US20040035556A1 - Heat-dissipating device with dissipating fins drivable to move within and ambient fluid - Google Patents

Heat-dissipating device with dissipating fins drivable to move within and ambient fluid Download PDF

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Publication number
US20040035556A1
US20040035556A1 US10/614,241 US61424103A US2004035556A1 US 20040035556 A1 US20040035556 A1 US 20040035556A1 US 61424103 A US61424103 A US 61424103A US 2004035556 A1 US2004035556 A1 US 2004035556A1
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Prior art keywords
heat
dissipating
primary housing
fluid
conducting
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Abandoned
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US10/614,241
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Amigo Jean
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • This invention relates to a heat-dissipating device, and more particularly to a heat-dissipating device that includes heat-dissipating fins which can be driven to move within an ambient fluid so as to promote the heat dissipation efficiency of the device.
  • a conventional heat-dissipating device normally includes a heat-conducting member contacting a heat source, a plurality of heat-dissipating fins fixed on the heat-conducting member so as to dissipate heat from the heat-conducting member to an ambient fluid, such as air, and a fan for blowing air toward the fins.
  • an ambient fluid such as air
  • a fan for blowing air toward the fins.
  • the object of this invention is to provide a heat-dissipating device that includes a plurality of heat-dissipating fins, which can be driven to move within an ambient fluid so as to increase significantly the relative speed between the ambient fluid and the fins, thereby promoting the heat dissipation efficiency of the device.
  • a heat-dissipating device includes a hollow housing adapted to contact a heat source and for receiving a heat-conducting fluid therein, a heat-conducting member contacting the heat-conducting fluid, and a heat-dissipating fin unit driven to move within an ambient fluid, such as air, so as to dissipate heat from the fin unit to the ambient fluid.
  • an ambient fluid such as air
  • FIG. 1 is a schematic sectional view of the first preferred embodiment of a heat-dissipating device according to this invention
  • FIG. 2 is a schematic sectional view of the second preferred embodiment of a heat-dissipating device according to this invention.
  • FIG. 3 is a schematic top view of two heat-dissipating fins of the second preferred embodiment
  • FIG. 4 is a schematic sectional view of the third preferred embodiment of a heat-dissipating device according to this invention.
  • FIG. 5 is a schematic view of the fourth preferred embodiment of a heat-dissipating device according to this invention.
  • the first preferred embodiment of a heat-dissipating device is shown to include a heat-absorbing mechanism 1 and a heat-dissipating mechanism 2 .
  • the heat-absorbing mechanism 1 includes a hollow primary housing 11 that is made of a heat-conducting material and that is adapted to contact a first heat source 3 , such as a CPU chip, so as to permit heat transfer from the first heat source 3 to the primary housing 11 , and a heat-conducting fluid 12 that is received within the primary housing 11 so as to permit heat transfer from the primary housing 11 to the heat-conducting fluid 12 .
  • the primary housing 11 has a contacting wall 111 that contacts the first heat source 3 , and a mounting wall 112 that is parallel to the contacting wall 111 and that is formed with a circular hole 112 therethrough.
  • the heat-conducting fluid 12 may be gas, liquid, or a coolant.
  • the heat-dissipating mechanism 2 includes a driving unit 21 , a heat-conducting member 22 , a bearing unit 23 , a connector 24 , and a heat-dissipating fin unit consisting of two heat-dissipating fins 25 .
  • the driving unit 21 is configured as an electrical motor.
  • the heat-conducting member 22 is configured as a motor shaft that is rotated by the driving unit 21 and that has a first end 221 and a second end 222 .
  • the first end 221 is journalled on the primary housing 11 by means of the bearing unit 23 , and extends into the primary housing 11 through the circular hole 113 in the mounting wall 112 of the primary housing 11 .
  • the second end 222 is connected to the driving unit 21 by means of the connector 24 .
  • the fins 25 are connected fixedly to and extend radially and outwardly from the second end 222 of the heat-conducting member 22 .
  • An outward flange 224 is formed on the first end 221 of the heat-conducting member 22 , is disposed in the primary housing 11 so as to contact the heat-conducting fluid 12 , thereby permitting heat transfer from the heat-conducting fluid 12 to the heat-conducting member 22 , and has a diameter that is larger than that of the circular hole 113 in the primary housing 11 so as to prevent removal of the heat-conducting member 22 from the primary housing 11 .
  • the fins 25 are exposed within an ambient fluid, i.e. air.
  • the fins 25 rotate about the heat-conducting member 22 at a relatively high speed relative to the ambient fluid so as to enhance the wind chill effect, thereby permitting rapid heat transfer from the fins 25 to the ambient fluid.
  • the fins 25 can be driven to perform reciprocating linear movement, swinging movement, or any other similar motion relative to the first heat source 3 .
  • FIGS. 2 and 3 show the second preferred embodiment of a heat-dissipating device according to this invention, which is similar to the first preferred embodiment in construction.
  • the heat-conducting member 22 is hollow, and is formed with a central bore 220
  • the heat-dissipating mechanism 2 further includes two tubes 26 that are connected respectively and fixedly to the fins 25 .
  • the central bore 220 has an open end 221 in fluid communication with an interior chamber 110 in the primary housing 11 , and a closed end 222 proximate to the driving unit 21 .
  • Each of the tubes 26 extends along a spiral path on the corresponding fin 25 , and has a closed outer end 261 , and an open inner end 262 in fluid communication with the central bore 220 in the heat-conducting member 22 .
  • FIG. 4 shows the third preferred embodiment of a heat-dissipating device according to this invention, which is similar to the second preferred embodiment in construction. Unlike the second preferred embodiment, no tubes 26 are provided, and each of the fins 25 is hollow, and is formed with an interior space 250 that has a closed radial outer end 251 and an open radial inner end 252 that is in fluid communication with the central bore 220 in the heat-conducting member 22 .
  • FIG. 5 shows the fourth preferred embodiment of a heat-dissipating device according to this invention, which is similar to the third preferred embodiment in construction.
  • the heat-absorbing mechanism 1 further includes a hollow secondary housing 13 that is adapted to contact a second heat source 3 ′ so as to permit heat transfer from the second heat source 3 ′ to the secondary housing 13 , and a conduit 14 that is connected removably to and that is in fluid communication with the primary and secondary housings 11 , 13 .
  • the first and second heat sources 3 , 3 ′ constitute a heat source unit.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

