CN101742826A - Method for repairing circuits of embedded circuit board - Google Patents
Method for repairing circuits of embedded circuit board Download PDFInfo
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- CN101742826A CN101742826A CN200810176080A CN200810176080A CN101742826A CN 101742826 A CN101742826 A CN 101742826A CN 200810176080 A CN200810176080 A CN 200810176080A CN 200810176080 A CN200810176080 A CN 200810176080A CN 101742826 A CN101742826 A CN 101742826A
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- circuit board
- circuit
- repairing
- mending
- defective
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Abstract
The invention relates to a method for repairing circuits of an embedded circuit board, which comprises the following steps of: firstly providing an embedded circuit board, wherein the embedded circuit board comprises a dielectric layer and a plurality of circuits, the dielectric layer is provided with a surface and a notched pattern, and the circuits are positioned in the notched pattern, the partial circuits are provided with at least one defect; and then, spray printing a conductive fluid material on the defects in a spray printing mode to repair the circuits.
Description
Technical field
The invention relates to a kind of method for repairing and mending of circuit, and particularly relevant for a kind of method for repairing and mending of circuit of embedded circuit board.
Background technology
Wiring board technology now develops into embedded circuit board (embedded circuit board) from general common non-embedded circuit board.Specifically, general common non-embedded circuit board is characterised in that its circuit is to protrude on the surface of dielectric layer, and embedded circuit board is characterised in that its circuit is to be embedded in dielectric layer.
The technology of the circuit of known embedded circuit board may further comprise the steps.At first, provide a substrate with a metal level and a metal loading plate.Then, be coated with a photoresist layer on metal level.Then, the photoresist layer is exposed and development, to form a patterning photoresist layer.Then, metal level is carried out an electroplating technology, to form a line layer, wherein line layer has many cablings.Then, remove patterning photoresist layer.Afterwards, be pressed on the film (prepreg) the metal loading plate is counter.At last, remove metal level and metal loading plate.So far, the circuit of known embedded circuit board completes.
When metal level being carried out electroplating technology when having the line layer of cabling or with the metal loading plate is anti-when being pressed on the film with formation, because of technology variation or other factors cause cabling to have defective, and electrical problem such as this defective may cause the short circuit of circuit or open circuit.Because the live width of embedding bury type circuit is less, therefore when discovery embedding bury type circuit defectiveness, common processing mode is directly to scrap to abandon, thereby makes the waste of cost of manufacture of embedded circuit board.
Summary of the invention
The invention provides a kind of method for repairing and mending of circuit of embedded circuit board, the waste that can reduce production costs.
The present invention proposes a kind of method for repairing and mending of circuit of embedded circuit board.At first, provide an embedded circuit board.Embedded circuit board comprises a dielectric layer and many circuits.Dielectric layer has a surface and an intaglio pattern.Circuit is positioned at intaglio pattern, and wherein the part circuit has at least one defective.Then, with spray printing mode spray printing one conductor fluid material in defective, with repairing circuit.
In one embodiment of this invention, above-mentioned conductor fluid material comprises metallic conduction cream or macromolecule conducting material.
In one embodiment of this invention, above-mentioned metallic conduction cream comprises tin cream, silver paste or copper cream.
In one embodiment of this invention, above-mentioned macromolecule conducting material comprises composite polymer electric conducting material or structural type macromolecule conducting material.
In one embodiment of this invention, above-mentioned composite polymer electric conducting material is a conductive filler is compound to fill, surface recombination or the compound mode composite high-molecular material of lamination and make.
In one embodiment of this invention, the material of above-mentioned composite polymer electric conducting material comprises plastics, rubber, fabric, cold coating or adhesive.
In one embodiment of this invention, above-mentioned conductive filler comprises carbon black, metal powder, tinsel, metallic fiber or carbon fiber.
In one embodiment of this invention, the material of above-mentioned structural type macromolecule conducting material comprises polyacetylene material, polysulfur nitride, polypyrrole, polyphenylene sulfide (PPS), poly-phthalonitrile compounds, polyaniline or polythiophene.
In one embodiment of this invention, above-mentioned with spray printing mode spray printing conductor fluid material after defective, comprise and carry out a baking procedure, so that the conductor fluid material transition becomes solid-state.
In one embodiment of this invention, above-mentioned with spray printing mode spray printing conductor fluid material after defective, comprise and carry out a ultraviolet light photocuring step, so that the conductor fluid material transition becomes solid-state.
