CN101742886B - Radiation device, radiation system and method for radiation - Google Patents

Radiation device, radiation system and method for radiation Download PDF

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Publication number
CN101742886B
CN101742886B CN200810305497.2A CN200810305497A CN101742886B CN 101742886 B CN101742886 B CN 101742886B CN 200810305497 A CN200810305497 A CN 200810305497A CN 101742886 B CN101742886 B CN 101742886B
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China
Prior art keywords
heat
air duct
cold air
heat abstractor
conducting substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200810305497.2A
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Chinese (zh)
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CN101742886A (en
Inventor
符猛
邓杰城
陈俊吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
Original Assignee
Hong Jun Precision Industry Co ltd
Fuzhun Precision Industry Shenzhen Co Ltd
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Publication date
Application filed by Hong Jun Precision Industry Co ltd, Fuzhun Precision Industry Shenzhen Co Ltd filed Critical Hong Jun Precision Industry Co ltd
Priority to CN200810305497.2A priority Critical patent/CN101742886B/en
Priority to US12/432,739 priority patent/US20100116462A1/en
Publication of CN101742886A publication Critical patent/CN101742886A/en
Application granted granted Critical
Publication of CN101742886B publication Critical patent/CN101742886B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention discloses a radiation device for an electronic element, a radiation system and a method for radiation. The radiation device comprises a heat conducting substrate and a plurality of radiating fins which are arrayed on the heat conducting substrate at intervals, wherein heat exchange channels are formed between adjacent radiating fins. The radiation device also comprises an air cooling channel which is parallel to the heat exchange channels and an air deflector component which is used for controlling the on and off of the air cooling channel. By adopting the technical scheme, the same heat radiation device can realize the balanced radiation of two heat sources which are arranged front and back, so the exchangeability of the radiation device can be increased while the part number of the radiation device is reduced, and the development cost is reduced.

