TWI377884B - Method for repairing circuit of embedded circuit board - Google Patents

Description

1377884 0807007 2917Itwf.doc/n IX. Description of the Invention: TECHNICAL FIELD OF THE INVENTION The present invention relates to a method of repairing a line, and more particularly to a method of repairing a line of an embedded circuit board. [Prior Art] Today's circuit board technology has evolved from a common non-embedded circuit board to an embedded circuit board. In detail, a non-embedded circuit board is generally characterized in that its wiring protrudes from the surface of the dielectric layer, and the embedded wiring board is characterized in that its wiring is embedded in the dielectric layer. The process of the conventional embedded circuit board circuit includes the following steps. First, a substrate having a metal layer and a metal carrier plate is provided. Next, a photoresist layer is coated on the metal layer. Next, the photoresist layer is exposed and developed to form a patterned photoresist layer. Next, the metal layer is subjected to an electroplating process to form a wiring layer in which the wiring layer has a plurality of wiring lines. Next, the patterned photoresist layer is removed. Thereafter, the metal carrier plate is back-pressed onto the film (Prepreg). Finally, the metal layer and the metal carrier plate are removed. So far, the circuit of the conventional embedded circuit board has been completed. When the metal layer is subjected to an electroplating process to form a wiring layer having a trace or when the metal carrier is back-compressed on the film, the trace has defects due to process variation or other factors, and the defect may cause a line defect. Short circuit or open circuit and other electrical problems. Since the line width of the embedded line is small, when it is found that the buried line is defective, the usual processing method is to directly discard and discard, thus making the production cost of the embedded circuit board waste. 5 〇8〇7〇〇7 29171twf.doc/n [Summary of the Invention] The method of repairing the line of the circuit board can be reduced. First circuit board. The embedded circuit board includes - I: multiple lines. The dielectric layer has a - surface disk - = layer and engraved pattern, wherein part of the Wei, 's wood line is located in the concave ^ lf" line has at least - touch. Then, spray sneeze - conductive flow is applied to the shaft In the present invention, the conductive material comprises a metal cold electric bone or a polymer conductive material. "In one embodiment of the present invention, the above metal conductive paste Including poor, silver poor or copper paste. In an embodiment of the invention, the polymer conductive material comprises a composite polymer conductive material or a structural polymer conductive material. In an embodiment of the invention, the composite polymer conductive material is prepared by filling a conductive filler into a composite, surface composite or laminated composite polymer material. In an embodiment of the invention, the material of the composite polymer conductive material comprises plastic 'rubber, fiber fabric, resin coating or adhesive. In an embodiment of the invention, the conductive filler comprises carbon black, metal powder, metal foil, metal fiber or carbon fiber. In an embodiment of the present invention, the material of the structural polymer conductive material comprises a polyacetylene material, a polysulfurnitride, a polypyrrole, a polypyrrole (pps), a polyphthalonitrile compound, a polyaniline or a poly Thiophene. In the embodiment of the present invention, after the defect is applied to the defect, the step of baking is performed to convert the material into a solid state. Package ~ ^ This hair shape - material office, the above (four) printing material spray after the 'including the process - light curing step ^ to convert the conductive fluid material into a solid state. Λ 本 本 本 本 本 本 本 本 本 , , , , , , , , , , , , , , , , , , 上述 上述In this case, the above-mentioned gap (four) is in the shape of a rectangle, a triangle or a triangle. In an embodiment of the invention, the sectional shape of the fracture comprises an arc shape, a rectangle shape or a wedge shape. In the embodiment of the invention, the line width of the above line is between 5 micrometers and 50 micrometers. In summary, the repair method of the embedded circuit board of the present invention mainly uses the printing method to print the conductive fluid material on the defect to repair the line, thereby reducing the waste of production cost. In addition, since the wiring is in the intaglio pattern of the dielectric layer, when the conductive fluid material is printed on the defect, the conductive fluid material can flow to avoid the generation of (10). The above and other objects, features, and advantages of the present invention will become more apparent. 1377884 0807007 29l71twf.dOC/n [Embodiment]

