成通孔的第二孔段，该第一孔段的孔径大于每一第二孔段的直径。
6.如权利要求5所述的散热模组，其特征在于：所述内壁的中间段的表面与导热转轴的吸热部的外壁表面之间设置导热填充介质。
7.如权利要求6所述的散热模组，其特征在于：所述内壁的每一端部的表面与导热转轴的吸热部的外壁表面之间设置有一密封圈，用以密封导热填充介质。
8.如权利要求1所述的散热模组，其特征在于：所述多个散热鳍片平行、间隔地设置在导热转轴的散热部的外壁表面。
9.如权利要求8所述的散热模组，其特征在于：所述多个散热鳍片中的每一散热鳍片包括一环形本体、自该本体的外边缘间隔延伸出的多个片体及自该本体的内边缘向内弯曲形成的与导热转轴的散热部的外壁表面焊接的结合部。
10.如权利要求8所述的散热模组，其特征在于：所述多个散热鳍片中的每一散热鳍片自导热转轴的散热部的外壁表面向外放射状延伸。
11.如权利要求1所述的散热模组，其特征在于：所述热管为螺旋状沿该导热套筒的轴线方向旋设于导热套筒的内壁。
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