CN101685791A - Substrate supporting device and method for discharging static electricity by using same - Google Patents
Substrate supporting device and method for discharging static electricity by using same Download PDFInfo
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- CN101685791A CN101685791A CN200810223308A CN200810223308A CN101685791A CN 101685791 A CN101685791 A CN 101685791A CN 200810223308 A CN200810223308 A CN 200810223308A CN 200810223308 A CN200810223308 A CN 200810223308A CN 101685791 A CN101685791 A CN 101685791A
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Abstract
The invention discloses a substrate supporting device and a method for discharging the static electricity by using the same. The substrate supporting device comprises a substrate base, a probe liftingmechanism and a static electricity discharging mechanism; a substrate can be placed on the substrate base; the probe lifting mechanism and the charging mechanism are arranged below the substrate; thestatic electricity discharging mechanism comprises a probe, a driving component and a switch; the probe penetrates through the substrate base and can move back and force relative to the substrate base; the driving component is used for driving the probe to move; and the switch is used for connecting the probe with the ground. In addition to the probe lifting mechanism, the substrate supporting device is only additionally provided with the static electricity discharging mechanism which comprises the probe, the damping component and the switch, and the substrate supporting device can be used for discharging the total static electricity left in the substrate. Compared with the prior art, the substrate supporting device has simple structure and lower producing and maintaining cost. Moreover,the method for discharging the static electricity by using the substrate supporting device has simple static electricity discharging process, does not need a complicate feedback mechanism to define asubstrate stain limit for distinguishing, is not limited by the response time and can rapidly discharge the total static electricity left in the substrate in short time.
Description
Technical field
The present invention relates to the plasma process technical field, particularly a kind of substrate support device and electrostatic release method thereof.
Background technology
In the plasma process field, generally in the vacuum reaction chamber, substrate is carried out etching or adopts chemical vapour deposition technique to form semiconductor structure at substrate surface.In this process, usually need utilize for example electrostatic chuck (ElectroStatic Chuck of substrate support device, ESC) substrate is fixed on the indoor specific station of vacuum reaction chamber, the process gas that then will be used for etching or deposition is transported among the vacuum reaction chamber by pipeline, simultaneously at the indoor rf electric field that applies of vacuum reaction chamber, process gas excited to plasmoid start working.
In the present plasma processing equipment, be embedded with the single electrode or the bipolar electrode that are used to produce static in the substrate support devices such as electrostatic chuck, for example, be embedded with a electrode in the electrostatic chuck of bipolar electrode, be placed with substrate to be processed on this upper surface near the upper surface of electrostatic chuck.In the technical process, utilize the ESC power supply on bipolar electrode, to apply high voltage direct current earlier, make two electrodes gather the electric charge of opposed polarity respectively, electrode corresponding zone in substrate near the electrostatic chuck upper surface induces the charge inducing different with the polarity of electrode itself, that is to say, polarity near the charge inducing of corresponding region in the electric charge in the electrode of electrostatic chuck upper surface and the substrate is opposite, and the electrostatic attraction between them makes substrate be adsorbed on the upper surface of electrostatic chuck and is fixed; After processing technology is finished, the ESC power supply applies reverse voltage again on described bipolar electrode, neutralize with the electric charge that in substrate, induces with described charge inducing opposed polarity, finish the static dispose procedure, described electrostatic attraction is disappeared, utilize the substrate that will rise after pin mechanism will process to hold up then, with manipulator substrate is taken out again from electrostatic chuck.
But, the method that applies reverse voltage by the ESC power supply generally can not be fully in and the charge inducing in the substrate, left over remaining static toward contact, this is because the elimination of static is subjected to influence of various factors, for example the height of reverse voltage, apply the reverse voltage time etc., and for different technology, substrate also is different by the electric weight of electrostatic chuck absorption back institute static electrification, so the electric weight of the remaining static in static release back also is not quite similar.