A heat-dissipating device includes a hollow housing adapted to contact a heat source and for receiving a heat-conducting fluid therein, a heat-conducting member contacting the heat-conducting fluid, and a heat-dissipating fin unit driven to move within an ambient fluid so as to dissipate heat from the fin unit to the ambient fluid.

Description

    CROSS REFERENCE TO RELATED APPLICATION
  • This application claims priority of Taiwanese Application No. 91115210, filed on Jul. 9, 2002. [0001]
    • BACKGROUND OF THE INVENTION
  • 1. Field of the Invention [0002]
  • This invention relates to a heat-dissipating device, and more particularly to a heat-dissipating device that includes heat-dissipating fins which can be driven to move within an ambient fluid so as to promote the heat dissipation efficiency of the device. [0003]
  • 2. Description of the Related Art [0004]
  • A conventional heat-dissipating device normally includes a heat-conducting member contacting a heat source, a plurality of heat-dissipating fins fixed on the heat-conducting member so as to dissipate heat from the heat-conducting member to an ambient fluid, such as air, and a fan for blowing air toward the fins. According to the wind chill effect, when the speed of air current flowing from the fan onto the fins increases by 100 meters per second, the surface temperature of the fins will reduce by only about 1° C. in view of a limited relative speed between air and the fins. As such, when the heat source has a comparatively high temperature, there is a need for a fan of a larger size to create a faster air current, thereby increasing the volume and manufacturing costs of the conventional heat dissipating device. [0005]
    • SUMMARY OF THE INVENTION
  • The object of this invention is to provide a heat-dissipating device that includes a plurality of heat-dissipating fins, which can be driven to move within an ambient fluid so as to increase significantly the relative speed between the ambient fluid and the fins, thereby promoting the heat dissipation efficiency of the device. [0006]
  • According to this invention, a heat-dissipating device includes a hollow housing adapted to contact a heat source and for receiving a heat-conducting fluid therein, a heat-conducting member contacting the heat-conducting fluid, and a heat-dissipating fin unit driven to move within an ambient fluid, such as air, so as to dissipate heat from the fin unit to the ambient fluid. As such, a relatively high relative speed between the ambient fluid and the heat-dissipating fin unit can be obtained so as to enhance the wind chill effect, thereby increasing the heat dissipation efficiency significantly.[0007]
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • These and other features and advantages of this invention will become apparent in the following detailed description of the preferred embodiments of this invention, with reference to the accompanying drawings, in which: [0008]
  • FIG. 1 is a schematic sectional view of the first preferred embodiment of a heat-dissipating device according to this invention; [0009]
  • FIG. 2 is a schematic sectional view of the second preferred embodiment of a heat-dissipating device according to this invention; [0010]
  • FIG. 3 is a schematic top view of two heat-dissipating fins of the second preferred embodiment; [0011]
  • FIG. 4 is a schematic sectional view of the third preferred embodiment of a heat-dissipating device according to this invention; and [0012]
  • FIG. 5 is a schematic view of the fourth preferred embodiment of a heat-dissipating device according to this invention.[0013]
    • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • Before the present invention is described in greater detail in connection with the preferred embodiments, it should be noted that similar elements and structures are designated by like reference numerals throughout the entire disclosure. [0014]
  • Referring to FIG. 1, the first preferred embodiment of a heat-dissipating device according to this invention is shown to include a heat-absorbing [0015] mechanism 1 and a heat-dissipating mechanism 2.
