CN101745877A - Diamond grinding material sequential arraying system and method - Google Patents
Diamond grinding material sequential arraying system and method Download PDFInfo
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- CN101745877A CN101745877A CN200910263091A CN200910263091A CN101745877A CN 101745877 A CN101745877 A CN 101745877A CN 200910263091 A CN200910263091 A CN 200910263091A CN 200910263091 A CN200910263091 A CN 200910263091A CN 101745877 A CN101745877 A CN 101745877A
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- Prior art keywords
- diamond abrasive
- diamond
- cylinder sleeve
- elastic plate
- piston
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 96
- 239000010432 diamond Substances 0.000 title claims abstract description 96
- 239000000463 material Substances 0.000 title claims abstract description 25
- 238000000227 grinding Methods 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000003825 pressing Methods 0.000 claims abstract description 11
- 238000007789 sealing Methods 0.000 claims abstract description 3
- 210000001161 mammalian embryo Anatomy 0.000 claims description 15
- 239000003292 glue Substances 0.000 claims description 11
- 239000003463 adsorbent Substances 0.000 claims description 10
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000005516 engineering process Methods 0.000 description 12
- 238000005520 cutting process Methods 0.000 description 11
- 239000003082 abrasive agent Substances 0.000 description 6
- 239000002245 particle Substances 0.000 description 4
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 3
- 229910001573 adamantine Inorganic materials 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 101001129803 Homo sapiens Paired mesoderm homeobox protein 2A Proteins 0.000 description 1
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 102100031686 Paired mesoderm homeobox protein 2A Human genes 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 239000004567 concrete Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Abstract
The invention relates to a diamond grinding material sequential arraying system and a method, belonging to the field of grinding material and tool manufacturing. The system comprises a cylinder sleeve (3) and a piston (4). The piston (4) which can move up and down is arranged in the cylinder sleeve by a piston rod (1), the cylinder sleeve is sealed with the piston by a sealing ring (5), an elastic plate (6) is fixed at the lower end face of the cylinder sleeve by a screw (7) and a pressing plate (8), and stepped holes are sequentially arrayed in the elastic plate. The system further comprises a worktable (14) and a supporting plate (12) arranged on the worktable (14) by a magnet block (13). With low cost and easy popularization, the system and the method can effectively, accurately and sequentially array and distribute diamond grinding materials.
Description
Technical field
The present invention relates to diamond grinding material sequential arraying system and method, belong to grinding materials and grinding tool and make the field.
Background technology
Materials such as granite, marble, concrete, pitch are the exemplary that adopts the diamond saw blade cutting.Diamond saw blade has the cutting lay of diamond abrasive on the saw bit matrix periphery.The sawing cutter head is usually by diamond particles with control adamantine metal matrix and form.At present, the production technology that diamond saw blade generally adopts: metallic bond (as iron powder, copper powder, glass putty, nickel powder, cobalt powder etc.) is added certain density diamond, adopt the mode of mechanical batch mixing, diamond and metallic bond are mixed, carry out base and sintering in the mould of packing into.There is following problem in this technology: (1) mechanical batch mixing can't guarantee that diamond abrasive evenly distributes in metallic bond, cause some regional diamond abrasive excessive concentration, and some zones are low excessively, some no diamond abrasives in zone; (2) because of the diamond abrasive skewness, saw blade cutting usefulness descends, and the zone cutting resistance that diamond abrasive concentration is high is big, and smear metal is easily stopped up, and cutting efficiency is low.In the rare district of diamond, effectively sawing of diamond, because it is excessive to bear live load, impulsive force is big, diamond is easy to broken and comes off.There is not adamantine zone, the bond quick abrasion, the cutting resistance is big; (3) because of the cutting resistance is big, the cutting temperature height, bond and diamond are easily burnt.In a word, unordered the arrange problems such as often causing saw blade cutting efficiency low, cutting life-span weak point, cut quality difference of diamond abrasive in cutter head.After adopting granulating process,, still can not tackle the problem at its root though the distribution of diamond abrasive makes moderate progress.
In recent years, in the diamond tool industry, release the new technology of cutter head diamond grinding material sequential arraying, improved cutting-rate, prolonged life tools.Simultaneously, can save diamond, reduce diamond concentration, save cost.
The Chinese emery wheel Song Jianmin doctor of company in China Taiwan at first arranges diamond order and is applied to saw blade tip, and the patented technology of its proposition (U.S.Patent6039641) is to implement the ordered arrangement of diamond abrasive with template.The first step of this method: carcass powder is mixed, add the suitable organic binder bond and the mixture of solvent, make " dough ", do straticulation by the method for roll extrusion then.Second step, make the template that has through hole by the particle diameter of diamond abrasive material and arrangement mode, the aperture is greater than single diamond particle diameter, less than two diamond abrasive particle diameters and, guarantee that single diamond enters in the pattern hole, template thickness is the 1/3-2/3 of diamond average grain diameter.In the 3rd step, diamond is distributed in the template through hole.The 4th step, remove template, the diamond in the hole drops on the surface of thin layer, forms the ordered arrangement array, and unnecessary diamond is removed together in company with template.In the 5th step, diamond is pressed in the carcass thin layer with plain plate.This technology is the ordered arrangement diamond abrasive accurately, but the manually-operated of per pass operation wastes time and energy, and efficient is low.
