US20100116462A1 - Heat dissipation system - Google Patents
Heat dissipation system Download PDFInfo
- Publication number
- US20100116462A1 US20100116462A1 US12/432,739 US43273909A US2010116462A1 US 20100116462 A1 US20100116462 A1 US 20100116462A1 US 43273909 A US43273909 A US 43273909A US 2010116462 A1 US2010116462 A1 US 2010116462A1
- Authority
- US
- United States
- Prior art keywords
- heat dissipation
- cooling air
- dissipation device
- air passage
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the disclosure relates to a heat dissipation system and, more particularly, to a heat dissipation system for dissipating heat generated by two electronic devices.
- a computer system such as a server, a workstation, often includes two electronic devices, such as two central processing units (CPUs).
- the CPUs produce a large amount of heat during operation. The heat must be quickly removed from the CPUs to prevent them from becoming unstable or being damaged.
- two heat dissipation devices are attached to outer surfaces of the CPUs, respectively.
- FIG. 6 shows a heat dissipation system 2 for dissipating heat generated by the computer system mentioned above.
- the heat dissipation system 2 includes two heat dissipation devices 50 a , 50 b .
- the heat dissipation devices 50 a , 50 b are respectively attached to outer surfaces of the CPUs (not shown) mounted on a printed circuit board 60 in the computer system.
- the heat dissipation devices 50 a , 50 b include a substrate 51 a , 51 b and a plurality of fins 52 a , 52 b extending upwardly from the substrate 51 a , 51 b , respectively.
- These fins 52 a , 52 b are spaced from each other to form a plurality of passages 521 a , 521 b through which a cooling airflow flows.
- the heat dissipation devices 50 a , 50 b and a plurality of accessories 70 around the CPUs cooperatively form a path 80 .
- the airflow flows through the path 80 along a direction indicated by arrows in the FIG. 6 , in other words, the airflow flows through the heat dissipation device 50 a firstly, and then flows through the heat dissipation device 50 b.
- the airflow flowing through the path 80 the airflow is heated by the heat dissipation device 50 a , and a speed of the airflow is decreased.
- the heated and low-speed airflow flows through the heat dissipation device 50 b , and carry away little heat absorbed by the heat dissipation device 50 b from the CPU.
- the heat dissipation capability of the heat dissipation device 50 b is lower than that of the heat dissipation device 50 a .
- the heat dissipation device 50 a has a heat dissipation capability that the computer system requires, the heat dissipation capability of the heat dissipation device 50 b is lower than the required heat dissipation capability, if the heat dissipation device 50 b achieve the required heat dissipation capability, an excessive heat dissipation performance of the heat dissipation device 50 a are used, representing considerable cost and material burdens.
- FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the disclosure.
- FIG. 2 is a partially exploded view of the heat dissipation device of FIG. 1 .
- FIG. 3 is an isometric, sectional view of an air guiding member of the heat dissipation device of FIG. 1 .
- FIG. 4 is an isometric, assembled view of a heat dissipation system utilizing the heat dissipation device of FIG. 1 .
- FIG. 5 is a schematic view showing air flow of the heat dissipation system of FIG. 4 .
- FIG. 6 is an isometric, assembled view of a heat dissipation system utilizing a heat dissipation device in accordance with related art.
- the heat dissipation device 10 a comprises a rectangular base 11 , a plurality of parallel fins 12 extending upwardly from a top face of the base 11 , four fasteners 13 fastening the base 11 on a printed circuit board 20 (see FIG. 4 ) and an air guiding member 15 mounted on the base 11 via one of the fasteners 13 .
- the base 11 and the fins 12 are made of materials having a good thermal conductivity, such as copper, aluminum for efficiently absorbing heat generated by an electronic member (not shown) mounted on the printed circuit board 20 and dissipating it to the exterior.
- These fins 12 are spaced from each other to form a plurality of heat exchange passages 121 for heat exchanging with a cooling airflow flowing therethrough.
