CN109168254A - Chip nut packaging structure and method - Google Patents
Chip nut packaging structure and method Download PDFInfo
- Publication number
- CN109168254A CN109168254A CN201811149606.6A CN201811149606A CN109168254A CN 109168254 A CN109168254 A CN 109168254A CN 201811149606 A CN201811149606 A CN 201811149606A CN 109168254 A CN109168254 A CN 109168254A
- Authority
- CN
- China
- Prior art keywords
- patch
- nut
- pad
- hole
- metal mesh
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 10
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 49
- 239000002184 metal Substances 0.000 claims abstract description 45
- 238000003466 welding Methods 0.000 claims abstract description 16
- 239000006071 cream Substances 0.000 claims description 43
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000012858 packaging process Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000010422 painting Methods 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention provides a chip nut packaging structure and a chip nut packaging method, wherein the packaging structure is used for being matched with a metal net and comprises a chip bonding pad; the patch bonding pad is provided with a through hole to form an annular welding area; the surface mounting bonding pad is used for attaching a metal net, and the metal net covers the through hole; a plurality of cavities are arranged on the contact surface of the metal mesh and the annular welding area; by adopting the technical scheme, the through hole can be covered when the metal mesh is manufactured by changing the PCB packaging of the patch nut, so that the through hole can not be coated with tin paste in the process of mounting and pasting, the inner wall of the through hole of the patch nut can not be blocked by tin, and a screw can be completely screwed into the patch nut; the scheme provided by the invention is relatively simple, effective, convenient to implement, low in cost and suitable for the current PCB packaging process.
Description
Technical field
The invention belongs to patch nut encapsulation technology fields, and in particular to a kind of patch nut encapsulating structure and method.
Background technique
Patch nut is mainly welded on PCB (printed circuit board printed circuit board), is revolved by screw
It is screwed into and others PCB is come to be fixed together in patch nut；Patch nut belongs to SMT component, but its PCB in technique
(printed circuit board printed circuit board) is encapsulated as through-hole patch pad, under normal circumstances, SMT laser metal net
Producer can all hollow out the patch pad of this element when making metal mesh, to give patch pad brush tin when technique attachment
Cream, but just because of the presence of welding plate hole, through-hole is also accordingly coated with tin cream, and after being painted with tin cream, blowing machine puts patch nut
Enter in its encapsulation, the tin cream of through-hole surfaces will be fallen into the inner wall of patch nut thread hole at this time, finally enter Reflow Soldering high temperature
In furnace, make patch nut together with patch pad solder, so that the threaded hole inner wall for patch nut occur is blocked by tin, because
This screw can not be screwed into patch nut.
Based on technical problem present in the encapsulation of above-mentioned patch nut, there has been no relevant solutions；Therefore compel to be essential
Seek effective scheme to solve the above problems.
Summary of the invention
The purpose of the present invention is shortcoming present in view of the above technology, propose a kind of patch nut encapsulating structure and
Method；Aim to solve the problem that the through-hole wall of existing patch nut is easy the problem of being blocked by tin cream in the welding process.
The present invention provides a kind of patch nut encapsulating structure, includes patch pad for cooperating with metal mesh；Patch weldering
Disk is equipped with through-hole, to form annular weld zone；Patch pad covers through-hole for being bonded metal mesh, metal mesh；Metal mesh
A plurality of cavities are equipped with the contact surface of annular weld zone.
Further, metal mesh is steel mesh；And/or cavity is circle or fan-shaped or polygon or ellipse；And/or ring
Shape welding region is equipped with multiple pads, and pad is circle or fan-shaped or polygon or ellipse；And/or metal mesh be it is round or
Fan-shaped or polygon or ellipse.
Further, annular weld zone, which corresponds to, is equipped with pad at cavity；Pad is welded equipped with tin cream.
It further, further include having patch nut；Patch nut edge is axially arranged with boss；Outside boss outer diameter and patch nut
Annular surface is equipped between diameter；Patch pad is sheathed on boss, and is welded on annular surface by the tin cream on pad.
Further, the internal diameter A of through-hole and the outer diameter a of boss are consistent；The outer diameter B of patch pad is outer with patch nut
Diameter b is consistent.
Further, patch pad is sheathed on boss by through-hole；Patch pad is fixedly welded on by tin cream solder joint
On annular surface.
Further, threaded hole is equipped in patch nut；Patch nut is penetrated in pcb board by boss, and passes through screw
It is fixed.