The direct influence that remaining static brings is to rise after technology is finished in the process of pin mechanism picking-up substrate the bonding die phenomenon takes place, that is to say, the electrostatic attraction of remaining generation of static electricity makes substrate still be adsorbed on the surface of electrostatic chuck, and with remaining static to increase the bonding die phenomenon obvious more, cause substrate may depart from the center of vacuum reaction chamber or in the rise process, fall sheet, cause manipulator can't normally take out substrate; Also the fragment phenomenon can take place under the even more serious bonding die situation, pollute whole vacuum reaction chamber, need shutdown to open chamber and clear up.
At the problems referred to above, a kind of supporting arrangement of semiconductor chip is provided in the prior art, its structure as shown in Figure 1, described supporting arrangement comprises: the substrate holder that is used to place semiconductor chip, be used for rising pin mechanism with what described substrate holder was left in the substrate lifting, be positioned at rise below the pin mechanism, be used to drive the motor that rises the lifting of pin mechanism, connect described motor and rise the guide spiro rod of pin mechanism, and be used for limiting and rise the feedback mechanism of pin mechanism the substrate active force in the lifting process.
The described pin mechanism that rises comprises: the column raising board below the substrate holder is connected in the lifting group post on the described column raising board; Described lifting group post passes substrate holder and contacts with the bottom surface of substrate, and described column raising board also is provided with sealing ring by switch and variable resistor ground connection between described column raising board and the substrate holder.Described feedback mechanism comprises: strain gauges, motor controller and encoder; Have the bipolar electrode (not shown) in the described substrate holder, one of them electrode is near the upper surface of substrate holder.
After plasma process technology is finished, apply reverse voltage on the bipolar electrode of substrate holder, open motor then, motor drives the described pin mechanism that rises by guide spiro rod and moves up, contact with the bottom surface of substrate in case rise the lifting group post of pin mechanism, then substrate begins to move up and leaves substrate holder.When having left over remaining static on the substrate holder, because the effect of electrostatic attraction, lifting group post can not lift substrate, but make substrate produce strain, along with the lifting of lifting group post, this strain is also increasing, and strain gauges is monitored this strain value in real time and fed back signal to motor controller, when remaining static excessive, when described strain was increased to the value that may cause damaged substrate, motor controller was ended motor running, stops to apply the rising active force to rising pin mechanism, simultaneously, Closing Switch makes substrate ground connection, begins substrate is discharged, discharged static after, motor controller order motor turns round again, thus with substrate band from substrate holder.
What technique scheme adopted is the typical closed-loop reponse system, when the substrate strain value is increased to the value that may cause damaged substrate, switch receives that signal discharges automatically, yet problem is, owing in substrate holder, introduced the feedback mechanism that comprises strain gauges, motor controller and encoder etc., structure is obviously comparatively complicated, has promoted the manufacturing and the maintenance cost of equipment.
Summary of the invention
The problem that the present invention solves provides a kind of substrate support device simple in structure, lower-cost.
Another problem that the present invention solves provide a kind of discharge process simply, electrostatic release method rapidly.
For addressing the above problem, the invention provides a kind of substrate support device, comprising: be used to place the substrate holder of substrate, be positioned at and rise pin mechanism and discharge mechanism below the substrate, described discharge mechanism comprises:
The probe that runs through described substrate holder and can move around with respect to substrate holder drives the driver part that described probe moves, and with the switch that is connected between described probe and the earth.
Optionally, the described pin mechanism that rises comprises the lifting pin group that runs through described substrate holder and can move around with respect to substrate holder, the raising board that is connected with described lifting pin group, and drive the driver part that described lifting pin group moves;
Described probe is provided with damped part away from an end of substrate, and probe flexibly connects by described damped part and described raising board, and the driver part of described probe is the driver part of lifting pin group.