In one embodiment of this invention, above-mentioned defective is for being selected from arbitrary or its combination of a breach (nick) or a fracture.
In one embodiment of this invention, the shape of above-mentioned breach comprises circle, rectangle or triangle.
In one embodiment of this invention, the section configuration of above-mentioned fracture comprises circular arc, rectangle or wedge shape.
In one embodiment of this invention, the live width of above-mentioned circuit is between 5 microns to 50 microns.
In sum, the method for repairing and mending of the circuit of embedded circuit board of the present invention, mainly be adopt spray printing mode with conductor fluid material spray printing in the defective of circuit, to carry out repairing circuit, so the waste that can reduce production costs.In addition, because circuit is the intaglio pattern that is positioned at dielectric layer, therefore when spray printing conductor fluid material during in defective, the conductor fluid material can flow in the intaglio pattern, can avoid producing the situation of overflow.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, embodiment cited below particularly, and cooperate appended graphic being described in detail below.
Description of drawings
Figure 1A to Figure 1B is the generalized section of method for repairing and mending of circuit of a kind of embedded circuit board of one embodiment of the invention;
Fig. 1 C is the enlarged diagram of overlooking of the local line of the embedded circuit board of repairing Figure 1B;
Fig. 2 A be one embodiment of the invention the circuit with defective overlook enlarged diagram;
Fig. 2 B be another embodiment of the present invention the circuit with defective overlook enlarged diagram;
Fig. 3 A be another embodiment of the present invention the circuit with defective overlook enlarged diagram;
Fig. 3 B be another embodiment of the present invention the circuit with defective overlook enlarged diagram;
Fig. 3 C be another embodiment of the present invention the circuit with defective overlook enlarged diagram;
Fig. 3 D be another embodiment of the present invention the circuit with defective overlook enlarged diagram.
The main element symbol description
100: embedded circuit board
110: dielectric layer
112: the surface
114: intaglio pattern
120a～120i: circuit
122a～122g: defective
130: the conductor fluid material
Embodiment
Figure 1A to Figure 1B is the generalized section of method for repairing and mending of circuit of a kind of embedded circuit board of one embodiment of the invention, and Fig. 1 C is the enlarged diagram of overlooking of the local line of the embedded circuit board of repairing Figure 1B.Please refer to Figure 1A, the method for repairing and mending according to the circuit of the embedded circuit board of present embodiment at first, provides an embedded circuit board 100.Embedded circuit board 100 comprises a dielectric layer 110 and many circuit 120a～120c (only schematically illustrating three among Figure 1A), wherein dielectric layer 110 has a surface 112 and one intaglio pattern 114, circuit 120a～120c is positioned at the intaglio pattern 114 of dielectric layer 110, and circuit 120c has a defective 122a.
What deserves to be mentioned is that the structure of embedded circuit board 100 can only have the uniline layer, or have the multilayer line layer.That is to say that embedded circuit board 100 can be individual layer wiring board (singlelayer circuit board), double-deck wiring board (double layer circuit board) or multilayer circuit board (multi-layer circuit board).In the present embodiment, Figure 1A is that an individual layer line layer describes with embedded circuit board 100 only.
Specifically, in the present embodiment, these circuits 120a～120c is the intaglio pattern 114 that is positioned at dielectric layer 110, that is to say, circuit 120a～120c basically can a kind of at last embedding bury type circuit, wherein the intaglio pattern 114 of dielectric layer 110 also can be ablated by laser beam and be formed, and these circuits 120a～120c in the intaglio pattern 114 can form by electroplating technology.Certainly, can also by little shadow and etch process (for example: semi-additive process or fully-additive process) and electroplating technology in circuit base plate (not illustrating) go up form circuit 120a～120c after, again with this circuit base plate back-pressure to dielectric layer 110, that is to say, mode by the pressing transfer printing is embedded in dielectric layer 110 with the circuit 120a～120c on the circuit base plate, can form these and be embedded into circuit 120a～120c in dielectric layer 110.
In the present embodiment, since in the process that forms circuit 120a～120c or with the circuit base plate back-pressure to the process of dielectric layer 110, because of technology variation or other factors cause circuit 120c to have a defective 122a, wherein defective 122a is a breach, and the shape of this breach for example is circular.In addition, in the present embodiment, the live width of these circuits 120a～120c is between 5 microns (μ m) to 50 microns (μ m).
