CN101688289A - Flexible circuit board material and method for producing the same - Google Patents

Flexible circuit board material and method for producing the same Download PDF

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Publication number
CN101688289A
CN101688289A CN200880012010A CN200880012010A CN101688289A CN 101688289 A CN101688289 A CN 101688289A CN 200880012010 A CN200880012010 A CN 200880012010A CN 200880012010 A CN200880012010 A CN 200880012010A CN 101688289 A CN101688289 A CN 101688289A
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CN
China
Prior art keywords
layer
circuit board
board material
flexible circuit
copper layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN200880012010A
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Chinese (zh)
Inventor
S·冈瑟
W·肖恩伯格
S·斯特拉克
N·希勒
V·柯克霍夫
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Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Forderung der Angewandten Forschung eV
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Publication date
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Publication of CN101688289A publication Critical patent/CN101688289A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor

Abstract

The invention relates to a flexible circuit board material comprising a polymer substrate (2) and a copper layer (4), and to a method for the production thereof, wherein a layer of titanium oxide (3)is deposited between the polymer substrate and copper layer, and the layer of titanium oxide and the copper layer are deposited by means of a vacuum method. The polymer substrate is made, as an example, of one of the materials polyamide, PEN, PEEK, PET, or fluoropolymer.

Description

Flexible circuit board material and preparation method thereof
Describe
The present invention relates to a kind of flexible circuit board material and a kind of method for preparing this flexible circuit board material that includes the polymeric substrates of copper coating.
In order to prepare flexible electric circuit board, at first use the polyimide of copper coated.Polyimide shows high thermal stability and chemical stability, therefore the load (Belastungen) of each processing step when this circuit board material of preparation, as electroplate the back and strengthen the copper layer that is coated with, next by etching reagent or finally for circuit board material outfit functional element makes the structurizing of copper layer, increase by wave soldering or immersion liquid soldering.
Except the stability of polyimide in described processing step process, in manufacturing processed the copper layer on polyimide adhesive power and the life-span of circuit board material all be marginal.On polyimide, tried out several different methods in order to realize copper layer strong bond.But also do not find gratifying solution at present.
Prior art
For example known, before copper layer on the Kapton, reactive ion etch process (people such as Arthur L. Ruoff " Improvement ofadhesion of copper on polyimide by reactive ion-beam etching; IBM J.Res.Develop.; 1988; the 32nd volume, 626-630 page or leaf) is carried out on the surface of Kapton.Though the polymer architecture of substrate is handled by ion etching and is opened the adhesive capacity that promotes sedimentary copper layer thereon, also plays the effect of the material character that changes substrate simultaneously.
For the sticking property of copper layer, also suggestion deposits adhesion promoting layer between polyimide substrate and copper layer.The bottom that for example known Cr or NiCr form is used for improving the adhesivity (people such as K.J.Blackwell of copper layer, Enhancement of Chromium-to-polyimide Adhesion byOxygen DC Glow Treatment Prior to Roll-Sputter Seeding, Society ofVacuum Coaters, 1992, S 279-283).The shortcoming of this scheme is, when the etch printing conductor structure, this moment is Cr or the NiCr layer under the etched copper together also, forms krebserregende Cr-VI-compound.Another shortcoming is, when the etching reagent that adapts to copper relates to Cr or NiCr layer, by this etching reagent, causes the printed circuit cable structure by sapping.
JP 200,301 1272 A disclose other metallic substance that is suitable as tackifier between polyimide film and copper layer.When structurizing sort circuit panel material, must remove this bottom of copper printed circuit cable outside fully because this can the conduction bottom otherwise can cause electrical short between the printed circuit cable.But, be used for making the structurized etching reagent of circuit board material especially to be designed to etch copper at its etching action, this causes, and usually can not remove metal back layer between the printed circuit cable fully with employed etching reagent, the sapping printed circuit cable structure of having described more than perhaps taking place again.
Summary of the invention
Therefore, the technical problem to be solved in the present invention provides a kind of flexible circuit board material and preparation method thereof, overcomes the shortcoming of prior art by this.Especially the copper layer of circuit board material should have high adhesion strength on base material, can make printed circuit cable structurizing on the circuit board material by etch process.
The theme of the feature by having claim 1 and 20 solves above-mentioned technical problem.Other favourable scheme of the present invention is provided by dependent claims.
