CN101728397A - Active component array substrate and detection method thereof - Google Patents
Active component array substrate and detection method thereof Download PDFInfo
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- CN101728397A CN101728397A CN200810171194A CN200810171194A CN101728397A CN 101728397 A CN101728397 A CN 101728397A CN 200810171194 A CN200810171194 A CN 200810171194A CN 200810171194 A CN200810171194 A CN 200810171194A CN 101728397 A CN101728397 A CN 101728397A
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- active component
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Abstract
The invention relates to an active component array substrate and a detection method thereof. The active component array substrate is provided with a display area and a peripheral circuit area, and comprises a plurality of pixel units, a plurality of signal conductors, a plurality of detection pads and a first dielectric layer, wherein the pixel units are arranged in an array in the display area; the signal conductors and the detection pads are configured in the peripheral circuit area; and the first dielectric layer is covered on the detection pads. In the detection method of the active component array substrate, first, part of the first dielectric layer is removed to expose the detection pads to be in electrical contact with a detecting tool, i.e., before detection, the detection pads are electrically insulated from the outside, thus preventing static charges from causing static damage to the pixel units through the detection pads and the signal conductors, and improving the circuit stability of the active component array substrate.
Description
Technical field
The present invention relates to a kind of active component array base board and detection method thereof, particularly relate to and to prevent that static from wounding a kind of active component array base board and the detection method thereof of circuit by detecting pad.
Background technology
Because the active plane display floater has advantages such as little, the in light weight and reaction speed of volume is fast, therefore has been widely used in the various electronic products at present.The active plane display floater is made of active component array base board, display layer and transparent substrates, wherein display layer is between active component array base board and transparent substrates, as display panels (liquid crystal displaypanel, the electrophoretic layer of liquid crystal layer LCD panel), electrophoretic display panel (elector-phoretic displaypanel, EPD panel) etc.
Seeing also shown in Figure 1ly, is the schematic diagram of existing known active component array base board.Existing known active component array base board 100 has viewing area 102 and periphery circuit region 104, (pixel is called picture element again wherein to dispose a plurality of pixels in the viewing area 102, this paper all is called pixel) unit 110, then dispose many barss (or being called signal) lead 120 in the periphery circuit region 104, in order to the pixel cell 110 in the viewing area 102 is electrically connected to drive circuit 130.
Manufacture process with existing active plane display floater; after all circuit arrangement on finishing active component array base board 100; usually can then carry out electric circuit inspection confirm on the active component array base board 100 circuit whether defectiveness exist; therefore can be provided with detecting pad 140 in the periphery circuit region 104 of active component array base board 100; testing tool (as probe, figure do not show) promptly be by detecting pad 140 with active component array base board 100 on circuit electrically connect.
Yet, no matter be that manufacturing equipment, operating personnel and active component array base board 100 itself all may be accumulated many electrostatic charges.Therefore, when active component array base board 100 touches manufacturing equipment, operating personnel or other objects in manufacture process, these electrostatic charges often reach on the active component array base board 100 via these electrified bodies easily, and by the circuit of detecting pad 140 in signal conductor 120 reaches viewing area 102, thereby cause circuit in the viewing area 102 wounded by static and damage active component array base board 100.
Seeing also shown in Figure 2ly, is the generalized section of the active component array base board of Fig. 1 along I-I ' line.As shown in Figures 1 and 2, electrostatic charge on active component array base board 100 dissipates in the viewing area 102 by detecting pad 140, known techniques is to form dielectric layer 125 earlier on signal conductor 120, forms detecting pad 140 on the dielectric layer above the signal conductor 120 125.In other words, be separated with dielectric layer 125 between detecting pad 140 and the signal conductor 120, to avoid electrostatic charge directly by the circuit of detecting pad 140 in signal conductor 120 conducts to viewing area 102.Then be formed with dielectric layer 150 and conductive layer 160 on the detecting pad 140 in regular turn, and conductive layer 160 is to electrically connect with detecting pad 140 by the opening 152 of dielectric layer 150 with opening 152.When desiring to detect, can utilize laser welding detecting pad 140 and signal conductor 120, again testing tool is electrically contacted with conductive layer 160, can the circuit on the active component array base board 100 be detected.
