CN101788136A - Water-tightness encapsulating method for LED lighting module by low melting-point metal - Google Patents
Water-tightness encapsulating method for LED lighting module by low melting-point metal Download PDFInfo
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- CN101788136A CN101788136A CN200910214287A CN200910214287A CN101788136A CN 101788136 A CN101788136 A CN 101788136A CN 200910214287 A CN200910214287 A CN 200910214287A CN 200910214287 A CN200910214287 A CN 200910214287A CN 101788136 A CN101788136 A CN 101788136A
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Abstract
The invention provides a water-tightness encapsulating method for an LED lighting module by low melting-point metal, which comprises the LED lighting module (1) and a glass lampshade (2). The LED lighting module (1) comprises a metal heat sink (5) with a sealed wire nipple (4). The encapsulating method is characterized in that water-tightness sealing is carried out on an interface between the metal heat sink (5) and the glass lampshade (2) by utilizing the fusion bonding principle of the low melting-point metal. The advantages of the encapsulating method are as follows: the outdoor lighting requirement of the LED lighting module can be met, the seepage of dampness and moisture is reduced, the reliability and durability of the LED lighting module are improved, the service life of the LED lighting module is longer, and the early failure of the LED lighting module is avoided.
Description
Technical field
The present invention relates to a kind of with the method for encapsulating water tightness of low-melting-point metal to the LED lighting module.
Background technology
Light emitting diode (LED) is a kind of electroluminescent device that utilizes semiconductor fabrication processing, and its luminescence mechanism is to utilize the compound action in electronics and hole to produce photon.This compound action in theory can be near 100% quantum efficiency under the electric current that continues and stable voltage drive.The mode that this electricity injects can also be avoided big Stokes shift, thereby LED has the luminous efficiency height, and colour rendering is good, and power consumption is few, energy-conserving and environment-protective, security reliability height, the advantage of long service life.
Since first blue-light LED chip succeeded in developing, mainly contain two kinds of technology of obtaining white light LEDs at present, a kind of is to utilize high brightness InGaN blue chip to excite yttrium aluminium garnet fluorescent powder (YAG:Ce
3+) obtain the technology of white light LEDs, a kind of is to utilize InGaN ultraviolet chip to excite the RGB three primary colors fluorescent powder to obtain the technology of white light LEDs.Wherein the mode of blue-ray LED+yellow fluorescent powder develops very rapidly because technology is simple, cost of manufacture is low, and technical merit improves constantly, and has occurred the white light LEDs of 100lm/W on the market.Based on the semiconductor lighting of high-power and high-luminance white light LEDs, be about to replace incandescent and fluorescent lamp, become the 4th generation lighting source.
High-brightness white-light LED has begun to be applied to many lighting fields, for example indoor LED lighting bulb, LED plate lighting, outdoor LED street lamp, LED Tunnel Lamp etc. at present.But, in the application of LED illuminating product, especially in outdoor environment, be subjected to the influence of factors such as temperature, steam, moisture and outdoor rain drop erosion, the air-tightness of LED illuminating product itself and water proofing property have become a key factor that influences the LED illuminating product life-span.When moisture, steam even water enter lamp body when inner, can with the metal generation chemical reaction of lamp body inside, generate some impurity and attached to the surface of lamp body, thus the illuminating effect of the whole lamp of influence.After illuminating product is subjected to the influence time of these poor environment factors long, steam may cause opening circuit of internal circuit or short circuit, also can cause the LED luminescent device of lamp body inside decay too early even inefficacy to occur, thereby finally cause the dead lamp that the LED illuminating product is too early.
Therefore, the LED illuminating product being carried out strict airtight and waterproofing design, is very important to avoid the being subjected to influence of moisture, steam etc.The mode that general LED illuminating product adopts mechanical fixation to add rubber weather strip more realizes airtight and waterproof, and still, actual effect confirms that this kind method can not effectively realize watertightness truly.In most LED illuminating products, adopt aforesaid way all can make on the lampshade of LED illuminating product, to be attached with the impurity that is subjected to moisture, influence of moisture and generates.In the process of long-time rain drop erosion, the same seepage problem that exists to a certain extent.
Summary of the invention
The technical problem to be solved in the present invention is, provide a kind of can satisfy the outdoor lighting requirement, long service life, good seal performance with the method for encapsulating water tightness of low-melting-point metal to the LED lighting module.
For addressing the above problem, of the present invention with the method for encapsulating water tightness of low-melting-point metal to the LED lighting module, comprise LED lighting module and glass lamp shade; The LED lighting module comprises the metal heat sink that contains the sealed wiring head; It is characterized in that comprising following encapsulation step:
A. the sealing position on glass lamp shade and metal heat sink is respectively with sputter or evaporation mode deposition layer of metal film; The double layer of metal film can be a metal material of the same race, or the metal material of different qualities.
