CN101745877B - Diamond grinding material sequential arraying system and method - Google Patents
Diamond grinding material sequential arraying system and method Download PDFInfo
- Publication number
- CN101745877B CN101745877B CN2009102630917A CN200910263091A CN101745877B CN 101745877 B CN101745877 B CN 101745877B CN 2009102630917 A CN2009102630917 A CN 2009102630917A CN 200910263091 A CN200910263091 A CN 200910263091A CN 101745877 B CN101745877 B CN 101745877B
- Authority
- CN
- China
- Prior art keywords
- diamond abrasive
- diamond
- cylinder sleeve
- elastic plate
- piston
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The invention relates to a diamond grinding material sequential arraying system and a method, belonging to the field of grinding material and tool manufacturing. The system comprises a cylinder sleeve (3) and a piston (4). The piston (4) which can move up and down is arranged in the cylinder sleeve by a piston rod (1), the cylinder sleeve is sealed with the piston by a sealing ring (5), an elastic plate (6) is fixed at the lower end face of the cylinder sleeve by a screw (7) and a pressing plate (8), and stepped holes are sequentially arrayed in the elastic plate. The system further comprises a worktable (14) and a supporting plate (12) arranged on the worktable (14) by a magnet block (13). With low cost and easy popularization, the system and the method can effectively, accurately and sequentially array and distribute diamond grinding materials.
Description
Technical field
The present invention relates to diamond grinding material sequential arraying system and method, belong to grinding materials and grinding tool and make the field.
Background technology
Materials such as granite, marble, concrete, pitch are the exemplary that adopts the diamond saw blade cutting.Diamond saw blade has the cutting lay of diamond abrasive on the saw bit matrix periphery.The sawing cutter head is usually by diamond particles with control adamantine metal matrix and form.At present, the production technology that diamond saw blade generally adopts: metallic bond (as iron powder, copper powder, glass putty, nickel powder, cobalt powder etc.) is added certain density diamond, adopt the mode of mechanical batch mixing, diamond and metallic bond are mixed, carry out base and sintering in the mould of packing into.There is following problem in this technology: (1) mechanical batch mixing can't guarantee that diamond abrasive evenly distributes in metallic bond, cause some regional diamond abrasive excessive concentration, and some zones are low excessively, some no diamond abrasives in zone; (2) because of the diamond abrasive skewness, saw blade cutting usefulness descends, and the zone cutting resistance that diamond abrasive concentration is high is big, and smear metal is easily stopped up, and cutting efficiency is low.In the rare district of diamond, effectively sawing of diamond, because it is excessive to bear live load, impulsive force is big, diamond is easy to broken and comes off.There is not adamantine zone, the bond quick abrasion, the cutting resistance is big; (3) because of the cutting resistance is big, the cutting temperature height, bond and diamond are easily burnt.In a word, unordered the arrange problems such as often causing saw blade cutting efficiency low, cutting life-span weak point, cut quality difference of diamond abrasive in cutter head.After adopting granulating process,, still can not tackle the problem at its root though the distribution of diamond abrasive makes moderate progress.
In recent years, in the diamond tool industry, release the new technology of cutter head diamond grinding material sequential arraying, improved cutting-rate, prolonged life tools.Simultaneously, can save diamond, reduce diamond concentration, save cost.
The Chinese emery wheel Song Jianmin doctor of company in China Taiwan at first arranges diamond order and is applied to saw blade tip, and the patented technology of its proposition (U.S.Patent6039641) is to implement the ordered arrangement of diamond abrasive with template.The first step of this method: carcass powder is mixed, add the suitable organic binder bond and the mixture of solvent, make " dough ", do straticulation by the method for roll extrusion then.Second step, make the template that has through hole by the particle diameter of diamond abrasive material and arrangement mode, the aperture is greater than single diamond particle diameter, less than two diamond abrasive particle diameters and, guarantee that single diamond enters in the pattern hole, template thickness is the 1/3-2/3 of diamond average grain diameter.In the 3rd step, diamond is distributed in the template through hole.The 4th step, remove template, the diamond in the hole drops on the surface of thin layer, forms the ordered arrangement array, and unnecessary diamond is removed together in company with template.In the 5th step, diamond is pressed in the carcass thin layer with plain plate.This technology is the ordered arrangement diamond abrasive accurately, but the manually-operated of per pass operation wastes time and energy, and efficient is low.