Yet, (laser is called laser light again not utilizing laser, this paper all is called laser) before welding detecting pad 140 and the signal conductor 120, because detecting pad 140, dielectric layer 125 are to constitute capacitor C with signal conductor 120, though therefore electrostatic charge can directly not reach signal conductor 120 from detecting pad 140, but when accumulating too much electrostatic charge on the detecting pad 140, the phenomenon of electrostatic breakdown will take place in moment, thereby the circuit on the active component array base board 100 is caused bigger damage.
This shows that above-mentioned existing active component array base board and detection method thereof obviously still have inconvenience and defective, and demand urgently further being improved in product structure, detection method and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product and method do not have appropriate structure and method to address the above problem, and this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of new active component array base board and detection method thereof, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Summary of the invention
The objective of the invention is to, overcome the defective that existing active component array base board exists, and a kind of new active component array base board is provided, technical problem to be solved is to make it have low static to wound the low and high circuit stability of rate.
Another object of the present invention is to, overcome the defective that conventional detection exists, and a kind of new detection method is provided, technical problem to be solved is to make it wound rate with the static that reduces above-mentioned active component array base board, and then improves its circuit stability.
The object of the invention to solve the technical problems realizes by the following technical solutions.For achieving the above object,, have a viewing area and a periphery circuit region, and this active component array base board comprises a plurality of pixel cells, many signal conductor, a plurality of detecting pad and first dielectric layer according to a kind of active component array base board of the present invention.Wherein, above-mentioned pixel cell be with arranged in array mode in the viewing area, above-mentioned signal conductor and detecting pad then are to be disposed in the periphery circuit region, and first dielectric layer is to cover above-mentioned detecting pad.
In preferred embodiment of the present invention, above-mentioned each detecting pad all with one of them electric connection of above-mentioned signal conductor.
The object of the invention to solve the technical problems also adopts following technical scheme to realize.For achieving the above object, according to a kind of detection method of the present invention, be suitable for detecting above-mentioned active component array base board, this detection method is first dielectric layer that removes part earlier, to expose at least one detecting pad, then again testing tool is electrically contacted with the detecting pad that exposes.
In preferred embodiment of the present invention, the above-mentioned method that removes first dielectric layer of part comprises that laser removes.
The object of the invention to solve the technical problems also realizes in addition by the following technical solutions.For achieving the above object, in preferred embodiment of the present invention, said active element array substrate also comprises second dielectric layer and conductive layer, and wherein second dielectric layer is to be disposed between above-mentioned detecting pad and the signal conductor, and conductive layer then is to be disposed on first dielectric layer of detecting pad top.
The object of the invention to solve the technical problems realizes in addition more by the following technical solutions.To achieve the above object of the invention, a kind of detection method according to the present invention's proposition, be suitable for detecting above-mentioned active component array base board, this detection method is that one of them is welded together at least with conductive layer and above-mentioned detecting pad, and the detecting pad that will be welded to conductive layer is welded together with the signal conductor that is positioned at its below.Afterwards, testing tool is electrically contacted with above-mentioned conductive layer.
In preferred embodiment of the present invention, the method for welding conductive layer and detecting pad comprises laser welding.
In preferred embodiment of the present invention, the method for welding detecting pad and signal conductor comprises laser welding.
In preferred embodiment of the present invention, the material of above-mentioned conductive layer for example is a transparent conductive material, as indium tin oxide (Indium Tin Oxide, ITO), indium-zinc oxide (Indium Zinc Oxide, IZO), zinc oxide (Zinc Oxide, ZnO) or indium gallium zinc oxide (Indium Gallium ZincOxide, IGZO).
