CN101728397B - Active element array substrate and detection method thereof - Google Patents

Abstract

The invention relates to an active element array substrate and a detection method thereof. The active element array substrate is provided with a display area and a peripheral circuit area and comprises a plurality of pixel units, a plurality of signal leads, a plurality of detection pads and a first dielectric layer. The pixel units are arranged in the display area in an array mode, the signal wires and the detection pads are arranged in the peripheral circuit area, and the first dielectric layer covers the detection pads. The method for inspecting the active device array substrate comprises removing part of the first dielectric layer to expose the inspection pad to be electrically contacted with the inspection tool. That is, before the detection, the detection pad is electrically insulated from the outside, so that the electrostatic charge can be prevented from causing electrostatic damage to the pixel unit through the signal conductor by the detection pad, and the circuit stability of the active device array substrate is improved.

Description

Active element array substrate and detection method thereof

technical field

The invention relates to an active element array substrate and a detection method thereof, in particular to an active element array substrate capable of preventing static electricity from passing through a detection pad to damage a circuit and a detection method thereof. the

Background technique

Due to the advantages of small size, light weight and fast response, the active flat display panel has been widely used in various electronic products. The active flat display panel is composed of an active element array substrate, a display layer and a light-transmitting substrate, wherein the display layer is located between the active element array substrate and the light-transmitting substrate, such as a liquid crystal display panel (LCD panel) Liquid crystal layer, electrophoretic layer of electrophoretic display panel (EPD panel), etc. the

Please refer to FIG. 1 , which is a schematic diagram of a conventional active device array substrate. The conventional active device array substrate 100 has a display area 102 and a peripheral circuit area 104, wherein the display area 102 is configured with a plurality of pixel (pixels are also referred to as pixels, all referred to herein as pixels) units 110, and the peripheral circuit area A plurality of signal (or called signal) wires 120 are arranged in 104 for electrically connecting the pixel units 110 in the display area 102 to the driving circuit 130 . the

In the current manufacturing process of active flat display panels, after completing all circuit configurations on the active device array substrate 100, circuit testing is usually performed to confirm whether there are defects in the circuits on the active device array substrate 100. Therefore, The peripheral circuit area 104 of the active device array substrate 100 is provided with detection pads 140 , and detection tools (such as probes, not shown) are electrically connected to the circuits on the active device array substrate 100 through the detection pads 140 . the

However, many electrostatic charges may be accumulated by the manufacturing equipment, operators and the active device array substrate 100 itself. Therefore, when the active device array substrate 100 is in contact with manufacturing equipment, operators or other objects during the manufacturing process, these static charges are often easily transmitted to the active device array substrate 100 through these charged objects, and pass through the detection pad 140 through the signal. The wires 120 are transmitted to the circuits in the display area 102 , thus causing the circuits in the display area 102 to be damaged by static electricity and damage the active device array substrate 100 . the

Please refer to FIG. 2 , which is a schematic cross-sectional view of the active element array substrate of FIG. 1 along line I-I'. As shown in FIG. 1 and FIG. 2, in order to prevent the static charge on the active device array substrate 100 from dissipating into the display area 102 through the detection pad 140, the conventional technology is to first form a dielectric layer 125 on the signal wire 120, and then form a dielectric layer on the signal wire 120. Detection pads 140 are formed on the dielectric layer 125 above 120 . In other words, the dielectric layer 125 is separated between the detection pad 140 and the signal wire 120 to prevent electrostatic charge from being directly conducted from the detection pad 140 to the circuit in the display area 102 through the signal wire 120 . A dielectric layer 150 having an opening 152 and a conductive layer 160 are sequentially formed on the detection pad 140 , and the conductive layer 160 is electrically connected to the detection pad 140 through the opening 152 of the dielectric layer 150 . When testing is desired, the detection pad 140 and the signal wire 120 can be welded by laser, and then the detection tool is electrically contacted with the conductive layer 160 to detect the circuit on the active device array substrate 100 . the

However, before the detection pad 140 and the signal wire 120 are welded by laser (laser is also called laser light, which is referred to herein as laser), since the detection pad 140, the dielectric layer 125 and the signal wire 120 form a capacitance C, although Static charge will not be directly transmitted from the detection pad 140 to the signal wire 120, but when too much static charge is accumulated on the detection pad 140, the phenomenon of electrostatic breakdown will occur instantaneously, thus affecting the circuit on the active element array substrate 100. cause more damage. the