Please also refer to Figure 1B and Fig. 1 C, then, with spray printing mode spray printing one conductor fluid material 130 in defective 122a, with repairing circuit 120c.In the present embodiment, the mode of repairing circuit 120c is to adopt the mode of spray printing, with conductor fluid material 130 spray printings on circuit 120c with defective 122a, because circuit 120c is positioned at the intaglio pattern 114 of dielectric layer 110, so when spray printing conductor fluid material 130 during in defective 122a, conductor fluid material 130 can flow in the intaglio pattern 114, to fill up defective 122c.In addition, the intaglio pattern 114 of dielectric layer 110 can also avoid conductor fluid material 130 that the phenomenon of overflow takes place.In the present embodiment, conductor fluid material 130 comprises metallic conduction cream or macromolecule conducting material.
What deserves to be mentioned is that in the present embodiment, when conductor fluid material 130 was metallic conduction cream, it comprised tin cream, silver paste, copper cream or other metal materials that is fit to.When conductor fluid material 130 is macromolecule conducting material, it comprises composite polymer electric conducting material or structural type macromolecule conducting material, wherein the composite polymer electric conducting material is that modes such as, surface recombination compound by filling by general macromolecular material and various conductive material or lamination be compound are made, and the kind of composite polymer electric conducting material includes conductive plastics, conductive rubber, conductive fiber fabric, electrically-conducting paint or conductive adhesive, even also can make transparent conductive film etc.The performance of composite polymer electric conducting material and the kind of selected conductive filler, consumption, granularity, state with and dispersity in macromolecular material very big relation is arranged, conductive filler wherein commonly used has carbon black, metal powder, tinsel, metallic fiber, carbon fiber etc.In addition, the structural type macromolecule conducting material is meant macromolecular structure itself or has the macromolecular material of conducting function that after overdoping the kind of wherein selected macromolecular material includes polyacetylene material, polysulfur nitride, polypyrrole, polyphenylene sulfide (PPS), poly-phthalonitrile compounds, polyaniline, polythiophene etc.According to conductivity principle, the structural type macromolecule conducting material also can be divided into electron conduction macromolecular material and ionic conduction macromolecular material, wherein the design feature of electron conduction macromolecular material is to have line style or the big conjugated system of face type, activation by conjugated pi electron under the effect of heat or light is conducted electricity, and conductivity is generally in semi-conductive scope.In addition, when adopting doping techniques, the electric conductivity of this class material is obviously improved, a small amount of iodine that for example in polyacetylene, mixes, conductivity can improve 12 orders of magnitude, and again for example, the polysulfur nitride after mixing can be transformed into the macromolecule superconductor under ultralow temperature.
Hold above-mentionedly, after defective 122a, then, carry out a baking procedure, so that conductor fluid material 130 is transformed into is solid-state at spray printing conductor fluid material 130.Because conductor fluid material 130 can flow in the intaglio pattern 114 of dielectric layer 110, therefore when carrying out a baking procedure, can be transformed into conductor fluid material 130 solid-state and affixed fully with circuit 120c.So far, finished the repairing of the circuit 120c of embedded circuit board 100.
In this mandatory declaration be, in the present embodiment, it is to adopt baking procedure that conductor fluid material 130 is transformed into solid-state mode, but in other embodiment, can be because of selecting different conductor fluid materials 130, and there have different modes that conductor fluid material 130 is transformed into to be solid-state, for example, when conductor fluid material 130 during for ultraviolet light typing metal material, can be by a ultraviolet light photocuring step, so that conductor fluid material 130 is transformed into is solid-state.
In brief, the method for repairing and mending of the circuit of the embedded circuit board of present embodiment, mainly be adopt spray printing mode with conductor fluid material 130 spray printings in circuit 120c with defective 122a, because circuit 120c is the intaglio pattern 114 that is positioned at dielectric layer 110, so when spray printing conductor fluid material 130 during in defective 122a, conductor fluid material 130 can flow in the intaglio pattern 114, afterwards, by baking procedure conductor fluid material 130 is transformed into solid-stately again, can finishes the repairing of circuit 120c.Therefore, the method for repairing and mending of the circuit of the embedded circuit board of present embodiment produces the phenomenon of overflow except avoiding conductor fluid material 130, can also reduce the waste of embedded circuit board production cost.