In preferred embodiment of the present invention, above-mentioned active component array base board more comprises a plurality of driving wafers, be disposed in the above-mentioned periphery circuit region, and above-mentioned driving wafer is to be electrically connected to above-mentioned pixel cell by above-mentioned signal conductor respectively.
By technique scheme; active component array base board of the present invention and detection method thereof have following advantage and beneficial effect at least: in active component array base board of the present invention; because detecting pad is to be electrically insulated with the external world by the protection of dielectric layer before carrying out testing process; therefore can prevent electrostatic charge on the active component array base board by detecting pad in signal conductor imports pixel cell into, wounded by static to avoid pixel cell.
In sum, active component array base board of the present invention has viewing area and periphery circuit region, and this active component array base board comprises a plurality of pixel cells, many signal conductor, a plurality of detecting pad and first dielectric layer.Pixel cell be with arranged in array mode in the viewing area, signal conductor and detecting pad then are to be disposed in the periphery circuit region, and first dielectric layer is to cover detecting pad.Detection side's rule of this active component array base board is first dielectric layer that removes part earlier, desires the detecting pad that electrically contacts with testing tool to expose.That is to say that before detecting, detecting pad is to be electrically insulated with the external world, thereby can avoid electrostatic charge to cause static to wound through signal conductor to pixel cell by detecting pad, to improve the circuit stability of active component array base board.The present invention has obvious improvement technically, and has tangible good effect, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic diagram of the active component array base board of known techniques.
Fig. 2 is the generalized section of the active component array base board of Fig. 1 along I-I ' line.
Fig. 3 is an active component array base board of the present invention schematic diagram in one embodiment.
Fig. 4 is that active component array base board of the present invention is in one embodiment in the generalized section that disposes the detecting pad part.
Fig. 5 A and Fig. 5 B are respectively active component array base board of the present invention schematic diagrames in other embodiments.
Fig. 6 A to Fig. 6 B is the cut-away section schematic diagram of active component array base board in testing process of Fig. 3.
Fig. 7 is that active component array base board of the present invention is in another embodiment in the generalized section that disposes the detecting pad part.
Fig. 8 A to Fig. 8 B is an active component array base board of the present invention cut-away section schematic diagram in testing process in another embodiment.
100,300: active component array base board 102,302: viewing area
104,304: periphery circuit region 110,310: pixel cell
120,320: signal conductor 125,150: dielectric layer
130,350: drive circuit 140,330: detecting pad
152: opening 160,720: conductive layer
312: scan distribution 314: the data distribution
316: active member 318: pixel electrode
Dielectric layer 600,800 in 340: the first: testing tool
Dielectric layer 810,820 in 710: the second: laser light
C: electric capacity
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to active component array base board and its embodiment of detection method, structure, detection method, step, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
See also Fig. 3 and Fig. 4, Fig. 3 is an active component array base board of the present invention schematic diagram in one embodiment, Fig. 4 then illustrate for active component array base board of the present invention in one embodiment in the generalized section that disposes the detecting pad part.Active component array base board 300 in one embodiment of the invention has viewing area 302 and periphery circuit region 304, and active component array base board 300 comprises a plurality of pixel cells 310, many signal conductor 320, a plurality of detecting pad 330 and first dielectric layer 340.
Above-mentioned pixel cell 310 is that the mode with array is disposed in the viewing area 302.
Each above-mentioned pixel cell 310 comprises and scans distribution (scan line) 312, data distribution (data line) 314, active member 316 and pixel electrode (pixel electrode) 318.
This scans distribution 312 and is perpendicular to one another with data distribution 314, active member 316 and pixel electrode 318 then are to be disposed to scan in the zone that distribution 312 and data distribution 314 surrounded, and with scan distribution 312, data distribution 314 and pixel electrode 318 and electrically connect.In the present embodiment, active member 316 can be membrane transistor (thin film transistor, TFT) or other active switch elements.
