CN101730383B - 印刷电路板 - Google Patents

印刷电路板 Download PDF

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CN101730383B
CN101730383B CN200810305118XA CN200810305118A CN101730383B CN 101730383 B CN101730383 B CN 101730383B CN 200810305118X A CN200810305118X A CN 200810305118XA CN 200810305118 A CN200810305118 A CN 200810305118A CN 101730383 B CN101730383 B CN 101730383B
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stitch
circuit board
printed circuit
pcb
perforation
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Expired - Fee Related
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CN101730383A (zh
Inventor
赖盈佐
黄宗胜
许寿国
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN200810305118XA priority Critical patent/CN101730383B/zh
Priority to US12/331,444 priority patent/US8089007B2/en
Publication of CN101730383A publication Critical patent/CN101730383A/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/114—Pad being close to via, but not surrounding the via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch or thickness; Using different connections on the pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

一种印刷电路板，其上设置有一电子元件，所述电子元件包括有若干与所述印刷电路板的参考层相连的针脚，流经所述若干个针脚的电流不尽相同，所述印刷电路板于邻近电流较小的针脚处设有至少一第一贯孔，于邻近电流较大的针脚处设有至少一第二贯孔，所述第一贯孔的直径大于所述第二贯孔的直径。上述印刷电路板可以使得上述电子元件的每个针脚的电流相对均匀分布。

Description

印刷电路板
技术领域
本发明涉及一种印刷电路板。
背景技术
印刷电路板上，电子元件的单一针脚可允许流过的电流有最高上限值，超过此上限值的电流极有可能造成针脚的铜壁熔毁，影响印刷电路板的可靠度。印刷电路板上的电源连接器为了要承受大量的电流负荷，通常会使用很多的针脚来分摊电流，然而由于印刷电路板上电流分布不均匀的原因，使得特定区域电流密度较高，从而使得在此区域的电源连接器的针脚的电流也较其他针脚高出许多。
发明内容
鉴于以上内容，有必要提供一种其上电子元件的针脚的电流相对均匀分布的印刷电路板。
一种印刷电路板，其上设置有一电子元件，所述电子元件包括有若干与所述印刷电路板的参考层相连的针脚，流经所述若干个针脚的电流不尽相同，所述印刷电路板于邻近电流较小的针脚处设有至少一第一贯孔，于邻近电流较大的针脚处设有至少一第二贯孔，所述第一贯孔的直径大于所述第二贯孔的直径。
上述印刷电路板通过设置若干不同直径的贯孔，利用贯孔的不同电阻值以及电流较易流向电阻值较小的区域的原理，可以使得所述电子元件的每个针脚的电流差距较小，能够改善所述印刷电路板上电子元件的针脚的电流分布状况。
附图说明
图1为一印刷电路板的示意图。
图2为本发明印刷电路板的较佳实施方式的示意图。
具体实施方式
下面结合附图及较佳实施方式对本发明作进一步详细描述。
请参考图1，一印刷电路板1上设置有一电源连接器(图未示)，所述电源连接器包括九个针脚P1-P9，所述九个针脚P1-P9均与所述印刷电路板1的电源层2相连，用于传输所述电源层2的电源信号给其他与所述电源连接器相连的电子元件(图未示)。
通过一仿真系统对所述印刷电路板1进行仿真，即可得到如表1所示的所述电源连接器的九个针脚P1-P9的电流分布图。
表1
Figure GDA0000097707460000021
从表1可以明显看到，流过所述针脚P1-P3的电流相当，流过所述针脚P4-P6的电流相当，流过所述针脚P7-P9的电流相当，且流过所述针脚P1-P3的电流、流过所述针脚P4-P6的电流以及流过所述针脚P7-P9的电流之间相差较大。上述现象即是由于所述印刷电路板上电流分布不均所造成的，所述针脚P1-P3所在的电源层区域、所述针脚P4-P6所在的电源层区域以及所述针脚P7-P9所在的电源层区域的电流密度依次递增。
为了改善印刷电路板上电源连接器的针脚的电流分布状况，请继续参考图2，本发明印刷电路板10的较佳实施方式上设置一电源连接器(图未示)以及若干贯孔，所述电源连接器包括九个针脚P11-P19，所述九个针脚P11-P19均与所述印刷电路板10的电源层20相连，用于传输所述电源层20的电源信号给其他与所述电源连接器相连的电子元件(图未示)。所述若干贯孔包括第一组贯孔12、第二组贯孔14以及第三组贯孔16，其中所述第一至第三组贯孔12、14、16的直径分别为R1、R2以及R3，且R1＞R2＞R3。所述第一组贯孔12设置于所述针脚P11-P13的周围；所述第二组贯孔14设置于所述针脚P14-P16的周围；所述第三组贯孔16设置于所述针脚P17-P19的周围。
根据贯孔的特性可知，贯孔的直径与其电阻值成反比，即直径较大的贯孔的电阻值较小，而直径较小的贯孔的电阻值较大。因此，所述第一组贯孔12、第二组贯孔14以及第三组贯孔16的电阻值依次递增。同时，由于电阻值越大，其对电流的阻碍作用就越大，因此，电流倾向于流向电阻值较小的区域。也就是说，所述印刷电路板10上的电流较易流向所述针脚P1-P3所位于电源层的区域。
同样，通过所述仿真系统对所述印刷电路板10进行仿真，即可得到如表2所示的所述电源连接器的九个针脚P11-P19的电流分布图。
表2
Figure GDA0000097707460000031
从表2可以看到，流过所述针脚P11-P13电流之间的差值在2％以内，流过所述针脚P14-P16电流之间的差值在2.6％以内，流过所述针脚P17-P19电流之间的差值在3.3％以内，且流过所述针脚P11-P13的电流、流过所述针脚P14-P16的电流以及流过所述针脚P17-P19的电流之间的差距明显小于表1中流过所述针脚P1-P3的电流、流过所述针脚P4-P6的电流以及流过所述针脚P7-P9的电流之间的差距。也就是说，所述印刷电路板10上所述电源连接器的九个针脚P11-P19的电流分布状况优于所述印刷电路板1上所述电源连接器的九个针脚P1-P9的电流分布状况。
本实施方式以设置一具有九个针脚P11-P19的电源连接器在所述印刷电路板10上为例进行说明，如果其他具有多个针脚的电子元件的针脚与所述印刷电路板10的其他参考层(如接地层)相连，其原理及效果与本实施方式相同。
上述印刷电路板10通过设置若干不同直径的贯孔，利用贯孔的不同电阻值以及电流较易流向电阻值较小的区域的原理，可以使得具有多个针脚的电子元件的针脚的电流差距较小，能够改善所述印刷电路板10上电子元件的针脚的电流分布状况。