Description

Heat abstractor, cooling system and heat dissipating method
Technical field
The present invention relates to a kind of heat abstractor, cooling system and heat dissipating method, particularly electronic component heat abstractor, cooling system and heat dissipating method.
Background technology
Some computer systems comprise two CPU (as equipment such as server, work stations), and system manufacturer need to satisfy the heat radiation requirement of two CPU simultaneously with kind of heat abstractor, to increase the interchangeability of heat abstractor, reduce simultaneously the heat abstractor item number, reduce development cost.
Fig. 1 shows the cooling system 2 to above-mentioned computer system heat radiation, this cooling system 2 comprises two traditional heat-dissipating device 50a that structure is identical, 50b, respectively with above-mentioned computer system circuit board 60 on the corresponding setting of two CPU (not shown), these two heat abstractor 50a, 50b includes with CPU and leads hot linked heat-conducting substrate 51A, 51B and some heat-conducting substrate 51a that is spaced at, radiating fin 52a on 51b, 52b, adjacent radiating fin 52a, form hot switching path 521a between 52b, 521b, pass for system's wind, thereby distribute heat-conducting substrate 51A, the heat that 51B absorbs from above-mentioned two CPU.Be combined into a system air channel 80 together with the peripheral element 70 of these two heat abstractor 50a, 50b and CPU.In the course of work, system's wind flows through in system air channel 80 along the direction of arrow, first passes through heat abstractor 50a, then dispels the heat through heat abstractor 50b.
yet, because system's wind first passes through heat abstractor 50a, its with heat abstractor 50a heat exchanging process in be preheated, and temperature rises, and wind speed is because the resistance of radiating fin 52a also reduces greatly, so, the conditions such as system's air temperature of heat abstractor 50b and wind speed that enter are all than entering the poor of heat abstractor 50a, make the radiating efficiency of heat abstractor 50b descend, cause heat abstractor 50a, the heat load of 50b in cooling system is unbalanced, when the heat dispersion of heat abstractor 50a just the time, the heat dispersion of heat abstractor 50b certainly will be not enough, so, required with regard to the heat radiation that is difficult to satisfied two CPU.
Problem for above-mentioned heat abstractor 50a, 50b heat load inequality, solution commonly used is to improve the heat dispersion of heat abstractor 50a, 50b at present, make heat abstractor 50b satisfy just the heat radiation requirement, yet, this certainly will cause the heat dispersion of heat abstractor 50a superfluous, can not reach and take full advantage of, and cause the manufacturing cost of heat abstractor significantly to rise.
Summary of the invention
In view of this, be necessary to provide a kind of heat abstractor, cooling system and heat dissipating method that can solve the unbalanced problem of heat load.
A kind of heat abstractor, comprise a heat-conducting substrate and some radiating fins that is spaced on this heat-conducting substrate, be formed with hot switching path between adjacent radiating fin, this heat abstractor also comprise one with the parallel cold air duct and of this hot switching path in order to control the air deflection assemblies of this cold air duct break-make.
A kind of cooling system, be used for dispelling the heat to two thermals source, it comprises two corresponding with this two thermal source respectively heat abstractors, and this two heat abstractor is connected in a system air channel, and each heat abstractor includes a hot switching path and one and the parallel cold air duct of this hot switching path; Wherein, the cold air duct conducting of the heat abstractor of close described system air channel air intake vent, and the cold air duct of another heat abstractor is closed.
A kind of heat dissipating method is used for to two cooling heat sources, and it comprises the steps:
(A) provide two heat abstractors, each heat abstractor all comprises hot switching path and the cold air duct parallel with this hot switching path;
(B) above-mentioned two heat abstractors are respectively installed on described two heat-generating electronic elements;
(C) above-mentioned two heat abstractors are connected in series in a system air channel;
(D) will open near the cold air duct of the heat abstractor of described system air channel air intake vent, the cold air duct of another heat abstractor is closed;
(E) provide system's wind to pass described system air channel, thereby distribute the heat that above-mentioned two thermals source produce.
By adopting technique scheme, the equilibrium that can utilize same heat abstractor to satisfy two thermals source is dispelled the heat, and can increase the interchangeability of heat abstractor, reduces simultaneously the heat abstractor item number, reduces development cost.
With reference to the accompanying drawings, the invention will be further described in conjunction with specific embodiments.
Description of drawings
Fig. 1 is the three-dimensional combination figure with the electronic installation of traditional heat-dissipating device.
Fig. 2 is the three-dimensional combination figure of heat abstractor in a preferred embodiment of the invention.
Fig. 3 is the three-dimensional exploded view of heat abstractor in Fig. 2.
Fig. 4 is the sectional drawing of air deflection assemblies shaft when axle sleeve is combined in Fig. 2.
Fig. 5 is with the three-dimensional combination figure that comprises the electronic installation of the cooling system of heat abstractor in Fig. 2.
Fig. 6 is that the system's wind in electronic installation shown in Figure 5 moves towards figure.
Embodiment
Fig. 2 and 3 shows the heat abstractor 10 in a preferred embodiment of the invention, this heat abstractor 10 (for example can be used to distribute a heat-generating electronic elements, the CPU of the equipment such as server, work station) heat that produces, it mainly comprises a heat-conducting substrate 11 and some spaced radiating fins 12.
The rectangular tabular of heat-conducting substrate 11, it adopts the good material such as the heat conductivility such as copper, aluminium to make.Radiating fin 12 also adopts the good material such as the heat conductivility such as copper, aluminium to make, it is laminar in the present embodiment, and concentrate the most of zone be arranged on heat-conducting substrate 11 end faces, a side that separately is positioned at radiating fin 12 at heat-conducting substrate 11 end faces reserves a white space (not label).Be formed with hot switching path 121 between adjacent radiating fin 12, for cooling air by and carry out heat exchange with radiating fin 12, thereby distribute the heat that heat-conducting substrate 11 absorbs from heat-generating electronic elements.