1A-1B are cross-sectional views showing a repair method of a circuit of a buried circuit board according to an embodiment of the present invention, and FIG. 1C is a schematic enlarged plan view showing a partial line of the embedded circuit board of FIG. 1B. Referring first to FIG. 1A', in accordance with the repair method of the embedded circuit board according to the present embodiment, an embedded circuit board is first provided. The embedded circuit board 100 includes a dielectric layer 110 and a plurality of lines 12〇a~12〇c (only three are schematically illustrated in FIG. 1A), wherein the dielectric layer 11() has a surface n2 and an intaglio The pattern 1M' line i2〇a~i2〇c is located in the recess pattern 114 of the dielectric layer no, and the line 120c has a defect 122a. It is worth mentioning that the structure of the embedded circuit board can have only a single circuit layer or a multilayer circuit layer. That is, the embedded circuit board 100 may be a single layer circuit b_d, a double layer circuit board or a multi-layer circuit board. In the present embodiment, FIG. ia illustrates only the buried circuit board 100 as a single layer circuit layer.

In detail, in the present embodiment, the lines 12A1 to 12k are located in the intaglio pattern 114 of the dielectric layer 110, that is, the line theory 120c can basically be regarded as a buried line. The intaglio pattern 114 of the dielectric layer (10) can also be formed by laser beam burn-out, and the lines in the intaglio pattern 114 can be made by the electric ore process, or by lithography. After the etching process (for example, semi-additive force method) and the plating process are formed on the circuit substrate (not), the circuit substrate is back pressed to the dielectric layer I. The upper line is also a 8 1377884 0807007 29171twf.doc/n, 'the circuit 120a~120c on the tree substrate is electrically transferred U0 to form the line 120a embedded in the dielectric layer ιι〇 ~120c.

In the present embodiment, the line 12〇c has a defect l22a due to the process of forming a line or during the process of back-pressing the circuit substrate to the dielectric layer 11G, due to manufacturing, or other factors. The defect 122a is a notch, and the shape of the notch is, for example, a circle. This/external in this embodiment, the line widths of these lines 12〇a to 120c are between 〇 and 50 μm (#m).