- each fastener 13 comprises a blot 131 with an upper head (not labeled) having a cross groove (not labeled) at a top end thereof for facilitating operation of a tool, a helical spring 132 and a gasket 133 sequentially coiled around the bolt 131 .
- the fastener 13 extends through a through hole 111 in the base 11 and the printed circuit board 20 , and engages with a back plate (not shown) located below the printed circuit board 20 .
- the helical spring 132 is elastically sandwiched between the upper head of the bolt 131 and the gasket 133 , such that the base 11 is secured on the printed circuit board 20 and attached to an outer, top surface of the electronic member on the printed circuit board 20 .
- the air guiding member 15 is made of materials having a certain elasticity, such as plastic or rubber.
- the air guiding member 15 is rested in the cooling air passage 122 on the base 11 for controlling open and close of the cooling air passage 122 .
- the air guiding member 15 is located at an intake of the cooling air passage 122 and mounted at a corner of the base 11 via one of the fasteners 13 .
- the air guiding member 15 can be located at any position of the cooling air passage 122 by other means.
- the air guiding member 15 comprises a cylindrical holder 153 , a cylindrical body 152 pivotally engaging with a top of the holder 153 , and a wing 151 integrally extending from an outer surface of the cylindrical body 152 .
- V-shaped slots 1532 are defined in an inner wall of the holder 153 .
- Two adjacent V-shaped slots 1532 each have an acute angle or a right angle (i.e., not larger than 90 degrees), and the other two adjacent V-shaped slots 1532 each have an obtuse angle (i.e. larger than 90 degrees).
- the body 152 is cylinder and has a tie-in 1521 at a bottom end thereof.
- the tie-in 1521 protrudes two clasps 1522 at two opposite sides thereof for selectively engaging in one of the two adjacent slots 1532 having an angle not larger than 90 degrees and one of the other two adjacent slots 1532 having an angle larger than 90 degrees, respectively.
- the wing 151 is a rectangular board.
- a height of the wing 151 is identical to that of the fins 12 , and a width thereof is identical to that of the cooling air passage 122 .
- a top of the wing 151 is flush with a top of the body 152 .
- the height of the wing 151 is identical to a sum of a height of the holder 153 and a height of the body 152 minus a height of the tie-in 1521 .
- the bolt 131 of the fastener 13 extends through the spring 132 , the body 152 , the holder 153 , and the gasket 133 in sequence to secure the air guiding member 15 on the base 11 and prevent it from rotating with respect to the base 11 .
- the wing 151 When one of the clasps 1522 of the body 152 is blocked in a corresponding acute-angled or right-angled slot 1532 of the holder 153 , the wing 151 is positioned parallel to the cooling air passage 122 of the heat dissipation device 10 a , and the cooling air passage 122 is open so that the branch of the cooling airflow can flow through the cooling air passage 122 ; when the body 152 rotates 90 degrees with respect to the holder 153 to make the one of the clasps 1522 of the body 152 is blocked in the other one acute-angle or right-angled slot 1532 , the wing 151 is positioned perpendicular to the cooling air passage 122 , and the cooling air passage 122 is closed so that the branch of the cooling airflow is blocked by the wing 151 .
- the body 152 is pivotably connected to the holder 153 , and the wing 151 is located at the required position by a rotation of the body 152 relative to the holder 153 .
- the heat dissipation system 1 comprises a heat dissipation device 10 a disclosed above, a heat dissipation device 10 b similar to the heat dissipation device 10 a , the printed circuit board 20 and a plurality of accessories 30 around the heat dissipation devices 10 a , 10 b .
- the accessories 30 in this embodiment are DRAM modules.
- the heat dissipation devices 10 a , 10 b are mounted on the printed circuit board 20 via the fasteners 13 , 13 b side by side for dissipating heat generated by two electronic members on the printed circuit board 20 .
- the heat dissipation device 10 a , 10 b and the accessory 30 cooperatively form a path 40 through which the cooling airflow passed.