B. glass lamp shade and metal heat sink are fixed with lampshade anchor clamps and heated jig respectively;
C. the low-melting sheet metal of one deck is placed at the sealing position on metal heat sink or glass lamp shade;
D. aim at glass lamp shade and metal heat sink;
E. close tight glass lamp shade anchor clamps and heated jig, make the Glass lamp cover cap on metal heat sink and compress sheet metal;
F. utilize the local heat mode from the back side sealing position of metal heat sink to be rapidly heated and keep a period of time by heated jig, make the sheet metal fusing between glass lamp shade and the metal heat sink, the molten metal sheet simultaneously with glass lamp shade and metal heat sink on metallic film begin to carry out frit reaction, change the melt metal layer into, realize the eutectic bonding of atom level;
G. when sheet metal fusion fully, and with glass lamp shade and metal heat sink on metallic film realize complete bonding after, stop local heat, making between glass lamp shade and the metal heat sink, the melt metal layer slowly cools off;
H. unclamp glass lamp shade anchor clamps and heated jig, take out through the LED of good seal lighting module;
I. install and fix ring in the outside, sealing position of the LED of good seal lighting module, keep the relative position between glass lamp shade and the metal heat sink.
The quantity of described led chip or module is at least one, is particularly useful for large chip (＞1 * 1mm
2), the encapsulation of super large chip and multicore sheet (multimode) array.
Described encapsulation step is to encapsulate in vacuum environment or non-vacuum environment, be packaged with minimizing is easy to generate micro-bubble at regional area in low-temperature metal solder fusing process the problem that is beneficial in vacuum environment, thereby promote the whole watertightness of lighting module, can significantly reduce simultaneously the moisture content in the sealed glass lampshade, avoid the corrosion of steam, promote the life-span of lighting module the metal devices such as circuit in the lighting module; When in non-vacuum environment, encapsulating, need after finishing above-mentioned encapsulation step, to insert silica gel in the space between glass lamp shade and metal heat sink.
On described metal heat sink, be pasted with led module or led chip; When mounting led chip on the metal heat sink, need in the space between glass lamp shade and the metal heat sink, insert silica gel; Silica gel is in order to realize the protection to led chip.
Described silica gel is gel or elastomer, the tool high transmission rate.
Advantage of the present invention is to satisfy the outdoor lighting requirement of LED lighting module, reduces the infiltration of moisture and steam, improves the reliability and the durability of lighting module, has the longer life-span, avoids the initial failure of lighting module.
Description of drawings
Fig. 1 is the schematic diagram of encapsulation step A of the present invention;
Fig. 2 is the schematic diagram of encapsulation step B of the present invention;
Fig. 3 is the schematic diagram of encapsulation step C of the present invention, D;
Fig. 4 is the schematic diagram of encapsulation step E of the present invention;
Fig. 5 is the schematic diagram of encapsulation step F of the present invention;
Fig. 6 is the schematic diagram of encapsulation step G of the present invention, H, I;
The specific embodiment
Below in conjunction with the description of drawings embodiments of the invention.
Referring to Fig. 1, of the present invention with the method for encapsulating water tightness of low-melting-point metal to the LED lighting module, comprise LED lighting module 1 and glass lamp shade 2; LED lighting module 1 comprises the metal heat sink 5 that contains sealed wiring head 4, is pasted with led module 3 on metal heat sink 5; Concrete encapsulation step is as follows:
A. the sealing position on metal heat sink 5 and glass lamp shade 2 deposits last layer metallic film 6 respectively with modes such as evaporation, sputters, for example deposits last layer copper film with the sputter mode.
B. referring to Fig. 2, with heated jig 9 and lampshade anchor clamps 10 metal heat sink 5 and glass lamp shade 2 are clamped respectively, at this moment, heated jig 9 does not begin heating.
C. referring to Fig. 3, one deck low-melting-point metal sheet 11 is placed at the sealing position on metal heat sink 5, copper sheet for example, and the contact area of the size of sheet metal 11 and glass lamp shade 2 and metal heat sink 5 is suitable.
D. utilize lampshade anchor clamps 10 and heated jig 9 that glass lamp shade 2 and metal heat sink 5 are aimed at.
E. referring to Fig. 4, slow mobile lampshade anchor clamps 10 close tight lampshade anchor clamps 10 and heated jig 9 downwards, make glass lamp shade 2 cover on metal heat sink 5 and compress sheet metal 11.
F. referring to Fig. 5, heated jig 9 begins heating, and for the temperature of control heating region does not have influence on led module 3 on the metal heat sink 5, heated jig 9 keeps programming rate faster, Fast Heating is carried out to metallic film 6 and sheet metal 11 in sealing position by metal heat sink 5, to realize bonding.In intensification and insulating process, begin to carry out frit reaction between sheet metal 11 and the metallic film 6, change melt metal layer 12 into, realize the eutectic bonding of atom level.
