CN101685673A - Distributed burning system - Google Patents
Distributed burning system Download PDFInfo
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- CN101685673A CN101685673A CN200810167746A CN200810167746A CN101685673A CN 101685673 A CN101685673 A CN 101685673A CN 200810167746 A CN200810167746 A CN 200810167746A CN 200810167746 A CN200810167746 A CN 200810167746A CN 101685673 A CN101685673 A CN 101685673A
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- burning
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Abstract
The invention relates to a distributed burning system which comprises a burning control unit and at least one burning device, wherein each burning device is provided with a plurality of chip carrier sockets and at least one control chip, the control chips are respectively connected with the chip carrier sockets and receive burning data of the burning control unit, and the control chips respectively control the burn of chips arranged in the chip carrier sockets. The invention can respectively burn and control the chips, and can greatly improve the burning efficiency because one chip is in trouble without influencing the burn of other chips.
Description
Technical field
The present invention relates to a kind of programming system, particularly relate to a kind of distributed burning system.
Background technology
Figure 1A is the synoptic diagram of existing known centralized programming system 100.This centralized programming system 100 comprises: a burning control module 110, supply unit 120 and most burning devices 130.
Burning control module 110 can be a computer system, but not as limit, burning control module 110 can provide burning data to those most burning devices 130, burning data comprises control signal (control signal), output input signal (I/O signal) etc., wherein exports input signal and comprises address (address) and data (data); Supply unit 120 can provide needed power supply to those most burning devices 130; Aforementioned burning data and power supply can be sent to those most burning devices 130 by a coupling arrangement 140.
Figure 1B is among Figure 1A, the functional schematic of burning device 130.Burning device 130 has most a chip carrier socket 131 and a bus 135.Each chip carrier socket 131 can hold the chip 50 for the treatment of burning, this chip 50 can be nonvolatile memory, for example flash memory (Flash Memory), flash memory cards (Flash Memory Card) or erasable programmable ROM (read-only memory) (Electrically-Erasable Programmable Read-Only Memory:EEPROM) etc.; Coupling arrangement 140 can have a slot, and burning device 130 can insert bus 135 this slot of coupling arrangement 140, uses and transmits aforementioned burning data and power supply.
Fig. 1 C is among Figure 1B, the circuit diagram of burning device 130.Aforementioned burning data is sent to chip 50 in each chip carrier socket 131 by the data/address line 136 of burning device 130; Aforementioned power source then is sent to chip 50 in each chip carrier socket 131 by the power lead 137 of burning device 130 and ground wire 138.That is all shared identical control signal of each chip 50, output input signal and power supply.By aforesaid centralized programming system 100, a large amount of chips 50 can carry out burning simultaneously by identical control signal, output input signal and power supply.
Yet, when one of them chip 50 produces the burning problem, other chip 50 might be influenced and can't burning, for example one chip 50 causes data/address line 136 to be short-circuited to ground wire 138 because of producing the burning problem, this moment, therefore the chip 50 of other shared data address wires 136 will can't obtain appropriate control signals or output input signal, and then caused chip 50 burning failures of all shared data address wires 136; In addition because power lead 137 also is shared with ground wire 138, when causing power lead 137 to be short-circuited to ground wire 138 when one of them chip 50 generation burning problem, this moment, therefore other common source lines 137 will can't obtain suitable power supply with the chip 50 of ground wire 138, and then caused chip 50 burning failures of all common source lines 137 and ground wire 138.
Therefore, the burning problem takes place in the one chip 50 of centralized programming system 100, will influence shared signal or power supply, and cause chip 50 burning failures or the damage of all shared signals or power supply.In addition, the reaction time of each chip 50 (polling time) difference, centralized programming system 100 can't carry out suitable disposal at individual chip 50 immediately, after needing all chips 50 to confirm that burning/step of reading back is finished, check at the chip 50 of not finishing the burning/step of reading back affirmation individually again, expend the suitable time back and forth, and the chip 50 of generation problem can't be closed it in the burning process individually.