It can be seen that the above-mentioned existing active device array substrate and its detection method obviously still have inconveniences and defects in terms of product structure, detection method and use, and further improvement is urgently needed. In order to solve the above-mentioned problems, the relevant manufacturers have tried their best to find a solution, but no suitable design has been developed for a long time, and there is no suitable structure and method for general products and methods to solve the above-mentioned problems. This is obviously a problem that relevant industry players are eager to solve. Therefore, how to create a new active device array substrate and its detection method is one of the current important research and development topics, and has also become a goal that the industry needs to improve. the

Contents of the invention

The object of the present invention is to overcome the defects of the existing active element array substrate and provide a new active element array substrate. The technical problem to be solved is to make it have low electrostatic damage rate and high circuit stability. the

Another object of the present invention is to overcome the defects of existing detection methods and provide a new detection method. The technical problem to be solved is to reduce the electrostatic damage rate of the above-mentioned active element array substrate, thereby improving its circuit stability. the

The purpose of the present invention and the solution to its technical problems are achieved by adopting the following technical solutions. To achieve the above object, an active element array substrate according to the present invention has a display area and a peripheral circuit area, and the active element array substrate includes a plurality of pixel units, a plurality of signal wires, a plurality of detection pads and a first dielectric layer. Wherein, the above-mentioned pixel units are arranged in the display area in an array, the above-mentioned signal wires and detection pads are arranged in the peripheral circuit area, and the first dielectric layer covers the above-mentioned detection pads to form an active element array substrate. Avoid exposing the test pad to the outside world before performing the test. the

In a preferred embodiment of the present invention, each of the detection pads is electrically connected to one of the signal wires. the

The purpose of the present invention and the solution to its technical problems are also achieved by the following technical solutions. In order to achieve the above object, a detection method according to the present invention is suitable for detecting the above-mentioned active element array substrate. The detection method is to first remove part of the first dielectric layer to expose at least one detection pad, and then The test tool is in electrical contact with the exposed test pad. the

In a preferred embodiment of the present invention, the method for removing part of the first dielectric layer includes laser removal. the

The purpose of the present invention and the solution to its technical problems are also achieved by the following technical solutions. To achieve the above object, in a preferred embodiment of the present invention, the above-mentioned active element array substrate further includes a second dielectric layer and a conductive layer, wherein the second dielectric layer is disposed between the detection pad and the signal wire, The conductive layer is disposed on the first dielectric layer above the detection pad. the

The purpose of the present invention and its technical problems are solved by adopting the following technical solutions in addition. In order to achieve the purpose of the above invention, a detection method proposed according to the present invention is suitable for detecting the above-mentioned active element array substrate. The detection method is to weld the conductive layer and at least one of the detection pads together, and weld the The detection pad is fused to the signal wire located underneath it. Afterwards, the detection tool is electrically contacted with the above-mentioned conductive layer. the

In a preferred embodiment of the present invention, the method of welding the conductive layer and the detection pad includes laser welding. the

In a preferred embodiment of the present invention, the method of welding the detection pad and the signal wire includes laser welding. the

In a preferred embodiment of the present invention, the material of the above-mentioned conductive layer is, for example, a transparent conductive material, such as indium tin oxide (Indium Tin Oxide, ITO), indium zinc oxide (Indium Zinc Oxide, IZO), zinc oxide (Zinc Oxide, ZnO) or Indium Gallium Zinc Oxide (IGZO). the

In a preferred embodiment of the present invention, the active element array substrate further includes a plurality of driving chips disposed in the peripheral circuit area, and the driving chips are electrically connected to the pixel units through the signal wires respectively. the

With the above technical solution, the active element array substrate and its detection method of the present invention have at least the following advantages and beneficial effects: In the active element array substrate of the present invention, since the detection pad is protected by a dielectric layer before the detection process It is electrically insulated from the outside world, so it can prevent the static charge on the active element array substrate from being transmitted into the pixel unit through the signal wire through the detection pad, so as to prevent the pixel unit from being damaged by static electricity. the

In summary, the active device array substrate of the present invention has a display area and a peripheral circuit area, and the active device array substrate includes a plurality of pixel units, a plurality of signal wires, a plurality of detection pads and a first dielectric layer. The pixel units are arranged in an array in the display area, the signal wires and the detection pads are arranged in the peripheral circuit area, and the first dielectric layer covers the detection pads. The detection method of the active device array substrate is to firstly remove part of the first dielectric layer to expose the detection pads to be electrically contacted with the detection tool. That is to say, before the detection, the detection pad is electrically insulated from the outside world, so that electrostatic damage to the pixel unit caused by electrostatic charge from the detection pad through the signal wire can be avoided, so as to improve the circuit stability of the active device array substrate. The present invention has remarkable progress technically, and has obvious positive effect, is a novel, progressive, practical new design. the

