CN101737760B - Watertightness packaging method of LED illumination module - Google Patents
Watertightness packaging method of LED illumination module Download PDFInfo
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- CN101737760B CN101737760B CN2009102142881A CN200910214288A CN101737760B CN 101737760 B CN101737760 B CN 101737760B CN 2009102142881 A CN2009102142881 A CN 2009102142881A CN 200910214288 A CN200910214288 A CN 200910214288A CN 101737760 B CN101737760 B CN 101737760B
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Abstract
The invention relates to a watertightness packaging method of an LED illumination module, comprising an LED illumination module (1) and a glass lamp shade (2), wherein the LED illumination module (1) comprises a sealing connector lug (4) and a metal heat sink (5). The watertightness packaging method is characterized by comprising the following step of: carrying out watertightness sealing on an interface positioned between the metal heat sink (5) and the glass lamp shade (2) by utilizing a glass-metal sizing mixture (9) melting and adhering principle. The invention can meet the outdoor illumination requirements of the LED illumination module, reduce the infiltration of moisture and water vapour, enhance the reliability and the durability of the LED illumination module, enable the LED illumination module to have longer service life and prevent the earlier failure of the LED illumination module.
Description
Technical field
The present invention relates to a kind of method for encapsulating water tightness of LED lighting module.
Background technology
Light emitting diode (LED) is a kind of electroluminescent device that utilizes semiconductor fabrication processing, and its luminescence mechanism is to utilize the compound action in electronics and hole to produce photon.This compound action in theory can be near 100% quantum efficiency under electric current that continues and stable driven.The mode that this electricity injects can also be avoided big Stokes shift, thereby LED has the luminous efficiency height, and colour rendering is good, and power consumption is few, energy-conserving and environment-protective, and security reliability is high, the advantage of long service life.
Since first blue-light LED chip succeeded in developing, mainly contain two kinds of technology of obtaining white light LEDs at present, a kind of is to utilize high brightness InGaN blue chip to excite yttrium aluminium garnet fluorescent powder (YAG:Ce
3+) obtain the technology of white light LEDs, a kind of is to utilize InGaN ultraviolet chip to excite the RGB three primary colors fluorescent powder to obtain the technology of white light LEDs.Wherein the mode of blue-ray LED+yellow fluorescent powder develops very rapidly because technology is simple, cost of manufacture is low, and technical merit improves constantly, and has occurred the white light LEDs of 100lm/W on the market.Based on the semiconductor lighting of high-power and high-luminance white light LEDs, be about to replace incandescent and fluorescent lamp, become the 4th generation lighting source.
High-brightness white-light LED has begun to be applied to many lighting fields, for example indoor LED lighting bulb, LED plate lighting, outdoor LED street lamp, LED Tunnel Lamp etc. at present.But; In the application of LED illuminating product; Especially in outdoor environment, receive the influence of factors such as temperature, steam, moisture and outdoor rain drop erosion, the air-tightness of LED illuminating product itself and water proofing property have become a key factor that influences the LED illuminating product life-span.When moisture, steam even water get into lamp body when inner, metal generation chemical reaction that can be inner with lamp body generates some impurity and attached to the surface of lamp body, thus the illuminating effect of the whole lamp of influence.After illuminating product receives the influence time of these poor environment factors long; Steam possibly cause opening circuit of internal circuit or short circuit; Also can cause the inner LED luminescent device of lamp body decay too early even inefficacy to occur, thereby finally cause the dead lamp that the LED illuminating product is too early.
Therefore, the LED illuminating product being carried out strict airtight and waterproofing design, is very important to avoid the receiving influence of moisture, steam etc.The mode that general LED illuminating product adopts mechanical fixation to add rubber weather strip more realizes airtight and waterproof, and still, actual effect confirms that this kind method can not effectively realize watertightness truly.In most LED illuminating products, adopt aforesaid way all can make on the lampshade of LED illuminating product, to be attached with the impurity that receives moisture, influence of moisture and generate.In the process of long-time rain drop erosion, the same seepage problem that exists to a certain extent.
Summary of the invention
The technical problem that the present invention will solve is, a kind of method for encapsulating water tightness that can satisfy the LED lighting module outdoor lighting requirement, long service life, good seal performance is provided.