  • The heat-absorbing [0016] mechanism 1 includes a hollow primary housing 11 that is made of a heat-conducting material and that is adapted to contact a first heat source 3, such as a CPU chip, so as to permit heat transfer from the first heat source 3 to the primary housing 11, and a heat-conducting fluid 12 that is received within the primary housing 11 so as to permit heat transfer from the primary housing 11 to the heat-conducting fluid 12. The primary housing 11 has a contacting wall 111 that contacts the first heat source 3, and a mounting wall 112 that is parallel to the contacting wall 111 and that is formed with a circular hole 112 therethrough. The heat-conducting fluid 12 may be gas, liquid, or a coolant.
  • The heat-[0017] dissipating mechanism 2 includes a driving unit 21, a heat-conducting member 22, a bearing unit 23, a connector 24, and a heat-dissipating fin unit consisting of two heat-dissipating fins 25. The driving unit 21 is configured as an electrical motor. The heat-conducting member 22 is configured as a motor shaft that is rotated by the driving unit 21 and that has a first end 221 and a second end 222. The first end 221 is journalled on the primary housing 11 by means of the bearing unit 23, and extends into the primary housing 11 through the circular hole 113 in the mounting wall 112 of the primary housing 11. The second end 222 is connected to the driving unit 21 by means of the connector 24. The fins 25 are connected fixedly to and extend radially and outwardly from the second end 222 of the heat-conducting member 22. An outward flange 224 is formed on the first end 221 of the heat-conducting member 22, is disposed in the primary housing 11 so as to contact the heat-conducting fluid 12, thereby permitting heat transfer from the heat-conducting fluid 12 to the heat-conducting member 22, and has a diameter that is larger than that of the circular hole 113 in the primary housing 11 so as to prevent removal of the heat-conducting member 22 from the primary housing 11. The fins 25 are exposed within an ambient fluid, i.e. air. As such, when the driving unit 21 runs, the fins 25 rotate about the heat-conducting member 22 at a relatively high speed relative to the ambient fluid so as to enhance the wind chill effect, thereby permitting rapid heat transfer from the fins 25 to the ambient fluid. Alternatively, the fins 25 can be driven to perform reciprocating linear movement, swinging movement, or any other similar motion relative to the first heat source 3.
  • FIGS. 2 and 3 show the second preferred embodiment of a heat-dissipating device according to this invention, which is similar to the first preferred embodiment in construction. Unlike the first preferred embodiment, the heat-conducting [0018] member 22 is hollow, and is formed with a central bore 220, and the heat-dissipating mechanism 2 further includes two tubes 26 that are connected respectively and fixedly to the fins 25. The central bore 220 has an open end 221 in fluid communication with an interior chamber 110 in the primary housing 11, and a closed end 222 proximate to the driving unit 21. Each of the tubes 26 extends along a spiral path on the corresponding fin 25, and has a closed outer end 261, and an open inner end 262 in fluid communication with the central bore 220 in the heat-conducting member 22.
  • FIG. 4 shows the third preferred embodiment of a heat-dissipating device according to this invention, which is similar to the second preferred embodiment in construction. Unlike the second preferred embodiment, no [0019] tubes 26 are provided, and each of the fins 25 is hollow, and is formed with an interior space 250 that has a closed radial outer end 251 and an open radial inner end 252 that is in fluid communication with the central bore 220 in the heat-conducting member 22.
  • FIG. 5 shows the fourth preferred embodiment of a heat-dissipating device according to this invention, which is similar to the third preferred embodiment in construction. Unlike the third preferred embodiment, the heat-absorbing [0020] mechanism 1 further includes a hollow secondary housing 13 that is adapted to contact a second heat source 3′ so as to permit heat transfer from the second heat source 3′ to the secondary housing 13, and a conduit 14 that is connected removably to and that is in fluid communication with the primary and secondary housings 11, 13. The first and second heat sources 3, 3′ constitute a heat source unit.
  • With this invention thus explained, it is apparent that numerous modifications and variations can be made without departing from the scope and spirit of this invention. It is therefore intended that this invention be limited only as indicated by the appended claims. [0021]