Optionally, probe is specially with the mode that raising board flexibly connects: it is the pilot hole of matched in clearance that the position of the corresponding probe of raising board is provided with probe, probe stretch in the described pilot hole away from an end of substrate and with being connected of damped part, the sleeve of damped part below raising board is fixed on and rises on the needle plate.
Optionally, the mode that probe and raising board flexibly connect is specially: probe stretches in the sleeve away from an end of substrate, and link to each other with sleeve by the embedded damped part of sleeve, probe and sleeve are matched in clearance, sleeve passes the raising board center and fixedlys connected with raising board.
Described probe is corresponding to the center of substrate.
The maximum damping force of described damped part is less than or equal to the gravity of substrate.
Probe does not contact under the state of substrate bottom surface, and the top of probe is higher than the top of lifting pin group.
Optionally, the driver part of described probe is an electromagnetic component, and described probe is the ferromagnetism end corresponding with described electromagnetic component away from an end of substrate, and described ferromagnetism end is connected with the bottom of substrate holder by damped part.
The difference of the electromagnetic force of described electromagnetic component and the maximum damping force of damped part is less than or equal to the gravity of substrate.
Described probe is cylindrical, and the material of probe is an electric conducting material.
Described electric conducting material is the material of plasma resistant.
Described damped part is spring, hydraulic damping parts or air pressure damped part.
Accordingly, the present invention also provides a kind of electrostatic release method of substrate support device, comprising:
Electrode in the substrate holder is applied reverse voltage;
The probe of discharge mechanism is connected substrate and the earth under the driving of driver part;
Lifting mechanism rises substrate from substrate holder.
Compared with prior art, technique scheme has the following advantages:
Described substrate support device has the only additional discharge mechanism that is made up of probe, damped part and switch on the basis that rises pin mechanism, remaining static in the substrate can be discharged fully, in terms of existing technologies, simple, manufacturing of apparatus structure and maintenance cost are lower.
In addition, the electrostatic release method of described substrate support device, come down to before rising pin mechanism rise substrate, to discharge the remaining static in the substrate, i.e. " discharge in advance ", discharge process is simple, and the limit that does not need complicated feedback mechanism to define a substrate strain is distinguished, and is not subjected to the restriction of response time, can be at short notice the remaining static of substrate be discharged rapidly, avoid taking place the possibility of bonding die.
Secondly, can regulate discharge time, and the probe by control discharge mechanism and the difference in height at the top of lifting pin group and the actuating speed of driver part realize; Once more, the probe of discharge mechanism is realized discharging function, and lifting pin group realizes rising the function of substrate, and both functions are separated separately, thereby can select to be fit to the material of self needs; At last, the discharge mechanism adaptive capacity of described substrate support device is strong, can adapt to the remaining static of various magnitudes, and discharge rapidly.
Description of drawings
Shown in accompanying drawing, above-mentioned and other purpose, feature and advantage of the present invention will be more clear.Reference numeral identical in whole accompanying drawings is indicated identical part.Painstakingly do not draw accompanying drawing, focus on illustrating purport of the present invention by actual size equal proportion convergent-divergent.
A kind of structural representation of electrostatic chuck in Fig. 1 prior art;
Fig. 2 is the schematic diagram of substrate support device in the embodiment of the invention one;
Fig. 3 is the schematic diagram of the static release condition of substrate support device shown in Figure 2;
Fig. 4 is the schematic diagram of discharge mechanism in the embodiment of the invention two;
Fig. 5 is the schematic diagram of substrate support device in the embodiment of the invention three.
Embodiment
For above-mentioned purpose of the present invention, feature and advantage can be become apparent more, the specific embodiment of the present invention is described in detail below in conjunction with accompanying drawing.
Set forth a lot of details in the following description so that fully understand the present invention, implement but the present invention can also adopt other to be different from alternate manner described here, so the present invention has not been subjected to the restriction of following public specific embodiment.