Referring to FIG. 1B and FIG. 1C simultaneously, a conductive fluid material 130 is printed on the defect 122a by printing to repair the line 12〇c. In the present embodiment, the line 120c is repaired by printing a conductive fluid material 130 onto the line i2〇c having the defect 122a, since the line 120c is located in the recessed pattern 114 of the dielectric layer 110. Therefore, when the conductive fluid material 130 is printed on the defect 122a, the conductive fluid material 13 can flow in the intaglio pattern 1H to fill the defect 122c. In addition, the intaglio pattern 114 of the dielectric layer n〇 can also avoid the phenomenon that the conductive fluid material 13〇 overflows. In the present embodiment, the conductive fluid material 130 comprises a metal conductive paste or a polymer conductive material. It is worth mentioning that in the present embodiment, when the conductive fluid material 13 is a metal conductive paste, it includes solder paste, silver paste, copper paste or other suitable metal material. When the conductive fluid material 130 is a polymer conductive material, it comprises a composite south molecular conductive material or a structural south molecular conductive material, wherein the composite polymer conductive material is made of a general polymer material and various conductive materials 9 0807007 29mtwf.d〇 c/n substance 迺 填充 填充 填充 填充 填充 填充 填充 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合 复合Conductive film, etc. Electro-adhesives, even with the type of conductive filler selected: the performance of the molecular material of the sub-conducting material (4) is more dispersed, and its state is higher in carbon black, metal powder, gold', and strontium in high fillers. Commonly used conductive materials, structural polymer conductive materials, such as fibers, carbon fibers and the like. After doping, it has a conductive structure, and the molecular structure itself or the type of the sub-material includes the selected high-grade phenyl sulfide (PPS), poly-concentration, dimerized sulfur nitride, polypyrrole, poly-W Principle, structure type; branching: material: sputum and so on. To the molecular material and ion-conducting high eight, the structure of the electronically conductive material of the 7-knife is characterized by a line; or the surface: the large-scale conductive polymer acts through a total of 1 electrons to correct the system, in heat or light Generally in the scope of semiconductors. This, conductive 'and conductivity - material conductivity __, ====, can make this kind of conductivity can be increased by 12 orders of magnitude, but also a small amount of moth, sulfur, can be converted into a polymer body at ultra-low temperature The gasification after the rubbing is followed by, after the printing, the current body material 130 is after the defect 122a, the energy can be converted into the solid conductive fluid material 130. Flowing through the dielectric layer _ embossing 130 辕 ^ Γ 当 When performing a glowing step, the conductive fluid material can be converted into a solid complaint and completely adhered to the line 1 service. So far, the repair of the line 120c of the buried circuit board 100 has been completed 1377884 0807007 29l71twf.doc/n. It is clear that in the present embodiment, in the conductive fluid material, the method is a baking step, but in other embodiments, the conductive fluid material 13G is used, and the V-electrode material 13 〇 is converted into a different manner. In the solid state, the metal material is dried up, and the conductive fluid material 130 can be converted into a solid state by curing the germanium by an ultraviolet light. The repairing method of the embedded circuit board of the present invention is to print the conductive fluid material 130 on the line 12〇c with the defect 122a by means of printing, since the line 12〇c is located The electric layer ιι〇 ' 1140 'so when the conductive fluid material is printed on the defect / 2a, the conductive fluid material 13 〇 can flow in the intaglio pattern I", and then the conductive fluid material 13〇 is transformed by the baking step In the solid state, the repair of the line 12 (k) can be completed. Therefore, the repair method of the new circuit board of the present embodiment can reduce the overflow of the conductive fluid material 130, and can also reduce the new circuit board. Waste of production cost. The following will exemplify the circuit of the other various different types of defects of the present invention. FIG. 2A is a schematic diagram of a defect in the embodiment of the present invention = a top view. Please refer to FIG. 2A and FIG. 1C simultaneously. In this embodiment, the line 120d having the defect 122b of FIG. 2A is similar to the line 120c having the defect 122a of FIG. 1C, but the main difference is that the defect 122b of the line 12〇d of FIG. 2A is a notch, and this The shape of the notch is a triangle. Figure 2B is a schematic enlarged plan view of a circuit having defects according to another embodiment of the present invention. Please refer to FIG. 2B and FIG. 1C simultaneously, in this embodiment, 1377884 0807007 29171twf.d〇c/n The line 12〇e with the defect 122c of FIG. ZB is similar to the line 120c of the figure 122a, but the main difference between the two is that the defect of me is both a notch, and the shape of the notch is township B. It must be noted that although the defects i2〇c, md, 12Ge mentioned in Fig. 1 (Fig. 2A) are defective, ΐ2θ%, the heart is embodied as a notch, and the shapes of the notches are respectively round. Shape, trigonometry, and rectangular shape, but in other embodiments not shown, the line can also be an irregularly shaped notch as long as the line is in the intaglio pattern of the dielectric layer, that is, the line is For the buried line, you can use: the repair method of the embedded circuit board to repair the "line" and therefore, the gap history described in Figure 1C, Figure 2, and Figure 2 is only an example, the present invention Not limited to this. 招 3t is the other part of the invention For example, referring to FIG. 3A and FIG. 1C, in the present embodiment, 122 ^ has the defect (4) and the line 1L has the defect = line 120c is similar to both. The main difference is that: Figure 3A = road read defect 122d is a fracture, and the cross-sectional shape of the fracture is full of f I Lin's invention of the age of the squatting line of the listening line. Please refer to the figure at the same time. 3B and FIG. 3a, in the present embodiment, the line 12〇g of the defective 1226 of 122d is similar to the line u〇f of the defect== of FIG. 3A, but the main difference between the two is that FIG. 3 is a circular arc shape. The defect of 12〇g is both a fracture, and the sectional shape of the fracture is 1377884 0807007 2917 ltwf.doc/n

Figure 3C is a top plan enlarged view of a defective circuit in accordance with another embodiment of the present invention. Referring to FIG. 3C and FIG. 3A simultaneously, in the present embodiment, the line 120h having the defect i22f of FIG. 3C is similar to the line n〇f having the defect 122d of FIG. 3A, but the main difference is that: FIG. 3C The defect 122f of the line 120h is a fracture, and the sectional shape of the fracture is a wedge shape.

Fig. 3D is a schematic enlarged plan view showing a defective circuit of another embodiment of the present invention. Referring to FIG. 3d and FIG. 3A simultaneously, in the present embodiment, the line I20i having the defect i22g of FIG. 3D is similar to the line 12〇f having the defect 122d of FIG. 3A, but the main difference between the two is: the line of the figure The defect I22g of 120i is a fracture, and the sectional shape of the fracture is irregular.