Above-mentioned signal conductor 320 is to be disposed in the periphery circuit region 304 of active component array base board 300, and these pixel cells 310 in the viewing area 302 be by signal conductor 320 with periphery circuit region 304 in circuit electrically connect.With present embodiment, pixel cell 310 promptly is to be electrically connected to drive circuit 350 by signal conductor 320.That is to say, the signal that drive circuit 350 is exported be transfer to pixel cell 310 via signal conductor 320 scan distribution 312 or data distribution 314, to drive pixel cell 310.
Above-mentioned detecting pad 330 is to be disposed in the periphery circuit region 304 equally, and as shown in Figure 4, the detecting pad 330 and the signal conductor 320 of present embodiment are to be positioned at same rete, and are electrically connected to each other.What deserves to be mentioned is that the present invention does not limit the shape profile of detecting pad 330, it can be an ellipse as shown in Figure 3, also can be the quadrangle with arc curve shown in the quadrangle shown in Fig. 5 A or Fig. 5 B.
The first above-mentioned dielectric layer 340 is to be covered on the detecting pad 330, and first dielectric layer 340 does not have any opening that exposes detecting pad 330.Thus, exist the electrostatic charge on the active component array base board 100 promptly can't reach in the viewing area 302 via detecting pad 330.That is to say that first dielectric layer 340 of present embodiment can be used as the electrical protective layer of detecting pad 330, make pixel cell 310 wounded by static to avoid electrostatic charge to reach in the viewing area 302 via detecting pad 330 and signal conductor 320.In the present embodiment, because detecting pad 330 and signal conductor 320 layer together, therefore first dielectric layer 340 also covers signal conductor 320 simultaneously.
Below the detection method of above-mentioned active component array base board will be described for embodiment.Seeing also shown in Fig. 6 A to Fig. 6 B, is the cut-away section schematic diagram of active component array base board in testing process of Fig. 3.As shown in Figure 6A, when desire detects by the circuit in 330 pairs of viewing areas 302 of detecting pad, then need remove first dielectric layer 340 of part earlier, desire the detecting pad 330 that electrically contacts with testing tool to expose.In the present embodiment, it for example is first dielectric layer 340 that removes part with the method that laser removes.
Shown in Fig. 6 B, then promptly be that the detecting pad 330 that testing tool 600 is outer with being exposed to first dielectric layer 340 electrically contacts.Haveing the knack of this operator will be appreciated that, testing tool 600 can be to be connected to detect the board probe (probe) of (figure does not show), in order to detection signal is inputed to pixel cell 310 in the viewing area 302 by detecting pad 330 and signal conductor 320, with electrically detecting to each pixel cell 310.In addition, testing tool 600 also can be the probe that is connected to electrical tester (as avometer), in order to the abnormal conditions of coming detection signal lead 320 whether to have short circuit or open circuit by detecting pad 330.
Seeing also shown in Figure 7ly, is that active component array base board of the present invention is in another embodiment in the generalized section that disposes the detecting pad part.Below only be illustrated at the different place of present embodiment and previous embodiment, the label components identical of all the other and previous embodiment please refer to the explanation of previous embodiment, below repeats no more.
As shown in Figure 7, the active component array base board of present embodiment more comprises second dielectric layer 710 and conductive layer 720 except including Fig. 3 and pixel cell 310, signal conductor 320, detecting pad 330 and first dielectric layer 340 shown in Figure 4.Wherein, second dielectric layer 710 is to be disposed between detecting pad 330 and the signal conductor 320, that is to say the detecting pad 330 of present embodiment and signal conductor 320 and different layers.Conductive layer 720 then is to be disposed on first dielectric layer 340 of detecting pad 330 tops.
