CN1872496A - Grinding tool with single layer of diamond, and manufacturing method - Google Patents
Grinding tool with single layer of diamond, and manufacturing method Download PDFInfo
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- CN1872496A CN1872496A CN 200510075742 CN200510075742A CN1872496A CN 1872496 A CN1872496 A CN 1872496A CN 200510075742 CN200510075742 CN 200510075742 CN 200510075742 A CN200510075742 A CN 200510075742A CN 1872496 A CN1872496 A CN 1872496A
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- diamond abrasive
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Abstract
A single-layer diamond grinding tool features that the abrasive particles are uniformly distributed on the surface of basic body in such manner that their exposed parts have a same height. Its preparing method features use of an air sucking mesh plate to uniformly arrange the abrasive particles on the surface of basic body.
Description
Technical field
The present invention relates to a kind of grinding tool and manufacture method thereof, specifically be meant a kind of grinding tool with single layer of diamond.
Background technology
Grinding tool with single layer of diamond is mainly used in occasions such as the grinding of finishing, hard brittle material of soft porous material and material surface roughening, the grinding tool with single layer of diamond of present domestic use is to adopt the method for electroplating technology or hard solder to make mostly, abrasive grain just is embedded in the metal by embedding, do not have firm chemical bond on the faying face between metal and the abrasive material, thereby hold is little.Because abrasive grain is the non-matrix surface that is uniformly distributed in, so the height that abrasive grain protrudes in matrix differs, in the heavier grinding operation of load, the abrasive grain unbalance stress, outstanding abrasive grain not only can damage workpiece but also more easily come off, thereby influences grinding speed and quality.For the hold that increases weld layer just must increase weld layer thickness, abrasive grain protrudes in the height of matrix less than 50%, and consequently exposed height of abrasive grain and chip space reduce, and emery wheel stops up easily, influences the service life of instrument.
So, press for a kind of abrasive grain size homogeneous and be uniformly distributed in the grinding tool with single layer of diamond of matrix surface, need a kind of abrasive grain to have the grinding tool with single layer of diamond of identical exposed height, need a kind of grinding tool with single layer of diamond that can prevent that abrasive grain from coming off.
Summary of the invention
The invention provides a kind of grinding tool with single layer of diamond and manufacture method thereof, the abrasive grain of this instrument size homogeneous, be uniformly distributed in matrix surface, and have identical exposed height, can prevent that abrasive grain from coming off.
The present invention adopts following scheme:
Grinding tool with single layer of diamond of the present invention, comprise a matrix and diamond abrasive, diamond abrasive grains is fixed on the matrix by a brazing layer, and diamond abrasive is the matrix arrangement and protrudes in this matrix surface with identical height, and it is exposed highly to be 20～80% of abrasive grain.Wherein brazing layer is the copper alloy that titaniferous is at least 3% percentage by weight, and basic material is metal or pottery.Because adopting the copper alloy of titaniferous is brazing layer, can form a titanium carbide layer between diamond abrasive grains and the brazing layer, strengthened the hold between diamond abrasive grains and the brazing layer, make the diamond abrasive grains difficult drop-off.Simultaneously, because diamond abrasive is arranged evenly, expose highly big and basically identical, so it has sharpness preferably, ground effect is good, and it is big to hold the bits amount, has prolonged the service life of instrument.
For improving diamond grinding instrument service life in corrosive atmosphere, a kind of preferable mode, in diamond abrasive and brazing layer surface coverage one deck anticorrosive coat, this anticorrosive coat can be any in electronickelling, ceramic glaze, titanium nitride or the diamond-like coating, and its thickness is about 1～5 μ m.
The manufacture method that grinding tool with single layer of diamond of the present invention adopts comprises the following steps:
1. diamond abrasive is bonded on the matrix surface by default arrangement mode;
2. form diamond abrasive is fixed in brazing layer on the matrix surface.
