CN101745708B - 插座的锡圈熔焊工艺 - Google Patents
插座的锡圈熔焊工艺 Download PDFInfo
- Publication number
- CN101745708B CN101745708B CN2008102378688A CN200810237868A CN101745708B CN 101745708 B CN101745708 B CN 101745708B CN 2008102378688 A CN2008102378688 A CN 2008102378688A CN 200810237868 A CN200810237868 A CN 200810237868A CN 101745708 B CN101745708 B CN 101745708B
- Authority
- CN
- China
- Prior art keywords
- socket
- sintered part
- welding process
- jack housing
- receptacle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000003466 welding Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title claims abstract description 29
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 11
- 238000005245 sintering Methods 0.000 claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 7
- 238000000576 coating method Methods 0.000 claims abstract description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 24
- 229910052759 nickel Inorganic materials 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 12
- 239000011521 glass Substances 0.000 claims description 10
- 229910045601 alloy Inorganic materials 0.000 claims description 9
- 239000000956 alloy Substances 0.000 claims description 9
- 229910000833 kovar Inorganic materials 0.000 claims description 9
- 239000012212 insulator Substances 0.000 claims description 8
- 230000003647 oxidation Effects 0.000 claims description 8
- 238000007254 oxidation reaction Methods 0.000 claims description 8
- 239000010454 slate Substances 0.000 claims description 5
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 230000008595 infiltration Effects 0.000 description 5
- 238000001764 infiltration Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Ceramic Products (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
Description
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102378688A CN101745708B (zh) | 2008-12-06 | 2008-12-06 | 插座的锡圈熔焊工艺 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008102378688A CN101745708B (zh) | 2008-12-06 | 2008-12-06 | 插座的锡圈熔焊工艺 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101745708A CN101745708A (zh) | 2010-06-23 |
| CN101745708B true CN101745708B (zh) | 2011-08-10 |
Family
ID=42473677
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008102378688A Active CN101745708B (zh) | 2008-12-06 | 2008-12-06 | 插座的锡圈熔焊工艺 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101745708B (zh) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1556544A (zh) * | 2003-12-31 | 2004-12-22 | 贵研铂业股份有限公司 | 集成电路用气密封装盖板制备方法 |
| US6845664B1 (en) * | 2002-10-03 | 2005-01-25 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | MEMS direct chip attach packaging methodologies and apparatuses for harsh environments |
| CN201112375Y (zh) * | 2007-07-25 | 2008-09-10 | 上海飞恩微电子有限公司 | 半导体器件密封封装的金属底座 |
-
2008
- 2008-12-06 CN CN2008102378688A patent/CN101745708B/zh active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6845664B1 (en) * | 2002-10-03 | 2005-01-25 | The United States Of America As Represented By The Administrator Of National Aeronautics And Space Administration | MEMS direct chip attach packaging methodologies and apparatuses for harsh environments |
| CN1556544A (zh) * | 2003-12-31 | 2004-12-22 | 贵研铂业股份有限公司 | 集成电路用气密封装盖板制备方法 |
| CN201112375Y (zh) * | 2007-07-25 | 2008-09-10 | 上海飞恩微电子有限公司 | 半导体器件密封封装的金属底座 |
Non-Patent Citations (2)
| Title |
|---|
| 朱奇农等.提高金属－玻璃封装集成电路外壳的可靠性途径.《电子产品可靠性与环境试验》.1995,(第5期),19-24. * |
| 沈涪.可伐合金玻璃封接电连接器电镀工艺改进.《电镀与涂饰》.2006,第25卷(第5期),20-23. * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101745708A (zh) | 2010-06-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105689833A (zh) | 一种微电路模块壳体与盖板的钎焊密封封盖方法及结构 | |
| CN103706908B (zh) | 一种石英加速度计接线柱与连接线的低温焊接工艺方法 | |
| CN105127532A (zh) | 一种光电子器件管口的封装方法 | |
| CN101745708B (zh) | 插座的锡圈熔焊工艺 | |
| CN205180996U (zh) | 一种新型保温杯 | |
| CN100562956C (zh) | 耐高温的银氧化物触头材料的制造方法 | |
| CN204632818U (zh) | 一种陶瓷密封电池 | |
| CN102410124A (zh) | 高可靠密封氧化亚铜半导体电嘴的方法 | |
| CN103752969A (zh) | 一种插座的锡圈熔焊工艺 | |
| CN103192192A (zh) | 一种紫铜换热管与管板的焊接结构及其焊接工艺 | |
| CN108129037B (zh) | 一种钼-玻璃密封绝缘子封接方法 | |
| CN103537772B (zh) | 金属外壳与封端玻璃的气密性焊接方法 | |
| CN104308313B (zh) | 一种不锈钢发热管与法兰镍基钎焊工艺 | |
| CN102767654A (zh) | 一种用波纹弹性套筒来密封焊接管道的方法 | |
| CN107394067B (zh) | 一种平行结构封接电极及其组装方法 | |
| CN202268525U (zh) | 一种密封连接器 | |
| CN108098095B (zh) | 一种避免高压涡轮叶片工艺通道产生钎焊裂纹的工艺方法 | |
| CN2162700Y (zh) | 无渗漏引出线瓷套 | |
| CN104942476A (zh) | 一种自钎性钎料及其制备方法 | |
| CN204975621U (zh) | 一种用于钢管中频加热瞬时液相扩散焊接的氩气保护装置 | |
| CN106410212B (zh) | 一种钠硫电池正极集流体 | |
| CN102148127B (zh) | 陶瓷金卤灯电极插入镶嵌式对焊结构 | |
| CN201994258U (zh) | 陶瓷金卤灯电极插入镶嵌式对焊结构 | |
| CN214640898U (zh) | 一种用以制备高熔点合金与金属间化合物的真空氩弧焊系统 | |
| CN217387020U (zh) | 一种直流继电器密封结构 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Linyi Longli Electronic Co.,Ltd. Assignor: Gao Wenbin Contract record no.: 2011370000121 Denomination of invention: Tin ring welding process of receptacle License type: Exclusive License Open date: 20100623 Record date: 20110425 |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: Linyi Longli Electronic Co.,Ltd. Assignor: Gao Wenbin Contract record no.: 2011370000121 Date of cancellation: 20150916 |
|
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20100623 Assignee: SHANDONG LONGLI ELECTRONIC CO.,LTD. Assignor: Gao Wenbin Contract record no.: 2015370000171 Denomination of invention: Tin ring welding process of receptacle Granted publication date: 20110810 License type: Exclusive License Record date: 20150922 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Tin ring welding process of receptacle Effective date of registration: 20191108 Granted publication date: 20110810 Pledgee: Linyi Branch of qishang Bank Co., Ltd Pledgor: Gao Wenbin Registration number: Y2019370000087 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20201124 Granted publication date: 20110810 Pledgee: Linyi Branch of qishang Bank Co.,Ltd. Pledgor: Gao Wenbin Registration number: Y2019370000087 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| EC01 | Cancellation of recordation of patent licensing contract |
Assignee: SHANDONG LONGLI ELECTRONICS Co.,Ltd. Assignor: Gao Wenbin Contract record no.: 2015370000171 Date of cancellation: 20210812 |
|
| EC01 | Cancellation of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20100623 Assignee: SHANDONG LONGLI ELECTRONICS CO.,LTD. Assignor: Gao Wenbin Contract record no.: X2021980012266 Denomination of invention: Tin ring fusion welding process of socket Granted publication date: 20110810 License type: Exclusive License Record date: 20211112 |
|
| EE01 | Entry into force of recordation of patent licensing contract |