Comprise in the inventive method of flexible circuit board material of polymeric substrates and copper layer in preparation, dielectric layer is as closed layer between polymeric substrates and copper layer, and in the case, dielectric layer and copper layer deposit by vacuum method.
Sedimentary like this dielectric intermediate layer has merged two advantages.On the one hand, this middle layer, it can be with thick layer thickness deposition to maximum 100nm, and the tackifier as excellence between polymeric substrates and copper layer work.On the other hand, this dielectric layer does not have electroconductibility, therefore needn't remove between the printed circuit cable when making the printed circuit cable structurizing.Therefore, when making the structurizing of conduction group, can use conventional etching reagent, described etching reagent especially is designed for the etch copper material.
Dielectric layer for example can be with oxide compound or mixed oxide deposition.Ti for example, Zn, Nb, Mo, Sn or Ta are suitable as the element of this oxide compound or mixed oxide layer.Described oxide compound or mixed oxide layer other element that also can mix.Titanium oxide layer is particularly suitable as dielectric layer, because titanium oxide plays the effect of outstanding tackifier between polymeric substrates and copper layer.
In a kind of embodiment, titanium oxide layer deposited with titanium dioxide layer before polymeric substrates and copper layer.
Perhaps described dielectric layer also can be formed by nitride or oxynitride deposition.This nitride or oxynitride layer for example can be by element tis, Zn, and Nb, Mo, Sn, Ta or Si form.
Magnetron sputtering system is fit to the deposit dielectric middle layer because with this method also can the deposit thickness scope the very little layer thickness of several nanometers only, and layer character keeps identical.For example can use with the average frequency scope and come settled layer as the dual magnetron that 5kHz to 250kHz moves.But also can use the RF-magnetron.Magnetron sputtering system both can reactively also can non-reactively carry out.
Deposited oxide layer deposits by spray the titanium target in the presence of reactant gas oxygen in another embodiment.When the titanium target sprays with the full response sexual norm, can implement simple especially process adjustments at this, because the full response pattern is a kind of stable state of the art.In addition, guarantee to deposit complete stoichiometric titanium oxide layer with the full response pattern.
But, for dielectric layer, also can use electron beam spraying or CVD method, in the case, each of these methods can be carried out under auxiliary being with or without plasma body.
Perhaps, when copper layer, also can use from the evaporation boat or by the magnetron of electron beam and spray or spraying, in the case, spraying can be with or without the auxiliary output down of plasma body again.
Particularly advantageous be dielectric layer and copper layer directly in turn and do not have the break vacuum deposit connect because realize the layer of special secure adhesion thus.
If transform the layer character that is maintained identical on the whole surface of polymeric substrates, then polymeric substrates moves with constant speed in coating procedure.
In another embodiment, with strengthening again by electrochemical plating after the vacuum method copper layer.
Flexible circuit board material of the present invention comprises polymeric substrates and copper layer, in the case, forms dielectric layer between polymeric substrates and copper layer.
Polymeric substrates can be made up of one of material polyimide, PEN, PEEK, PET or fluoropolymer, perhaps forms film or forms fibrous reticulum or fabric.
To dielectric layer and stark suitable layer thickness is thick in maximum 100nm.Dielectric layer for example can be with element ti, Zn, and Nb, Mo, the oxide compound of Sn or Ta or mixed oxide form, and in the case, oxide compound or mixed oxide can have other doped element.If dielectric layer forms with titanium dioxide layer, then the layer thickness of 75nm is just enough as the upper limit.But if with titanium dioxide layer as adhesion promoting layer, just reached good adhesion results even then be lower than the layer thickness of 30nm.
Perhaps dielectric layer also can be with for example element ti, Si, and Zn, Nb, Mo, the nitride of Sn or Ta or oxynitride form.
In one embodiment, the adhesion strength of the copper layer of flexible circuit board material is 6N/cm at least, records according to IPC-Norm 650.
Embodiment
Below explain the present invention in more detail by preferred embodiment.
The sectional view of flexible circuit board material 1 of the present invention schematically draws in Fig. 1.In the thick polyimide of 25 μ m-(Kapton HN)-substrate 2, deposit the thick TiO of 6nm by MF-sputter device 2Layer 3.In the case, in first vacuum chamber,, in the presence of reactant gas oxygen, spray the titanium target with oxidation model by dual magnetron with average frequency 40kHz operation.Do not having under the break vacuum situation, next in second vacuum chamber, depositing the thick copper layer 4 of about 100nm at once.For copper layer 4, use single magnetron with direct voltage drive.Next the copper layer 4 of sputter is electroplated on total layer thickness of about 20 μ m again and is strengthened.
The single adhesion strength value that can record copper layer 4 in the substrate 2 according to IPC-Norm 650 is 12.0N/cm.Otherwise, do not having TiO 2Under layer 3 situation, the adhesion strength of 4N/cm is had in same experiment down.

Claims (17)