Correspondingly, the present invention also provides a kind of patch nut packaging methods, encapsulate knot including patch nut described above
Structure, comprising the following steps:
S1: metal mesh is fitted on patch pad, and covers the through-hole of patch pad；
S2: coating tin cream on patch pad by the cavity on metal mesh, so that tin cream falls in annular weld zone, and
Remove metal mesh；
S3: the patch pad solder of tin cream will be coated in patch nut.
Using above technical scheme, the PCB by changing patch nut is encapsulated, can be through-hole lid when making metal mesh
Firmly, so that would not be coated onto through-hole during technique attachment when applying tin cream, the through-hole wall of such patch nut is just not
It can be blocked by tin, screw can be completely screwed into patch nut；Scheme provided by the invention is relatively easy, it is effective, be convenient for
Implement, and cost is relatively low, suitable for current PC B packaging technology.
Detailed description of the invention
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Below with reference to attached drawing, the invention will be further described:
Fig. 1 is a kind of patch nut structure main view of the present invention；
Fig. 2 is a kind of patch nut structure side view of the present invention；
Fig. 3 is patch welding plate structure schematic in the prior art；
Fig. 4 is patch pad encapsulation schematic diagram of the present invention；
Fig. 5 is that metal mesh of the present invention covers patch welding plate hole schematic diagram.
In figure: 1, patch pad；2, circular pad；3, metal mesh；4, boss；5, annular surface；6, threaded hole；7, cavity；
8, screw thread；9, through-hole；10, annular weld zone.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
As shown in Fig. 4 to Fig. 5, the present invention provides a kind of patch nut encapsulating structure, for being matched with metal mesh, including
There is patch pad 1；Patch pad 1 is equipped with through-hole 9, and to form annular weld zone 10, annular weld zone 10 is equipped with multiple
Pad；Patch pad 1 covers patch pad 1 and its through-hole 9 for being bonded metal mesh 3, metal mesh 3；Specifically, this metal mesh 3
Patch nut electroless coating threaded hole is covered, prevents from blocking threaded hole during painting tin cream when trial assembly patch nut；And
Metal mesh 3 and the contact surface of annular weld zone 10 are equipped with a plurality of cavities 7, tin cream can be coated in patch by the cavity 7
In the annular weld zone 10 of pad 1, so that the annular weld zone 10 of patch pad 1, which corresponds to, is equipped with pad at cavity, weldering
Disk is equipped with tin cream, so that patch pad 1 is by the tin cream on pad together with patch nut-welding；Using above-mentioned side
Case blocks the through-hole of patch pad by metal mesh, and empties out cavity on metal mesh to coat tin on patch pad
Cream can coat tin cream in this way to avoid in the annular weld zone of entire patch pad, so that in patch pad in welding process
Middle tin cream is easy to block patch nut in the threaded hole or through-hole that fall into patch nut, so that screw can not be threaded into hole.
Preferably, in conjunction with above scheme, in the present embodiment, metal mesh is preferably steel mesh, and the cavity on metal mesh can be set
The round or fan-shaped or various structures such as polygon or ellipse are calculated as, to be adapted to the welding of different modes；Further, annular welds
The pad on region 10 is connect as round or fan-shaped or polygon or ellipse, can equally be adapted to the welding of different modes；Into one
Step ground, metal mesh are circle or fan-shaped or polygon or ellipse, can equally be adapted to the welding of different modes.
Preferably, in conjunction with above scheme, as shown in Figure 1 and Figure 2, in the present embodiment, patch nut encapsulating structure further includes having
Patch nut；Patch nut edge is axially arranged with boss 4；Annular surface 5 is equipped between 4 outer diameter a of boss and patch nut outer diameter b；Tool
Body, patch pad 1 is sheathed on boss 4 by through-hole 9, and the internal diameter A of through-hole 9 is consistent with boss outer diameter a, patch weldering
The outer diameter B of disk 1 is consistent with patch nut outer diameter b, so that patch pad 1 can be directly sleeved on boss 4, and with patch
Piece nut is concordant；Further, the annular weld zone 10 of patch pad 1, which corresponds to, is equipped with circular pad at 3 cavity of metal mesh
2, tin cream solder joint is coated in circular pad 2, patch pad 1 is fixedly welded on the annular surface 5 of patch nut by tin cream solder joint,
Since tin cream is uniformly distributed in annular weld zone, and relative to small more of existing tin cream area, therefore in the welding process
It can be to avoid falling into the threaded hole of patch nut；Specifically, circular pad 2 belongs to the solder mask pad in PCB design, is used for
With patch nut-welding, the diameter C size of circular pad 2 depends on the outer diameter B of patch nut, and the outer diameter B of patch nut is bigger
Then circular pad quantity, size can suitably increase, to guarantee that patch nut is reliably welded with its pad；Using the above scheme, should
Encapsulating structure replaces single annular pad using multiple circular pads, and non-electrical plated-through-hole replaces electroplating ventilating hole, this kind encapsulation both may be used
So that circular pad welds together well with patch nut, and can cover through-hole by metal mesh, patch spiral shell is avoided
Tin plug-hole is glued on female through-hole wall.