The white space of heat-conducting substrate 11 end faces forms a cold air duct 122 parallel with above-mentioned hot switching path 121, its width is much larger than the width of single hot switching path 121, for cooling air in the situation that with heat abstractor 10, heat exchanges occur and pass through as far as possible less, thereby cooling air through this cold air duct 122 afterwards temperature do not rise or not obvious rising.
Above-mentioned heat abstractor 10 also comprises some fasteners 13 that are arranged on heat-conducting substrate 11, this fastener 13 is in order to realize the fixing of heat abstractor 10, it is a bolt assembly in the present embodiment, comprise that a bolt 131, is set in spring 132 and the pad 133 on bolt 131, bolt 131 is located in perforation 111 on heat-conducting substrate 11.
Above-mentioned heat abstractor 10 further comprises an air deflection assemblies 15, and this air deflection assemblies 15 is arranged in cold air duct 122, in order to control the break-make of cold air duct 122.In the present embodiment, it is interior near on the fastener 13 of inlet air side that this air deflection assemblies 15 is mounted in cold air duct 122, and certainly, it also can be arranged separately in other positions in cold air duct 122.
Consult Fig. 3, air deflection assemblies 15 adopts the certain flexible material of tool such as plastics to make again, and it comprises that a wind deflector 151, is fixed on rotating shaft 152 and that wind deflector 151 is integrally connected the axle sleeve 153 that coordinates with rotating shaft 152 on heat-conducting substrate 11.
Wind deflector 151 is rectangular tabular in the present embodiment, and its length equates with the width of cold air duct 122, highly equates with the height of radiating fin 12, and it can when vertical with cold air duct 122, be closed cold air duct 122.Rotating shaft 152 is cylindric, and its lower ora terminalis is provided with a joint 1521, and the outer peripheral edges two opposite sides of joint 1521 are respectively equipped with a barb 1522.It is cylindric that axle sleeve 153 also is, and it is fixed on heat-conducting substrate 11 by fastener 13, and axle sleeve 153 can not rotated relative to heat-conducting substrate 11.It is one pullover 1531 that the upper ora terminalis of axle sleeve 153 is provided with, and is used for socket shaft joint 1521.Together with reference to Fig. 4, pullover 1531 internal face is distributed with four V-arrangement draw-in grooves 1532 that coordinate with joint barb 1522 equally spacedly, wherein the angle of two adjacent draw-in grooves is the obtuse angle, the angle of another two two adjacent draw-in grooves is right angle or acute angle, so that rotating shaft 152 can be rotated in 90 degree scopes relative to axle sleeve 153, and fix, thereby realize the setting that is flapped toward of wind deflector 151 after turning to the precalculated position.
Be understandable that, the effect of wind deflector 151 is mainly the break-make that realizes cold air duct 122, and it is not limited to and adopts rotating shaft 152 and the mode of axle sleeve 153 pivot joints to be arranged on heat-conducting substrate 11, and other mode that is fit to is also applicable.
Fig. 5 shows the cooling system 1 that comprises two heat abstractor 10a, 10b, this cooling system 1 is to dispelling the heat with the electronic installation of two heat-generating electronic elements (such as with equipment such as the server of two CPU, work stations), preferably, these two heat abstractor 10 performance parameters and structure are identical, its respectively be arranged on electronic device circuit plate 20 on two heat-generating electronic elements (not shown) heat conduction be connected, and be combined into a system air channel 40 together with the peripheral element 30 of heat-generating electronic elements.In this system air channel 40, this two heat abstractor 10a, 10b one in front and one in back connect along the direction of system's wind, both differences are, the wind deflector 151a of the heat abstractor 10a of close system air channel 40 air intake vents is parallel with cold air duct 122a, so that this cold air duct 122a conducting, and vertical with cold air duct 122b away from the wind deflector 10b of the heat abstractor 10b of air intake vent, so that this cold air duct 122b closes.
Together with reference to Fig. 6, above-mentioned cooling system 1 in the course of the work, system's wind flows along the direction of arrow, at first enter heat abstractor 10a, at this moment, due to cold air duct 122a conducting, a part of system wind flows through from the hot switching path 121a of this heat abstractor 10a, carry out heat exchange with radiating fin 12a, heat abstractor 10a is taken away from the heat that its corresponding heat-generating electronic elements absorbs; And another part system wind passes through from cold air duct 122a, do not take away or seldom take away the heat of heat abstractor 10a.After the wind process heat abstractor 10a of system, enter again heat abstractor 10b, at this moment, the cold air duct 122b of heat abstractor 10b closes, the system wind of making all flows through through its hot switching path 121b, carry out heat exchange with radiating fin 12b, heat abstractor 10b is taken away from the heat that its corresponding heat-generating electronic elements absorbs, thereby realized the heat radiation of two heat-generating electronic elements of above-mentioned electronic installation.In addition, for radiating efficiency is provided, can be with the cold air duct 122a of the heat abstractor 10a hot switching path 121b over against heat abstractor 10b.
In above-mentioned cooling system 1, because system's wind first is preheated through heat abstractor 10a, the system's air temperature that causes entering heat abstractor 10b rises, the heat dispersion of system's wind descends to some extent, but the cold air duct 122a conducting due to heat abstractor 10a, and the cold air duct 122b of heat abstractor 10b closes, and makes system's wind air quantity of the hot switching path 121a of the heat abstractor 10a that flows through be less than system's wind air quantity of the hot switching path 121b of the heat abstractor 10b that flows through.So, can make up the hot switching path 121a system wind of the heat abstractor 10a that flows through because temperature rises, the problem that heat dispersion descends when entering heat abstractor 10b has reached the balanced heat radiation of heat abstractor 10a with heat abstractor 10b.
What need especially proposition is, in above-mentioned cooling system 1, the equilibrium that can adopt same heat abstractor to satisfy two heat-generating electronic elements arranging front and back is dispelled the heat, and can increase the interchangeability of heat abstractor, reduce simultaneously the heat abstractor item number, reduce development cost.