1. be used for the method that preparation comprises the flexible circuit board material of polymeric substrates (2) and copper layer (4), it is characterized in that, titanium deposition oxide skin (3) between polymeric substrates (2) and copper layer (4), in the case, titanium oxide layer (3) and copper layer (4) deposit by vacuum method.
2. according to the method for claim 1, it is characterized in that deposition of titanium oxide layer (3) between polymeric substrates (2) and copper layer (4).
3. according to the method for claim 1 or 2, it is characterized in that titanium oxide layer (3) deposits by the magnetron sputtering device.
4. according to the method for claim 3, it is characterized in that, use dual magnetron with average frequency 5kHz to 250kHz operation.
5. according to the method for claim 3, it is characterized in that, use the RF magnetron.
6. according to the method for one of claim 3 to 5, it is characterized in that, use the titanium target that in the presence of reactant gas oxygen, sprays.
7. according to the method for claim 6, it is characterized in that the titanium target sprays with the complete reaction sexual norm.
8. according to the method for one of aforementioned claim, it is characterized in that copper layer (4) deposits by the magnetron sputtering device.
9. according to the method for one of aforementioned claim, it is characterized in that titanium oxide layer and copper layer are not directly in turn having the break vacuum deposit.
10. according to the method for one of aforementioned claim, it is characterized in that titanium oxide layer is with the thickness deposition less than 100nm.
11. comprise the flexible circuit board material of polymeric substrates (2) and copper layer (4), it is characterized in that, between polymeric substrates (2) and copper layer (4), form titanium oxide layer (3).
12. the flexible circuit board material according to claim 11 is characterized in that, polymeric substrates (2) is by the material polyimide, PEN, and PEEK, one of PET or fluoropolymer are formed.
13. the flexible circuit board material according to claim 11 or 12 is characterized in that, the thickness of titanium oxide layer (3) is less than 100nm.
14. the flexible circuit board material according to one of claim 11 to 13 is characterized in that, titanium oxide layer (3) forms with titanium dioxide layer.
15. the flexible circuit board material according to claim 14 is characterized in that, the thickness of titanium dioxide layer (3) is less than 75nm.
16. the flexible circuit board material according to claim 15 is characterized in that, the thickness of titanium dioxide layer (3) is less than 30nm.
17. the flexible circuit board material according to one of claim 11 to 16 is characterized in that, the adhesion strength of the copper layer (4) that records according to IPC-Norm 650 is 6N/cm at least.
CN200880012010A 2007-05-10 2008-05-07 Flexible circuit board material and method for producing the same Pending CN101688289A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102007021896.8 2007-05-10
DE102007021896A DE102007021896A1 (en) 2007-05-10 2007-05-10 Flexible printed circuit board material and method of making the same
PCT/EP2008/003678 WO2008138532A1 (en) 2007-05-10 2008-05-07 Flexible circuit board material and method for producing the same

Publications (1)

Publication Number Publication Date
CN101688289A true CN101688289A (en) 2010-03-31

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CN200880012010A Pending CN101688289A (en) 2007-05-10 2008-05-07 Flexible circuit board material and method for producing the same

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US (1) US20100300731A1 (en)
JP (1) JP2010530612A (en)
KR (1) KR20100015522A (en)
CN (1) CN101688289A (en)
DE (1) DE102007021896A1 (en)
WO (1) WO2008138532A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104155716A (en) * 2014-08-14 2014-11-19 武汉北方光电科技有限公司 Low-loss and high-temperature-resistant optical fiber

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010015149A1 (en) 2010-04-16 2011-10-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Apparatus for coating a substrate within a vacuum chamber by plasma assisted chemical vapor deposition

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3698946A (en) * 1969-11-21 1972-10-17 Hughes Aircraft Co Transparent conductive coating and process therefor
US4647508A (en) * 1984-07-09 1987-03-03 Rogers Corporation Flexible circuit laminate
DE3926877A1 (en) * 1989-08-16 1991-02-21 Leybold Ag METHOD FOR COATING A DIELECTRIC SUBSTRATE WITH COPPER
JP2788779B2 (en) * 1990-03-09 1998-08-20 古河電気工業株式会社 Material board for circuit board
US5112462A (en) * 1990-09-13 1992-05-12 Sheldahl Inc. Method of making metal-film laminate resistant to delamination
US5589280A (en) * 1993-02-05 1996-12-31 Southwall Technologies Inc. Metal on plastic films with adhesion-promoting layer
US6103320A (en) * 1998-03-05 2000-08-15 Shincron Co., Ltd. Method for forming a thin film of a metal compound by vacuum deposition
DE19850592C1 (en) * 1998-11-03 2000-10-12 Lpkf Laser & Electronics Ag Adhesion promoter layer for creating adhesive conductor structures on electronic insulation materials
AU1648701A (en) * 1999-11-30 2001-06-12 Otsuka Chemical Co. Ltd. Resin composition and flexible printed circuit board
JP2003011272A (en) 2001-07-02 2003-01-15 Mitsubishi Shindoh Co Ltd Metallized polyimide film
JP2003117404A (en) * 2001-10-19 2003-04-22 Bridgestone Corp Method for preparing photocatalyst and photocatalyst
JP5105217B2 (en) * 2005-04-25 2012-12-26 大日本印刷株式会社 Metal laminate
JP2006310357A (en) * 2005-04-26 2006-11-09 Teijin Ltd Substrate for flexible printed circuit

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104155716A (en) * 2014-08-14 2014-11-19 武汉北方光电科技有限公司 Low-loss and high-temperature-resistant optical fiber
CN104155716B (en) * 2014-08-14 2018-09-11 武汉北方光电科技有限公司 Low-loss high-temperature-resisting optical fiber

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Publication number Publication date
JP2010530612A (en) 2010-09-09
WO2008138532A1 (en) 2008-11-20
KR20100015522A (en) 2010-02-12
US20100300731A1 (en) 2010-12-02
DE102007021896A1 (en) 2008-11-20

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Open date: 20100331