This shows that above-mentioned existing centralized programming system obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of distributed burning system of new structure, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that above-mentioned existing centralized programming system exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of distributed burning system of new structure, can improve general existing centralized programming system, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
The objective of the invention is to, overcome the defective that existing centralized programming system exists, and provide a kind of distributed burning system of new structure, technical matters to be solved is to make it can carry out the burning and the control of chip respectively, one chip generation problem can not influence the burning of other chips, use the efficient that promotes burning, be very suitable for practicality.
The object of the invention to solve the technical problems realizes by the following technical solutions.According to a kind of distributed burning system that the present invention proposes, it comprises: a burning control module; And at least one burning device, this burning device has most chip carrier socket and at least one control chip, this control chip connects this most chip carrier socket respectively, this control chip can receive a burning data of this burning control module, and this control chip can be distinguished the burning of the chip of control setting in this chip carrier socket.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid distributed burning system, wherein said chip carrier socket are connected to a power lead and a ground wire respectively, are connected a current-limiting apparatus between this chip carrier socket and this ground wire.
Be connected a switchgear, this this switchgear of control chip may command between the aforesaid distributed burning system, wherein said chip carrier socket and this power lead.
Aforesaid distributed burning system, a chip pin of wherein said control chip only is connected to a socket pin of those chip carrier sockets.
Aforesaid distributed burning system, wherein said burning device can be to be arranged at a pre-burning internal system, and this pre-burning system can provide a test environment, and this chip of using being placed in this chip carrier socket carries out burn-in testing.
The object of the invention to solve the technical problems also realizes by the following technical solutions.A kind of burning device according to the present invention proposes is applied to burn-in testing (burn-in test), and this burning device comprises: a circuit board; Most chip carrier sockets, this chip carrier socket can be arranged at this circuit board, the ccontaining chip of this chip carrier socket: and at least one control chip, this control chip is arranged at this circuit board, this control chip connects this most chip carrier socket respectively, this control chip can receive a burning data that is transmitted by a pre-burning system, and the burning of this control chip chip that may command should majority respectively.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid distributed burning device, wherein said chip carrier socket are connected to a power lead and a ground wire respectively, are connected a current-limiting apparatus between this chip carrier socket and this ground wire.
Be connected a switchgear, this this switchgear of control chip may command between the aforesaid distributed burning device, wherein said chip carrier socket and this power lead.
Aforesaid distributed burning device, a chip pin of wherein said control chip only is connected to a socket pin of those chip carrier sockets.
Aforesaid distributed burning device, wherein said this burning device are to be arranged at this pre-burning internal system, and this pre-burning system can provide a test environment, and this chip of using being placed in this chip carrier socket carries out burn-in testing.
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above,, the invention provides a kind of distributed burning system, comprise: a burning control module for achieving the above object; And at least one burning device.This burning device has most chip carrier socket and at least one control chip, this control chip connects this most chip carrier socket respectively, this control chip can receive a burning data of this burning control module, and this control chip can be distinguished the burning of the chip of control setting in this chip carrier socket.
By technique scheme, distributed burning system of the present invention has following advantage and beneficial effect at least: effect of the present invention is to provide a kind of distributed burning system, can carry out the burning and the control of chip respectively, one chip generation problem can not influence the burning of other chips, so the efficient of burning can significantly promote.
In sum, the present invention is a kind of distributed burning system, comprises: a burning control module; And at least one burning device.This burning device has most chip carrier socket and at least one control chip, this control chip connects this most chip carrier socket respectively, this control chip can receive a burning data of this burning control module, and this control chip can be distinguished the burning of the chip of control setting in this chip carrier socket.The present invention has above-mentioned advantage and practical value, no matter it all has bigger improvement on system architecture or function, obvious improvement is arranged technically, and produced handy and practical effect, and more existing centralized programming system has the outstanding effect of enhancement, thereby being suitable for practicality more, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of instructions, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Figure 1A is the synoptic diagram of existing known centralized programming system.
Figure 1B is among Figure 1A, the functional schematic of burning device.
Fig. 1 C is among Figure 1B, the circuit diagram of burning device.
Fig. 2 A is the synoptic diagram according to the distributed burning system of a preferred embodiment of the present invention.
Fig. 2 B is among Fig. 2 A, the synoptic diagram of burning device.
Fig. 2 C is among Fig. 2 B, the circuit diagram of burning module.
Fig. 2 D is among Fig. 2 C, the control flow chart of control chip.