The patented technology (EP1208345A) that Switzerland ETH lathe and doctor G.Burkhard of working research institute propose is to utilize the gluing process abrasive material of arranging, point glue equipment is made up of storage glue bottle, glue conveying box, little metering head, when applying a potential pulse, little metering head is discharged a glue and is dripped, but ordered arrangement glue point, then diamond is spread in glue and drips, form adamantine ordered arrangement.This explained hereafter efficient is low, and a glue drips the abrasive material number that easy adhesion does not wait, the low precision of arranging.
The ARIX automatic placement system of new Korea Spro of Korea S (Shinhan) diamond industrial group exploitation, can be in cutter head the uniform sequential diamond abrasive of arranging.Its technology is in compacting carcass thin stock, goes out the hole of ordered arrangement in thin stock, then diamond abrasive is filled in the hole.This automation technolo degree height, but owing to be to arrange piecewise, production efficiency is low, and in addition, the equipment price costliness is difficult for promoting.
" vacuum material distributing machine (patent No. 2008200616561656.4) " of the development of bold and unconstrained superhard material Co., Ltd is that the diamond abrasive in the cloth through-hole template is vibrated blanking by vibrator in China Chengdu, the advantage of this equipment is a cloth efficient height, but there is a determining deviation between cloth template and carcass thin stock, entanglement takes place in the diamond abrasive of ordered arrangement in vibration blanking process in the casement plate, the diamond that drops on carcass thin layer surface is arranged irregular, has influenced the cutting usefulness of cutter head and attractive in appearance.
In a word, because the grinding material sequential arraying technical research time is not long, obviously there is deficiency in existing diamond grinding material sequential arraying technology, mainly shows aspects such as production efficiency is low, the precision of arranging is low, apparatus expensive.
Summary of the invention
The purpose of this invention is to provide a kind of novel diamond grinding material sequential arraying system and method,, reduce equipment cost simultaneously, in order to popularization to realize efficient, accurate, the ordered arrangement of diamond abrasive.This system and method can be used for saw blade tip processing.
This system comprises diamond abrasive adsorbent equipment and the cutter head thin stock support platform of colding pressing.
Above-mentioned diamond abrasive adsorbent equipment comprises cylinder sleeve, be installed on piston moving up and down in the cylinder sleeve by piston rod, by seal ring seal, the cylinder sleeve lower surface is fixed with elastic plate by screw and pressing plate, is arranging stepped hole in the elastic plate in order between piston and cylinder sleeve; This stepped hole by up aperture and below macropore combine, and hole diameter is 0.2d-0.4d, big bore dia is 1.05d-1.2d, the macropore height is 0.55d 1.4d, wherein d is the diamond abrasive diameter; The above-mentioned cutter head thin stock support platform of colding pressing comprises workbench, places gripper shoe on the workbench by magnet piece.
Above-mentioned elastic plate is by having elasticity and toughness material is made.
The arrangement method of described diamond grinding material sequential arraying system may further comprise the steps: 1. the embryo places the upper surface of gripper shoe; 2. it is fixing to utilize the magnet piece of gripper shoe below that the embryo is adsorbed; 3. evenly rinse at embryo's upper surface and be coated with pressure sensitive adhesive; 4. the diamond abrasive adsorbent equipment is moved near the diamond abrasive feed zone, move on the piston, the stepped hole that air communication is crossed in the elastic plate is fixed in diamond abrasive absorption in the stepped hole; 5. the diamond abrasive adsorbent equipment is moved to cold pressing thin stock support platform top of cutter head, cylinder sleeve moves down, and the splicing on diamond abrasive and embryo surface is touched; 6. piston moves down, and discharges in the stepped hole of the air-flow of formation from elastic plate, and piston lower surface presses down elastic plate, makes diamond abrasive be tightly adhered to the surface of glue; 7. move on the cylinder sleeve, diamond abrasive breaks away from elastic plate, and diamond grinding material sequential arraying is on the embryo surface.
The relation of above-mentioned hole diameter, big bore dia, macropore height and diamond abrasive diameter is just in time to adsorb a diamond abrasive in the stepped hole in order to guarantee, the setting of hole diameter simultaneously is convenient to produce enough big suction.When macropore height during less than the diamond abrasive diameter, be adsorbed stepped hole into diamond abrasive some can be exposed at the macropore outside, after technology in exposed portions serve be easy to stick in the pressure sensitive adhesive.But since elastic plate have certain elasticity in addition cylinder sleeve move down the pressure of generation, when the macropore height also can guarantee greater than the diamond abrasive diameter time after technology in diamond abrasive stick on the pressure sensitive adhesive.