The method for encapsulating water tightness of a kind of LED lighting module of the present invention comprises LED lighting module and glass lamp shade; The LED lighting module comprises the metal heat sink that contains the sealed wiring head, and on metal heat sink, is pasted with led module or led chip; It is characterized in that comprising following encapsulation step:
A. glass lamp shade and metal heat sink are fixed with lampshade anchor clamps and heated jig respectively;
B. the sealing position brushing one deck glass metal mixed slurry on metal heat sink or glass lamp shade;
C. aim at glass lamp shade and metal heat sink;
D. close tight lampshade anchor clamps and heated jig, make the glass metal mixed slurry be evenly distributed in the contact site of glass lamp shade and metal heat sink on the metal heat sink thereby make glass lamp shade be pressed in;
E. utilize the local heat mode from the back side sealing position of metal heat sink to be rapidly heated and keep a period of time through heated jig; Make the glass metal mixed slurry fusing between glass lamp shade and the metal heat sink; The glass metal mixed slurry of fusing is filled in the contact slit between glass lamp shade and the metal heat sink; And the metal in the glass metal mixed slurry of fusing sinks and bonds with metal heat sink; Melten glass in the glass metal mixed slurry of fusing then floats and is bonded together with glass lamp shade, and this moment, the glass metal mixed slurry then changed melten glass metal composite tack coat into;
F. after realizing boning fully when the fusing fully of glass metal mixed slurry, and with glass lamp shade and metal heat sink, stop local heat, the melten glass metal composite tack coat between glass lamp shade and the metal heat sink is slowly cooled off;
G. unclamp lampshade anchor clamps and heated jig, take out through the LED of good seal lighting module;
H. install and fix ring in the outside, sealing position of the LED of good seal lighting module, keep the relative position between glass lamp shade and the metal heat sink.
Described encapsulation step is in vacuum environment or non-vacuum environment, to encapsulate; In vacuum environment, be packaged with minimizing is easy to generate micro-bubble at regional area in glass metal slurry fusion process the problem that is beneficial to; Thereby promote the whole watertightness of lighting module; Can significantly reduce simultaneously the moisture content in the sealed glass lampshade, avoid the corrosion of the metal devices such as circuit in the steam illumination module, promote the life-span of lighting module; When in non-vacuum environment, encapsulating, need after accomplishing above-mentioned encapsulation, to insert silica gel in the space between glass lamp shade and metal heat sink.
When mounting led chip on the described metal heat sink, need in the space between glass lamp shade and the metal heat sink, insert silica gel; Silica gel is in order to realize the protection to led chip.
Said silica gel is gel or elastomer, the tool high transmission rate.
Advantage of the present invention is to satisfy the outdoor lighting requirement of LED lighting module, reduces the infiltration of moisture and steam, improves the reliability and the durability of lighting module, has the longer life-span, avoids the initial failure of lighting module.
Description of drawings
Fig. 1 is the sketch map of encapsulation step A of the present invention;
Fig. 2 is the sketch map of encapsulation step B of the present invention, C;
Fig. 3 is the sketch map of encapsulation step D of the present invention;
Fig. 4 is the sketch map of encapsulation step E of the present invention;
Fig. 5 is the sketch map of encapsulation step F of the present invention, G, H;
The specific embodiment
Below in conjunction with the description of drawings embodiments of the invention.
Referring to Fig. 1, the method for encapsulating water tightness of a kind of LED lighting module of the present invention comprises LED lighting module 1 and glass lamp shade 2; LED lighting module 1 comprises the metal heat sink 5 that contains sealed wiring head 4, on metal heat sink 5, is pasted with led module 3; Concrete encapsulation step is following:
A. respectively metal heat sink 5 and glass lamp shade 2 are clamped with heated jig 7 and lampshade anchor clamps 8, at this moment, heated jig 7 does not begin heating.
B. referring to Fig. 2; Sealing position brushing one deck glass metal mixed slurry 9 on metal heat sink 5; The lead-free glass powder that for example contains 30～40%Sn96.5/Ag3.5 nano-metal particle, the size of glass metal mixed slurry 9 should be suitable with the contact area of glass lamp shade 2 and metal heat sink 5.
