CN101711434B - Led lighting device - Google Patents
Led lighting device Download PDFInfo
- Publication number
- CN101711434B CN101711434B CN2007800534543A CN200780053454A CN101711434B CN 101711434 B CN101711434 B CN 101711434B CN 2007800534543 A CN2007800534543 A CN 2007800534543A CN 200780053454 A CN200780053454 A CN 200780053454A CN 101711434 B CN101711434 B CN 101711434B
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- emitting diode
- light emitting
- substrate
- illuminating apparatus
- diode illuminating
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- 239000000758 substrate Substances 0.000 claims abstract description 65
- 230000000994 depressogenic effect Effects 0.000 claims description 47
- 239000013078 crystal Substances 0.000 claims description 29
- 239000002245 particle Substances 0.000 claims description 26
- 239000012782 phase change material Substances 0.000 claims description 26
- 238000009826 distribution Methods 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000004065 semiconductor Substances 0.000 claims description 7
- 230000007704 transition Effects 0.000 claims description 6
- 229920000297 Rayon Polymers 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 238000005286 illumination Methods 0.000 description 5
- 230000009466 transformation Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Microscoopes, Condenser (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The present invention provides a LED lighting device (1). The LED lighting device (1) includes a carrier (12), a substrate (14), a LED die (16) and a micro-lens module (18). The carrier (12) comprises a top surface (122) and a bottom surface (124). A first concave (126) is formed in the top surface (122) of the carrier (12). A second concave (128) is formed in the bottom surface (124) of the carrier (12). The first concave (126) is connected with the second concave (128). The substrate (14) is embedded in the second concave (128). The first LED die (16) is provided on the substrate (14). The micro-lens module (18) is provided in the first concave (126).
Description
Technical field
The present invention relates to a kind of light emitting diode illuminating apparatus, particularly a kind of light emitting diode illuminating apparatus with little shape set of lenses.
Technical background
Along with semiconductor luminous assembly development, light-emitting diode be a kind of emerging light source, has power saving, shatter-proof, fast, suitable volume production of reaction or the like, many advantages.Therefore, belonged to commonly as indicating device with light-emitting diode, and, also gradually become trend with the illuminating product of light-emitting diode as light source.For enough illuminations are provided, with the lighting device many uses high-power light-emitting diode of light-emitting diode as light source.In addition, in many illumination situations, what illumination was not enough is because light is concentrated inadequately, so that in general the application, use more high-power light-emitting diode to obtain required brightness, also causes other problem except wasting energy, for example heat radiation.
If the light of being launched by light-emitting diode is unjustified, then light will be towards advancing from all directions, and then cause light to concentrate inadequately.In the prior art, usually lens are placed on the light-emitting diode, to assemble the light of launching by this light-emitting diode.When these lens can pass through encapsulation LED crystal grain, form simultaneously.Or merely single convex lens are arranged on the light-emitting diode with collected light.No matter adopt above-mentioned which kind of mode, its beam angle of light that emits through lens still possibly be not sufficient to collected light meets lighting use to promote brightness demand up to about 145 degree.
Therefore, be necessary to provide a kind of light emitting diode illuminating apparatus with little shape set of lenses, this little shape set of lenses effectively collected light to address the above problem.
Brief summary of the invention
The purpose of this invention is to provide a kind of light emitting diode illuminating apparatus.
Another object of the present invention provides a kind of light emitting diode illuminating apparatus that uses little shape set of lenses.
Light emitting diode illuminating apparatus of the present invention comprises a microscope carrier, a substrate, a LED crystal particle and a little shape set of lenses.Said microscope carrier comprises a top surface and a basal surface, and said microscope carrier forms one first depressed part on said top surface, and said microscope carrier forms one second depressed part on said basal surface, and said first depressed part is connected with said second depressed part.Said substrate embeds said second depressed part.Said LED crystal particle is arranged on the said substrate.Said little shape set of lenses is arranged on said first depressed part.
Said little shape set of lenses comprises several gives prominence to, and said several are given prominence to and are arranged on the surface of said little shape set of lenses with Two dimensional Distribution.An each outstanding hemisphere, a horizontal cylinder or pyramid lenticule of can be.Said these outstanding several concentric circless that also can be, and each outstanding cross section can be a semicircle, a triangle or one trapezoidal.In addition, comprise a first area and a second area on the said surface of said little shape set of lenses, said these outstanding density that are positioned at said first area are greater than said these outstanding density that are positioned at said second area.That is said these outstanding be not necessity to be evenly distributed on the said surface.In one embodiment, but through light that said little shape set of lenses emits its below beam angle limit to 20 degree.