- the heat dissipation device 10 a is located at an intake of the path 40
- the heat dissipation device 10 b is located at an outtake of the path 40 .
- the wing 151 of the heat dissipation device 10 a is rotated to a position parallel to the fins 12 , whereby the cooling air passage 122 is opened.
- the wing 151 b of the heat dissipation device 10 b is rotated to a position perpendicular to the fin 12 , whereby the cooling air passage 122 b is closed.
- Each of the air guiding members 15 is located at a corner of a windward side of the base 11 of the corresponding heat dissipation device 10 a ( 10 b ), whereby an entrance of the cooling passage 122 b is closed, and the cooling air which flows through the cooling passage 122 a can almost flow into the heat exchange passages 121 b to effectively take heat away from the heat dissipation device 10 b.
- the cooling airflow flows along a direction indicated by arrows in the path 40 .
- a part of the cooling airflow flows through the heat exchange passages 121 of the fins 12 of the heat dissipation device 10 a and exchanges heat therewith, and the other part of the cooling airflow, that is to say, the branch of the cooling airflow directly flows through the cooling air passage 122 without being blocked by the wing 151 .
- the heated airflow by the fins 12 of the heat dissipation device 10 a and the branch of the cooling airflow together flow through the heat dissipation device 10 b .
- the heat dissipation system 1 can more effectively cool two electronic members arranged in series along an airflow path.
- amount of airflow flowing through the heat exchange passages 121 of the heat dissipation device 10 a is smaller than that flowing through the heat exchange passage 121 b of the heat dissipation device 10 b .
- the increased amount of airflow through the heat dissipation device 10 b compensates the increase of temperature of the airflow through the heat dissipation device 10 b , to thereby achieve a balance of heat dissipation capabilities between the heat dissipation devices 10 a , 10 b .
- the exit of the cooling air passage 122 of the heat dissipation device 10 a faces the heat exchange passages 121 b of the heat dissipation device 10 b .
- the heat dissipation devices 10 a , 10 b are the same from each other regarding the configuration and structure to improve an interchangeability of the heat dissipation devices 10 a , 10 b for further reducing a designing cost of the heat dissipation system 1 .
- the wing 151 of the heat dissipation device 10 a is rotated perpendicular to the fins 12 to close the cooling air passage 122
- the wing 151 b of the heat dissipation device 10 b is rotated parallel the fins 12 to open the cooling air passage 122 b .
- the amount of the airflow flowing through the heat exchange passages 121 of the heat dissipation device 10 a is increased whereby the heat dissipation devices 10 a has a great heat dissipation capability.
- the airflow heated by the heat dissipation device 10 a flows through the heat dissipation device 10 b and exchanges heat with the heat dissipation device 10 b to decrease the temperature of the heat dissipation system 1 .
- the temperature of the dissipation system 1 can be kept as low as possible.
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
- 1. Technical Field
- The disclosure relates to a heat dissipation system and, more particularly, to a heat dissipation system for dissipating heat generated by two electronic devices.
- 2. Description of Related Art
- A computer system, such as a server, a workstation, often includes two electronic devices, such as two central processing units (CPUs). The CPUs produce a large amount of heat during operation. The heat must be quickly removed from the CPUs to prevent them from becoming unstable or being damaged. Typically, two heat dissipation devices are attached to outer surfaces of the CPUs, respectively.