For the grinding tool with single layer of diamond that is provided with anticorrosive coat, also be included in the step that covers an anticorrosive coat on diamond abrasive and the brazing layer outer surface.This step can adopt galvanoplastic and physical vaporous deposition, is known method.
The idiographic flow of this manufacture method is as follows:
1. on treated matrix surface, evenly be coated with one deck glue-line.
2. utilizing air exhauster to bleed in web plate one side is adsorbed in diamond abrasive grains in the web plate hole.Arrange by default matrix in this web plate hole, and its width is less than the width of diamond abrasive grains.Upwards bleed when air exhauster, web plate top pressure is diminished, diamond abrasive grains is adsorbed in the mesh below under the effect of air pressure.
3. adhere to glue-line on identical height abrasive grain and remove web plate.Because the web plate hole has identical aperture, make the diamond abrasive grains size that is adsorbed in the web plate hole consistent, when adhering on the glue-line under the effect of diamond abrasive grains at web plate, just can make diamond abrasive grains protrude in this matrix surface by the matrix arrangement in web plate hole and with identical height.
4. on the matrix surface that is stained with diamond abrasive grains, evenly spread and spill the cored solder powder, carry out the welding first time, diamond abrasive grains is fixed on the matrix, and glue-line is burnt.
5. on the matrix surface that is welded with diamond abrasive grains, evenly spread once more and spill the cored solder powder, and carry out the welding second time, make brazing layer reach required thickness to needed amount.
Above-mentioned welding method can adopt vacuum brazing or other known method for welding.
The arrangement of diamond abrasive grains on matrix can be adopted following manner:
1. adjacent three particle diamond abrasive grains are the equilateral triangle arrangement arbitrarily.
2. adjacent four particle diamond abrasive grains are square arrangement arbitrarily.
Owing to adopt air exhauster that diamond abrasive grains is adsorbed in the web plate hole, make the abrasive grain size that adheres on the glue-line more consistent, arrange more regularly, reduced manual replenishing or the ratio of adjustment abrasive grain, improved production efficiency greatly.Adopt this method, replenish or adjust the abrasive grain ratio less than 10% by hand.
Owing to adopt the secondary soldering, make brazing process more easy to control, the thickness of brazing layer is more accurate.
Description of drawings
Fig. 1 is existing grinding tool with single layer of diamond structural representation;
Fig. 2 is a grinding tool with single layer of diamond structural representation of the present invention;
Fig. 3 is the grinding tool with single layer of diamond structural representation of covering anticorrosive coat of the present invention;
Fig. 4 is the detailed structure view at A place among Fig. 2;
Fig. 5 is the basal body structure schematic diagram that scribbles glue-line;
Fig. 6 is adsorbed in structural representation on the web plate for diamond abrasive grains;
Fig. 7 adheres to the structural representation of glue-line for diamond abrasive grains;
Fig. 8 removes the structural representation that diamond abrasive grains behind the web plate adheres to glue-line;
Fig. 9 spreads the structural representation that spills on diamond abrasive grains for the cored solder powder;
Figure 10 is the structural representation of square arrangement for diamond abrasive grains of the present invention;
Figure 11 is equilateral triangle structure arranged schematic diagram for diamond abrasive grains of the present invention
Figure 12 is the present invention and contrast of existing diamond tool grinding time schematic diagram.
The specific embodiment
Describe the specific embodiment of the present invention with reference to the accompanying drawings in detail.
With reference to Fig. 1, diamond abrasive grains 2 non-uniform Distribution of existing grinding tool with single layer of diamond are in matrix 1 surface, and exposedly highly differ, and very easily come off from weld layer 3, cause weld layer 3 directly to contact with work piece surface, have aggravated the rate of wear of weld layer 3.
Embodiment one:
With reference to Fig. 2, Fig. 4, Figure 10, the mono-layer diamond grinding dish that does not contain anticorrosive coat, diamond abrasive grains 2 is fixed on the matrix 1 by brazing layer 3, form one deck titanium carbide layer 21 between diamond abrasive grains 2 and the brazing layer 3, diamond abrasive 2 is equilateral triangle to be arranged, its exposed 80% of abrasive grain 2 that highly is about.Wherein diamond abrasive grains 2 adopts size to be about 200 microns boart boart, and brazing layer 3 is the copper alloy of 11% percentage by weight for titaniferous.
