CN101677492A - Manufacturing technology of printed circuit board (PCB) - Google Patents
Manufacturing technology of printed circuit board (PCB) Download PDFInfo
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- CN101677492A CN101677492A CN 200810200181 CN200810200181A CN101677492A CN 101677492 A CN101677492 A CN 101677492A CN 200810200181 CN200810200181 CN 200810200181 CN 200810200181 A CN200810200181 A CN 200810200181A CN 101677492 A CN101677492 A CN 101677492A
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- tin
- tapping
- endoporus
- hole
- pcb board
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Abstract
The invention provides a manufacturing technology of a printed circuit board (PCB). In the process for manufacturing the PCB, a bonding pad of a surface mount component and a through hole ring which needs to be prearranged with tin are perforated, and prearranged tin cream is printed. In the process for treating the PCB by reflow soldering, the prearranged tin cream forms prearranged tin. The bonding pad and/or the through hole of the through hole ring are/is provided with an inner hole; and the printing area and the printing quantity of the tin cream need to meet the condition that after thereflow soldering of the PCB is completed, the inner hole is not printed with tin, namely that no tin is soaked in the inner hole, and the inner hole can not be clogged. The invention can effectively solve the problem that the PCB is difficult to be printed with tin because of the oxidation of the bonding pad, the arrangement or structure defects of the PCB, and the like.
Description
Technical field
The present invention relates to a kind of manufacture craft of pcb board, particularly a kind of manufacture craft in order to the pcb board that solves the difficult problem of tin.
Background technology
What solder once adopted morely is leypewter, but because lead is heavy metal, human body is had very big injury, and therefore, prior art has turned to the generation of lead-free process.What usually prior art adopted is SAC alloy and special scaling powder, yet with respect to original leypewter, existing SAC alloy and special scaling powder are higher to the requirement of welding temperature.Like this, in the process of manual welding or Reflow Soldering welding, be easy to occur the problem of tin on the pad difficulty, this is the oxidation that has caused pad because be subjected to high temperature once or twice in the pcb board Reflow Soldering welding in the early stage.This layer oxide-film is difficult to be soaked into by common scaling powder, and therefore, tin is bad occurring after the welding, even leaks the phenomenon of weldering.And welding is to realize circuit elements device connection basis, and the bad rosin joint that causes easily of last tin causes the properties of product instability or can't reach performance index, and the problem that the leakage weldering causes is more obvious.
Under the situation of manual welding, problem is more obvious.In many scientific research occasions, need be on pcb board test of many times, adjust, be difficult to tin, cause length of side weld time, temperature sharply rises, reflow repeatedly even may cause pad directly to come off.
In addition, because problems such as the layout of pcb board or structures, the part pcb board is when wave soldering, and tin is also comparatively difficult on the through hole.
Therefore, need a kind of solution for this problem of tin on the difficulty.
Summary of the invention
The purpose of this invention is to provide a kind of manufacture craft that is used to solve the pcb board of the difficult problem of tin.
A kind of manufacture craft of pcb board is characterized in that: after pad and through hole finish printing, paste solder printing is preset on the pad and/or through hole of tin at needs.
Through hole under wherein said pad and/or the described through hole orifice ring has an endoporus, and after the printing area of described tin cream and number to be printed should satisfy the pcb board Reflow Soldering, endoporus was not gone up tin, does not promptly have tin to soak in the endoporus, can not block endoporus.Before the print solder paste, needs are preset the pad and/or the vias of tin.Described pad comprises endoporus, tapping and tapping not, and tapping is not adjacent for each tapping and two, and tapping is not adjacent with two tappings for each.Described through hole orifice ring comprises tapping and tapping not, and tapping is not adjacent for each tapping and two, and tapping is not adjacent with two tappings for each.Described paste solder printing is at described tapping, and each tapping and each the not size of tapping area occupied can be adjusted, but after should satisfying the pcb board Reflow Soldering, endoporus is not gone up tin, does not promptly have tin to soak in the endoporus, can not block endoporus.
Beneficial effect of the present invention is: the manufacture craft of pcb board of the present invention is by after pad and through hole finish printing, preset paste solder printing on the pad and/or through hole of tin at needs, can effectively solve owing to pad oxidation and problems such as pcb board layout or structure the phenomenon that is difficult to tin that causes.
Description of drawings
Fig. 1 is a pcb board through hole schematic diagram.
Fig. 2 is a pcb board through hole orifice ring perforate schematic diagram.
Embodiment
Describe the preferred embodiments of the present invention in detail below in conjunction with accompanying drawing.
Be difficult to this problem of tin in order to solve, the manufacture craft of pcb board provided by the present invention on existing manufacture craft, has increased and has preset this step of tin cream.