Compare with existing diamond abrasive alignment technology, the present invention has following characteristics:
1. high efficiency, system works once can be arranged more than 40, and per minute can be worked 2 times, arranges more than 80, is the highest diamond abrasive arranging system of present production efficiency.
2. the precision of arranging height, because that the arrange diamond abrasive arranged in order in the plate and carcass thin slice are that contact is sticked is fixing, diamond abrasive does not have the changing of the relative positions, and the very high precision of arranging is arranged.
3. automaticity height, the key operations that abrasive material is arranged is finished by equipment linkage entirely.
4. equipment cost is low, is easy to promote.
Description of drawings
Fig. 1 is the structural representation of diamond grinding material sequential arraying system;
Fig. 2 is the abrasive material plate structure schematic diagram of arranging.
Among the figure: 1, piston rod, 2, air inlet/outlet, 3, cylinder sleeve, 4, piston, 5, sealing ring, 6, grinding material sequential arraying elastic plate, 7, screw, 8, pressing plate, 9, diamond abrasive, 10, glue, 11, carcass thin stock, 12, gripper shoe, 13, magnet piece, 14, workbench.
The specific embodiment
A kind of system of grinding material sequential arraying diamond saw blade, its operating procedure is:
1. the embryo places the upper surface of gripper shoe;
2. it is fixing to utilize the magnet piece of gripper shoe below that the embryo is adsorbed;
3. evenly rinse at embryo's upper surface and be coated with pressure sensitive adhesive;
4. the diamond abrasive adsorbent equipment is moved near the diamond abrasive feed zone, move on the piston, the stepped hole that air communication is crossed in the elastic plate is fixed in diamond abrasive absorption in the stepped hole;
5. the diamond abrasive adsorbent equipment is moved to cold pressing thin stock support platform top of cutter head, cylinder sleeve moves down, and the splicing on diamond abrasive and embryo surface is touched;
6. piston moves down, and discharges in the stepped hole of the air-flow of formation from elastic plate, and piston lower surface presses down elastic plate, makes diamond abrasive be tightly adhered to the surface of glue;
7. move on the cylinder sleeve, diamond abrasive breaks away from elastic plate, and diamond grinding material sequential arraying is on the embryo surface.
Claims (3)
1. diamond grinding material sequential arraying system is characterized in that:
This system comprises diamond abrasive adsorbent equipment and the cutter head thin stock support platform of colding pressing;
Above-mentioned diamond abrasive adsorbent equipment comprises cylinder sleeve (3), be installed on the interior piston moving up and down (4) of cylinder sleeve by piston rod (1), seal by sealing ring (5) between piston and cylinder sleeve, the cylinder sleeve lower surface is fixed with elastic plate (6) by screw (7) and pressing plate (8), is arranging stepped hole in the elastic plate in order; This stepped hole by up aperture and below macropore combine, and hole diameter is 0.2d-0.4d, big bore dia is 1.05d-1.2d, the macropore height is 0.55d-1.4d, wherein d is the diamond abrasive diameter;
The above-mentioned cutter head thin stock support platform of colding pressing comprises workbench (14), places gripper shoe (12) on the workbench (14) by magnet piece (13).
2. diamond grinding material sequential arraying system according to claim 1 is characterized in that above-mentioned elastic plate (6) is by having elasticity and toughness material is made.