50: chip 100: centralized programming system
110: burning control module 120: supply unit
130: burning device 131: chip carrier socket
135: bus 136: the data address lines
137: power lead 138: ground wire
140: coupling arrangement 200: distributed burning system
210: burning control module 220: supply unit
230: burning device 231: burning module
232: chip carrier socket 233: circuit board
234: bus 235: control chip
236: switchgear 237: power lead
238: ground wire 239: current-limiting apparatus
240: coupling arrangement 280: pre-burning test device
500: control flow 510: beginning
520: power supply 530 is provided: confirm item number
540: burning/read back 550: confirm the chip reaction time
560: chip overtime 3 times 565: stop chip carrier socket power supply/stop burning action
570: confirm final data 580: stop power supply
590: stop 2341: handle
2322: the second chip carrier sockets of 2321: the first chip carrier sockets
2324: the four-core sheets of 2323: the three chip carrier sockets socket
2332: the second data/address lines of 2331: the first data/address lines
2334: the four data/address lines of 2333: the three data/address lines
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, to its embodiment of distributed burning system, structure, feature and the effect thereof that foundation the present invention proposes, describe in detail as after.
Some embodiments of the present invention will be described in detail as follows.Yet except following description, the present invention can also be widely implements at other embodiment, and protection scope of the present invention is not subjected to the qualification of embodiment, and its protection domain with claim is as the criterion.Moreover for clearer description being provided and being more readily understood the present invention, graphic interior each several part is not drawn according to its relative size, and some size is compared with other scale dependents and exaggerated; Incoherent detail section does not show fully yet, in the hope of graphic succinct.
Fig. 2 A is the synoptic diagram according to the distributed burning system 200 of a preferred embodiment of the present invention.The distributed burning system 200 of preferred embodiment of the present invention comprises: a burning control module 210, supply unit 220 and at least one burning device 230.
In the present embodiment, burning device 230 can be a burn-in board (burn-in board), be applied to the burn-in testing (burn-in test) of chip, burning device 230 is the inside that is arranged at a pre-burning test device (burn-in test device) 280 with coupling arrangement 240, this pre-burning test device 280 can provide a test environment, use the burn-in testing of carrying out chip, but not as limit, burning device 230 also can be arranged at other positions, or be arranged at the inside of pre-burning test device 280, but do not carry out the burn-in testing of chip.
Fig. 2 B is among Fig. 2 A, the synoptic diagram of burning device 230.This burning device 230 comprises: the burning module 231 of a circuit board 233, majority.Those burning modules 231 are to be arranged on this circuit board 233, and each burning module 231 comprises: most chip carrier socket 232 and at least one control chip 235.Wherein, each chip carrier socket 232 can a ccontaining chip 50, and this control chip 235 connects this most chip carrier socket 232 respectively, this control chip 235 receives a burning data that is transmitted by burning control module 210, control the burning of those chips 50 respectively, burning data comprises control signal (control signal), output input signal (I/O signal) etc., wherein exports input signal and comprises address (address) and data (data); Chip 50 can be non-volatile volatile memory, for example flash memory (Flash Memory), flash memory cards (Flash Memory Card) or erasable programmable read-only storer (Electrically-Erasable Programmable Read-OnlyMemory:EEPROM) etc.
According to present embodiment, circuit board 233 can comprise leader 2341, use convenient the extraction, in addition, circuit board 233 can have at least one bus 234, and this bus 234 can be inserted a slot of coupling arrangement 240, and the burning data that burning control module 210 is transmitted is sent to this control chip 235 by this bus 234, but not as limit, burning data also can be sent to this control chip 235 by other electric connection modes.
Fig. 2 C is among Fig. 2 B, the circuit diagram of burning module 231.Wherein, the quantity of chip 50 is only in order to characteristics of the present invention to be described, not as limit.Control chip 235 is connected to first chip carrier socket 2321, second chip carrier socket 2322, the 3rd chip carrier socket 2323 and four-core sheet socket 2324 respectively by first data/address line 2331, second data/address line 2332, the 3rd data/address line 2333, the 4th data/address line 2334, this control chip 235 can be controlled the burning of each chip 50 respectively, wherein, a chip pin of control chip 235 only is connected to the socket pin of those chip carrier sockets 2321-2324.