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited below, and are described in detail as follows in conjunction with the accompanying drawings. the

Description of drawings

FIG. 1 is a schematic diagram of an active device array substrate in the prior art. the

2 is a schematic cross-sectional view of the active device array substrate of FIG. 1 along the line I-I'. the

FIG. 3 is a schematic diagram of an embodiment of the active device array substrate of the present invention. the

FIG. 4 is a schematic cross-sectional view of the active device array substrate of the present invention where the detection pads are disposed in an embodiment. the

FIG. 5A and FIG. 5B are schematic diagrams of active device array substrates in other embodiments of the present invention, respectively. the

6A to 6B are partial cross-sectional schematic views of the active device array substrate in FIG. 3 during the testing process. the

7 is a schematic cross-sectional view of the active device array substrate in another embodiment of the present invention where the detection pads are disposed. the

8A to 8B are partial cross-sectional schematic views of the active device array substrate in another embodiment of the present invention during the detection process. the

100, 300: active element array substrate 102, 302: display area

104, 304: peripheral circuit area 110, 310: pixel unit

120, 320: signal wires 125, 150: dielectric layer

130, 350: drive circuit 140, 330: detection pad

152: Opening 160, 720: Conductive layer

312: Scan wiring 314: Data wiring

316: Active component 318: Pixel electrode

340: the first dielectric layer 600, 800: detection tools

710: second dielectric layer 810, 820: laser light

C: capacitance

Detailed ways

In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, The detection method, steps, features and efficacy are described in detail below. the

Please refer to FIG. 3 and FIG. 4. FIG. 3 is a schematic diagram of an active device array substrate of the present invention in an embodiment, and FIG. Schematic diagram of the cross-section. The active device array substrate 300 in an embodiment of the present invention has a display area 302 and a peripheral circuit area 304, and the active device array substrate 300 includes a plurality of pixel units 310, a plurality of signal wires 320, a plurality of detection pads 330 and a first interposer. electrical layer 340 . the

The aforementioned pixel units 310 are arranged in the display area 302 in an array. the

Each pixel unit 310 mentioned above includes a scan line (scan line) 312 , a data line (data line) 314 , an active element 316 and a pixel electrode (pixel electrode) 318 . the

The scanning wiring 312 and the data wiring 314 are perpendicular to each other, and the active element 316 and the pixel electrode 318 are arranged in the area surrounded by the scanning wiring 312 and the data wiring 314, and are connected to the scanning wiring 312. , the data wiring 314 and the pixel electrode 318 are electrically connected. In this embodiment, the active element 316 may be a thin film transistor (thin film transistor, TFT) or other active switching elements. the

The above-mentioned signal wires 320 are arranged in the peripheral circuit area 304 of the active device array substrate 300 , and the pixel units 310 in the display area 302 are electrically connected to the circuits in the peripheral circuit area 304 through the signal wires 320 . In this embodiment, the pixel unit 310 is electrically connected to the driving circuit 350 through the signal wire 320 . That is to say, the signal output by the driving circuit 350 is transmitted to the scanning wiring 312 or the data wiring 314 of the pixel unit 310 through the signal wire 320 to drive the pixel unit 310 . the

The detection pads 330 mentioned above are also disposed in the peripheral circuit area 304 , and as shown in FIG. 4 , the detection pads 330 and the signal wires 320 of this embodiment are located on the same film layer and are electrically connected to each other. It is worth mentioning that the present invention does not limit the shape profile of the detection pad 330, which can be an ellipse as shown in FIG. 3, or a quadrilateral as shown in FIG. quadrilateral. the

The above-mentioned first dielectric layer 340 covers the detection pad 330 , and the first dielectric layer 340 does not have any opening exposing the detection pad 330 . In this way, the electrostatic charge existing on the active device array substrate 100 cannot be transmitted to the display area 302 through the detection pad 330 . That is to say, the first dielectric layer 340 of this embodiment can be used as an electrical protection layer for the detection pad 330, so as to prevent the static charge from being transmitted to the display area 302 through the detection pad 330 and the signal wire 320, causing the pixel unit 310 to suffer from static electricity. wounded. In this embodiment, since the detection pad 330 is on the same layer as the signal wire 320 , the first dielectric layer 340 also covers the signal wire 320 at the same time. the