Below will illustrate the circuit of other multiple different defect kenels of the present invention again.Fig. 2 A is the schematic top plan view of the circuit with defective of one embodiment of the invention.Please also refer to Fig. 2 A and Fig. 1 C, in the present embodiment, the circuit 120d with defective 122b of Fig. 2 A is similar to the circuit 120c with defective 122a of Fig. 1 C, only the two main difference be in: the defective 122b of the circuit 120d of Fig. 2 A is a breach, and this breach be shaped as triangle.
Fig. 2 B be another embodiment of the present invention the circuit with defective overlook enlarged diagram.Please also refer to Fig. 2 B and Fig. 1 C, in the present embodiment, the circuit 120e with defective 122c of Fig. 2 B is similar to the circuit 120c with defective 122a of Fig. 1 C, and only the two main difference part is: the defective 122c of the circuit 120e of Fig. 2 B is a breach, and this breach be shaped as rectangle.
In this mandatory declaration be, though circuit 120c, 120d, defective 122a, the 122b of 120e, 122c mentioned in Fig. 1 C, Fig. 2 A and Fig. 2 B are embodied as breach, and the shape of these breach is respectively circle, triangle and rectangle, but, in the embodiment that other do not illustrate, the defective of circuit can also be erose breach, as long as circuit is the intaglio pattern that is positioned at dielectric layer, that is to say, circuit is the embedding bury type circuit, can repair defective circuit by the method for repairing and mending of the circuit of embedded circuit board of the present invention.Therefore, the shape of Fig. 1 C, Fig. 2 A and the described breach of Fig. 2 B is only for illustrating, and the present invention is not as limit.
Fig. 3 A be another embodiment of the present invention the circuit with defective overlook enlarged diagram.Please also refer to Fig. 3 A and Fig. 1 C, in the present embodiment, the circuit 120f with defective 122d of Fig. 3 A is similar to the circuit 120c with defective 122a of Fig. 1 C, and only the two main difference part is: the defective 122d of the circuit 120f of Fig. 3 A is a fracture, and the section configuration of this fracture is a rectangle.
Fig. 3 B be another embodiment of the present invention the circuit with defective overlook enlarged diagram.Please also refer to Fig. 3 B and Fig. 3 A, in the present embodiment, the circuit 120g with defective 122e of Fig. 3 B is similar to the circuit 120f with defective 122d of Fig. 3 A, only the two main difference part is: the defective 122e of the circuit 120g of Fig. 3 B is a fracture, and the section configuration of this fracture is a circular arc.
Fig. 3 C be another embodiment of the present invention the circuit with defective overlook enlarged diagram.Please also refer to Fig. 3 C and Fig. 3 A, in the present embodiment, the circuit 120h with defective 122f of Fig. 3 C is similar to the circuit 120f with defective 122d of Fig. 3 A, and only the two main difference part is: the defective 122f of the circuit 120h of Fig. 3 C is a fracture, and the section configuration of this fracture is a wedge shape.
Fig. 3 D be another embodiment of the present invention the circuit with defective overlook enlarged diagram.Please also refer to Fig. 3 D and Fig. 3 A, in the present embodiment, the circuit 120i with defective 122g of Fig. 3 D is similar to the circuit 120f with defective 122d of Fig. 3 A, only the two main difference part is: the defective 122g of the circuit 120i of Fig. 3 D is a fracture, and the section configuration of this fracture is irregular shape.
What deserves to be mentioned is; the present invention does not limit the form of defective 122a～122g; though in Fig. 1 C; mentioned circuit 120c among Fig. 2 A and Fig. 2 B; 120d; the defective 122a of 120e; 122b; 122c is embodied as breach; in Fig. 3 A; Fig. 3 B; the defective 122d of Fig. 3 C and Fig. 3 D; 122e; 122f; 122g is embodied as fracture; but in the embodiment that other do not illustrate; as long as have the circuit of defective is the intaglio pattern that is positioned at dielectric layer; that is to say; circuit is the embedding bury type circuit; can repair defective circuit by the method for repairing and mending of the circuit of embedded circuit board of the present invention; still belong to the adoptable technical scheme of the present invention, do not break away from the scope of institute of the present invention desire protection.
In sum, the method for repairing and mending of the circuit of embedded circuit board of the present invention, mainly be adopt spray printing mode with conductor fluid material spray printing in circuit, to carry out repairing circuit, so the waste that can reduce production costs with defective.In addition, because circuit is the intaglio pattern that is positioned at dielectric layer, therefore when spray printing conductor fluid material during in defective, the conductor fluid material can flow in the intaglio pattern, can avoid producing the situation of overflow.