When the burning problem takes place in one chip 50, because each chip 50 is to be connected to control chip 235 respectively by data/address line 2331-2334 independently, other chips 50 still can obtain appropriate control signals or output input signal, can therefore not be affected.In addition, because each chip 50 is to be connected to control chip 235 respectively by data/address line 2331-2334 independently, the control pin of each chip 50 (control pin) can be connected to control chip 235 respectively, by this, control chip 235 can be detected the burning situation of each chip 50 immediately, and carries out suitable disposal.
In addition, each chip carrier socket 2321-2324 connects power lead 237 and ground wire 238 respectively, wherein, has a current-limiting apparatus 239 between each chip carrier socket 2321-2324 and the ground wire 238, according to present embodiment, this current-limiting apparatus 239 is fuses, but not as limit, this current-limiting apparatus 239 also can be that other are in order to avoid the electronic component of short circuit.Make when being short-circuited between power lead 237 and the ground wire 238 when chip 50 generation problems, current-limiting apparatus 239 can cut off the electric connection between chip 50 and the ground wire 238 immediately, can avoid influencing the power supply supply of other chips 50 by this.
In addition, between power lead 237 and each the chip carrier socket 2321-2324 switchgear 236 can be set respectively, control chip 235 can be connected to this switchgear 236, uses this switchgear 236 of control.When the burning problems took place for chip 50, this switchgear 236 of control chip 235 may command and stop supplies power supply can be avoided chip 50 damages by this to chip 50.According to present embodiment, this switchgear 236 is a relay (relay), but not as limit, and this switchgear 236 also can be other electronic components that can be opened circuit by control chip 235.
Fig. 2 D is among Fig. 2 C, the control flow chart of control chip 235.In the present embodiment, control chip 235 is a field programmable gate array chip (Field-Programmable GateArray, FPGA), input to this control chip 235 by specific program (code), can make this control chip 235 have specific function, but not as limit, control chip 235 also can be an other control systems.
By aforementioned distributed burning system 200, when carrying out chip 50 burnings, the control flow 500 of control chip 235 is described as follows:
(1) at first, carry out step 510, beginning control flow 500.
(2) then, carry out step 520, provide power supply to chip 50.
(3) then, carry out step 530, confirm whether the item number of chip 50 conforms to burning data, when item number is confirmed successfully, then carry out next step; When item number is confirmed failure, carry out step 565, stop chip carrier socket power supply/stop the burning action, and carry out step 590, stop control flow 500.
(4) then, carry out step 540, burning data is burned onto chip 50, and then the data of the burning on the chip 50 is read back, carry out the comparison of burning data, use and confirm whether the burning situation is normal.
(5) then, carry out step 550, confirms whether the burning reaction time of chip 50 normal, when reaction time of chip 50 just often, then carry out next step; When the reaction time of chip 50 is unusual, carry out step 560, whether the reaction time of judging chip 50 overtime 3 times, if the reaction time overtime of chip 50 does not reach 3 times, then gets back to step 540, carries out the action of burning/read back once more; If the reaction time overtime of chip 50 has reached 3 times, show this chip 50 generation problems, then carry out step 565, stop chip carrier socket power supply/stop the burning action, and carry out step 590, stop control flow 500.
(6) then, carry out step 570, confirm whether the data of chip 50 are final data, when the data of chip 50 have been final data, represent burning data fully burning then carry out step 580 in chip 50, stop the chip carrier socket power supply, and carry out step 590, stop control flow 500; When the data of chip 50 are not final data, then get back to step 540, proceed the action of burning/read back.
By distributed burning system of the present invention, can carry out the burning and the control of chip respectively, one chip generation problem can not influence the burning of other chips, so the efficient of burning can significantly promote.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be the content that does not break away from technical solution of the present invention, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (10)
1, a kind of distributed burning system is characterized in that it comprises:
One burning control module; And
At least one burning device, this burning device has most chip carrier socket and at least one control chip, this control chip connects this most chip carrier socket respectively, this control chip receives a burning data of this burning control module, and the burning of the chip of control setting in this chip carrier socket respectively of this control chip.