Secondly, the present invention is described in detail in conjunction with schematic diagram, when the embodiment of the invention is described in detail in detail; for ease of explanation; the profile of indication device structure can be disobeyed general ratio and be done local the amplification, and described schematic diagram is example, and it should not limit the scope of protection of the invention at this.The three dimensions size that in actual fabrication, should comprise in addition, length, width and the degree of depth.
In the plasma processing equipment, the discharge mechanism of traditional substrate support device is owing to introduced the feedback mechanism (see figure 1) that comprises strain gauges, motor controller and encoder etc. in substrate holder, structure is obviously comparatively complicated, thereby has promoted the manufacturing and the maintenance cost of equipment.
Secondly, the release of the remaining static of substrate makes substrate produce strain enough may to carry out during fragment greatly rising pin mechanism, need discern the strain that remaining static causes by strain gauges and whether reach discharge limit.When strain was excessive, strain gauges need spend the regular hour to the motor controller signal, and motor controller needs the regular hour to stop motor operations after receiving signal equally.In this process, still the column raising board continues to rise, although the response time is extremely short, substrate still may produce bigger strain.The response time of feedback mechanism is oversize relatively cause substrate may be under the situation that does not have enough time to discharge fragment.
Once more, too many to the discharge limit influencing factor, promptly strain gauges just can be sent stop signal when strain reaches much.Through in the reverse voltage and after, remaining static is uneven distribution in the substrate, and the position that changes the absorption of technological parameter meron changes, these precision to strain gauges have more or less also caused influence.
In addition, the substrate discharge is finished by column raising board ground connection, and this inevitable requirement column raising board is an electric conducting material.For general electric conducting material major part is metal, but metal plasma resistant poor ability corrodes in environment easily, has influenced useful life.
Based on this, the invention provides a kind of substrate support device simple in structure, lower-cost, and the electrostatic release method essence of described substrate support device is, remaining static in the substrate can be eliminated before substrate is risen the rise of pin mechanism fully, can break off bonding die or fragment hidden danger that remaining static brings.
Embodiment one
Substrate support device in the present embodiment is an electrostatic chuck, and Fig. 2 is the structural representation of described substrate support device.This substrate support device comprises: the substrate holder 1 that is used to place substrate 2, be positioned at and rise pin mechanism 3 and discharge mechanism 4 below the substrate 2, the described pin mechanism 3 that rises is used for after processing technology is finished substrate being lifted from substrate holder, and discharge mechanism 4 is used for discharging the remaining static of substrate.
Be embedded with the bipolar electrode (not shown) in the described substrate holder 1, an electrode in the bipolar electrode is near the upper surface of substrate holder, and this bipolar electrode links to each other with external dc power, is used for making substrate to produce charge inducing, and this part structure is similar to conventional art.
The described pin mechanism 3 that rises comprises: the lifting pin group 31 that runs through described substrate holder 1 and can move around with respect to substrate holder, and the raising board 32 that is connected with described lifting pin group 31 drive the driver part (not shown) that described lifting pin group 31 moves.
Particularly, lifting pin group 31 be positioned at substrate 2 under, comprise three equally distributed cylindrical lifting pins at least, four pin lifting pin groups that are symmetrically distributed with the center of substrate holder 1 for example, the position of corresponding lifting pin group 31 is provided with through hole 11 in the substrate holder 1.Lifting pin group 31 is connected with raising board 32 away from an end of substrate, and raising board 32 links to each other with driver part by screw rod, and driver part can be motor.Lifting pin group 31 can move around in through hole 11 under the driving of motor, when lifting pin group 31 rises, the substrate 2 that has discharged remaining static can be lifted from substrate holder 1.
Described discharge mechanism 4 comprises: the probe 41 that runs through described substrate holder 1 and can move around with respect to substrate holder 1, the damped part 42 that probe 41 is provided with away from an end 412 of substrate 2 is with the switch 6 that is connected between described probe 41 and the earth.