Though the present invention discloses as above with embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when doing a little change and retouching, so protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (14)
1. the method for repairing and mending of the circuit of an embedded circuit board comprises:
Embedded circuit board is provided, and this embedded circuit board comprises dielectric layer and many circuits, and this dielectric layer has a surface and intaglio pattern, and those circuits are positioned at this intaglio pattern, and wherein those circuits of part have at least one defective; And
With spray printing mode spray printing conductor fluid material in this defective, to repair those circuits.
2. the method for repairing and mending of the circuit of embedded circuit board as claimed in claim 1, wherein this conductor fluid material comprises metallic conduction cream or macromolecule conducting material.
3. the method for repairing and mending of the circuit of embedded circuit board as claimed in claim 2, wherein this metallic conduction cream comprises tin cream, silver paste or copper cream.
4. the method for repairing and mending of the circuit of embedded circuit board as claimed in claim 2, wherein this macromolecule conducting material comprises composite polymer electric conducting material or structural type macromolecule conducting material.
5. the method for repairing and mending of the circuit of embedded circuit board as claimed in claim 4, wherein this composite polymer electric conducting material is conductive filler is compound to fill, surface recombination or the compound mode composite high-molecular material of lamination and make.
6. the method for repairing and mending of the circuit of embedded circuit board as claimed in claim 4, wherein the material of this composite polymer electric conducting material comprises plastics, rubber, fabric, cold coating or adhesive.
7. the method for repairing and mending of the circuit of embedded circuit board as claimed in claim 5, wherein this conductive filler comprises carbon black, metal powder, tinsel, metallic fiber or carbon fiber.
8. the method for repairing and mending of the circuit of embedded circuit board as claimed in claim 4, wherein the material of this structural type macromolecule conducting material comprises polyacetylene material, polysulfur nitride, polypyrrole, polyphenylene sulfide, poly-phthalonitrile compounds, polyaniline or polythiophene.
9. the method for repairing and mending of the circuit of embedded circuit board as claimed in claim 1 wherein is somebody's turn to do with this conductor fluid material of spray printing mode spray printing after this defective, comprising:
Carry out baking procedure, so that this conductor fluid material transition becomes solid-state.
10. the method for repairing and mending of the circuit of embedded circuit board as claimed in claim 1 wherein is somebody's turn to do with this conductor fluid material of spray printing mode spray printing after this defective, comprising:
Carry out ultraviolet light photocuring step, so that this conductor fluid material transition becomes solid-state.
11. the method for repairing and mending of the circuit of embedded circuit board as claimed in claim 1, wherein this defective is to be selected from the arbitrary of breach or fracture or its combination.
12. the method for repairing and mending of the circuit of embedded circuit board as claimed in claim 11, wherein the shape of this breach comprises circle, rectangle or triangle.
13. the method for repairing and mending of the circuit of embedded circuit board as claimed in claim 11, wherein the section configuration of this fracture comprises circular arc, rectangle or wedge shape.
14. the method for repairing and mending of the circuit of embedded circuit board as claimed in claim 1, wherein the live width of those circuits is between 5 microns to 50 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101760800A CN101742826B (en) | 2008-11-11 | 2008-11-11 | Method for repairing circuits of embedded circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2008101760800A CN101742826B (en) | 2008-11-11 | 2008-11-11 | Method for repairing circuits of embedded circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101742826A true CN101742826A (en) | 2010-06-16 |
| CN101742826B CN101742826B (en) | 2011-12-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008101760800A Expired - Fee Related CN101742826B (en) | 2008-11-11 | 2008-11-11 | Method for repairing circuits of embedded circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102821552A (en) * | 2012-09-12 | 2012-12-12 | 高德（无锡）电子有限公司 | Method for improving scrapped PCB (printed circuit board) marking process |
-
2008
- 2008-11-11 CN CN2008101760800A patent/CN101742826B/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102821552A (en) * | 2012-09-12 | 2012-12-12 | 高德（无锡）电子有限公司 | Method for improving scrapped PCB (printed circuit board) marking process |
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| CN101742826B (en) | 2011-12-21 |
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Granted publication date: 20111221 Termination date: 20131111 |