Claims (10)

1. heat abstractor, comprise a heat-conducting substrate and some radiating fins that is spaced on this heat-conducting substrate, be formed with hot switching path between adjacent radiating fin, it is characterized in that, this heat abstractor also comprise one with the parallel cold air duct and of this hot switching path in order to control the air deflection assemblies of this cold air duct break-make, described radiating fin in the form of sheets, its parallel interval is arranged in the end face of described heat-conducting substrate, and reserve a white space in the side that described heat-conducting substrate end face is positioned at radiating fin, this white space forms described cold air duct, the width of cold air duct is greater than the width of single hot switching path.
2. heat abstractor according to claim 1 is characterized in that: described air deflection assemblies comprise that wind deflector, a rotating shaft and that is connected with this wind deflector that a size and described cold air duct adapt are fixed on described heat-conducting substrate and with the axle sleeve of described rotating shaft pivot joint.
3. heat abstractor according to claim 2, it is characterized in that: the axle sleeve of described air deflection assemblies is fixed on described heat-conducting substrate by a fastener.
4. heat abstractor according to claim 3, it is characterized in that: described fastener is a bolt assembly, it comprises that a bolt and that runs through described axle sleeve supports the spring between this bolt and described axle sleeve.
5. the described heat abstractor of according to claim 2 to 4 any one, it is characterized in that: the lower end of described rotating shaft is provided with a joint, and these joint outer peripheral edges are provided with barb; The upper end of described axle sleeve is provided with coordinate with described joint pullover, and this pullover internal face is provided with the groove that coordinates with described barb.
6. cooling system, be used for dispelling the heat to two thermals source, it comprises two corresponding with this two thermal source respectively heat abstractors, this two heat abstractor is connected in a system air channel, it is characterized in that: each heat abstractor includes a hot switching path and one and the parallel cold air duct of this hot switching path; Wherein, the cold air duct conducting of the heat abstractor of close described system air channel air intake vent, and the cold air duct of another heat abstractor is closed, described heat abstractor includes a heat-conducting substrate and some radiating fins that is spaced on this heat-conducting substrate, is formed with described hot switching path between adjacent radiating fin; The side that described heat-conducting substrate end face is positioned at radiating fin reserves a white space, and this white space forms described cold air duct, and the width of cold air duct is greater than the width of single hot switching path.
7. cooling system according to claim 6, it is characterized in that: described two heat abstractors are identical heat abstractor, and near the cold air duct of the heat abstractor of the system's air channel air intake vent heat exchange air duct over against another heat abstractor.
8. cooling system according to claim 6, it is characterized in that: described heat abstractor also comprises one in order to control the air deflection assemblies of this cold air duct break-make; This aerofoil assembly comprise that wind deflector, a rotating shaft and that is connected with this wind deflector that a size and described cold air duct adapt are fixed on described heat-conducting substrate and with the axle sleeve of described rotating shaft pivot joint; Wherein, the wind deflector of the heat abstractor of close described system air channel air intake vent is parallel with cold air duct, makes the cold air duct conducting; And the wind deflector of another heat abstractor is vertical with cold air duct, and cold air duct is closed.
9. a heat dissipating method, be used for to two cooling heat sources, and it comprises the steps:
(A) provide two heat abstractors, each heat abstractor all comprises hot switching path and the cold air duct parallel with this hot switching path, described heat abstractor includes a heat-conducting substrate and some radiating fins that is spaced on this heat-conducting substrate, is formed with described hot switching path between adjacent radiating fin; The side that described heat-conducting substrate end face is positioned at radiating fin reserves a white space, and this white space forms described cold air duct, and the width of cold air duct is greater than the width of single hot switching path;
(B) above-mentioned two heat abstractors are respectively installed on two heat-generating electronic elements;
(C) above-mentioned two heat abstractors are connected in series in a system air channel;
(D) will open near the cold air duct of the heat abstractor of described system air channel air intake vent, the cold air duct of another heat abstractor is closed;
(E) provide system's wind to pass described system air channel, thereby distribute the heat that above-mentioned two thermals source produce.
10. heat dissipating method according to claim 9, it is characterized in that: described two heat abstractors are same heat abstractors.
CN200810305497.2A 2008-11-12 2008-11-12 Radiation device, radiation system and method for radiation Expired - Fee Related CN101742886B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200810305497.2A CN101742886B (en) 2008-11-12 2008-11-12 Radiation device, radiation system and method for radiation
US12/432,739 US20100116462A1 (en) 2008-11-12 2009-04-29 Heat dissipation system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN200810305497.2A CN101742886B (en) 2008-11-12 2008-11-12 Radiation device, radiation system and method for radiation