▲ 仵 仵 ▲ ▲ ▲ ▲ 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 122 (4) The defect is shaped as a gap. The defects 122d, l22e, 22f and I22g of FIGS. 3A, 3B, 3C and 3D are embodied as fractures, but in other embodiments not shown, = _ The line is located in the _ _ of the dielectric layer, that is, the Ϊ 丝 丝 埋 埋 , , , , , , , , , , 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本 本The technical solution does not depart from the scope of the invention as intended. The above-mentioned method of the buried circuit board of the present invention is mainly a line which is trapped by printing, for repairing (4) the printing of the body material with the missing/compensating line, thereby reducing the waste of production cost. 13 1377884 0807007 29171twf.doc/n In addition, since the line is located in the intaglio pattern of the dielectric layer, the conductive fluid material is printed in the absence of _, and the conductive fluid material can flow in the concave pattern to avoid overflow. The situation. The present invention has been disclosed in the above embodiments, but it is not the present invention. Any subject matter of the technical field of the present invention can be made without any departure from the spirit and scope of the present invention. The protection of the fine is attached to the _ _ patent parade defined.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A to Fig. 1B are cross-sectional views showing a method of repairing a circuit of a board of the present invention. In-line, line-up Amplification of the local circuit of the embedded circuit board of the _ 1β _ 1β enlarged view: meaning: a view of the defective line of the embodiment of the present invention

视视:: 意 ί 本 本 本 本 本 本 本 本 本 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 A plan view of a defective circuit of another embodiment of the present invention is placed in a plan view of a defective circuit of another embodiment of the present invention: a line of a defective circuit of another embodiment of the present invention 14 1377884 0807007 29171twf.doc/n [Description of main component symbols] 100: embedded circuit board 110: dielectric layer 112: surface 114: intaglio patterns 120a to 120i: lines 122a to 122g: defect 130: conductive fluid material

Claims (1)

1377884 0807007 29171 twf.doc/π X. Applying for a patent garden: Providing a method of supplementing 'includes: with a plurality of lines, the dielectric layer has a buried circuit board including - the dielectric layer is located in the concave _ two cut: , the lines are trapped; and / two green roads have at least one missing line. , h p | material material in the defect to repair the 2. If the method of repairing the road described in the patent application stipulates, the conductive conductive material is injected. The core is a conductive paste or a high-circle 2nd tear, wherein the metal conductive paste includes solder paste, silver paste = 2 pin-shaped insert wire of Xilu = wire conductive material; 1 == material includes composite polymer The line of the embedded circuit board described in item 4 of the patent application scope of the road taxi = the application of the composite polymer road material in which the composite polymer conductive material is composited or laminated. The wire-shaped circuit of the embedded circuit board according to the fourth aspect of the patent scope, wherein the material of the composite polymer conductive material comprises a τ leaf rubber, a fiber fabric, a resin coating or an adhesive. 7. The method of repairing an embedded circuit according to claim 5, wherein the conductive filler comprises carbon black, metal powder U 16 1377884 0807007 29l7ltwf.doc/n ν ό, metal fiber or carbon fiber. 8. The method for repairing a circuit of an embedded circuit board according to claim 4, wherein the material of the structural polymer conductive material comprises acetylene material, polysulfurnitride, polyfluorene, polyphenylene sulfide Ether, polyphthalonitrile, polyaniline or polybenzazole. 9. The method for repairing a circuit of a buried circuit board according to the invention of claim 2, wherein the printing of the conductive fluid material after the defect is printed, including: A baking step is performed to convert the electrically conductive fluid material into a solid state. 10. The method for repairing a circuit of a buried circuit board according to the above aspect of the invention, wherein the printing the conductive fluid material after the defect is printed, comprising: performing an ultraviolet light curing step, In order to make the conductive fluid material solid. U inch will be the same as La Chen. _ 1 line of the circuit board or method, wherein the defect is selected from any one of σ or σ Line 2 = the angle of the embedded circuit board described in Item 11. / method, wherein the shape of the notch comprises a shape of a buried circuit board or a wedge shape of a circle, a rectangle or a three-wire two=11 item, wherein the sectional shape of the fracture σ includes a circular arc shape and a second moment of the moment Between the lines of the embedded circuit board. DX two lines have line widths from 5 microns to 50 microns 17