Preferably, in conjunction with above scheme, as shown in Figure 1 and Figure 2, in the present embodiment, threaded hole 6, spiral shell are equipped in patch nut
Screw thread 8 is equipped in pit 6；Patch nut is penetrated in pcb board by boss 4, and is fixed by screw, is consolidated patch nut with this
Due on pcb board, other SMT components can be fixed by patch nut again in this way；Specifically, patch nut is used primarily in PCB
It supports between plate, is encapsulated using above-mentioned patch nut so that the present invention has the effect that
The first, this encapsulation can guarantee its reliable welding with patch nut；
The second, this is encapsulated in easy to accomplish in PCB design；
Through-hole can be covered when third, SMT precision metallic net producer production metal mesh, it is ensured that when trial assembly process applies tin cream
It will not be coated on through-hole, solve the problems, such as that the through-hole wall of patch nut is blocked by tin.
Correspondingly, in conjunction with above scheme, the present invention also provides a kind of patch nut packaging methods, including patch described above
Piece nut encapsulating structure, comprising the following steps:
S1: metal mesh is fitted on patch pad, and covers the through-hole of patch pad, to avoid when applying tin cream, tin
Cream is fallen into through-hole, and patch nut screw is interfered to be screwed into；
S2: coating tin cream on patch pad by the cavity on metal mesh, so that tin cream falls in annular weld zone, and
Remove metal mesh；Tin cream painting amount can be effectively reduced using such herbal paste formula that applies, while tin cream being avoided to fall into through-hole；
S3: the patch pad solder of tin cream will be coated in patch nut；Specifically, passing through the patch pad that will be coated with tin cream
It is fitted on patch nut, and is put into Reflow Soldering high temperature furnace, make patch nut and patch pad solder logical in the high temperature environment
Tin cream is crossed to weld together.
Preferably, in conjunction with above scheme, in the present embodiment, patch nut is along being axially arranged with boss；Boss outer diameter and patch
Annular surface is equipped between nut outer diameter；Patch pad is sheathed on boss by through-hole, and is welded on annular surface by tin cream.
Using above technical scheme, the PCB by changing patch nut is encapsulated, can be through-hole lid when making metal mesh
Firmly, so that would not be coated onto through-hole during technique attachment when applying tin cream, the through-hole wall of such patch nut is just not
It can be blocked by tin, screw can be completely screwed into patch nut；Scheme provided by the invention is relatively easy, effective, is convenient for
Implement, and cost is relatively low, suitable for current PC B packaging technology.
The above, only presently preferred embodiments of the present invention not do limitation in any form to the present invention.It is any ripe
Those skilled in the art is known, without departing from the scope of the technical proposal of the invention, all using technology contents described above
Many possible changes and modifications or equivalent example modified to equivalent change are made to technical solution of the present invention.Therefore, all
It is the content without departing from technical solution of the present invention, any change modification made to the above embodiment of technology according to the present invention,
Equivalent variations and modification belong to the protection scope of the technical program.
Claims (10)
1. a kind of patch nut encapsulating structure, for cooperating with metal mesh, which is characterized in that include patch pad；The patch
Piece pad is equipped with through-hole, to form annular weld zone；The patch pad is for being bonded metal mesh, the metal mesh covering
The through-hole；The metal mesh and the contact surface of the annular weld zone are equipped with a plurality of cavities.
2. patch nut encapsulating structure according to claim 1, which is characterized in that the metal mesh is steel mesh；And/or
The annular weld zone is equipped with multiple pads；The pad is circle or fan-shaped or polygon or ellipse；And/or it is described
Patch pad is circle or fan-shaped or polygon or ellipse；And/or the metal mesh is round or fan-shaped or polygon or ellipse
It is round.
3. patch nut encapsulating structure according to claim 1, which is characterized in that the annular weld zone corresponds to institute
It states and is equipped with pad at cavity；The pad is equipped with tin cream.