In addition, said microscope carrier is a LTCC plate, a printed circuit board (PCB) or a metallic core circuit board.Between said substrate and said second depressed part, can fill a viscose glue, to strengthen fixing said substrate in said second depressed part.Said substrate is a silicon, metal or LTCC.Said LED crystal particle is semiconductor light-emitting diode or semiconductor laser.Light emitting diode illuminating apparatus of the present invention can further comprise an encapsulating material, and said encapsulating material and covers said LED crystal particle between said LED crystal particle and said little shape set of lenses.
In addition, in one embodiment, the diameter of said first depressed part causes said second depressed part to have a top less than the diameter of said second depressed part, and said substrate is electrically connected with said top.In another embodiment, said substrate is provided with circuit junction, and on the said top also correspondence be provided with circuit junction, when said substrate is connected with said top, the circuit junction on the said substrate promptly with said top on circuit junction be electrically connected.In another embodiment, said substrate comprises one the 3rd depressed part and a reflector, and said reflector is positioned on said the 3rd depressed part, and said LED crystal particle is arranged in said the 3rd depressed part and on said reflector.
Light emitting diode illuminating apparatus of the present invention can further comprise a heat-conductive assembly and a supporter.Said heat-conductive assembly has a par, and said substrate is arranged on the said par.Said supporter is connected with said heat-conductive assembly.Said microscope carrier is fixed on the said supporter.Said heat-conductive assembly is a heat pipe or a thermal conductance post.One heat conduction phase-change material can be arranged between said par and the said substrate.In one embodiment; Said substrate has a basal surface; The said basal surface of said substrate and the said basal surface of said microscope carrier be copline roughly, and said heat conduction phase-change material can be filled between said par and the said substrate really, to reduce the generation of pore.
In addition, said heat conduction phase-change material has viscosity, and therefore said heat conduction phase-change material can adhere to each other said substrate and said heat-conductive assembly.Said heat conduction phase-change material also has a phase transition temperature.When said heat conduction phase-change material produces phase transformation; Its mobile increasing; Can more effectively be filled between said substrate and the said par, and then avoid the generation of air chamber, the heat that effectively said LED crystal particle is produced in operation conducts to heat-conductive assembly and dissipation is gone out.In one embodiment, said phase transition temperature is between 40 ℃ to 60 ℃.In addition, said heat conduction phase-change material has a conductive coefficient, and said conductive coefficient is between 3.6W/mK to 4.0W/mK.
Therefore, the light that light emitting diode illuminating apparatus of the present invention uses little shape set of lenses to be launched by said LED crystal particle with adjustment is to reach the effect of optically focused.And through said these the outstanding geometries of design, said little shape set of lenses can significantly be dwindled the beam angle of the light that penetrates said little shape set of lenses so that effective illumination to be provided.
Summary of the invention
See also Figure 1A and B, Figure 1A is the part sectioned view according to the light emitting diode illuminating apparatus 1 of preferred embodiment of the present invention; Figure 1B is the part exploded view of said light emitting diode illuminating apparatus 1.Light emitting diode illuminating apparatus 1 of the present invention comprises the little shape set of lenses of a microscope carrier 12, a substrate 14, several LED crystal particles 16, one 18, a supporter 20, a heat-conductive assembly 22 and a heat conduction phase-change material 24.
Said microscope carrier 12 comprises a top surface 122 and a basal surface 124; Said microscope carrier 12 forms one first depressed part 126 on said top surface 122; Said microscope carrier 12 forms one second depressed part 128 on said basal surface 124, said first depressed part 126 is connected with said second depressed part 128.Said substrate 14 embeds said second depressed part 128.Said substrate 14 comprises several the 3rd depressed parts 142, is formed with a reflector 144 (being represented by dotted lines) on each the 3rd depressed part 142.Said these LED crystal particles 16 are arranged in said these grade in an imperial examination three depressed parts 142, on the reflector 144.And the diameter that said first depressed part 126 is connected with said second depressed part 128 makes said second depressed part 128 have a top 130 less than said second depressed part 128 and the diameter that said first depressed part 126 is connected.Said substrate 14 is connected with said top 130.Said top 130 has the function of the said substrate 14 of engaging, also can increase said substrate 14 and said second depressed part, 128 bond areas, that is increases the adhesive force between said substrate 14 and said second depression 128.If between said substrate 14 and said second depressed part 128, fill a viscose glue, can strengthen fixing said substrate 14 more in said second depressed part 128.In addition; Can be provided with circuit junction 148 on the said substrate 14; And on the said top 130 then correspondence be provided with circuit junction 132, when said substrate 14 is connected with said top 130, the circuit junction 148 on the said substrate 14 promptly with said top 130 on circuit junction 148 be electrically connected.In this situation, said first LED crystal particle 16 promptly need not on routing to the said microscope carrier 12 again, and is electrically connected with said substrate 14 earlier.