C. utilize lampshade anchor clamps 8 and heated jig 7 that glass lamp shade 2 and metal heat sink 5 are aimed at.
D. referring to Fig. 3, slowly move lampshade anchor clamps 8 downwards, make between glass lamp shade 2 and the metal heat sink 5 to compress, glass metal mixing oar material 9 is evenly spread out between glass lamp shade 2 and metal heat sink 5.
E. referring to Fig. 4; Heated jig 7 begins heating, and for the temperature of controlling heating region does not have influence on the led module 3 on the metal heat sink 5, heated jig 7 keeps programming rate faster; Fast Heating is carried out to glass metal mixed slurry 9 in sealing position through metal heat sink 5, to realize bonding.In intensification and insulating process; 9 fusings of glass metal mixed slurry; The glass metal mixed slurry 9 of fusing is filled in the contact slit between glass lamp shade 2 and the metal heat sink 5; And the metal section and part in the glass metal mixed slurry 9 of fusing sinks and metal heat sink 5 bondings, and the come-up of the melten glass in the glass metal mixed slurry 9 of fusing is bonded together with glass lamp shade 2, and 9 of glass metal mixed slurries change melten glass metal composite tack coat 10 at this moment.
F. referring to Fig. 5,, and after realizing fully bonding with glass lamp shade 2 and metal heat sink 5, stop local heat when glass metal mixed slurry 9 fusing fully; Melten glass metal composite tack coat 10 between glass lamp shade 2 and the metal heat sink 5 is slowly cooled off.
G. unclamp lampshade anchor clamps 8 and heated jig 7, take out through the LED of good seal lighting module.
H. install and fix ring 11 in the outside, sealing position of the LED of good seal lighting module,, keep lighting module good reliability in use with the relative position between fixing glass lampshade 2 and the metal heat sink 5.
Claims (5)
1. the method for encapsulating water tightness of a LED lighting module comprises LED lighting module (1) and glass lamp shade (2); LED lighting module (1) comprises the metal heat sink (5) that contains sealed wiring head (4); It is characterized in that comprising following encapsulation step:
A. use lampshade anchor clamps (8) and heated jig (7) to fix respectively glass lamp shade (2) and metal heat sink (5);
B. the sealing position brushing one deck glass metal mixed slurry (9) on metal heat sink (5) or glass lamp shade (2), said glass metal mixed slurry (9) is for containing the lead-free glass powder of 30～40%Sn96.5/Ag3.5 nano-metal particle;
C. aim at glass lamp shade (2) and metal heat sink (5);
D. close tight lampshade anchor clamps (8) and heated jig (7), make glass lamp shade (2) be pressed in metal heat sink (5) thereby go up to make glass metal mixed slurry (9) be evenly distributed in the contact site of glass lamp shade (2) and metal heat sink (5);
E. utilize the local heat mode from the back side sealing position of metal heat sink (5) to be rapidly heated and keep a period of time through heated jig (7); Make glass metal mixed slurry (9) fusing between glass lamp shade (2) and the metal heat sink (5); The glass metal mixed slurry (9) of fusing is filled in the contact slit between glass lamp shade (2) and the metal heat sink (5); And the motlten metal in the glass metal mixed slurry (9) of fusing sinks and metal heat sink (5) bonding; And the come-up of the melten glass in the glass metal mixed slurry (9) of fusing is bonded together with glass lamp shade (2), and glass metal mixed slurry this moment (9) then changes melten glass metal composite tack coat (10) into;
F. when glass metal mixed slurry (9) fusing fully; And after realizing fully bonding with glass lamp shade (2) and metal heat sink (5); Stop local heat, make the slowly cooling of melten glass metal composite tack coat (10) between glass lamp shade (2) and the metal heat sink (5);
G. unclamp lampshade anchor clamps (8) and heated jig (7), take out through the LED of good seal lighting module;
H. install and fix ring (11) in the outside, sealing position of the LED of good seal lighting module, keep the relative position between glass lamp shade (2) and the metal heat sink (5).
2. the method for encapsulating water tightness of a kind of LED lighting module according to claim 1 is characterized in that: described encapsulation step is in vacuum environment or non-vacuum environment, to encapsulate.