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CN101742886B true CN101742886B (en) 2013-06-05

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CN201393359Y (en) * 2009-02-26 2010-01-27 富准精密工业(深圳)有限公司 Heat radiation device and base thereof
CN102858142A (en) * 2012-09-16 2013-01-02 李明科 Cooling device of server
CN104142713B (en) * 2013-05-08 2017-08-04 鸿富锦精密工业（深圳）有限公司 Cabinet
CN105592665A (en) * 2014-10-24 2016-05-18 富瑞精密组件（昆山）有限公司 Heat radiation device
CN107426951B (en) * 2017-07-26 2019-12-03 合肥联宝信息技术有限公司 Heat exchange mechanisms and electronic equipment
CN107845520A (en) * 2017-12-26 2018-03-27 安徽开诚电器有限公司 A kind of electric switch with heat sinking function
CN111383488A (en) * 2020-03-26 2020-07-07 孙利 Word memory device

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TWM244712U (en) * 2003-12-26 2004-09-21 Hon Hai Prec Ind Co Ltd Heat sink fastener
CN2711902Y (en) * 2003-02-18 2005-07-20 微星科技股份有限公司 Radiation device

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CN1396069A (en) * 2001-06-27 2003-02-12 三菱重工业株式会社 Vehicle air conditioner
CN2711902Y (en) * 2003-02-18 2005-07-20 微星科技股份有限公司 Radiation device
TWM244712U (en) * 2003-12-26 2004-09-21 Hon Hai Prec Ind Co Ltd Heat sink fastener

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