CN101752275B - Led模块的封装方法和封装结构 - Google Patents

Led模块的封装方法和封装结构 Download PDF

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CN101752275B
CN101752275B CN2009102337061A CN200910233706A CN101752275B CN 101752275 B CN101752275 B CN 101752275B CN 2009102337061 A CN2009102337061 A CN 2009102337061A CN 200910233706 A CN200910233706 A CN 200910233706A CN 101752275 B CN101752275 B CN 101752275B
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张宏庭
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Jiangsu Wenrun Optoelectronic Co Ltd
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Abstract

本发明公开了一种LED显示器的封装方法，1)在显示模块腔体面板的各注胶孔内注入注胶孔深度1/2的环氧树脂；2)在电路板正面上喷涂第一层硅胶树脂；3)电路板上的定位孔套进显示模块腔体的定位柱上，第一层硅胶树脂表面抵靠在显示模块腔体面板的内侧面上；4)将凸出电路板背面的定位柱上端烫平形成盖帽；5)在电路板背面浇注第二层硅胶树脂。本发明还公开使用该方法的封装结构，包括显示模块腔体、电路板、多个LED晶片，各个LED晶片分别位于相应的注胶孔内。本发明消除注胶孔内环氧树脂的内应力，防止LED显示模块腔体变形；本发明可在制造过程中可更换晶片或电路板，提高了LED显示模块的一次合格率。

Description

LED模块的封装方法和封装结构
技术领域
本发明涉及一种LED模块的封装方法，还涉及使用该方法封装的LED模块封装结构，属于灯光显示器技术领域。 
背景技术
LED(发光二极管)是一种固态的半导体器件，它可以直接把电转化为光，作为一种新型节能灯光源，具有能耗低、寿命长、亮度高、响应时间短等优点。多个LED管芯可按点阵排列形式在壳体内组合成LED数码模块或点阵模块，多个LED显示模块组合成能显示数码或色彩鲜丽图像的LED显示屏。目前，在信号显示、户外广告和公共场所的大型显示器方面，LED显示屏以其屏幕大、显示效果好等优点得到越来越广泛的应用。现有的LED显示模块如图1所示，包括显示模块腔体1、电路板2、环氧树脂3和多个通过固晶胶粘接于电路板正面的LED晶片4。在显示腔体内设有至少一对用于电路板定位的定位柱11，在电路板2上开设与定位柱对应的定位孔与多个过胶孔，电路板2背面引出与外部电路相连的引脚5。封装时，先在显示模块腔体1内灌装环氧树脂3，使环氧树脂3注满注胶孔12，然后将电路板2连同粘接在其表面的LED晶片3，引脚5朝上且定位孔套进定位柱11，电路板2正面抵靠在显示模块腔体面板13的内侧面上，液态环氧树脂3通过电路板2上的过胶孔溢出，部分覆盖了电路板2背面，通过烘烤固化使电路板2连同LED晶片4与显示模块腔体1结合成一体。由于环氧树脂3固化后与电路板2、LED晶片4连接牢固，一旦电路板2或LED晶片4损坏，无法将其与环氧树脂3分离。现有的LED显示模块存在的不可修复性，影响了LED显示模块的一次合格率，增加了其制造成本。 
发明内容
本发明的目的是提供一种可修复的LED显示模块，提高LED显示模块的一次合格率，降低了制造成本。 
本发明通过以下技术方案予以实现： 
一种LED显示模块的封装方法，包括以下步骤： 
1)将显示模块腔体倒置，用点胶设备在显示模块腔体面板的各注胶孔内注入环氧树脂，所述环氧树脂浇注厚度为注胶孔深度的1/2，烘烤固化； 
2)多个LED晶片通过固晶胶粘接于电路板正面，在该面上喷涂第一层硅胶树脂，形成一层透明保护层，烘烤固化； 
3)将电路板以其表面的第一层硅胶树脂面朝下、引脚朝上的方式放进显示模块腔体内，使电路板上至少一对定位孔套进显示模块腔体面板内侧相应的定位柱上，电路板的第一层硅胶树脂表面抵靠在显示模块腔体面板的内侧面上； 
4)使用加热装置将凸出电路板背面的定位柱上端烫平，形成紧靠在电路板背面上的定位柱盖帽； 
5)在电路板背面浇注第二层硅胶树脂，烘烤固化，所述第二层硅胶树脂的厚度大于第一层硅胶树脂的厚度。 
一种使用上述封装方法的LED显示模块封装结构，包括显示模块腔体、电路板，所述电路板的正面粘接多个LED晶片，显示模块腔体面板上设有成点阵排列的多个注胶孔和至少一对定位柱，所述电路板上的定位孔套进定位柱，电路板正面抵靠在显示模块腔体面板的内侧面上，各个LED晶片分别位于相应的注胶孔内；所述注胶孔内充填的环氧树脂厚度为注胶孔深度的1/2，所述定位柱上端设有紧靠在电路板背面上的盖帽；所述电路板正面设有第一层硅胶树脂， 背面设有第二层硅胶树脂，所述第二层硅胶树脂的厚度大于第一层硅胶树脂的厚度。 
本发明的目的还可以通过以下技术措施来进一步实现。 
前述的LED显示模块的封装结构，其中所述第二层硅胶树脂厚度为第一层硅胶树脂厚度的2.5～3.5倍。 
本发明结构简单、制造方便，本发明在各注胶孔内浇注的环氧树脂厚度仅为注胶孔深度的1/2，电路板正面及粘接于电路板正面的LED晶片与各注胶孔内的环氧树脂不接触。本发明在电路板正面喷涂第一层硅胶树脂，形成一层透明保护层；背面设有第二层硅胶树脂，且第二层硅胶树脂的厚度大于第一层硅胶树脂的厚度，采用这样的结构可以消除注胶孔内环氧树脂的内应力，防止LED显示模块腔体变形。本发明加长了定位柱长度，当电路板套进显示模块腔体定位柱后，用电烙铁或其他加热设备将伸出电路板背面的定位柱上端高温烫平形成紧靠在电路板背面上的定位柱盖帽，使得电路板与显示模块腔体连接更牢固。一旦电路板或LED晶片损坏，由于硅胶树脂具有可拆除性，可去除显示模块腔体中的硅胶树脂，将电路板连同LED晶片从显示模块腔体中取出维修，再将其用硅胶树脂固定在显示模块腔体中。本发明可在制造过程中及时更换不亮的LED晶片或电路板，提高LED显示模块产品的制造质量，降低其制造成本，提高了LED显示模块的一次合格率。 
本发明的优点和特点，将通过下面优选实施例的非限制性说明进行图示和解释，这些实施例，是参照附图仅作为例子给出的。 
附图说明
图1是现有LED显示模块的放大剖视图； 
图2是本发明的放大剖视图。 
具体实施方式
下面结合附图和实施例对本发明作进一步说明。 
如图1、图2所示，本发明的封装方法包括以下步骤： 
1)将显示模块腔体1倒置，用注射器或其他点胶设备在显示模块腔体1面板的各注胶孔12内注入环氧树脂3，环氧树脂3浇注厚度为注胶孔12深度的1/2，烘烤固化； 
2)多个LED晶片4通过固晶胶粘接于电路板2的正面21上，在该面上喷涂第一层硅胶树脂6，形成一层透明保护层，烘烤固化； 
3)将电路板2以其表面的第一层硅胶树脂6面朝下、引脚5朝上的方式放进显示模块腔体1内，使电路板2上的一对定位孔22套进显示模块腔体1面板内侧相应的定位柱11上，电路板2的第一层硅胶树脂6表面抵靠在显示模块腔体面板13的内侧面上； 
4)使用电烙铁或其他加热设备将凸出电路板2的定位柱11上端烫平形成紧靠在电路板背面上的定位柱盖帽111； 
5)在电路板背面23浇注第二层硅胶树脂7，烘烤固化，第二层硅胶树脂7的厚度大于第一层硅胶树脂6的厚度，由于定位柱盖帽111和第二层硅胶树脂7和显示模块腔体1的连接作用，使得电路板2连同LED晶片4与显示模块腔体1连接牢固。 
本发明的封装结构包括显示模块腔体1、电路板2，所述电路板的正面21粘接多个LED晶片4，显示模块腔体面板13上设有成点阵排列的多个注胶孔12和一对定位柱11；电路板2上的定位孔21套进定位柱11，使电路板2定位。 
本发明的注胶孔12内只充填了其深度的1/2的环氧树脂3，上面留有空隙131，电路板2不与环氧树脂3接触。一旦电路板2或LED晶片4损坏，就可去除第一层硅胶树脂6和第二层硅胶树脂7，将电路板2连同LED晶片4从显示模块腔体1中取出维修，降低LED显示模块的制造成本 
除上述实施例外，本发明还可以有其他实施方式，凡采用等同替换或等效变换形式的技术方案，均落在本发明要求的保护范围内。 