Claims (8)

I claim:
1. A heat-dissipating device for dissipating heat from a heat source unit to an ambient fluid, said heat-dissipating device comprising:
a heat-absorbing mechanism including a hollow primary housing that is made of a heat-conducting material and that is adapted to contact the heat source unit so as to permit heat transfer from the heat source unit to said primary housing, and a heat-conducting fluid that is received within said primary housing so as to permit heat transfer from said primary housing to said heat-conducting fluid; and
a heat-dissipating mechanism including
a heat-conducting member that contacts said heat-conducting fluid so as to permit heat transfer from said heat-conducting fluid to said heat-conducting member,
a heat-dissipating fin unit that is mounted to said heat-conducting member so as to permit heat transfer from said heat-conducting member to said heat-dissipating fin unit and that is adapted to be exposed within the ambient fluid so as to permit heat transfer from said dissipating fin unit to the ambient fluid, and
a driving unit connected to said heat-dissipating fin unit so as to drive said heat-dissipating fin unit to move within the ambient fluid.
2. The heat-dissipating device as claimed in claim 1, wherein said driving unit is configured as an electrical motor, said conducting member being configured as a motor shaft that is rotated by said electrical motor, said heat-dissipating fin unit including a plurality of fins that are connected fixedly to and that extend radially and outwardly from said motor shaft so that said electrical motor can rotate said fins about said motor shaft.
3. The heat-dissipating device as claimed in claim 2, wherein said primary housing has an interior chamber for receiving said heat-conducting fluid therein, said motor shaft being hollow and being formed with a central bore that has a closed end proximate to said electrical motor, and an open end in fluid communication with said interior chamber in said primary housing.
4. The heat-dissipating device as claimed in claim 3, wherein said heat-dissipating mechanism further includes a plurality of tubes that are connected respectively and fixedly to said fins, each of said tubes having a closed outer end, and an open inner end in fluid communication with said central bore in said motor shaft.
5. The heat-dissipating device as claimed in claim 4, wherein each of said tubes extends along a spiral path on a respective one of said fins.
6. The heat-dissipating device as claimed in claim 3, wherein each of said fins is hollow, and is formed with an interior space that has a closed radial outer end and an open radial inner end, which is in fluid communication with said central bore in said motor shaft.
7. The heat-dissipating device as claimed in claim 6, wherein said heat-absorbing mechanism further includes a hollow secondary housing that is adapted to contact the heat source unit so as to permit heat transfer from the heat source unit to said secondary housing, and a conduit that is connected removably to and that is in fluid communication with said primary and secondary housings.
8. The heat-dissipating device as claimed in claim 2, wherein said heat-dissipating mechanism further includes a bearing unit, said motor shaft being journalled on said primary housing by means of said bearing unit, said primary housing having a contacting wall that is adapted to contact the heat source unit, and a mounting wall that is parallel to said contacting wall and that is formed with a circular hole therethrough, said motor shaft extending into said primary housing through said circular hole and being formed with an outward flange that is disposed in said primary housing and that has a diameter which is larger than that of said circular hole in said primary housing so as to prevent removal of said motor shaft from said primary housing.
US10/614,241 2002-07-09 2003-07-08 Heat-dissipating device with dissipating fins drivable to move within and ambient fluid Abandoned US20040035556A1 (en)

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TW091115210A TW551028B (en) 2002-07-09 2002-07-09 Dynamic heat exchange device
TW091115210 2002-07-09