2, distributed burning system according to claim 1 is characterized in that wherein said chip carrier socket is connected to a power lead and a ground wire respectively, is connected a current-limiting apparatus between this chip carrier socket and this ground wire.
3, distributed burning system according to claim 2 is characterized in that being connected a switchgear between wherein said chip carrier socket and this power lead, and this control chip is controlled this switchgear.
4, distributed burning system according to claim 1 is characterized in that a chip pin of wherein said control chip only is connected to a socket pin of those chip carrier sockets.
5, distributed burning system according to claim 1 is characterized in that wherein said burning device is to be arranged at a pre-burning internal system, and this pre-burning system provides a test environment, and this chip of using being placed in this chip carrier socket carries out burn-in testing.
6, a kind of burning device is applied to burn-in testing, it is characterized in that this burning device comprises:
One circuit board;
Most chip carrier sockets, this chip carrier socket is arranged at this circuit board, the ccontaining chip of this chip carrier socket; And
At least one control chip, this control chip is arranged at this circuit board, this control chip connects this most chip carrier socket respectively, and this control chip receives a burning data that is transmitted by a pre-burning system, and this control chip is controlled the burning of this most chip respectively.
7, distributed burning device according to claim 6 is characterized in that wherein said chip carrier socket is connected to a power lead and a ground wire respectively, is connected a current-limiting apparatus between this chip carrier socket and this ground wire.
8, distributed burning device according to claim 7 is characterized in that being connected a switchgear between wherein said chip carrier socket and this power lead, and this control chip is controlled this switchgear.
9, distributed burning device according to claim 6 is characterized in that a chip pin of wherein said control chip only is connected to a socket pin of those chip carrier sockets.
10, distributed burning device according to claim 6 is characterized in that wherein this burning device is to be arranged at this pre-burning internal system, and this pre-burning system provides a test environment, and this chip of using being placed in this chip carrier socket carries out burn-in testing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810167746 CN101685673B (en) | 2008-09-27 | 2008-09-27 | Distributed burning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810167746 CN101685673B (en) | 2008-09-27 | 2008-09-27 | Distributed burning system |
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| CN101685673A true CN101685673A (en) | 2010-03-31 |
| CN101685673B CN101685673B (en) | 2013-04-10 |
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| CN 200810167746 Active CN101685673B (en) | 2008-09-27 | 2008-09-27 | Distributed burning system |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102568580A (en) * | 2010-12-14 | 2012-07-11 | 无锡华润矽科微电子有限公司 | Burner with chip test function and burning method thereof |
| CN105448337A (en) * | 2014-08-06 | 2016-03-30 | 扬智科技股份有限公司 | Data burning system and data burning method |
| CN105632556A (en) * | 2015-12-25 | 2016-06-01 | 环鸿电子（昆山）有限公司 | Chip offset detection device and method and chip burning method and system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5659245A (en) * | 1996-06-03 | 1997-08-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | ESD bypass and EMI shielding trace design in burn-in board |
| CN1991731B (en) * | 2005-12-26 | 2011-11-09 | 鸿富锦精密工业（深圳）有限公司 | Chip burn-recording system |
| CN101059779A (en) * | 2006-04-20 | 2007-10-24 | 英业达股份有限公司 | Burning system and method thereof |
-
2008
- 2008-09-27 CN CN 200810167746 patent/CN101685673B/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102568580A (en) * | 2010-12-14 | 2012-07-11 | 无锡华润矽科微电子有限公司 | Burner with chip test function and burning method thereof |
| CN102568580B (en) * | 2010-12-14 | 2016-03-02 | 无锡华润矽科微电子有限公司 | The CD writers of microarray strip test function and method for burn-recording thereof |
| CN105448337A (en) * | 2014-08-06 | 2016-03-30 | 扬智科技股份有限公司 | Data burning system and data burning method |
| CN105448337B (en) * | 2014-08-06 | 2019-06-04 | 扬智科技股份有限公司 | Data recording system and data burning method |
| CN105632556A (en) * | 2015-12-25 | 2016-06-01 | 环鸿电子（昆山）有限公司 | Chip offset detection device and method and chip burning method and system |
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| Publication number | Publication date |
|---|---|
| CN101685673B (en) | 2013-04-10 |
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