Said little shape set of lenses 18 comprises that several are outstanding 184, and said these outstanding 184 are arranged on the surface 182 of said little shape set of lenses 18 with Two dimensional Distribution.Each gives prominence to 184 is a hemisphere.The vertical view of said little shape set of lenses 18 is shown in Fig. 1 C.Said these distribution patterns of outstanding 184 do not exceed with what represent among Fig. 1 C, can distribute with the closeest arrangement, shown in Fig. 1 D yet.Give prominence to 184 and be distributed in fifty-fifty on said surperficial 182 though show said these among Fig. 1 C and the D, the present invention is not as limit.That is said these distributions of outstanding 184 maybe be at some regional comparatively dense, and more sparse in some zone, should look product and set and decide.For example, said these outstanding 184 distribution densities around near said surperficial 182 are higher, and lower near the distribution density at said surperficial 182 centers, shown in Fig. 1 E.
In practical application, said these outstanding 184 are not limited to aforementionedly, also can be a horizontal cylinder (shown in Fig. 2 A) or a pyramid lenticule (shown in Fig. 2 B).The profile of Fig. 2 A can be with reference to Figure 1B.The profile of Fig. 2 B is shown in Fig. 2 C.In addition, said these outstanding 184 also can be and are arranged in several concentric circless, or said these outstanding 184 are several concentric circless, shown in Fig. 2 D.Each cross section of outstanding 184 is a semicircle (can with reference to Figure 1B), a triangle (like Fig. 2 E) or one trapezoidal (shown in Fig. 2 F).What remark additionally is that each gives prominence to 184 not to be all necessity mutually.And said these geometries of outstanding 184 also can be aforesaid combination.In addition, relevant said these outstanding 184 the explanations in the said preferred embodiment also are applicable to here.What remark additionally is that said these size, quantity of outstanding 184 are not limited to shown in the figure.And said these are given prominence to 184 and also can be formed on said little shape set of lenses 18 towards said these LED crystal particles 16.
See also Figure 1A and B, according to said preferred embodiment, said supporter 20 has a through hole 202, causes said supporter 20 can be fixed on the said heat-conductive assembly 22.Said heat-conductive assembly 22 comprises a par 222.Said heat conduction phase-change material 24 is set on the said par 222, and said then substrate 14 is being arranged on the said heat conduction phase-change material 24.Said heat conduction phase-change material 24 can be filled the space between said substrate 14 and the said par 222, to reduce the interface thermal resistance of 222 of said substrate 14 and said pars.Because said substrate 14 has embedded said second depressed part 128, therefore can reach the purpose of fixing said substrate 14 through fixing said microscope carrier 12.With several screws 26 said microscope carrier 12 is fixed on the said supporter 20, causes the said heat conduction phase-change material 24 of said substrate 14 compressions to reach the purpose that is fixed on said par 232.Because a basal surface 146 of said substrate 14 and the said basal surface 124 of said microscope carrier 12 be copline roughly.Therefore said heat conduction phase-change material 24 can be filled between said substrate 14 and the said par 222 fully.What remark additionally is that said heat conduction phase-change material 24 is not necessity also to be filled between said microscope carrier 12 and the said supporter 20.
According to said preferred embodiment, said heat conduction phase-change material 24 has a phase transition temperature.Said phase transition temperature is between 40 ℃ to 60 ℃, but the present invention is not as limit.After said heat conduction phase-change material 24 phase transformations; Its mobile increasing; Can more effectively be filled between said substrate 14 and the said par 222; And then avoid the generation of air chamber, the heat that effectively said LED crystal particle 16 is produced in operation to conduct to said heat-conductive assembly 22 and dissipation is gone out.Said heat conduction phase-change material 24 also has a conductive coefficient, and said conductive coefficient is between 3.6W/mK to 4.0W/mK.In addition, said heat conduction phase-change material 24 itself has viscosity, therefore helps said substrate 14 attached on the said par 222.In addition, said heat-conductive assembly 22 can comprise several fins (not shown), in order to will going out via said these fin dissipations via the heat of said par 222 conduction.The setting of said these fins depends on that the product meter establishes, and repeats no more at this.