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100177480A1 (en) * 2007-12-18 2010-07-15 Koplow Jeffrey P Heat exchanger device and method for heat removal or transfer
US20100193175A1 (en) * 2009-02-05 2010-08-05 International Business Machines Corporation Heat Sink Apparatus with Extendable Pin Fins
US7896611B2 (en) 2007-01-03 2011-03-01 International Business Machines Corporation Heat transfer device in a rotating structure
US8945914B1 (en) 2010-07-08 2015-02-03 Sandia Corporation Devices, systems, and methods for conducting sandwich assays using sedimentation
US8962346B2 (en) 2010-07-08 2015-02-24 Sandia Corporation Devices, systems, and methods for conducting assays with improved sensitivity using sedimentation
US8988881B2 (en) 2007-12-18 2015-03-24 Sandia Corporation Heat exchanger device and method for heat removal or transfer
US9005417B1 (en) 2008-10-01 2015-04-14 Sandia Corporation Devices, systems, and methods for microscale isoelectric fractionation
US9207023B2 (en) 2007-12-18 2015-12-08 Sandia Corporation Heat exchanger device and method for heat removal or transfer
US9244065B1 (en) 2012-03-16 2016-01-26 Sandia Corporation Systems, devices, and methods for agglutination assays using sedimentation
US9261100B2 (en) 2010-08-13 2016-02-16 Sandia Corporation Axial flow heat exchanger devices and methods for heat transfer using axial flow devices
US9795961B1 (en) 2010-07-08 2017-10-24 National Technology & Engineering Solutions Of Sandia, Llc Devices, systems, and methods for detecting nucleic acids using sedimentation

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102937384A (en) * 2012-11-04 2013-02-20 王晓鹏 Active type heat exchanger
CN106354230A (en) * 2016-10-31 2017-01-25 郑州云海信息技术有限公司 Server and CUP heat dissipation device thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2327786A (en) * 1941-09-15 1943-08-24 Jack & Heintz Inc Cooling method and apparatus
US2330121A (en) * 1940-10-04 1943-09-21 Jack & Heintz Inc Motor cooling system
US3999400A (en) * 1970-07-10 1976-12-28 Gray Vernon H Rotating heat pipe for air-conditioning
US4144932A (en) * 1977-06-02 1979-03-20 Kohler Co. Heat sink for rotating electronic circuitry
US5335143A (en) * 1993-08-05 1994-08-02 International Business Machines Corporation Disk augmented heat transfer system
US5794687A (en) * 1997-08-04 1998-08-18 International Business Machine Corp. Forced air cooling apparatus for semiconductor chips
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2330121A (en) * 1940-10-04 1943-09-21 Jack & Heintz Inc Motor cooling system
US2327786A (en) * 1941-09-15 1943-08-24 Jack & Heintz Inc Cooling method and apparatus
US3999400A (en) * 1970-07-10 1976-12-28 Gray Vernon H Rotating heat pipe for air-conditioning
US4144932A (en) * 1977-06-02 1979-03-20 Kohler Co. Heat sink for rotating electronic circuitry
US5335143A (en) * 1993-08-05 1994-08-02 International Business Machines Corporation Disk augmented heat transfer system
US5794687A (en) * 1997-08-04 1998-08-18 International Business Machine Corp. Forced air cooling apparatus for semiconductor chips
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7896611B2 (en) 2007-01-03 2011-03-01 International Business Machines Corporation Heat transfer device in a rotating structure
US9207023B2 (en) 2007-12-18 2015-12-08 Sandia Corporation Heat exchanger device and method for heat removal or transfer
US8228675B2 (en) * 2007-12-18 2012-07-24 Sandia Corporation Heat exchanger device and method for heat removal or transfer
US8988881B2 (en) 2007-12-18 2015-03-24 Sandia Corporation Heat exchanger device and method for heat removal or transfer
US20100177480A1 (en) * 2007-12-18 2010-07-15 Koplow Jeffrey P Heat exchanger device and method for heat removal or transfer
US9005417B1 (en) 2008-10-01 2015-04-14 Sandia Corporation Devices, systems, and methods for microscale isoelectric fractionation
US20100193175A1 (en) * 2009-02-05 2010-08-05 International Business Machines Corporation Heat Sink Apparatus with Extendable Pin Fins
US8910706B2 (en) * 2009-02-05 2014-12-16 International Business Machines Corporation Heat sink apparatus with extendable pin fins
US8945914B1 (en) 2010-07-08 2015-02-03 Sandia Corporation Devices, systems, and methods for conducting sandwich assays using sedimentation
US8962346B2 (en) 2010-07-08 2015-02-24 Sandia Corporation Devices, systems, and methods for conducting assays with improved sensitivity using sedimentation
US9795961B1 (en) 2010-07-08 2017-10-24 National Technology & Engineering Solutions Of Sandia, Llc Devices, systems, and methods for detecting nucleic acids using sedimentation
US9261100B2 (en) 2010-08-13 2016-02-16 Sandia Corporation Axial flow heat exchanger devices and methods for heat transfer using axial flow devices
US9244065B1 (en) 2012-03-16 2016-01-26 Sandia Corporation Systems, devices, and methods for agglutination assays using sedimentation

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TW551028B (en) 2003-09-01

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