-
FIG. 6 shows aheat dissipation system 2 for dissipating heat generated by the computer system mentioned above. Theheat dissipation system 2 includes twoheat dissipation devices heat dissipation devices circuit board 60 in the computer system. Theheat dissipation devices substrate fins substrate fins passages heat dissipation devices accessories 70 around the CPUs cooperatively form apath 80. The airflow flows through thepath 80 along a direction indicated by arrows in theFIG. 6 , in other words, the airflow flows through theheat dissipation device 50 a firstly, and then flows through theheat dissipation device 50 b. - During the airflow flowing through the
path 80, the airflow is heated by theheat dissipation device 50 a, and a speed of the airflow is decreased. The heated and low-speed airflow flows through theheat dissipation device 50 b, and carry away little heat absorbed by theheat dissipation device 50 b from the CPU. Thus the heat dissipation capability of theheat dissipation device 50 b is lower than that of theheat dissipation device 50 a. That is to say, if theheat dissipation device 50 a has a heat dissipation capability that the computer system requires, the heat dissipation capability of theheat dissipation device 50 b is lower than the required heat dissipation capability, if theheat dissipation device 50 b achieve the required heat dissipation capability, an excessive heat dissipation performance of theheat dissipation device 50 a are used, representing considerable cost and material burdens. - What is needed, therefore, is a heat dissipation system having a balanceable heat dissipation capability.
- Many aspects of the disclosure can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the disclosure. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views.
-
FIG. 1 is an isometric, assembled view of a heat dissipation device in accordance with an embodiment of the disclosure. -
FIG. 2 is a partially exploded view of the heat dissipation device ofFIG. 1 . -
FIG. 3 is an isometric, sectional view of an air guiding member of the heat dissipation device ofFIG. 1 . -
FIG. 4 is an isometric, assembled view of a heat dissipation system utilizing the heat dissipation device ofFIG. 1 . -
FIG. 5 is a schematic view showing air flow of the heat dissipation system ofFIG. 4 . -
FIG. 6 is an isometric, assembled view of a heat dissipation system utilizing a heat dissipation device in accordance with related art. - Referring to
FIG. 1 , aheat dissipation device 10 a is illustrated in accordance with an embodiment of the disclosure. Theheat dissipation device 10 a comprises arectangular base 11, a plurality ofparallel fins 12 extending upwardly from a top face of thebase 11, fourfasteners 13 fastening thebase 11 on a printed circuit board 20 (seeFIG. 4 ) and anair guiding member 15 mounted on thebase 11 via one of thefasteners 13. Thebase 11 and thefins 12 are made of materials having a good thermal conductivity, such as copper, aluminum for efficiently absorbing heat generated by an electronic member (not shown) mounted on the printedcircuit board 20 and dissipating it to the exterior. Thesefins 12 are spaced from each other to form a plurality ofheat exchange passages 121 for heat exchanging with a cooling airflow flowing therethrough. There is non-fins disposed at a side of thebase 11 to form a blank region (not labeled) for defining acooling air passage 122 through which a branch of the cooling airflow passes. Width of thecooling air passage 122 is larger than that of theheat exchange passage 121, whereby a sufficient amount of cool air of the cooling airflow can flow through thecooling air passage 122. - Referring also to
FIG. 2 , eachfastener 13 comprises ablot 131 with an upper head (not labeled) having a cross groove (not labeled) at a top end thereof for facilitating operation of a tool, ahelical spring 132 and agasket 133 sequentially coiled around thebolt 131. When thefastener 13 is used, thefastener 13 extends through a throughhole 111 in thebase 11 and the printedcircuit board 20, and engages with a back plate (not shown) located below the printedcircuit board 20. Simultaneously, thehelical spring 132 is elastically sandwiched between the upper head of thebolt 131 and thegasket 133, such that thebase 11 is secured on the printedcircuit board 20 and attached to an outer, top surface of the electronic member on the printedcircuit board 20. - The
