CN201632941U - Diamond grinding material orderly sand embedding device - Google Patents

Diamond grinding material orderly sand embedding device Download PDF

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Publication number
CN201632941U
CN201632941U CN2010200495745U CN201020049574U CN201632941U CN 201632941 U CN201632941 U CN 201632941U CN 2010200495745 U CN2010200495745 U CN 2010200495745U CN 201020049574 U CN201020049574 U CN 201020049574U CN 201632941 U CN201632941 U CN 201632941U
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CN
China
Prior art keywords
grinding material
diamond
diamond grinding
orderly
embedding device
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Expired - Fee Related
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CN2010200495745U
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Chinese (zh)
Inventor
胡建根
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Hangzhou Boda Diamond Co Ltd
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Hangzhou Boda Diamond Co Ltd
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Application filed by Hangzhou Boda Diamond Co Ltd filed Critical Hangzhou Boda Diamond Co Ltd
Priority to CN2010200495745U priority Critical patent/CN201632941U/en
Application granted granted Critical
Publication of CN201632941U publication Critical patent/CN201632941U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model relates to the manufacturing field of diamond grinding material milling tools, in particularly relates to a diamond grinding material orderly sand embedding device which is used for producing sawing bits or thin-wall drilling heads; the purposes of the utility model are realized by adopting the following proposal: the diamond grinding material orderly sand embedding device comprises a vacuumizing pipe (1) and a vacuum chamber cylinder sleeve (2), a grinding material distribution board (4) is fixed at the lower end of the vacuum chamber cylinder sleeve (2), a plurality of holes (10) which can adsorb and fix the diamond grinding material (7) are orderly arranged; the diamond grinding material orderly sand embedding device has the characteristics that: 1. the efficiency is high, more than 40 pieces can be distributed one time, two times are carried out in each minute, more than 80 pieces can be distributed, therefore, the production efficiency of the diamond grinding material orderly sand embedding device is the highest at present; 2. the automation degree is high, the key actions of the grinding material distribution are carried out by linkage of equipment completely; 3. the device has simple structure and low cost and is easy to popularize.

