CN101730447B - 散热装置组合 - Google Patents
散热装置组合 Download PDFInfo
- Publication number
- CN101730447B CN101730447B CN200810305076.XA CN200810305076A CN101730447B CN 101730447 B CN101730447 B CN 101730447B CN 200810305076 A CN200810305076 A CN 200810305076A CN 101730447 B CN101730447 B CN 101730447B
- Authority
- CN
- China
- Prior art keywords
- section
- radiating fin
- radiator
- radiating
- butting section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 3
- 238000005452 bending Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
- H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L2023/4075—Mechanical elements
- H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Connection Of Plates (AREA)
Abstract
Description
Claims (6)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810305076.XA CN101730447B (zh) | 2008-10-21 | 2008-10-21 | 散热装置组合 |
US12/328,783 US20100096106A1 (en) | 2008-10-21 | 2008-12-05 | Clip and heat sink assembly having the same |
JP2009229661A JP2010103523A (ja) | 2008-10-21 | 2009-10-01 | 固定具及び該固定具を使う放熱装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN200810305076.XA CN101730447B (zh) | 2008-10-21 | 2008-10-21 | 散热装置组合 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101730447A CN101730447A (zh) | 2010-06-09 |
CN101730447B true CN101730447B (zh) | 2013-06-05 |
Family
ID=42107695
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200810305076.XA Active CN101730447B (zh) | 2008-10-21 | 2008-10-21 | 散热装置组合 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20100096106A1 (zh) |
JP (1) | JP2010103523A (zh) |
CN (1) | CN101730447B (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103369930A (zh) * | 2013-07-10 | 2013-10-23 | 吴江市三元精密电子有限公司 | 一种组合型散热模块 |
CN109757119B (zh) * | 2017-09-05 | 2022-12-23 | 新电元工业株式会社 | 半导体装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5436798A (en) * | 1994-01-21 | 1995-07-25 | Wakefield Engineering, Inc. | Spring clip and heat sink assembly for electronic components |
CN1983577A (zh) * | 2005-12-12 | 2007-06-20 | 华信精密股份有限公司 | 适于散热装置的扣件 |
CN101072486A (zh) * | 2006-05-12 | 2007-11-14 | 富准精密工业(深圳)有限公司 | 散热器固定装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR980003088A (ko) * | 1996-06-22 | 1998-03-30 | 이종수 | 회로차단기의 고정장치 |
JP2005260499A (ja) * | 2004-03-10 | 2005-09-22 | Toshiba Corp | ディスプレイ装置 |
US20060144558A1 (en) * | 2004-12-30 | 2006-07-06 | Inventec Corporation | Fan-driven heat dissipating device with enhanced air blowing efficiency |
US7690418B2 (en) * | 2005-12-28 | 2010-04-06 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat sink |
CN100518475C (zh) * | 2006-06-02 | 2009-07-22 | 富准精密工业(深圳)有限公司 | 散热装置 |
-
2008
- 2008-10-21 CN CN200810305076.XA patent/CN101730447B/zh active Active
- 2008-12-05 US US12/328,783 patent/US20100096106A1/en not_active Abandoned
-
2009
- 2009-10-01 JP JP2009229661A patent/JP2010103523A/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5436798A (en) * | 1994-01-21 | 1995-07-25 | Wakefield Engineering, Inc. | Spring clip and heat sink assembly for electronic components |
CN1983577A (zh) * | 2005-12-12 | 2007-06-20 | 华信精密股份有限公司 | 适于散热装置的扣件 |
CN101072486A (zh) * | 2006-05-12 | 2007-11-14 | 富准精密工业(深圳)有限公司 | 散热器固定装置 |
Also Published As
Publication number | Publication date |
---|---|
JP2010103523A (ja) | 2010-05-06 |
US20100096106A1 (en) | 2010-04-22 |
CN101730447A (zh) | 2010-06-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: JIANGSU LIANZHONG CASING FILM CO., LTD. Free format text: FORMER OWNER: FUHUAI (SHENZHENG) PRECISION INDUSTRY CO., LTD. Effective date: 20141115 Free format text: FORMER OWNER: HONGZHUN PRECISION INDUSTRY CO., LTD. Effective date: 20141115 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 518109 SHENZHEN, GUANGDONG PROVINCE TO: 226500 NANTONG, JIANGSU PROVINCE |
|
TR01 | Transfer of patent right |
Effective date of registration: 20141115 Address after: 226500, Jiangsu City, Rugao Province, such as town Huimin Road No. 666 Patentee after: Jiangsu Lianzhong Casing Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Fuhuai (Shenzheng) Precision Industry Co., Ltd. Patentee before: Foxconn Precision Industry Co., Ltd. Effective date of registration: 20141115 Address after: 226500, Jiangsu City, Rugao Province, such as town Huimin Road No. 666 Patentee after: Jiangsu Lianzhong Casing Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Patentee before: Fuhuai (Shenzheng) Precision Industry Co., Ltd. Patentee before: Foxconn Precision Industry Co., Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170906 Address after: 226500, Jiangsu City, Rugao Province, such as town Huimin Road No. 666 Patentee after: Nantong Shuangshi Chemical Co., Ltd. Address before: 226500, Jiangsu City, Rugao Province, such as town Huimin Road No. 666 Patentee before: Jiangsu Lianzhong Casing Co., Ltd. Effective date of registration: 20170906 Address after: 226500, Jiangsu City, Rugao Province, such as town Huimin Road No. 666 Patentee after: Nantong Shuangshi Chemical Co., Ltd. Address before: 226500, Jiangsu City, Rugao Province, such as town Huimin Road No. 666 Patentee before: Jiangsu Lianzhong Casing Co., Ltd. |
|
TR01 | Transfer of patent right |
Effective date of registration: 20200426 Address after: 226500, Rugao City, Jiangsu province Nantong City, such as Huimin Road No. 666 Patentee after: JIANGSU LIANZHONG CASING Co.,Ltd. Address before: 226500, Jiangsu City, Rugao Province, such as town Huimin Road No. 666 Patentee before: NANTONG SHUANGSHI CHEMICAL Co.,Ltd. |
|
TR01 | Transfer of patent right |