The patented technology (EP1208345A) that Switzerland ETH lathe and doctor G.Burkhard of working research institute propose is to utilize the gluing process abrasive material of arranging, point glue equipment is made up of storage glue bottle, glue conveying box, little metering head, when applying a potential pulse, little metering head is discharged a glue and is dripped, but ordered arrangement glue point, then diamond is spread in glue and drips, form adamantine ordered arrangement.This explained hereafter efficient is low, and a glue drips the abrasive material number that easy adhesion does not wait, the low precision of arranging.
The ARIX automatic placement system of new Korea Spro of Korea S (Shinhan) diamond industrial group exploitation, can be in cutter head the uniform sequential diamond abrasive of arranging.Its technology is in compacting carcass thin stock, goes out the hole of ordered arrangement in thin stock, then diamond abrasive is filled in the hole.This automation technolo degree height, but owing to be to arrange piecewise, production efficiency is low, and in addition, the equipment price costliness is difficult for promoting.
" vacuum material distributing machine (patent No. 2008200616561656.4) " of the development of bold and unconstrained superhard material Co., Ltd is that the diamond abrasive in the cloth through-hole template is vibrated blanking by vibrator in China Chengdu, the advantage of this equipment is a cloth efficient height, but there is a determining deviation between cloth template and carcass thin stock, entanglement takes place in the diamond abrasive of ordered arrangement in vibration blanking process in the casement plate, the diamond that drops on carcass thin layer surface is arranged irregular, has influenced the cutting usefulness of cutter head and attractive in appearance.
In a word, because the grinding material sequential arraying technical research time is not long, obviously there is deficiency in existing diamond grinding material sequential arraying technology, mainly shows aspects such as production efficiency is low, the precision of arranging is low, apparatus expensive.
Summary of the invention
The purpose of this invention is to provide a kind of novel diamond grinding material sequential arraying system and method,, reduce equipment cost simultaneously, in order to popularization to realize efficient, accurate, the ordered arrangement of diamond abrasive.This system and method can be used for saw blade tip processing.
This system comprises diamond abrasive adsorbent equipment and the cutter head thin stock support platform of colding pressing.
Above-mentioned diamond abrasive adsorbent equipment comprises cylinder sleeve, be installed on piston moving up and down in the cylinder sleeve by piston rod, by seal ring seal, the cylinder sleeve lower surface is fixed with elastic plate by screw and pressing plate, is arranging stepped hole in the elastic plate in order between piston and cylinder sleeve; This stepped hole by up aperture and below macropore combine, and hole diameter is 0.2d-0.4d, big bore dia is 1.05d-1.2d, the macropore height is 0.55--1.4d, wherein d is the diamond abrasive diameter; The above-mentioned cutter head thin stock support platform of colding pressing comprises workbench, places gripper shoe on the workbench by magnet piece.
Above-mentioned elastic plate is by having elasticity and toughness material is made.
The arrangement method of described diamond grinding material sequential arraying system may further comprise the steps: 1. the embryo places the upper surface of gripper shoe; 2. it is fixing to utilize the magnet piece of gripper shoe below that the embryo is adsorbed; 3. evenly rinse at embryo's upper surface and be coated with pressure sensitive adhesive; 4. the diamond abrasive adsorbent equipment is moved near the diamond abrasive feed zone, move on the piston, the stepped hole that air communication is crossed in the elastic plate is fixed in diamond abrasive absorption in the stepped hole; 5. the diamond abrasive adsorbent equipment is moved to cold pressing thin stock support platform top of cutter head, cylinder sleeve moves down, and the splicing on diamond abrasive and embryo surface is touched; 6. piston moves down, and discharges in the stepped hole of the air-flow of formation from elastic plate, and piston lower surface presses down elastic plate, makes diamond abrasive be tightly adhered to the surface of glue; 7. move on the cylinder sleeve, diamond abrasive breaks away from elastic plate, and diamond grinding material sequential arraying is on the embryo surface.
The relation of above-mentioned hole diameter, big bore dia, macropore height and diamond abrasive diameter is just in time to adsorb a diamond abrasive in the stepped hole in order to guarantee, the setting of hole diameter simultaneously is convenient to produce enough big suction.When macropore height during less than the diamond abrasive diameter, be adsorbed stepped hole into diamond abrasive some can be exposed at the macropore outside, after technology in exposed portions serve be easy to stick in the pressure sensitive adhesive.But since elastic plate have certain elasticity in addition cylinder sleeve move down the pressure of generation, when the macropore height also can guarantee greater than the diamond abrasive diameter time after technology in diamond abrasive stick on the pressure sensitive adhesive.