air guiding member 15 is made of materials having a certain elasticity, such as plastic or rubber. Theair guiding member 15 is rested in thecooling air passage 122 on thebase 11 for controlling open and close of thecooling air passage 122. In this illustrated embodiment, theair guiding member 15 is located at an intake of thecooling air passage 122 and mounted at a corner of thebase 11 via one of thefasteners 13. In other uses, theair guiding member 15 can be located at any position of thecooling air passage 122 by other means. - The
air guiding member 15 comprises acylindrical holder 153, acylindrical body 152 pivotally engaging with a top of theholder 153, and awing 151 integrally extending from an outer surface of thecylindrical body 152. - Referring also to
FIG. 3 , four evenly spaced substantially V-shaped slots 1532 are defined in an inner wall of theholder 153. Two adjacent V-shaped slots 1532 each have an acute angle or a right angle (i.e., not larger than 90 degrees), and the other two adjacent V-shaped slots 1532 each have an obtuse angle (i.e. larger than 90 degrees). Thebody 152 is cylinder and has a tie-in 1521 at a bottom end thereof. The tie-in 1521 protrudes twoclasps 1522 at two opposite sides thereof for selectively engaging in one of the twoadjacent slots 1532 having an angle not larger than 90 degrees and one of the other twoadjacent slots 1532 having an angle larger than 90 degrees, respectively. Thewing 151 is a rectangular board. A height of thewing 151 is identical to that of thefins 12, and a width thereof is identical to that of thecooling air passage 122. In this embodiment, a top of thewing 151 is flush with a top of thebody 152. The height of thewing 151 is identical to a sum of a height of theholder 153 and a height of thebody 152 minus a height of the tie-in 1521. Thebolt 131 of thefastener 13 extends through thespring 132, thebody 152, theholder 153, and thegasket 133 in sequence to secure theair guiding member 15 on thebase 11 and prevent it from rotating with respect to thebase 11. - When one of the
clasps 1522 of thebody 152 is blocked in a corresponding acute-angled or right-angled slot 1532 of theholder 153, thewing 151 is positioned parallel to thecooling air passage 122 of theheat dissipation device 10 a, and thecooling air passage 122 is open so that the branch of the cooling airflow can flow through thecooling air passage 122; when thebody 152 rotates 90 degrees with respect to theholder 153 to make the one of theclasps 1522 of thebody 152 is blocked in the other one acute-angle or right-angled slot 1532, thewing 151 is positioned perpendicular to thecooling air passage 122, and thecooling air passage 122 is closed so that the branch of the cooling airflow is blocked by thewing 151. Thebody 152 is pivotably connected to theholder 153, and thewing 151 is located at the required position by a rotation of thebody 152 relative to theholder 153. - Referring to
FIG. 4 , aheat dissipation system 1 utilizing theheat dissipation device 10 a is illustrated. Theheat dissipation system 1 comprises aheat dissipation device 10 a disclosed above, aheat dissipation device 10 b similar to theheat dissipation device 10 a, the printedcircuit board 20 and a plurality ofaccessories 30 around theheat dissipation devices accessories 30 in this embodiment are DRAM modules. Theheat dissipation devices circuit board 20 via thefasteners circuit board 20. Theheat dissipation device accessory 30 cooperatively form apath 40 through which the cooling airflow passed. Theheat dissipation device 10 a is located at an intake of thepath 40, and theheat dissipation device 10 b is located at an outtake of thepath 40. Thewing 151 of theheat dissipation device 10 a is rotated to a position parallel to thefins 12, whereby thecooling air passage 122 is opened. Simultaneously, thewing 151 b of theheat dissipation device 10 b is rotated to a position perpendicular to thefin 12, whereby the coolingair passage 122 b is closed. Each of theair guiding members 15 is located at a corner of a windward side of thebase 11 of the correspondingheat dissipation device 10 a (10 b), whereby an entrance of thecooling passage 122 b is closed, and the cooling air which flows through the cooling passage 122 a can almost flow into theheat exchange passages 121 b to effectively take heat away from theheat dissipation device 10 b. - Referring also to