3. arrangement method that utilizes the described diamond grinding material sequential arraying system of claim 1 is characterized in that may further comprise the steps:
1. the embryo places the upper surface of gripper shoe;
2. it is fixing to utilize the magnet piece of gripper shoe below that the embryo is adsorbed;
3. evenly rinse at embryo's upper surface and be coated with pressure sensitive adhesive;
4. the diamond abrasive adsorbent equipment is moved near the diamond abrasive feed zone, move on the piston, the stepped hole that air communication is crossed in the elastic plate is fixed in diamond abrasive absorption in the stepped hole;
5. the diamond abrasive adsorbent equipment is moved to cold pressing thin stock support platform top of cutter head, cylinder sleeve moves down, and the splicing on diamond abrasive and embryo surface is touched;
6. piston moves down, and discharges in the stepped hole of the air-flow of formation from elastic plate, and piston lower surface presses down elastic plate, makes diamond abrasive be tightly adhered to the surface of glue;
7. move on the cylinder sleeve, diamond abrasive breaks away from elastic plate, and diamond grinding material sequential arraying is on the embryo surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102630917A CN101745877B (en) | 2009-12-16 | 2009-12-16 | Diamond grinding material sequential arraying system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102630917A CN101745877B (en) | 2009-12-16 | 2009-12-16 | Diamond grinding material sequential arraying system and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101745877A CN101745877A (en) | 2010-06-23 |
| CN101745877B true CN101745877B (en) | 2011-08-24 |
Family
ID=42473827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009102630917A Expired - Fee Related CN101745877B (en) | 2009-12-16 | 2009-12-16 | Diamond grinding material sequential arraying system and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101745877B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023182779A1 (en) * | 2022-03-21 | 2023-09-28 | 이화다이아몬드공업 주식회사 | Cmp conditioning disk, and method and device for manufacturing cmp conditioning disk |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102672188B (en) * | 2012-06-05 | 2015-01-21 | 安泰科技股份有限公司 | Method for positioning and distributing diamonds in tool bit and distributing device |
| CN102785054A (en) * | 2012-08-18 | 2012-11-21 | 吉林大学 | Device and method for cold press molding of diamond positioning arranging cutter |
| CN103406841B (en) * | 2013-07-29 | 2016-03-02 | 南京航空航天大学 | Realize the device and method of abrasive material and the collaborative ordered arrangement of hollow ball three-dimensional |
| CN103600314B (en) * | 2013-11-26 | 2016-01-13 | 北京安泰钢研超硬材料制品有限责任公司 | At the device and method of superhard particles surface-coated powder |
| CN103692562B (en) * | 2013-12-24 | 2016-01-20 | 安泰科技股份有限公司 | A kind of manufacture craft of diamond ultra-thin cutting blade |
| CN104002256B (en) * | 2014-06-09 | 2016-06-01 | 郑州磨料磨具磨削研究所有限公司 | Superhard material mill abrasive material block arrangement adhering device and technique |
| CN104526592B (en) * | 2014-12-31 | 2017-06-20 | 广东工业大学 | The apparatus and method of abrasive material multilayer order arrangement |
| CN104552044B (en) * | 2014-12-31 | 2017-03-29 | 广东工业大学 | The ordered arrangement apparatus and method of abnormal curved surface revolving body grinding tool single layer of abrasive particles |
| CN105196196B (en) * | 2015-09-22 | 2017-12-22 | 郑州磨料磨具磨削研究所有限公司 | A kind of plated diamond grinding wheel of grinding material sequential arrangement |
| CN105856088B (en) * | 2016-05-27 | 2019-01-25 | 华侨大学 | A kind of preparation facilities and its method of abrasive grain three-dimensional controllable arrangement grinding tool |
| CN106064354B (en) * | 2016-05-30 | 2018-12-21 | 江苏锋泰工具有限公司 | Diamond abrasive arranging system |
| CN114393523A (en) * | 2016-12-22 | 2022-04-26 | 3M创新有限公司 | Apparatus for forming abrasive particle layer and method of forming abrasive article |
| CN107127398B (en) * | 2017-07-05 | 2018-10-30 | 中南大学 | Diamond helical positioning is distributed the manufacture craft of full working lining ultrathin saw bit |
| CN107262822B (en) * | 2017-07-05 | 2018-10-30 | 中南大学 | The equidistant shape positioning of diamond is distributed the manufacture craft of full working lining ultrathin saw bit |
| CN107262821B (en) * | 2017-07-05 | 2018-10-23 | 中南大学 | The radial positioning of diamond is distributed the manufacture craft of full working lining ultrathin saw bit |
| CN107460480B (en) * | 2017-08-24 | 2022-08-23 | 广东工业大学 | Preparation device and method of diamond-containing coating |