Compare with existing diamond abrasive alignment technology, the present invention has following characteristics:
1. high efficiency, system works once can be arranged more than 40, and per minute can be worked 2 times, arranges more than 80, is the highest diamond abrasive arranging system of present production efficiency.
2. the precision of arranging height, because that the arrange diamond abrasive arranged in order in the plate and carcass thin slice are that contact is sticked is fixing, diamond abrasive does not have the changing of the relative positions, and the very high precision of arranging is arranged.
3. automaticity height, the key operations gold that abrasive material is arranged is finished by equipment linkage.
4. equipment cost is low, is easy to promote.
Description of drawings
Fig. 1 is the structural representation of diamond grinding material sequential arraying system;
Fig. 2 is the abrasive material plate structure schematic diagram of arranging.
Among the figure: 1, piston rod, 2, air inlet/outlet, 3, cylinder sleeve, 4, piston, 5, sealing ring, 6, grinding material sequential arraying elastic plate, 7, screw, 8, pressing plate, 9, diamond abrasive, 10, glue, 11, carcass thin stock, 12, gripper shoe, 13, magnet piece, 14, workbench.
The specific embodiment
A kind of system of grinding material sequential arraying diamond saw blade, its operating procedure is:
1. the embryo places the upper surface of gripper shoe;
2. it is fixing to utilize the magnet piece of gripper shoe below that the embryo is adsorbed;
3. evenly rinse at embryo's upper surface and be coated with pressure sensitive adhesive;
4. the diamond abrasive adsorbent equipment is moved near the diamond abrasive feed zone, move on the piston, the stepped hole that air communication is crossed in the elastic plate is fixed in diamond abrasive absorption in the stepped hole;
5. the diamond abrasive adsorbent equipment is moved to cold pressing thin stock support platform top of cutter head, cylinder sleeve moves down, and the splicing on diamond abrasive and embryo surface is touched;
6. piston moves down, and discharges in the stepped hole of the air-flow of formation from elastic plate, and piston lower surface presses down elastic plate, makes diamond abrasive be tightly adhered to the surface of glue;
7. move on the cylinder sleeve, diamond abrasive breaks away from elastic plate, and diamond grinding material sequential arraying is on the embryo surface.
Claims (3)
1. diamond grinding material sequential arraying system is characterized in that:
This system comprises diamond abrasive adsorbent equipment and the cutter head thin stock support platform of colding pressing;
Above-mentioned diamond abrasive adsorbent equipment comprises cylinder sleeve (3), be installed on the interior piston moving up and down (4) of cylinder sleeve by piston rod (1), seal by sealing ring (5) between piston and cylinder sleeve, the cylinder sleeve lower surface is fixed with elastic plate (6) by screw (7) and pressing plate (8), is arranging stepped hole in the elastic plate in order; This stepped hole by up aperture and below macropore combine, and hole diameter is 0.2d-0.4d, big bore dia is 1.05d-1.2d, the macropore height is 0.55-1.4d, wherein d is the diamond abrasive diameter;
The above-mentioned cutter head thin stock support platform of colding pressing comprises workbench (14), places gripper shoe (12) on the workbench (14) by magnet piece (13).
2. diamond grinding material sequential arraying system according to claim 1 is characterized in that above-mentioned elastic plate (6) is by having elasticity and toughness material is made.
3. arrangement method that utilizes the described diamond grinding material sequential arraying system of claim 1 is characterized in that may further comprise the steps:
1. the embryo places the upper surface of gripper shoe;
2. it is fixing to utilize the magnet piece of gripper shoe below that the embryo is adsorbed;
3. evenly rinse at embryo's upper surface and be coated with pressure sensitive adhesive;
4. the diamond abrasive adsorbent equipment is moved near the diamond abrasive feed zone, move on the piston, the stepped hole that air communication is crossed in the elastic plate is fixed in diamond abrasive absorption in the stepped hole;
5. the diamond abrasive adsorbent equipment is moved to cold pressing thin stock support platform top of cutter head, cylinder sleeve moves down, and the splicing on diamond abrasive and embryo surface is touched;
6. piston moves down, and discharges in the stepped hole of the air-flow of formation from elastic plate, and piston lower surface presses down elastic plate, makes diamond abrasive be tightly adhered to the surface of glue;
7. move on the cylinder sleeve, diamond abrasive breaks away from elastic plate, and diamond grinding material sequential arraying is on the embryo surface.
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CN2009102630917A CN101745877B (en) | 2009-12-16 | 2009-12-16 | Diamond grinding material sequential arraying system and method |
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CN101745877B CN101745877B (en) | 2011-08-24 |
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