The following examples will be used to illustrate the detection method of the above-mentioned active device array substrate. Please refer to FIG. 6A to FIG. 6B , which are partial cross-sectional schematic diagrams of the active device array substrate in FIG. 3 during the testing process. As shown in FIG. 6A, when it is desired to test the circuit in the display area 302 through the test pad 330, it is necessary to remove part of the first dielectric layer 340 first to expose the test pad to be electrically contacted with the test tool. 330. In this embodiment, a part of the first dielectric layer 340 is removed by laser removal, for example. the

As shown in FIG. 6B , the next step is to electrically contact the testing tool 600 with the testing pad 330 exposed from the first dielectric layer 340 . Those skilled in the art should know that the detection tool 600 can be a probe connected to a detection machine (not shown in the figure) to input the detection signal to the pixels in the display area 302 through the detection pad 330 and the signal wire 320 unit 310 to detect the electrical properties of each pixel unit 310 . In addition, the detection tool 600 can also be a probe connected to an electric property measuring meter (such as a three-purpose electric meter) to detect whether there is a short circuit or an open circuit in the signal wire 320 through the detection pad 330 . the

Please refer to FIG. 7 , which is a schematic cross-sectional view of the active device array substrate in another embodiment of the present invention where the detection pads are disposed. The following only describes the differences between the present embodiment and the foregoing embodiments, and for the rest of the elements with the same labels as the foregoing embodiments, please refer to the description of the foregoing embodiments, and will not be repeated below. the

As shown in FIG. 7 , the active device array substrate of this embodiment not only includes the pixel unit 310 , the signal wire 320 , the detection pad 330 and the first dielectric layer 340 shown in FIG. Dielectric layer 710 and conductive layer 720 . Wherein, the second dielectric layer 710 is disposed between the detection pad 330 and the signal wire 320 , that is, the detection pad 330 and the signal wire 320 in this embodiment are not in different layers. The conductive layer 720 is disposed on the first dielectric layer 340 above the detection pad 330 . the

Please refer to FIG. 3 and FIG. 7 at the same time. Before testing, the detection pad 330 of this embodiment is not electrically connected to the signal wire 320 , so even if the electrostatic charge accumulated in the conductive layer 720 breaks down to the detection pad 330 , it will not enter the circuit in the display area 302 from the detection pad 330 through the signal wire 320 , thus protecting the pixel unit 310 in the display area 302 from being damaged by static electricity. the

The following examples will be used to illustrate the detection method of the above-mentioned active device array substrate. Please refer to FIG. 8A to FIG. 8B , which are partial cross-sectional schematic views of the active device array substrate in another embodiment of the present invention during the detection process. As shown in FIG. 8A , when the circuit in the display area 302 is to be detected through the detection pad 330 , the conductive layer 720 and the detection pad 330 need to be welded together, and the detection pad 330 and the signal wire 320 must be welded together. Wherein, in this embodiment, for example, the conductive layer 720 and the detection pad 330 and the detection pad 330 and the signal wire 320 are welded by means of laser welding. In detail, the method of fusing the conductive layer 720 and the detection pad 330 by laser is, for example, making the laser 810 incident from above the conductive layer 720 . However, if the detection pad 330 and the signal wire 320 are to be welded, the laser 820 needs to be incident from below the signal wire 320 . the

As shown in FIG. 8B , after the welding of the conductive layer 720 and the detection pad 330 and the detection pad 330 and the signal wire 320 are completed, then the detection tool 800 is electrically contacted with the conductive layer 720, so that the detection tool 800 can be used for active contact. The circuits on the element array substrate 700 are tested. As described in the foregoing embodiments, the detection tool 800 can be a probe connected to the detection machine, or a probe connected to an electrical measurement meter. Those skilled in this technology can choose the desired one according to the needs of the detection process. The inspection tool 800 used. the