This grinding dish has sharpness preferably, and ground effect is good, and it is big to hold the bits amount, and be 1.5～2 times of existing instrument the service life of this instrument.
With reference to Fig. 5 to Fig. 9, its manufacture process comprises the following steps:
1. on through matrix 1 surface after cleaning, the blasting treatment, be coated with glue-line 6;
2. upwards bleed with air exhauster, diamond abrasive grains 2 is adsorbed in the hole of web plate 5;
3. adhere to diamond abrasive grains 2 on the glue-line 6 and remove web plate 5;
4. evenly spread on diamond abrasive grains 2 and glue-line 6 and spill cored solder powder 31, place vacuum drying oven to carry out vacuum brazing under 1000 ℃ of temperature, this process is carried out secondary and is reached required thickness until brazing layer 3.
Embodiment two:
With reference to Fig. 3, make grinding tool with single layer of diamond according to the method for embodiment one, on diamond abrasive grains 2 and brazing layer 3, cover one deck anticorrosive coat 4, anticorrosive coat 4 is a ceramic glaze, its thickness is 2 μ m, adopts physical vaporous deposition to make.This instrument is existing more than 2.5 times of grinding tool the service life in sour environment.
Above-mentioned only is two specific embodiment of the present invention; but design concept of the present invention is not limited thereto; as: also available other super hard abrasive of the diamond abrasive among the present invention such as boron nitride replace; allly utilize design of the present invention that the present invention is carried out the change of unsubstantiality, all should belong to the behavior of invading protection domain of the present invention.
Claims (10)
1, a kind of diamond grinding instrument, comprise a matrix, a large amount of diamond abrasive and make diamond abrasive be fixed in brazing layer on the matrix, it is characterized in that: diamond abrasive is the matrix arrangement and protrudes in this matrix surface with identical height, and described brazing layer is the copper alloy that titaniferous is at least 3% percentage by weight.
2, a kind of diamond grinding instrument as claimed in claim 1, it is characterized in that: described basic material is metal or pottery.
3, a kind of diamond grinding instrument as claimed in claim 1 is characterized in that: the height that described diamond abrasive protrudes in matrix surface is 20～80% of an abrasive grain height.
4, a kind of diamond grinding instrument as claimed in claim 1 is characterized in that: described diamond abrasive and brazing layer surface coverage one deck anticorrosive coat, this anticorrosive coat is any in electronickelling, ceramic glaze, titanium nitride or the diamond-like coating.
5, the manufacture method of a kind of diamond grinding instrument as claimed in claim 1 comprises the following steps:
A. diamond abrasive is bonded on the matrix surface by default arrangement mode;
B. form diamond abrasive is fixed in brazing layer on the matrix surface.
6, the manufacture method of a kind of diamond grinding instrument as claimed in claim 5 is characterized in that: described brazing layer is the alloy that titaniferous is at least 3% percentage by weight, and described basic material is metal or pottery.
7, the manufacture method of a kind of diamond grinding instrument as claimed in claim 5 is characterized in that: described diamond abrasive is comprised the following steps: by the process that default arrangement mode adheres on the matrix surface
A. be coated with glue-line at matrix surface;
B. diamond abrasive grains is adsorbed in the web plate hole;
The diamond abrasive grains that C. will be adsorbed in the web plate hole adheres on the glue-line;
8, the manufacture method of a kind of diamond grinding instrument as claimed in claim 7 is characterized in that: described web plate hole is pressed matrix and is arranged, and its aperture is less than the particle diameter of diamond abrasive grains.
9, the manufacture method of a kind of diamond grinding instrument as claimed in claim 7 is characterized in that: diamond abrasive grains is adsorbed in the method in web plate hole for to bleed in web plate one side with air exhauster.