G. referring to Fig. 6, when sheet metal 11 with metallic film 6 complete fusions, realize the sealing of glass lamp shade 2 and metal heat sink 5 after, stop local heat, making between glass lamp shade 2 and the metal heat sink 5, melt metal layer 12 slowly cools off.
H. unclamp lampshade anchor clamps 10 and heated jig 9, take out through the LED of good seal lighting module.
I. install and fix ring 13 in the outside, sealing position of the LED of good seal lighting module,, keep LED lighting module good reliability in use with the relative position between fixing glass lampshade 2 and the metal heat sink 5.
Claims (5)
1. one kind with the method for encapsulating water tightness of low-melting-point metal to the LED lighting module, comprises LED lighting module (1) and glass lamp shade (2); LED lighting module (1) comprises the metal heat sink (5) that contains sealed wiring head (4), it is characterized in that comprising following encapsulation step:
A. the sealing position on glass lamp shade (2) and metal heat sink (5) is respectively with sputter or evaporation mode deposition layer of metal film (6); Metallic film on each position (6) can be a metal material of the same race, or the metal material of different qualities;
B. use lampshade anchor clamps (10) and heated jig (9) to fix respectively glass lamp shade (2) and metal heat sink (5);
C. one deck low-melting-point metal sheet (11) is placed at the sealing position on metal heat sink (5) or glass lamp shade (2);
D. aim at glass lamp shade (2) and metal heat sink (5);
E. close tight lampshade anchor clamps (10) and heated jig (9), make glass lamp shade (2) cover and go up and compress sheet metal (11) at metal heat sink (5);
F. utilize the local heat mode from the back side sealing position of metal heat sink (5) to be rapidly heated and keep a period of time by heated jig (9), make sheet metal (11) fusing between glass lamp shade (2) and the metal heat sink (5), molten metal sheet (11) begins to carry out frit reaction simultaneously and between the metallic film (6) on glass lamp shade (2) and the metal heat sink (5), change melt metal layer (12) into, realize the eutectic bonding of atom level;
G. when sheet metal (11) fusion fully, and after realizing complete bonding with metallic film (6) on glass lamp shade (2) and the metal heat sink (5), stop local heat, make slowly cooling of melt metal layer (12) between glass lamp shade (2) and the metal heat sink (5);
H. unclamp lampshade anchor clamps (10) and heated jig (9), take out through the LED of good seal lighting module;
I. install and fix ring (13) in the outside, sealing position of the LED of good seal lighting module, keep the relative position between glass lamp shade (2) and the metal heat sink (5).
2. according to claim 1 with the method for encapsulating water tightness of low-melting-point metal to the LED lighting module, it is characterized in that: described encapsulation step is to encapsulate in vacuum environment or non-vacuum environment.
3. according to claim 2 with the method for encapsulating water tightness of low-melting-point metal to the LED lighting module, it is characterized in that: described encapsulation step is when encapsulating in non-vacuum environment, needs insert silica gel finishing in the space of watertightness encapsulation back between glass lamp shade (2) and metal heat sink (5).
4. according to claim 1 with the method for encapsulating water tightness of low-melting-point metal to the LED lighting module, it is characterized in that: on described metal heat sink (5), be pasted with led module (3) or led chip.
5. according to claim 4 with the method for encapsulating water tightness of low-melting-point metal to the LED lighting module, it is characterized in that: when on described metal heat sink (5), mounting led chip, need in the space between glass lamp shade (2) and the metal heat sink (5), insert silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200910214287A CN101788136A (en) | 2009-12-28 | 2009-12-28 | Water-tightness encapsulating method for LED lighting module by low melting-point metal |
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|---|---|---|---|
| CN200910214287A CN101788136A (en) | 2009-12-28 | 2009-12-28 | Water-tightness encapsulating method for LED lighting module by low melting-point metal |
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| CN101788136A true CN101788136A (en) | 2010-07-28 |
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| CN200910214287A Pending CN101788136A (en) | 2009-12-28 | 2009-12-28 | Water-tightness encapsulating method for LED lighting module by low melting-point metal |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019028557A1 (en) * | 2017-08-11 | 2019-02-14 | Crystal Fountains Holdings Inc. | Fully encapsulating lighting technology |
-
2009
- 2009-12-28 CN CN200910214287A patent/CN101788136A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019028557A1 (en) * | 2017-08-11 | 2019-02-14 | Crystal Fountains Holdings Inc. | Fully encapsulating lighting technology |
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Assignee: Hunan Yiyuan Photoelectric Technology Co., Ltd. Assignor: Guangdong Shaoxin Opto-electrical Technology Co., Ltd. Contract record no.: 2011430000048 Denomination of invention: Water-tightness encapsulating method for LED lighting module by low melting-point metal License type: Exclusive License Open date: 20100728 Record date: 20110421 |
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Application publication date: 20100728 |