Have central through hole 12 in the substrate holder 2, probe 41 stretches in the central through hole 12, and then probe 41 is corresponding to the center of substrate 2.Probe 41 flexibly connects by damped part 42 and raising board 32 away from an end 412 of substrate 2, the driver part of probe 41 is the driver part of lifting pin group 31, and then driver part can drive lifting pin group 31 and probe 41 simultaneously together along moving around on the direction perpendicular to substrate 2.
As shown in Figure 2, probe 41 does not contact under the state of substrate 2, and the top 411 of probe 41 is higher than the top 311 of lifting pin group 31, and 42 pairs of probes 41 of damped part this moment play supporting role.Fig. 3 is the schematic diagram of the static release condition of substrate support device shown in Figure 2, as shown in Figure 3, under the state of probe 41 and substrate 2 butts, probe 41 moves in sleeve 43 with respect to raising board 32 along pilot hole 321, damped part 42 is compressed, the maximum damping force of described damped part 42 is less than or equal to the gravity of substrate, and probe 41 can not rise substrate 2 separately all the time from substrate holder 1 like this.
Described damped part 42 can be spring, hydraulic damping parts or air pressure damped part, spring preferably, and the spring cost is lower, and with respect to the damped part of other kinds, can the vacuum reaction chamber at substrate support device place not polluted.
Described probe 41 is cylindrical, and the material of probe is an electric conducting material, and described electric conducting material is preferably the material of plasma resistant, can guarantee probe in technical process not by plasma erosion, increase the service life.
Introduce the electrostatic release method of described substrate support device below:
After technical process is finished, as shown in Figure 2, the probe 41 that rises the lifting pin group 31 of pin mechanism 3 and discharge mechanism 4 all be positioned at substrate 2 below, do not contact with substrate 2.External dc power applies reverse voltage (voltage that applies when making substrate 2 be adsorbed on the substrate holder 1) to the electrode in the substrate holder 1, at this moment, charge inducing major part in substrate 2 bottom surfaces is neutralized, but the still residual remaining static that part is arranged, this part remaining static makes substrate 2 still be adsorbed on the substrate holder 1.
Driver part drives probe 41 and lifting pin group 31 continues to rise, and probe 41 is compressed damped part 42 owing to propped up by substrate 2 and move downward with respect to raising board 32; Because the maximum damping force of damped part 42 is less than or equal to the gravity of substrate 2, so before lifting pin group 31 contact substrates 2, substrate 2 can not risen by probe 41.
Lifting pin group 31 continues to rise and abut to substrate 2, and the process that remaining static discharges so far finishes, and the electrostatic attraction between substrate 2 and the substrate holder 1 disappears, so, substrate 2 is risen by lifting pin group 31 and probe 41, leaves substrate holder 1, and then utilizes manipulator that substrate 2 is taken out.
In substrate 2 rise processes, because probe 41 is positioned at the center of substrate holder 1, cooperate with equally distributed lifting pin group 31, can keep rising the balance of process substrate 2.
The described substrate support device of present embodiment has the only additional discharge mechanism that is made up of probe, damped part and switch on the basis that rises pin mechanism, the remaining static of substrate can be discharged fully, in terms of existing technologies, simple in structure, manufacturing and maintenance cost are lower.
In addition, the electrostatic release method of described substrate support device, come down to before rising pin mechanism rise substrate, to discharge the remaining static in the substrate, i.e. " discharge in advance ", the limit that does not need complicated feedback mechanism to define a substrate strain is distinguished, be not subjected to the restriction of response time, can avoided all that the possibility of bonding dies takes place at short notice with the remaining static release of substrate.
Secondly, can regulate discharge time, and the probe by control discharge mechanism and the difference in height at the top of lifting pin group and the actuating speed of driver part realize; Once more, the probe of discharge mechanism is realized discharging function, and lifting pin group realizes rising the function of substrate, and both functions are separated separately, thereby can select to be fit to the material of self needs; At last, the discharge mechanism adaptive capacity of described substrate support device is strong, can adapt to the remaining static of various magnitudes, and discharge rapidly.