| CN108724025B (en) * | 2018-05-17 | 2020-01-31 | 郑州磨料磨具磨削研究所有限公司 | ordered arrangement metal bond diamond grinding wheel and preparation method thereof |
| CN109483421B (en) * | 2018-12-10 | 2019-08-27 | 郑州磨料磨具磨削研究所有限公司 | A kind of super hard abrasive realizes the device and method of ordered arrangement in electroplating abrasion wheel |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6193770B1 (en) * | 1997-04-04 | 2001-02-27 | Chien-Min Sung | Brazed diamond tools by infiltration |
| CN1565806A (en) * | 2003-07-01 | 2005-01-19 | 崇越科技股份有限公司 | Manufacturing method of abrasive tool with regulate arrayed abrasive material |
| CN1872496A (en) * | 2005-05-31 | 2006-12-06 | 厦门佳品金刚石工业有限公司 | Grinding tool with single layer of diamond, and manufacturing method |
| CN1907649A (en) * | 2006-08-25 | 2007-02-07 | 侯志刚 | Manufacturing method of grinding and cutting tool for controllable component structure with three-dimensional arrangement abrasive particle |
| CN100563932C (en) * | 1997-04-04 | 2009-12-02 | 宋健民 | Milling tool and manufacture method thereof with patterned grit distribution |
-
2009
- 2009-12-16 CN CN2009102630917A patent/CN101745877B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6193770B1 (en) * | 1997-04-04 | 2001-02-27 | Chien-Min Sung | Brazed diamond tools by infiltration |
| CN100563932C (en) * | 1997-04-04 | 2009-12-02 | 宋健民 | Milling tool and manufacture method thereof with patterned grit distribution |
| CN1565806A (en) * | 2003-07-01 | 2005-01-19 | 崇越科技股份有限公司 | Manufacturing method of abrasive tool with regulate arrayed abrasive material |
| CN1872496A (en) * | 2005-05-31 | 2006-12-06 | 厦门佳品金刚石工业有限公司 | Grinding tool with single layer of diamond, and manufacturing method |
| CN1907649A (en) * | 2006-08-25 | 2007-02-07 | 侯志刚 | Manufacturing method of grinding and cutting tool for controllable component structure with three-dimensional arrangement abrasive particle |
Non-Patent Citations (1)
| Title |
|---|
| JP特开2001-315060A 2001.11.13 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023182779A1 (en) * | 2022-03-21 | 2023-09-28 | 이화다이아몬드공업 주식회사 | Cmp conditioning disk, and method and device for manufacturing cmp conditioning disk |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101745877A (en) | 2010-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101745877B (en) | Diamond grinding material sequential arraying system and method | |
| CN101797725A (en) | Diamond grinding material sequential distributing system and process | |
| CN101786263B (en) | Novel orderly arrangement system for diamond abrasives and arrangement process | |
| CN101376234B (en) | Ordered arrangement method for abrading agent granule on abrading tool and abrading tool | |
| CN201283606Y (en) | Superfine diamond cutting wire | |
| CN102814746B (en) | Grinding material optimizing and distributing sintered diamond tool and manufacture method thereof | |
| CN105856088A (en) | Preparation device and method of grinding tool for three-dimensional controllable distribution of abrasive particles | |
| CN103406841B (en) | Realize the device and method of abrasive material and the collaborative ordered arrangement of hollow ball three-dimensional | |
| CN104526592B (en) | The apparatus and method of abrasive material multilayer order arrangement | |
| CN101870092B (en) | Millstone for processing crystal and manufacturing method thereof | |
| CN104057404A (en) | Three-dimensional cooperative distribution method for various grinding materials for preparing superhard tool | |
| CN101066614A (en) | Diamond jigsaw | |
| CN108687681B (en) | Diamond grinding disc and preparation process thereof | |
| CN202147227U (en) | Grinding wheel special for grinding soft metal | |
| CN202861538U (en) | Saw grinding circular saw blade | |
| CN201632941U (en) | Diamond grinding material orderly sand embedding device | |
| CN201140364Y (en) | Nodal diamond grinding disc | |
| CN106863394B (en) | The separator and its separation method of LED lamp bead | |
| CN2678862Y (en) | Diamond fret-saw for cutting-off hard and fragile material | |
| CN204450260U (en) | The device of abrasive material multilayer order arrangement | |
| CN106064354B (en) | Diamond abrasive arranging system | |
| CN209207277U (en) | Flexible polishing device | |
| CN205765684U (en) | A kind of preparation facilities of abrasive particle three-dimensional controllable arrangement grinding tool | |
| CN103406840B (en) | A kind of preparation method of metallographic magnetic abrasive disk | |
| CN113400206A (en) | Grinding wheel for polishing silicon carbide substrate and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110824 Termination date: 20131216 |