It can be known from the above that the active element array substrate of the present invention covers the detection pad with a dielectric layer as an electrical protection layer for the detection pad. In the process of detecting the active element array substrate of the present invention, if the detection pad and the signal wire are on the same layer, and no film layer is arranged on the dielectric layer above the detection pad, then only the dielectric layer above the detection pad needs to be Removal exposes the test pad intended to be in electrical contact with the test tool. On the other hand, if the detection pad and the signal wire are in different layers, and a conductive layer is arranged on the dielectric layer above the detection pad, the conductive layer and the detection pad and the detection pad and the signal wire can be welded together successively, and then the detection The tool is in electrical contact with the conductive layer welded to the detection pad, so that the circuit on the active element array substrate can be detected. the

To sum up, before the detection process of the active device array substrate of the present invention, the detection pad is electrically insulated from the outside world by the protection of the dielectric layer, thus preventing the static charge on the active device array substrate from being released by the detection pad. The signal wires are passed into the pixel unit to prevent the pixel unit from being damaged by static electricity, thereby improving the circuit stability of the active element array substrate. the

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, may use the method and technical content disclosed above to make some changes or modifications to equivalent embodiments with equivalent changes, but if they do not depart from the technical solution of the present invention, Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention still fall within the scope of the technical solutions of the present invention. the

Claims (11)

1. an active component array base board has a viewing area and a periphery circuit region, it is characterized in that this active component array base board comprises:

A plurality of pixel cells, arrayed is in this viewing area;

Many signal conductor are disposed in this periphery circuit region, and are electrically connected to said pixel cell;

A plurality of detecting pads are disposed in this periphery circuit region; And

One first dielectric layer covers said detecting pad and avoids said detecting pad to be exposed to the external world with before detecting at this active component array base board.

2. active component array base board according to claim 1, it is characterized in that wherein said detecting pad be respectively with one of them electric connection of said signal conductor.

3. active component array base board according to claim 1 is characterized in that it also comprises:

One second dielectric layer is disposed between said detecting pad and the said signal conductor; And

One conductive layer is disposed on this first dielectric layer of said detecting pad top.

4. active component array base board according to claim 3, the material that it is characterized in that wherein said conductive layer is a transparent conductive material.

5. active component array base board according to claim 4, the material that it is characterized in that wherein said conductive layer are indium tin oxide, indium-zinc oxide, zinc oxide or indium gallium zinc oxide.

6. active component array base board according to claim 1 is characterized in that it also comprises a plurality of driving wafers, be disposed in this periphery circuit region, and said driving wafer is to be electrically connected to said pixel cell through said signal conductor respectively.

7. detection method; Be suitable for detecting an active component array base board; This active component array base board has a viewing area and a periphery circuit region; Wherein, this active component array base board comprises a plurality of pixel cells, many signal conductor, a plurality of detecting pad and one first dielectric layer, and said pixel unit array is arranged in this viewing area; Said signal conductor is disposed in this periphery circuit region and is electrically connected to said pixel cell; Said detecting pad is disposed in this periphery circuit region, and this first dielectric layer covers said detecting pad to avoid said detecting pad to be exposed to the external world before detecting at this active component array base board, it is characterized in that this detection method may further comprise the steps:

Remove the part this first dielectric layer, with expose said detecting pad at least one of them; And

One testing tool is electrically contacted with this detecting pad that exposes.

8. detection method according to claim 7 is characterized in that the wherein said method that removes this first dielectric layer of part comprises that laser removes.

9. detection method; Be suitable for detecting an active component array base board; This active component array base board has a viewing area and a periphery circuit region; Wherein, this active component array base board comprises a plurality of pixel cells, many signal conductor, a plurality of detecting pad, one first dielectric layer, one second dielectric layer and a conductive layer, and said pixel unit array is arranged in this viewing area; Said signal conductor is disposed in this periphery circuit region and is electrically connected to said pixel cell; Said detecting pad is disposed in this periphery circuit region, and this first dielectric layer covers said detecting pad and avoids said detecting pad to be exposed to the external world with before detecting at this active component array base board, and this second dielectric layer is disposed between said detecting pad and the said signal conductor; And this conductive layer is disposed on this first dielectric layer of said detecting pad top, it is characterized in that this detection method may further comprise the steps:

This conductive layer of welding and said detecting pad at least one of them;

With this detecting pad that is welded to this conductive layer and this signal conductor welding that is positioned at its below; And

One testing tool is electrically contacted with this conductive layer.

10. detection method according to claim 9, it is characterized in that this conductive layer of wherein said welding and said detecting pad at least one of them method comprise laser welding.

11. detection method according to claim 9 is characterized in that wherein said this detecting pad that will be welded to this conductive layer and the method for this signal conductor welding that is positioned at its below comprise laser welding.

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