Supplementary notes, the mode of said supporter 20 fixing said microscope carriers 12 is not exceeded with what Figure 1A showed yet.For example, said supporter 20 also can block said microscope carrier 12 on the structure.Certainly, also can combine above-mentioned two kinds of fixed forms simultaneously.Said light emitting diode illuminating apparatus 1 further comprises an encapsulating material (not shown).Said encapsulating material and covers said these LED crystal particles 16 between said these LED crystal particles 16 and said little shape set of lenses 18, but is not necessity with said first depressed part 126 of complete filling.In addition, according to the present invention, said microscope carrier 12 can be a LTCC plate, a printed circuit board (PCB), a metallic core circuit board or other material that can be connected with said substrate 14.Said substrate 14 can be silicon, metal, LTCC or other can carry the material of LED crystal particle.Said LED crystal particle 16 can be semiconductor light-emitting diode or semiconductor laser.Said heat-conductive assembly 22 can be a heat pipe, a thermal conductance post or other has the material or the device of thermal conduction characteristic.
What deserves to be mentioned is that though said preferred embodiment only comprises a substrate 14, the present invention is not as limit.See also Fig. 3, promptly in one embodiment, said microscope carrier 12 ' can comprise several second depressed parts 128 (in Fig. 3, not marking), each second depressed part 128 all embed a substrate 14 ', at least one LED crystal particle 16 of each substrate 14 ' be provided with.
In sum, the light that light emitting diode illuminating apparatus of the present invention uses little shape set of lenses to be launched by said LED crystal particle with adjustment is to reach the effect of optically focused.And through said these the outstanding geometries of design; Said little shape set of lenses can significantly be dwindled the beam angle of the light that penetrates said little shape set of lenses so that effective illumination to be provided, and then reduces the use amount of High Power LED crystal grain and save the energy.In addition, light emitting diode illuminating apparatus of the present invention uses said heat conduction phase-change material, and said substrate is adhered on the said par.After the phase transformation of said heat conduction phase-change material, its mobile increasing, said heat conduction phase-change material can more effectively be filled between said substrate and the said par.And after long-time the use; Said heat conduction phase-change material still can keep quite mobile, thermal conductivity; Make the unlikely rising of interface thermal resistance between said substrate and said heat-conductive assembly, and then the useful life of light emitting diode illuminating apparatus of the present invention, more traditional light emitting diode illuminating apparatus came longly.
Below preferred embodiment of the present invention is specified; But the present invention is not limited to said embodiment; Those of ordinary skill in the art also can make all modification that is equal to or replacement under the prerequisite of spirit of the present invention, modification that these are equal to or replacement all are included in the application's claim institute restricted portion.
Description of drawings
For let above and other objects of the present invention, feature and advantage can be more obviously understandable, will combine accompanying drawing that preferred embodiment of the present invention is specified below:
Figure 1A is the part sectioned view of the light emitting diode illuminating apparatus of preferred embodiment of the present invention;
Figure 1B is the part exploded view of said light emitting diode illuminating apparatus;
Fig. 1 C is the vertical view of little shape set of lenses of said light emitting diode illuminating apparatus;
Fig. 1 D is another outstanding distribution schematic diagram of said little shape set of lenses;
Fig. 1 E is another outstanding distribution schematic diagram of said little shape set of lenses;
Fig. 2 A is the sketch map of another outstanding geometry of said little shape set of lenses;
Fig. 2 B is the sketch map of another outstanding geometry of said little shape set of lenses;
Fig. 2 C is the profile of the said little shape set of lenses among Fig. 2 B;
Fig. 2 D is the sketch map of another outstanding geometry of said little shape set of lenses;
Fig. 2 E is the profile of the said little shape set of lenses among Fig. 2 D;
Fig. 2 F is another profile of the said little shape set of lenses among Fig. 2 D; And
Fig. 3 is the part sectioned view of the light emitting diode illuminating apparatus of embodiments of the invention.
Claims (19)
1. a light emitting diode illuminating apparatus is characterized in that, comprises:
One microscope carrier, said microscope carrier comprise a top surface and a basal surface, and said microscope carrier forms one first depressed part on said top surface, and said microscope carrier forms one second depressed part on said basal surface, and said first depressed part is connected with said second depressed part;
One substrate, said substrate embed said second depressed part, and said substrate is connected with a top, and said substrate has a basal surface, and the said basal surface of said substrate and the said basal surface of said microscope carrier be copline roughly;
One LED crystal particle, said LED crystal particle are arranged on the said substrate;
One heat pipe has a par, and said substrate is arranged on the said par;
One supporter, said supporter has a through hole, and said supporter is fixed on the said heat pipe, and said microscope carrier is fixed on the said supporter through a plurality of screws; And a little shape set of lenses, said little shape set of lenses is arranged on said first depressed part.
2. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that: said little shape set of lenses comprises several gives prominence to, and said several are given prominence to and are arranged on the surface of said little shape set of lenses with Two dimensional Distribution.
3. light emitting diode illuminating apparatus as claimed in claim 2 is characterized in that: each is outstanding to be a hemisphere, a horizontal cylinder or a pyramid lenticule.
4. light emitting diode illuminating apparatus as claimed in claim 2 is characterized in that: it is several concentric circless that said these are given prominence to.
5. light emitting diode illuminating apparatus as claimed in claim 4 is characterized in that: each outstanding cross section is a semicircle, a triangle or one trapezoidal.
6. light emitting diode illuminating apparatus as claimed in claim 2; It is characterized in that: said surface comprises a first area and a second area, and said these outstanding density that are positioned at said first area are greater than said these outstanding density that are positioned at said second area.
7. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that: said microscope carrier is a LTCC plate, a printed circuit board (PCB) or a metallic core circuit board.
8. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that: a viscose glue is filled between said substrate and said second depressed part.
9. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that: the diameter of said first depressed part causes said second depressed part to have said top less than the diameter of said second depressed part.
10. light emitting diode illuminating apparatus as claimed in claim 9 is characterized in that: said substrate is electrically connected with said top.
11. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that: said substrate comprises one the 3rd depressed part, and said LED crystal particle is arranged in said the 3rd depressed part.
12. light emitting diode illuminating apparatus as claimed in claim 11 is characterized in that: said substrate comprises a reflector, and said reflector is positioned on said the 3rd depressed part, and said LED crystal particle is arranged on the said reflector.
13. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that: further comprise a heat conduction phase-change material, be arranged between said par and the said substrate.
14. light emitting diode illuminating apparatus as claimed in claim 13 is characterized in that: said heat conduction phase-change material has viscosity.
15. light emitting diode illuminating apparatus as claimed in claim 13 is characterized in that: said heat conduction phase-change material has a phase transition temperature, and said phase transition temperature is between 40 ℃ to 60 ℃.
16. light emitting diode illuminating apparatus as claimed in claim 13 is characterized in that: said heat conduction phase-change material has a conductive coefficient, and said conductive coefficient is between 3.6W/mK to 4.0W/mK.
17. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that: further comprise an encapsulating material, said encapsulating material and covers said LED crystal particle between said LED crystal particle and said little shape set of lenses.
18. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that: said substrate is a silicon, metal or LTCC.
19. light emitting diode illuminating apparatus as claimed in claim 1 is characterized in that: said LED crystal particle is semiconductor light-emitting diode or semiconductor laser crystal grain.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2007/001982 WO2009000106A1 (en) | 2007-06-25 | 2007-06-25 | Led lighting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101711434A CN101711434A (en) | 2010-05-19 |
| CN101711434B true CN101711434B (en) | 2012-03-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007800534543A Expired - Fee Related CN101711434B (en) | 2007-06-25 | 2007-06-25 | Led lighting device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20100181590A1 (en) |
| CN (1) | CN101711434B (en) |
| WO (1) | WO2009000106A1 (en) |
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| CN102044536B (en) * | 2009-10-21 | 2013-06-12 | 新灯源科技有限公司 | Photoelectric energy conversion device |
| JP4842387B1 (en) * | 2010-06-11 | 2011-12-21 | シャープ株式会社 | Lighting device |
| US8354684B2 (en) | 2011-01-09 | 2013-01-15 | Bridgelux, Inc. | Packaging photon building blocks having only top side connections in an interconnect structure |
| CN102693973A (en) * | 2011-03-24 | 2012-09-26 | 新灯源科技有限公司 | Light-emitting diode lighting device |
| US8593330B2 (en) | 2011-07-11 | 2013-11-26 | Honeywell International Inc. | Multichannel, multimode, multifunction L-band radio transceiver |
| KR101850432B1 (en) * | 2011-07-11 | 2018-04-19 | 엘지이노텍 주식회사 | Light emitting moudule |
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Also Published As
| Publication number | Publication date |
|---|---|
| US20100181590A1 (en) | 2010-07-22 |
| WO2009000106A1 (en) | 2008-12-31 |
| CN101711434A (en) | 2010-05-19 |
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