In the process of making pcb board, after pad and through hole finished printing, to the pad of element pasted on surface and the through hole orifice ring perforate that need preset tin cream, then, to the pad of element pasted on surface and need preset to stamp on the through hole orifice ring of tin cream and preset tin cream, when then pcb board being carried out reflow soldering, tin cream is heated, and can form one deck and preset tin.
With the through hole example below, for plurality of opening embodiment.
Embodiment one
See also Fig. 1, Figure 1 shows that the through hole (PTH) of pcb board, described through hole has orifice ring 1.
See also Fig. 2, Fig. 2 is a pcb board through hole orifice ring perforate schematic diagram.The PCB through hole comprises orifice ring 1 and endoporus 2, and in this preferred embodiment, orifice ring 1 has four tappings 11,12,13,14, four tappings 15,16,17,18 not, wherein, the diameter of endoporus 2 can not be printed on tin cream than the big 0.4mm of radius of whole through hole to guarantee endoporus 2.When making pcb board, preset tin cream and will be printed onto tapping, pcb board is crossed Reflow Soldering after the mount components, presets tin cream and melts, and forms one deck and presets tin, soaks into whole through hole orifice ring.All tapping is not adjacent with two for each tapping, and tapping is all not adjacent with two tappings for each, and each tapping and each the not size of tapping area occupied can be adjusted, but after should satisfying the pcb board Reflow Soldering, endoporus 2 is not gone up tin, does not promptly have tin to soak in the endoporus 2, can not block endoporus 2.
Same, the pad of element pasted on surface presets tin cream on can also be by the way.
Embodiment two
The difference of present embodiment and embodiment one is, two places not tapping 15,17 become tapping, then, former tapping 13, former not tapping 15, former tapping 11 are merged into a new tapping, former tapping 14, former not tapping 17, former tapping 12 are merged into another new tapping, form new two tappings and two original not tappings, each new tapping is all adjacent with two original not tappings, and each original not tapping is all adjacent with two new tappings.Same, new tapping can be adjusted with original not tapping area occupied size, but after should satisfying the pcb board Reflow Soldering, endoporus 2 is not gone up tin, does not promptly have the tin infiltration in the endoporus 2, can not block endoporus 2.
Embodiment three
In the present embodiment, through hole orifice ring 1 has not tapping of three tappings and three, and all tapping is not adjacent with two for each tapping, and tapping is all not adjacent with two tappings for each.
Above-mentioned various perforate mode, all should satisfy the pcb board Reflow Soldering after, endoporus 2 is not gone up tin, does not promptly have tin to soak in the endoporus 2, can not block endoporus 2, and to cover whole through hole orifice ring be good to preset tin.
The manufacture craft of pcb board provided by the invention mainly contains two effects, and the first prevents pad and through hole oxidation, especially to surface treatment mode itself than pad that is easier to oxidation and through hole, by prefabricated tin, can make tin cover pad and through hole, stop contacting of pad and through hole and oxygen.And tin is difficult for oxidation, and the compatibility between tin and the tin is fine, the problem that is difficult to tin that just can avoid pad and through hole oxidation to cause.
It two is in order to improve solderability.The part pcb board when wave soldering on pad or the through hole tin difficult, and relatively easy by tin in the Reflow Soldering.Can just form alloy-layer when the Reflow Soldering by prefabricated tin with pad or through hole, because tin has good wettability, in ensuing wave soldering technology, owing to covered on the pad by tin, thereby upward tin will become easily, go up the difficult problem of tin in the time of can avoiding wave-soldering.
Above embodiment is the unrestricted technical scheme of the present invention in order to explanation only.Any modification or partial replacement that does not break away from spirit and scope of the invention all should be encompassed in the middle of the claim scope of the present invention.
Claims (7)
1, a kind of manufacture craft of pcb board is characterized in that: after pad and through hole finish printing, preset on the pad and/or through hole orifice ring of tin cream at needs presetting paste solder printing.
2, the manufacture craft of pcb board according to claim 1, it is characterized in that: the through hole under described pad and/or the described through hole orifice ring has an endoporus, after the printing area of described tin cream and number to be printed should satisfy the pcb board Reflow Soldering, endoporus is not gone up tin, be not have tin to soak in the endoporus, can not block endoporus.
3, the manufacture craft of pcb board according to claim 2 is characterized in that: before the print solder paste, needs are preset the pad and/or the perforate of through hole orifice ring of tin.
4, the manufacture craft of pcb board according to claim 3 is characterized in that: described pad comprises endoporus, tapping and tapping not, and tapping is not adjacent for each tapping and two, and tapping is not adjacent with two tappings for each.