4. patch nut encapsulating structure according to claim 3, which is characterized in that further include having patch nut；The patch
Piece nut edge is axially arranged with boss；Annular surface is equipped between the boss outer diameter and the patch nut outer diameter；The patch weldering
Disk is sheathed on the boss, and is welded on the annular surface by the tin cream on the pad.
5. patch nut encapsulating structure according to claim 4, which is characterized in that the internal diameter A of the through-hole with it is described convex
The outer diameter a of platform is consistent；The outer diameter B of the patch pad is consistent with the outer diameter b of the patch nut.
6. patch nut encapsulating structure according to claim 4, which is characterized in that the patch pad passes through the through-hole
It is sheathed on the boss；The patch pad is fixedly welded on the annular surface by the tin cream solder joint.
7. patch nut encapsulating structure according to claim 4, which is characterized in that be equipped with screw thread in the patch nut
Hole；The patch nut is penetrated in pcb board by the boss, and is fixed by screw.
8. a kind of patch nut packaging method, which is characterized in that including patch nut encapsulating structure described in claim 1, packet
Include following steps:
S1: metal mesh is fitted on patch pad, and covers the through-hole of patch pad；
S2: tin cream is coated on the patch pad by the cavity on the metal mesh, so that the tin cream falls in the ring
Shape welding region, and remove the metal mesh；
S3: the patch pad solder of tin cream will be coated in patch nut.
9. patch nut packaging method according to claim 8, which is characterized in that the patch nut is convex along being axially arranged with
Platform；Annular surface is equipped between the boss outer diameter and the patch nut outer diameter；The patch pad is arranged by the through-hole
In on the boss, and it is welded on the annular surface by the tin cream.
10. patch nut packaging method according to claim 8, which is characterized in that it is specifically included in the step S3, it will
The patch pad for being coated with tin cream is fitted on the patch nut, and is put into Reflow Soldering high temperature furnace, and the patch spiral shell is made
It is female together with the patch pad solder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811149606.6A CN109168254A (en) | 2018-09-29 | 2018-09-29 | Chip nut packaging structure and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811149606.6A CN109168254A (en) | 2018-09-29 | 2018-09-29 | Chip nut packaging structure and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109168254A true CN109168254A (en) | 2019-01-08 |
Family
ID=64892998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811149606.6A Pending CN109168254A (en) | 2018-09-29 | 2018-09-29 | Chip nut packaging structure and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109168254A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101677492A (en) * | 2008-09-19 | 2010-03-24 | 伟创力电子科技（上海）有限公司 | Manufacturing technology of printed circuit board (PCB) |
| EP2288241A1 (en) * | 2009-08-04 | 2011-02-23 | Siemens Aktiengesellschaft | Electric attachment assembly, method for its manufacture and usage |
| CN104125721A (en) * | 2014-08-04 | 2014-10-29 | 太仓市同维电子有限公司 | Method and device for firmly welding SMD (surface mounted devices) nuts on printed circuit boards |
| CN104582300A (en) * | 2013-10-18 | 2015-04-29 | 重庆方正高密电子有限公司 | Circuit board anti-welding baseplate and circuit board manufacturing method |
| CN107750091A (en) * | 2017-09-30 | 2018-03-02 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN209546003U (en) * | 2018-09-29 | 2019-10-25 | 珠海格力电器股份有限公司 | Paster nut packaging structure |
-
2018
- 2018-09-29 CN CN201811149606.6A patent/CN109168254A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101677492A (en) * | 2008-09-19 | 2010-03-24 | 伟创力电子科技（上海）有限公司 | Manufacturing technology of printed circuit board (PCB) |
| EP2288241A1 (en) * | 2009-08-04 | 2011-02-23 | Siemens Aktiengesellschaft | Electric attachment assembly, method for its manufacture and usage |
| CN104582300A (en) * | 2013-10-18 | 2015-04-29 | 重庆方正高密电子有限公司 | Circuit board anti-welding baseplate and circuit board manufacturing method |
| CN104125721A (en) * | 2014-08-04 | 2014-10-29 | 太仓市同维电子有限公司 | Method and device for firmly welding SMD (surface mounted devices) nuts on printed circuit boards |
| CN107750091A (en) * | 2017-09-30 | 2018-03-02 | 生益电子股份有限公司 | A kind of PCB preparation method and PCB |
| CN209546003U (en) * | 2018-09-29 | 2019-10-25 | 珠海格力电器股份有限公司 | Paster nut packaging structure |
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