Please consult Fig. 3 and shown in Figure 7 simultaneously; before detecting; the detecting pad 330 of present embodiment does not electrically connect with signal conductor 320; even therefore accumulating on the electrostatic charge of conductive layer 720 punctures to detecting pad 330; it also can be by the circuit of detecting pad 330 in signal conductor 320 enters to viewing area 302, thereby can protect the pixel cells 310 in the viewing area 302 to avoid suffering static to wound.
Below the detection method of above-mentioned active component array base board will be described for embodiment.Seeing also shown in Fig. 8 A to Fig. 8 B, is active component array base board of the present invention cut-away section schematic diagram in testing process in another embodiment.Shown in Fig. 8 A, when desire detects by the circuit in 330 pairs of viewing areas 302 of detecting pad, then need conductive layer 720 and detecting pad 330 are welded together, and detecting pad 330 and signal conductor 320 are welded together.Wherein, present embodiment for example is the mode welding conductive layer 720 and detecting pad 330 and detecting pad 330 and signal conductor 320 with laser welding.Specifically, the method with laser welding conductive layer 720 and detecting pad 330 for example is to make laser 810 from conductive layer 720 top incidents.And, then need make the below incident of laser 820 from signal conductor 320 as desiring welding detecting pad 330 and signal conductor 320.
Shown in Fig. 8 B, after the welding of finishing conductive layer 720 and detecting pad 330 and detecting pad 330 and signal conductor 320, promptly be that testing tool 800 is electrically contacted with conductive layer 720 then, so that detect by the circuit on 800 pairs of active component array base boards 700 of testing tool.Described as previous embodiment, testing tool 800 can be to be connected to the probe that detects board, can be the probe that is connected to electrical tester also, and haveing the knack of this operator can be voluntarily according to the required testing tool 800 of selecting institute's desire to use of testing process.
From the above, active component array base board of the present invention is that dielectric layer is covered on the detecting pad, with the electrical protective layer as detecting pad.In the process that active component array base board of the present invention is detected, if detecting pad and signal conductor are with layer, and do not dispose any rete on the dielectric layer of detecting pad top, then only need dielectric layer with the detecting pad top remove to expose to desire the detecting pad that electrically contacts with testing tool.On the other hand, if detecting pad and signal conductor different layers, and dispose conductive layer on the dielectric layer of detecting pad top, after then can be successively conductive layer and detecting pad and detecting pad and signal conductor being welded together, make testing tool electrically contact again, can the circuit on the active component array base board be detected with the conductive layer that is welded to detecting pad.
In sum; active component array base board of the present invention is before carrying out testing process; its detecting pad is to be electrically insulated with the external world by the protection of dielectric layer; thereby can prevent electrostatic charge on the active component array base board by detecting pad in signal conductor imports pixel cell into; avoiding pixel cell wounded by static, and improve the circuit stability of active component array base board by this.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the method that can utilize above-mentioned announcement and technology contents are made a little change or be modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (11)
1. an active component array base board has a viewing area and a periphery circuit region, it is characterized in that this active component array base board comprises:
A plurality of pixel cells, arrayed is in this viewing area;
Many signal conductor are disposed in this periphery circuit region, and are electrically connected to described pixel cell;
A plurality of detecting pads are disposed in this periphery circuit region; And
One first dielectric layer covers described detecting pad.
2. active component array base board according to claim 1, it is characterized in that wherein said detecting pad be respectively with one of them electric connection of described signal conductor.
3. active component array base board according to claim 1 is characterized in that it also comprises:
One second dielectric layer is disposed between described detecting pad and the described signal conductor; And
One conductive layer is disposed on this first dielectric layer of described detecting pad top.
4. active component array base board according to claim 3, the material that it is characterized in that wherein said conductive layer is a transparent conductive material.
5. active component array base board according to claim 4, the material that it is characterized in that wherein said conductive layer are indium tin oxide, indium-zinc oxide, zinc oxide or indium gallium zinc oxide.