10, the manufacture method of a kind of diamond grinding instrument as claimed in claim 5 is characterized in that: the process of described formation brazing layer comprises the following steps:
A. on the matrix surface that is stained with diamond abrasive grains, evenly spread and spill the cored solder powder, carry out the welding first time, diamond abrasive grains is fixed on the matrix;
B. on the matrix surface that is welded with diamond abrasive grains, evenly spread once more and spill the cored solder powder, and carry out the welding second time to needed amount.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200510075742 CN1872496A (en) | 2005-05-31 | 2005-05-31 | Grinding tool with single layer of diamond, and manufacturing method |
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| CN 200510075742 CN1872496A (en) | 2005-05-31 | 2005-05-31 | Grinding tool with single layer of diamond, and manufacturing method |
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| WO2009026776A1 (en) * | 2007-08-28 | 2009-03-05 | Jiaxiang Hou | Method for arranging abrasive particles of a grind tool orderly |
| CN101786263A (en) * | 2010-03-11 | 2010-07-28 | 江苏锋泰钻石工具制造有限公司 | Novel orderly arrangement system for diamond abrasives and arrangement process |
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| CN104290047A (en) * | 2013-07-16 | 2015-01-21 | 宁波大华砂轮有限公司 | A preparation method for a single-layer brazing diamond grinding wheel |
| CN104552044A (en) * | 2014-12-31 | 2015-04-29 | 广东工业大学 | Orderly arranging device and method for single-layer abrasive particles of special-shaped curved surface rotator grinder |
| CN104669139A (en) * | 2015-03-12 | 2015-06-03 | 金华职业技术学院 | Method for uniformly distributing diamond particles of diamond grinding wheel |
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| CN106826602A (en) * | 2017-03-31 | 2017-06-13 | 河南工业大学 | A kind of plunge grinding soldering manufacture of diamond dressing roller and preparation method thereof |
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- 2005-05-31 CN CN 200510075742 patent/CN1872496A/en active Pending
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| CN103878375A (en) * | 2012-12-20 | 2014-06-25 | 北京有色金属研究总院 | Manufacturing method of positioned arranged superhard tool bit |
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| CN104669139A (en) * | 2015-03-12 | 2015-06-03 | 金华职业技术学院 | Method for uniformly distributing diamond particles of diamond grinding wheel |
| CN104802100B (en) * | 2015-05-13 | 2018-03-27 | 厦门致力金刚石科技股份有限公司 | Soldering diamond flap disc |
| CN104802100A (en) * | 2015-05-13 | 2015-07-29 | 厦门致力金刚石科技股份有限公司 | Brazed diamond flap wheel |
| CN104849211A (en) * | 2015-05-27 | 2015-08-19 | 深圳市常兴技术股份有限公司 | Detecting method for diamond thickening degree on electroplating abrasive tool surface |
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| CN107520770A (en) * | 2017-05-04 | 2017-12-29 | 漳州职业技术学院 | A kind of wear-resisting skive preparation method of abrasive particle crystal orientation distribution |
| CN107718729A (en) * | 2017-11-10 | 2018-02-23 | 江苏瑞和磨料磨具有限公司 | A kind of soft water-proof strong frosted cloth |
| CN111372725A (en) * | 2017-11-21 | 2020-07-03 | 3M创新有限公司 | Coated abrasive discs and methods of making and using the same |
| CN108608345A (en) * | 2018-07-13 | 2018-10-02 | 华侨大学 | A kind of low temperature brazing diamond and its brazing filler metal alloy containing Cr |
| CN108608345B (en) * | 2018-07-13 | 2020-08-07 | 华侨大学 | Low-temperature brazing diamond containing Cr and brazing filler metal alloy thereof |
| CN112975769A (en) * | 2021-02-24 | 2021-06-18 | 合肥铨得合半导体有限责任公司 | Method for transferring diamond array to diamond disk substrate |
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