Claims (6)

1.一种印刷电路板，其上设置有一电子元件，所述电子元件包括有若干与所述印刷电路板的参考层相连的针脚，流经所述若干个针脚的电流不尽相同，所述印刷电路板于邻近电流较小的针脚处设有至少一第一贯孔，于邻近电流较大的针脚处设有至少一第二贯孔，所述第一贯孔的直径大于所述第二贯孔的直径。
2.如权利要求1所述的印刷电路板，其特征在于：所述电子元件为一电源连接器。
3.如权利要求1或2所述的印刷电路板，其特征在于：所述参考层为电源层。
4.一种印刷电路板，其上设置有一电子元件，所述电子元件包括有一第一组及一第二组与所述印刷电路板的参考层相连的针脚，其中，流经所述第一组针脚中每一针脚的电流之间的差值在2％以内，流经所述第二组针脚的每一针脚的电流之间的差值在3.3％以内，且流经第二组中每一针脚的电流大于流经所述第一组针脚的电流，所述印刷电路板于邻近所述第一组针脚中的每一针脚处均设有至少一第一贯孔，于邻近所述第二组针脚中的每一针脚处均设有至少一第二贯孔，所述第一贯孔的直径大于所述第二贯孔的直径。
5.如权利要求4所述的印刷电路板，其特征在于：所述电子元件为一电源连接器。
6.如权利要求4或5所述的印刷电路板，其特征在于：所述参考层为电源层。
CN200810305118XA 2008-10-23 2008-10-23 印刷电路板 Expired - Fee Related CN101730383B (zh)

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CN200810305118XA CN101730383B (zh) 2008-10-23 2008-10-23 印刷电路板
US12/331,444 US8089007B2 (en) 2008-10-23 2008-12-10 Printed circuit board

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Publication number Priority date Publication date Assignee Title
JP6984441B2 (ja) * 2018-01-25 2021-12-22 富士通株式会社 基板及び電子装置
CN213991163U (zh) * 2020-10-23 2021-08-17 广东积微科技有限公司 一种接线端子的电控板、电控箱以及空调器

Citations (2)

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Publication number Priority date Publication date Assignee Title
CN1541047A (zh) * 2003-03-31 2004-10-27 ��˹̩�˹��ʹ�˾ 高电流输出引脚
CN101057377A (zh) * 2004-11-12 2007-10-17 Fci公司 两部件式中间背板

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US3243498A (en) * 1964-12-24 1966-03-29 Ibm Method for making circuit connections to internal layers of a multilayer circuit card and circuit card produced thereby
US3991347A (en) * 1975-01-31 1976-11-09 Amp Incorporated Plated-through hole soldering to filter body
US5036301A (en) * 1989-03-30 1991-07-30 Sony Corporation Filter apparatus
US6639154B1 (en) * 2000-10-10 2003-10-28 Teradyne, Inc. Apparatus for forming a connection between a circuit board and a connector, having a signal launch
JP4652230B2 (ja) * 2003-06-02 2011-03-16 日本電気株式会社 プリント回路基板用コンパクトビア伝送路およびその設計方法
JPWO2005074338A1 (ja) * 2004-01-29 2007-07-26 日本電気株式会社 回路基板
JP4682028B2 (ja) * 2005-11-28 2011-05-11 Ｈｏｙａ株式会社 導電層の製造方法、導電層、及び、信号伝送基板

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CN1541047A (zh) * 2003-03-31 2004-10-27 ��˹̩�˹��ʹ�˾ 高电流输出引脚
CN101057377A (zh) * 2004-11-12 2007-10-17 Fci公司 两部件式中间背板

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US20100101837A1 (en) 2010-04-29
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