5, the manufacture craft of pcb board according to claim 3 is characterized in that: described through hole orifice ring comprises tapping and tapping not, and tapping is not adjacent for each tapping and two, and tapping is not adjacent with two tappings for each.
6, according to the manufacture craft of claim 4 or 5 described pcb boards, it is characterized in that: described paste solder printing is at described tapping, each tapping and each the not size of tapping area occupied can be adjusted, but after should satisfying the pcb board Reflow Soldering, endoporus is not gone up tin, be not have tin to soak in the endoporus, can not block endoporus.
7, according to the manufacture craft of claim 4 or 5 described pcb boards, it is characterized in that: the diameter of described endoporus is bigger than the radius of whole through hole, and the radius difference range of the diameter of described endoporus and described through hole is from 0.3mm to 0.5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810200181.7A CN101677492B (en) | 2008-09-19 | 2008-09-19 | Manufacturing technology of printed circuit board (PCB) |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810200181.7A CN101677492B (en) | 2008-09-19 | 2008-09-19 | Manufacturing technology of printed circuit board (PCB) |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101677492A true CN101677492A (en) | 2010-03-24 |
| CN101677492B CN101677492B (en) | 2014-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810200181.7A Active CN101677492B (en) | 2008-09-19 | 2008-09-19 | Manufacturing technology of printed circuit board (PCB) |
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| CN (1) | CN101677492B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102300420A (en) * | 2010-10-14 | 2011-12-28 | 陈锦海 | Method for manufacturing printed circuit board (PCB) containing electric conduction hole |
| CN106455321A (en) * | 2016-10-12 | 2017-02-22 | 青岛海信电器股份有限公司 | Fixed pin of through-hole reflow device, a television main board terminal and use method |
| CN106529106A (en) * | 2017-01-09 | 2017-03-22 | 郑州云海信息技术有限公司 | Hole building method and device as well as PCB |
| CN107251663A (en) * | 2015-02-12 | 2017-10-13 | 古河电气工业株式会社 | Flexible base board and optical module |
| CN109168254A (en) * | 2018-09-29 | 2019-01-08 | 珠海格力电器股份有限公司 | A kind of patch nut encapsulating structure and method |
| CN115446410A (en) * | 2022-09-21 | 2022-12-09 | 北京经纬恒润科技股份有限公司 | Welding method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6295210B1 (en) * | 2000-04-07 | 2001-09-25 | Lucent Technologies, Inc. | Chassis grounding ring for a printed wiring board mounting aperture |
-
2008
- 2008-09-19 CN CN200810200181.7A patent/CN101677492B/en active Active
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102300420A (en) * | 2010-10-14 | 2011-12-28 | 陈锦海 | Method for manufacturing printed circuit board (PCB) containing electric conduction hole |
| CN107251663A (en) * | 2015-02-12 | 2017-10-13 | 古河电气工业株式会社 | Flexible base board and optical module |
| CN106455321A (en) * | 2016-10-12 | 2017-02-22 | 青岛海信电器股份有限公司 | Fixed pin of through-hole reflow device, a television main board terminal and use method |
| CN106455321B (en) * | 2016-10-12 | 2019-02-15 | 青岛海信电器股份有限公司 | A kind of through-hole reflux device fixing pin, TV motherboard terminal and application method |
| CN106529106A (en) * | 2017-01-09 | 2017-03-22 | 郑州云海信息技术有限公司 | Hole building method and device as well as PCB |
| CN106529106B (en) * | 2017-01-09 | 2019-09-06 | 郑州云海信息技术有限公司 | One kind building hole method, apparatus and a kind of PCB |
| CN109168254A (en) * | 2018-09-29 | 2019-01-08 | 珠海格力电器股份有限公司 | A kind of patch nut encapsulating structure and method |
| CN115446410A (en) * | 2022-09-21 | 2022-12-09 | 北京经纬恒润科技股份有限公司 | Welding method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101677492B (en) | 2014-07-09 |
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Owner name: FLEXCOMPUTING (SUZHOU) CO., LTD. Free format text: FORMER OWNER: WEICHUANGLI ELECTRONIC TECHNOLOGY (SHANGHAI) CO., LTD. Effective date: 20131212 |
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Effective date of registration: 20131212 Address after: Suzhou Wuzhong District City, Jiangsu province 215224 Guo Xiang Jie Dao Guan Pu Road No. 1 Applicant after: Flextronics computer (Suzhou) Co. Ltd. Address before: 201801 Shanghai Jiading District Malu Town Yongsheng Road No. 77 Building 2 Applicant before: Flextronics Technology (Shanghai) Co., Ltd. |
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