In the above substrate support device, probe stretches in the sleeve by the pilot hole on the raising board, when probe moves around with respect to raising board, pilot hole is defined in the moving direction of probe the direction of vertical and raising board, in addition, the parts of all right as a whole formula of probe and sleeve specifically describe in detail in following examples.
Embodiment two
Fig. 4 is the structural representation of discharge mechanism in the present embodiment, as shown in Figure 4, probe 44 stretches in the sleeve 45 away from an end of substrate, and link to each other with sleeve 45 by the embedded damped part 46 of sleeve, probe 44 is a matched in clearance with sleeve 45, probe 44 can move around in sleeve 45, and sleeve 45 passes the raising board center and fixedlys connected with raising board.Other structures and embodiment one are similar, do not repeat them here.
Be that with the difference of embodiment one probe 44 no longer leads by raising board, but directly the sleeve 45 by embedded damped part 46 leads.Wherein, sleeve 45 outer walls can threading or other structure, so that be fixed on the raising board.This all-in-one-piece simple in structure and also be convenient to the assembling.
Among above embodiment one and the embodiment two, the driver part of described probe is the driver part of lifting pin group, and also, driver part drives probe simultaneously and lifting pin group moves, and in addition, probe can also have independent driver part.
Embodiment three
Fig. 5 is the structural representation of the described substrate support device of present embodiment, and described substrate support device comprises: be used to place the substrate holder 1 of substrate, be positioned at and rise pin mechanism (not shown) and discharge mechanism 7 below the substrate 2.
Described discharge mechanism 7 comprises: the probe 71 that runs through described substrate holder 1 and can move around with respect to substrate holder 1 drives the driver part that described probe 71 moves, with the switch 6 that is connected between described probe 71 and the earth.
The driver part of probe 71 is an electromagnetic component 72, and probe 71 is the ferromagnetism end 712 corresponding with described electromagnetic component 72 away from an end of substrate 1, and described ferromagnetism terminal 712 is connected with the bottom of substrate holder 1 by damped part 73.
Described electromagnetic component 72 is for connecting the electromagnet of external power source, electromagnet is positioned at the below of the ferromagnetism end 712 of probe 71 in the present embodiment, after Closing Switch 721 makes the magnet spool energising, electromagnet applies electromagnetic force towards substrate 2 directions to probe, and the number of turn by coil on the regulating magnet or the voltage of DC power supply can change the size of electromagnetic force.Electromagnet also can be positioned at the top of the ferromagnetism end 712 of probe 71 in addition.
It is similar to rise pin mechanism and previous embodiment and the pin mechanism that rises of the prior art, does not repeat them here.
In the present embodiment, the electromagnetic force that discharge mechanism produces by electromagnet is controlled the lifting of probe 71, thereby realizes the rapid discharge to substrate 2.Discharge mechanism with rise pin mechanism and be not connected, so the work of the mechanism of discharging is independent of and rises pin mechanism, decided by the switch closure time of electromagnet discharge time fully.In addition, the discharge probe because discharge mechanism with rise pin mechanism and be not connected, so can be placed on other position, needn't be the center.Such structure is simplified structure further, reduces and makes and maintenance cost.
The above only is preferred embodiment of the present invention, is not the present invention is done any pro forma restriction.Need to prove; rise pin mechanism and be not limited to above structure; can also be for other versions of the prior art rise pin mechanism; described probe with rise that pin mechanism is connected and driven by same driver part and move around with respect to substrate holder; equally also can realize the purpose of technical solution of the present invention, also within protection scope of the present invention.