Claims (2)

1.一种LED显示模块的封装方法，其特征在于，包括以下步骤：
1)将显示模块腔体倒置，用点胶设备在显示模块腔体面板的各注胶孔内注入环氧树脂，所述环氧树脂浇注厚度为注胶孔深度的1/2，烘烤固化；
2)多个LED晶片通过固晶胶粘接于电路板正面，在该面上喷涂第一层硅胶树脂，形成一层透明保护层，烘烤固化；
3)将电路板以其表面的第一层硅胶树脂面朝下、引脚朝上的方式放进显示模块腔体内，使电路板上至少一对定位孔套进显示模块腔体面板内侧相应的定位柱上，电路板的第一层硅胶树脂表面抵靠在显示模块腔体面板的内侧面上；
4)使用加热装置将凸出电路板背面的定位柱上端烫平，形成紧靠在电路板背面上的定位柱盖帽；
5)在电路板背面浇注第二层硅胶树脂，烘烤固化，所述第二层硅胶树脂的厚度大于第一层硅胶树脂的厚度。
2.一种使用如权利要求1所述的LED显示模块的封装方法制备的封装结构，其特征在于，包括显示模块腔体、电路板，所述电路板的正面粘接多个LED晶片，显示模块腔体面板上设有成点阵排列的多个注胶孔和至少一对定位柱，所述电路板上的定位孔套进定位柱，电路板正面抵靠在显示模块腔体面板的内侧面上，各个LED晶片分别位于相应的注胶孔内；其特征在于，所述注胶孔内充填的环氧树脂厚度为注胶孔深度的1/2，所述定位柱上端设有紧靠在电路板背面上的盖帽；所述电路板正面设有第一层硅胶树脂，背面设有第二层硅胶树脂，所述第二层硅胶树脂的厚度大于第一层硅胶树脂的厚度。
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