Description

Diamond grinding material sequential is planted the sand device
Technical field
The utility model relates to the diamond abrasive grinding tool and makes the field, refers in particular to a kind of diamond grinding material sequential that is used to produce saw blade tip or thin-walled drill bit and plants the sand device.
Background technology
Nonmetal fragile materials such as granite, marble, concrete, pitch are to adopt the diamond saw blade cutting, the exemplary of diamond core drill bit punching.Diamond saw blade has the cutting lay of diamond abrasive on the saw bit matrix periphery.The sawing cutter head is usually by diamond particles with control adamantine metal matrix and form.At present, the production technology that diamond saw blade generally adopts: metallic bond (as iron powder, copper powder, glass putty, nickel powder, cobalt powder etc.) is added certain density diamond, adopt the mode of mechanical batch mixing, diamond and metallic bond are mixed, carry out base and sintering in the mould of packing into.There is following problem in this technology: (1) mechanical batch mixing can't guarantee that diamond abrasive evenly distributes in metallic bond, cause some regional diamond abrasive excessive concentration, and some zones are low excessively, some no diamond abrasives in zone; (2) because of the diamond abrasive skewness, saw blade cutting usefulness descends, and the zone cutting resistance that diamond abrasive concentration is high is big, and smear metal is easily stopped up, and cutting efficiency is low.In the rare district of diamond, effectively sawing of diamond, because it is excessive to bear live load, impulsive force is big, diamond is easy to broken and comes off.There is not adamantine zone, the bond quick abrasion, the cutting resistance is big; (3) because of the cutting resistance is big, the cutting temperature height, bond and diamond are easily burnt.In a word, unordered the arrange problems such as often causing saw blade cutting efficiency low, cutting life-span weak point, cut quality difference of diamond abrasive in cutter head.After adopting granulating process, (diamond core drill bit drill produced technology roughly the same) though the distribution of diamond abrasive makes moderate progress, still can not tackle the problem at its root.
In recent years, in the diamond tool industry, release the new technology of cutter head diamond grinding material sequential arraying, improved cutting-rate, prolonged life tools.Simultaneously, can save diamond, reduce diamond concentration, save cost.
The ARIX of new Korea Spro of Korea S (Shinhan) diamond industrial group exploitation plants the sand device automatically, can be in cutter head the uniform sequential diamond abrasive of arranging.Its technology is in compacting carcass thin stock, goes out the hole of ordered arrangement in thin stock, then diamond abrasive is filled in the hole.This automation technolo degree height, but owing to be to arrange piecewise, production efficiency is low, and in addition, the equipment price costliness is difficult for promoting.
The Chinese emery wheel Song Jianmin doctor of company in China Taiwan at first arranges diamond order and is applied to saw blade tip, and the patented technology of its proposition (U.S.Patent6039641) is to implement the ordered arrangement of diamond abrasive with template.The first step of this method: carcass powder is mixed, add the suitable organic binder bond and the mixture of solvent, make " dough ", do straticulation by the method for roll extrusion then.Second step, make the template that has through hole by the particle diameter of diamond abrasive material and arrangement mode, the aperture is greater than single diamond particle diameter, less than two diamond abrasive particle diameters and, guarantee that single diamond enters in the pattern hole, template thickness is the 1/3-2/3 of diamond average grain diameter.In the 3rd step, diamond is distributed in the template through hole.The 4th step, remove template, the diamond in the hole drops on the surface of thin layer, forms the ordered arrangement array, and unnecessary diamond is removed together in company with template.In the 5th step, diamond is pressed in the carcass thin layer with plain plate.This technology is the ordered arrangement diamond abrasive accurately, but the manually-operated of per pass operation wastes time and energy, and efficient is low.
The patented technology (EP1208345A) that Switzerland ETH lathe and doctor G.Burkhard of working research institute propose is to utilize the gluing process abrasive material of arranging, point glue equipment is made up of storage glue bottle, glue conveying box, little metering head, when applying a potential pulse, little metering head is discharged a glue and is dripped, but ordered arrangement glue point, then diamond is spread in glue and drips, form adamantine ordered arrangement.This explained hereafter efficient is low, and a glue drips the abrasive material number that easy adhesion does not wait, the low precision of arranging.
In a word, because the grinding material sequential arraying technical research time is not long, obviously there is deficiency in existing diamond grinding material sequential arraying technology, mainly shows aspects such as production efficiency is low, apparatus expensive.
The utility model content
The utility model provides a kind of efficient, low-cost diamond grinding material sequential of diamond grinding material sequential arraying in saw blade tip and the thin-walled drill bit of realizing to plant the sand device.
The purpose of this utility model is realized by following technical scheme: a kind of diamond grinding material sequential is planted the sand device, comprise vacuum exhaust pipe (1) and vacuum chamber cylinder sleeve (2), vacuum chamber cylinder sleeve (2) lower end is fixed with the abrasive material plate (4) of arranging, the hole (10) that described abrasive material is arranged and arranged some adsorbable fixed diamond abrasive materials (7) in order in the plate (4).
As a kind of improvement of the present utility model, described abrasive material plate (4) upper fixed of arranging has vibrator (3).
As a kind of improvement of the present utility model, the abrasive material diameter that plate (4) goes up hole (10) of arranging is 1/3 of diamond abrasive (a 7) diameter.
As a kind of improvement of the present utility model, described vacuum chamber cylinder sleeve (2) lower end and abrasive material are arranged, and plate (4) passes through screw (5) and pressing plate (6) is fixing.
Compare with existing diamond abrasive alignment technology, the utlity model has following characteristics:
1. high efficiency is worked and once can be arranged more than 40, and per minute can be worked 2 times, arranges more than 80, is that the highest diamond abrasive of present production efficiency is planted the sand device.
2. automaticity height, the key operations that abrasive material is arranged is finished by equipment linkage entirely.
3. this apparatus structure is simple, and cost is low, is easy to promote.
Description of drawings
Fig. 1 plants the structural representation of sand device for diamond grinding material sequential;
Fig. 2 plants the structural representation of sand device work for diamond grinding material sequential;
Among the figure: 1, vacuum exhaust pipe, 2, the vacuum chamber cylinder sleeve, 3, vibrator, 4, the orifice plate of arranging, 5, screw, 6, pressing plate, 7, diamond abrasive, 8, the thin stock of colding pressing, 9, magnetic worktable, 10, the hole.
The specific embodiment
Shown in Fig. 1-2, a kind of novel diamond grinding material sequential is planted the sand device, this system comprises vacuum exhaust pipe (1), vacuum chamber cylinder sleeve (2), many holes (10) are being arranged, adsorbable fixed diamond abrasive material (7) in order by screw (5), pressing plate (6) fixed-abrasive ordered arrangement orifice plate (4) in the cylinder sleeve lower surface in the plate of arranging, the plate upper fixed of arranging has vibrator (3) to be used to vibrate blanking, and a plurality of cutter heads that magnetic worktable (9) can scribble surface glue thin stock (8) absorption of colding pressing is fixing.Wherein, the abrasive material diameter that plate (4) goes up hole (10) of arranging is 1/3 of diamond abrasive (a 7) diameter.

Claims (4)

1. a diamond grinding material sequential is planted the sand device, comprise vacuum exhaust pipe (1) and vacuum chamber cylinder sleeve (2), vacuum chamber cylinder sleeve (2) lower end is fixed with the abrasive material plate (4) of arranging, and it is characterized in that: the hole (10) that described abrasive material is arranged and arranged some adsorbable fixed diamond abrasive materials (7) in order in the plate (4).
2. diamond grinding material sequential according to claim 1 is planted the sand device, it is characterized in that: described abrasive material plate (4) upper fixed of arranging has vibrator (3).
3. diamond grinding material sequential according to claim 1 and 2 is planted the sand device, it is characterized in that: the abrasive material diameter that plate (4) goes up hole (10) of arranging is 1/3 of diamond abrasive (a 7) diameter.
4. diamond grinding material sequential according to claim 1 is planted the sand device, it is characterized in that: described vacuum chamber cylinder sleeve (2) lower end and abrasive material are arranged, and plate (4) passes through screw (5) and pressing plate (6) is fixing.
CN2010200495745U 2010-01-19 2010-01-19 Diamond grinding material orderly sand embedding device Expired - Fee Related CN201632941U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010200495745U CN201632941U (en) 2010-01-19 2010-01-19 Diamond grinding material orderly sand embedding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010200495745U CN201632941U (en) 2010-01-19 2010-01-19 Diamond grinding material orderly sand embedding device

Publications (1)

Publication Number Publication Date
CN201632941U true CN201632941U (en) 2010-11-17

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010200495745U Expired - Fee Related CN201632941U (en) 2010-01-19 2010-01-19 Diamond grinding material orderly sand embedding device

Country Status (1)

Country Link
CN (1) CN201632941U (en)

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C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101117

Termination date: 20150119

EXPY Termination of patent right or utility model