6. active component array base board according to claim 1 is characterized in that it also comprises a plurality of driving wafers, be disposed in this periphery circuit region, and described driving wafer is to be electrically connected to described pixel cell by described signal conductor respectively.
7. a detection method is suitable for test right and requires 1 described active component array base board, it is characterized in that this detection method may further comprise the steps:
Remove the part this first dielectric layer, with expose described detecting pad at least one of them; And
One testing tool is electrically contacted with this detecting pad that exposes.
8. detection method according to claim 7 is characterized in that the wherein said method that removes this first dielectric layer of part comprises that laser removes.
9. a detection method is suitable for test right and requires 3 described active component array base boards, it is characterized in that this detection method may further comprise the steps:
This conductive layer of welding and described detecting pad at least one of them;
This detecting pad and this signal conductor welding that is positioned at its below of this conductive layer will be welded to; And
One testing tool is electrically contacted with this conductive layer.
10. detection method according to claim 9, it is characterized in that this conductive layer of wherein said welding and described detecting pad at least one of them method comprise laser welding.
11. detection method according to claim 9 is characterized in that wherein said this detecting pad that will be welded to this conductive layer and the method for this signal conductor welding that is positioned at its below comprise laser welding.
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| CN2008101711946A CN101728397B (en) | 2008-10-22 | 2008-10-22 | Active component array substrate and detection method thereof |
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| CN2008101711946A CN101728397B (en) | 2008-10-22 | 2008-10-22 | Active component array substrate and detection method thereof |
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| CN101728397A true CN101728397A (en) | 2010-06-09 |
| CN101728397B CN101728397B (en) | 2012-02-15 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103617772A (en) * | 2013-11-12 | 2014-03-05 | 华映视讯（吴江）有限公司 | Display panel and testing method thereof |
| CN104536630A (en) * | 2015-01-21 | 2015-04-22 | 京东方科技集团股份有限公司 | Touch display panel, detection method thereof and display device |
| CN104880877A (en) * | 2015-06-18 | 2015-09-02 | 京东方科技集团股份有限公司 | Array substrate and manufacturing method thereof, testing method thereof |
| CN109119356A (en) * | 2018-08-22 | 2019-01-01 | 京东方科技集团股份有限公司 | The detection device and detection method of array substrate |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100464238C (en) * | 2005-07-01 | 2009-02-25 | 中华映管股份有限公司 | Active element array and detection method for same |
| CN101101894A (en) * | 2006-07-05 | 2008-01-09 | 联华电子股份有限公司 | Semiconductor structure and its making method |
-
2008
- 2008-10-22 CN CN2008101711946A patent/CN101728397B/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103617772A (en) * | 2013-11-12 | 2014-03-05 | 华映视讯（吴江）有限公司 | Display panel and testing method thereof |
| CN103617772B (en) * | 2013-11-12 | 2016-02-03 | 华映视讯（吴江）有限公司 | Display panel and method of testing thereof |
| CN104536630A (en) * | 2015-01-21 | 2015-04-22 | 京东方科技集团股份有限公司 | Touch display panel, detection method thereof and display device |
| US9678614B2 (en) | 2015-01-21 | 2017-06-13 | Boe Technology Group Co., Ltd. | Touch display panel, detecting method thereof, and display device |
| CN104880877A (en) * | 2015-06-18 | 2015-09-02 | 京东方科技集团股份有限公司 | Array substrate and manufacturing method thereof, testing method thereof |
| CN109119356A (en) * | 2018-08-22 | 2019-01-01 | 京东方科技集团股份有限公司 | The detection device and detection method of array substrate |
| US10885821B2 (en) | 2018-08-22 | 2021-01-05 | Hefei Xinsheng Optoelectronics Technology Co., Ltd. | Inspection device and inspection method for array substrate |
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| CN101728397B (en) | 2012-02-15 |
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Granted publication date: 20120215 Termination date: 20211022 |