FIG. 5 , the cooling airflow flows along a direction indicated by arrows in thepath 40. A part of the cooling airflow flows through theheat exchange passages 121 of thefins 12 of theheat dissipation device 10 a and exchanges heat therewith, and the other part of the cooling airflow, that is to say, the branch of the cooling airflow directly flows through the coolingair passage 122 without being blocked by thewing 151. Then, the heated airflow by thefins 12 of theheat dissipation device 10 a and the branch of the cooling airflow together flow through theheat dissipation device 10 b. As blocked by thewing 151 b of theheat dissipation device 10 b, all of the airflows flowing through theheat dissipation device 10 a flow through the coolingair passages 121 b of thefins 12 b and exchanging heat therewith. Accordingly, theheat dissipation system 1 can more effectively cool two electronic members arranged in series along an airflow path. - In the
heat dissipation system 1, amount of airflow flowing through theheat exchange passages 121 of theheat dissipation device 10 a is smaller than that flowing through theheat exchange passage 121 b of theheat dissipation device 10 b. The increased amount of airflow through theheat dissipation device 10 b compensates the increase of temperature of the airflow through theheat dissipation device 10 b, to thereby achieve a balance of heat dissipation capabilities between theheat dissipation devices heat dissipation system 1, the exit of the coolingair passage 122 of theheat dissipation device 10 a faces theheat exchange passages 121 b of theheat dissipation device 10 b. Theheat dissipation devices heat dissipation devices heat dissipation system 1. - Alternatively, when one electronic member which engages the
heat dissipation device 10 a works and the other one electronic member which engages theheat dissipation device 10 b stops, thewing 151 of theheat dissipation device 10 a is rotated perpendicular to thefins 12 to close the coolingair passage 122, and thewing 151 b of theheat dissipation device 10 b is rotated parallel thefins 12 to open the coolingair passage 122 b. Thus, the amount of the airflow flowing through theheat exchange passages 121 of theheat dissipation device 10 a is increased whereby theheat dissipation devices 10 a has a great heat dissipation capability. Simultaneously, the airflow heated by theheat dissipation device 10 a flows through theheat dissipation device 10 b and exchanges heat with theheat dissipation device 10 b to decrease the temperature of theheat dissipation system 1. The temperature of thedissipation system 1 can be kept as low as possible. - It is to be understood, however, that even though numerous characteristics and advantages of the present embodiments have been set forth in the foregoing description, together with details of the structures and functions of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the disclosure to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.
Claims (15)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810305497.2 | 2008-11-12 | ||
CN200810305497.2A CN101742886B (en) | 2008-11-12 | 2008-11-12 | Radiation device, radiation system and method for radiation |
Publications (1)
Publication Number | Publication Date |
---|---|
US20100116462A1 true US20100116462A1 (en) | 2010-05-13 |
Family
ID=42164121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/432,739 Abandoned US20100116462A1 (en) | 2008-11-12 | 2009-04-29 | Heat dissipation system |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100116462A1 (en) |
CN (1) | CN101742886B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100212869A1 (en) * | 2009-02-26 | 2010-08-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
CN105592665A (en) * | 2014-10-24 | 2016-05-18 | 富瑞精密组件(昆山)有限公司 | Heat radiation device |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102858142A (en) * | 2012-09-16 | 2013-01-02 | 李明科 | Cooling device of server |
CN104142713B (en) * | 2013-05-08 | 2017-08-04 | 鸿富锦精密工业(深圳)有限公司 | Cabinet |
CN107426951B (en) * | 2017-07-26 | 2019-12-03 | 合肥联宝信息技术有限公司 | Heat exchange mechanisms and electronic equipment |
CN107845520A (en) * | 2017-12-26 | 2018-03-27 | 安徽开诚电器有限公司 | A kind of electric switch with heat sinking function |