3. the method for encapsulating water tightness of a kind of LED lighting module according to claim 2; It is characterized in that: described encapsulation step is when in non-vacuum environment, encapsulating, and needs insert silica gel accomplishing in the space of watertightness encapsulation back between glass lamp shade (2) and metal heat sink (5).
4. the method for encapsulating water tightness of a kind of LED lighting module according to claim 1 is characterized in that: on described metal heat sink (5), be pasted with led module (3) or led chip.
5. the method for encapsulating water tightness of a kind of LED lighting module according to claim 4 is characterized in that: when on described metal heat sink (5), mounting led chip, need in the space between glass lamp shade (2) and the metal heat sink (5), insert silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102142881A CN101737760B (en) | 2009-12-28 | 2009-12-28 | Watertightness packaging method of LED illumination module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009102142881A CN101737760B (en) | 2009-12-28 | 2009-12-28 | Watertightness packaging method of LED illumination module |
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| Publication Number | Publication Date |
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| CN101737760A CN101737760A (en) | 2010-06-16 |
| CN101737760B true CN101737760B (en) | 2012-08-22 |
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| CN2009102142881A Active CN101737760B (en) | 2009-12-28 | 2009-12-28 | Watertightness packaging method of LED illumination module |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103513447A (en) * | 2012-06-20 | 2014-01-15 | 苏州工业园区赫光科技有限公司 | Transient heating device for removing IC from liquid crystal display |
| CN109099352B (en) * | 2018-07-11 | 2021-07-20 | 浙江君运能源科技有限公司 | Bury lamp with remove water smoke function |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3784807A (en) * | 1971-09-17 | 1974-01-08 | Philips Corp | Electric lamp |
| CN1427487A (en) * | 2001-12-20 | 2003-07-02 | 翰立光电股份有限公司 | Packaging structure of display element and its packaging method |
| CN1973348A (en) * | 2004-06-23 | 2007-05-30 | 株式会社东芝 | Image display apparatus and process for producing the same |
| CN101473424A (en) * | 2006-06-20 | 2009-07-01 | 英特尔公司 | Bulk metallic glass solders, foamed bulk metallic glass solders, foamed- solder bond pads in chip packages, methods of assembling same and systems containing same |
| CN201359210Y (en) * | 2008-12-26 | 2009-12-09 | 黄金鹿 | Lens integrated LED light source module |
-
2009
- 2009-12-28 CN CN2009102142881A patent/CN101737760B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3784807A (en) * | 1971-09-17 | 1974-01-08 | Philips Corp | Electric lamp |
| CN1427487A (en) * | 2001-12-20 | 2003-07-02 | 翰立光电股份有限公司 | Packaging structure of display element and its packaging method |
| CN1973348A (en) * | 2004-06-23 | 2007-05-30 | 株式会社东芝 | Image display apparatus and process for producing the same |
| CN101473424A (en) * | 2006-06-20 | 2009-07-01 | 英特尔公司 | Bulk metallic glass solders, foamed bulk metallic glass solders, foamed- solder bond pads in chip packages, methods of assembling same and systems containing same |
| CN201359210Y (en) * | 2008-12-26 | 2009-12-09 | 黄金鹿 | Lens integrated LED light source module |
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| CN101737760A (en) | 2010-06-16 |
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| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hunan Yiyuan Photoelectric Technology Co., Ltd. Assignor: Guangdong Shaoxin Opto-electrical Technology Co., Ltd. Contract record no.: 2011430000048 Denomination of invention: Watertightness packaging method of LED illumination module License type: Exclusive License Open date: 20100616 Record date: 20110421 |
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Effective date of registration: 20210826 Address after: 528200 unit 601, floor 6, block a, Jingu Zhichuang industrial community, No. 2, Yong'an North Road, Dawei community, Guicheng Street, Nanhai District, Foshan City, Guangdong Province Patentee after: GUANGDONG REAL FAITH LIGHTING TECHNOLOGY Co.,Ltd. Address before: 528521, Guangdong, Foshan City, Nanhai District, Ping Chau sand tail Bridge Industrial West Patentee before: GUANGDONG REAL FAITH OPTO-ELECTRONIC Co.,Ltd. |
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