Though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention.Any those of ordinary skill in the art, do not breaking away under the technical solution of the present invention scope situation, all can utilize the method and the technology contents of above-mentioned announcement that technical solution of the present invention is made many possible changes and modification, or be revised as the equivalent embodiment of equivalent variations.Therefore, every content that does not break away from technical solution of the present invention, all still belongs in the scope of technical solution of the present invention protection any simple modification, equivalent variations and modification that above embodiment did according to technical spirit of the present invention.
Claims (13)
1, a kind of substrate support device is characterized in that, comprising: be used to place the substrate holder of substrate, be positioned at and rise pin mechanism and discharge mechanism below the substrate, described discharge mechanism comprises:
The probe that runs through described substrate holder and can move around with respect to substrate holder drives the driver part that described probe moves, and with the switch that is connected between described probe and the earth.
2, substrate support device according to claim 1, it is characterized in that, the described pin mechanism that rises comprises the lifting pin group that runs through described substrate holder and can move around with respect to substrate holder, the raising board that is connected with described lifting pin group, and drive the driver part that described lifting pin group moves;
Described probe is provided with damped part away from an end of substrate, and probe flexibly connects by described damped part and described raising board, and the driver part of described probe is the driver part of lifting pin group.
3, substrate support device according to claim 2, it is characterized in that, probe is specially with the mode that raising board flexibly connects: it is the pilot hole of matched in clearance that the position of the corresponding probe of raising board is provided with probe, probe stretch in the described pilot hole away from an end of substrate and with being connected of damped part, the sleeve of damped part below raising board is fixed on and rises on the needle plate.
4, substrate support device according to claim 2, it is characterized in that, the mode that probe and raising board flexibly connect is specially: probe stretches in the sleeve away from an end of substrate, and link to each other with sleeve by the embedded damped part of sleeve, probe and sleeve are matched in clearance, and sleeve passes the raising board center and fixedlys connected with raising board.
5, according to each described substrate support device of claim 2 to 4, it is characterized in that described probe is corresponding to the center of substrate.
According to each described substrate support device of claim 2 to 4, it is characterized in that 6, the maximum damping force of described damped part is less than or equal to the gravity of substrate.
According to each described substrate support device of claim 2 to 4, it is characterized in that 7, probe does not contact under the state of substrate bottom surface, the top of probe is higher than the top of lifting pin group.
8, substrate support device according to claim 1, it is characterized in that, the driver part of described probe is an electromagnetic component, and described probe is the ferromagnetism end corresponding with described electromagnetic component away from an end of substrate, and described ferromagnetism end is connected with the bottom of substrate holder by damped part.
9, substrate support device according to claim 8 is characterized in that, the difference of the electromagnetic force of described electromagnetic component and the maximum damping force of damped part is less than or equal to the gravity of substrate.
According to claim 1,2 or 8 described substrate support devices, it is characterized in that 10, described probe is cylindrical, the material of probe is an electric conducting material.
11, substrate support device according to claim 10 is characterized in that, described electric conducting material is the material of plasma resistant.
According to claim 2 or 8 described substrate support devices, it is characterized in that 12, described damped part is spring, hydraulic damping parts or air pressure damped part.
13, a kind of electrostatic release method of substrate support device as claimed in claim 1 comprises:
Electrode in the substrate holder is applied reverse voltage;
The probe of discharge mechanism is connected substrate and the earth under the driving of driver part;
Lifting mechanism rises substrate from substrate holder.
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| CN2008102233087A CN101685791B (en) | 2008-09-25 | 2008-09-25 | Substrate supporting device and method for discharging static electricity by using same |
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| TW286414B (en) * | 1995-07-10 | 1996-09-21 | Watkins Johnson Co | Electrostatic chuck assembly |
| JPH1014266A (en) * | 1996-06-21 | 1998-01-16 | Sony Corp | Electrostatic chucking device and wafer retention/ removal therewith/therefrom |
| US8149562B2 (en) * | 2007-03-09 | 2012-04-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | System for decharging a wafer or substrate after dechucking from an electrostatic chuck |
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