CN111383488A (en) * | 2020-03-26 | 2020-07-07 | 孙利 | Word memory device |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4595051A (en) * | 1983-05-11 | 1986-06-17 | Valeo | Casing for a heat exchanger in an air-conditioner, in particular for a vehicle cabin |
US5077601A (en) * | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
US5630469A (en) * | 1995-07-11 | 1997-05-20 | International Business Machines Corporation | Cooling apparatus for electronic chips |
US6588496B2 (en) * | 2001-06-27 | 2003-07-08 | Mitsubishi Heavy Industries, Ltd. | Air conditioner for vehicle |
US20050141201A1 (en) * | 2003-12-26 | 2005-06-30 | Hon Hai Precision Industry Co., Ltd. | Fastener for heat sink |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2711902Y (en) * | 2003-02-18 | 2005-07-20 | 微星科技股份有限公司 | Radiation device |
-
2008
- 2008-11-12 CN CN200810305497.2A patent/CN101742886B/en not_active Expired - Fee Related
-
2009
- 2009-04-29 US US12/432,739 patent/US20100116462A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4595051A (en) * | 1983-05-11 | 1986-06-17 | Valeo | Casing for a heat exchanger in an air-conditioner, in particular for a vehicle cabin |
US5077601A (en) * | 1988-09-09 | 1991-12-31 | Hitachi, Ltd. | Cooling system for cooling an electronic device and heat radiation fin for use in the cooling system |
US5630469A (en) * | 1995-07-11 | 1997-05-20 | International Business Machines Corporation | Cooling apparatus for electronic chips |
US6588496B2 (en) * | 2001-06-27 | 2003-07-08 | Mitsubishi Heavy Industries, Ltd. | Air conditioner for vehicle |
US20050141201A1 (en) * | 2003-12-26 | 2005-06-30 | Hon Hai Precision Industry Co., Ltd. | Fastener for heat sink |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100212869A1 (en) * | 2009-02-26 | 2010-08-26 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
CN105592665A (en) * | 2014-10-24 | 2016-05-18 | 富瑞精密组件(昆山)有限公司 | Heat radiation device |
Also Published As
Publication number | Publication date |
---|---|
CN101742886A (en) | 2010-06-16 |
CN101742886B (en) | 2013-06-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20100116462A1 (en) | Heat dissipation system | |
US7986521B2 (en) | Heat dissipation device and computer using same | |
US7613001B1 (en) | Heat dissipation device with heat pipe | |
US7423875B2 (en) | Liquid-cooling heat dissipating device for dissipating heat by a casing | |
US8638554B2 (en) | Air duct and electronic device having the same | |
US8514574B2 (en) | Heat dissipating apparatus | |
US6366461B1 (en) | System and method for cooling electronic components | |
US20050286232A1 (en) | Heat sink | |
US7180740B2 (en) | Method and apparatus for side-type heat dissipation | |
US20090044927A1 (en) | Thermal module and fin unit thereof | |
US20080314556A1 (en) | Heat dissipation device having a fan for dissipating heat generated by at least two electronic components | |
US20120145363A1 (en) | Fan duct and heat dissipation device using the same | |
US7286357B2 (en) | Computer system with cooling device for CPU | |
US8248794B2 (en) | Heat dissipation device and electronic device using the same | |
US20080074845A1 (en) | Heat sink having high heat dissipation efficiency | |
US20080151505A1 (en) | Heat dissipation device | |
US7589967B2 (en) | Heat dissipation device | |
US20030151900A1 (en) | Multi-opening heat-dissipation device for high-power electronic components | |
US20080113607A1 (en) | Wind-guiding cover | |
US8355253B2 (en) | Electronic apparatus with heat dissipation device | |
TW201214088A (en) | Heat dissipation device and electronic device having the same | |
US7423873B2 (en) | Heat dissipation device having fan holder for attachment of a fan | |
US6822862B2 (en) | Apparatus and method for heat sink | |
US8422226B2 (en) | Heat dissipation device | |
US7580263B2 (en) | Heat dissipation device with a fan holder |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD.,C Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FU, MENG;DENG, JIE-CHENG;CHEN, CHUN-CHI;REEL/FRAME:022617/0064 Effective date: 20090421 Owner name: FOXCONN TECHNOLOGY CO., LTD.,TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:FU, MENG;DENG, JIE-CHENG;CHEN, CHUN-CHI;REEL/FRAME:022617/0064 Effective date: 20090421 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |