CN101673049A - Gray tone mask and method for manufacturing gray tone mask - Google Patents
Gray tone mask and method for manufacturing gray tone mask Download PDFInfo
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- CN101673049A CN101673049A CN200910179767A CN200910179767A CN101673049A CN 101673049 A CN101673049 A CN 101673049A CN 200910179767 A CN200910179767 A CN 200910179767A CN 200910179767 A CN200910179767 A CN 200910179767A CN 101673049 A CN101673049 A CN 101673049A
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Classifications
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- H01L27/1288—
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136231—Active matrix addressed cells for reducing the number of lithographic steps
- G02F1/136236—Active matrix addressed cells for reducing the number of lithographic steps using a grey or half tone lithographic process
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/13625—Patterning using multi-mask exposure
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Junction Field-Effect Transistors (AREA)
Abstract
Pprovided is a gray tone mask having preferable transmittance distribution in a semitransmitting part and high pattern accuracy in a channel part. In the gray tone mask, a thick resist pattern formingpart, a thin resist pattern forming part, and a non-resist pattern forming part respectively for forming thick resist pattern, thin resist pattern and non resist pattern are formed on the copied substrate, the thin resist pattern forming part is composed of ligh semitransmitting part, the thick resist pattern forming part is composed of ligh shielding part, and the non resist pattern forming partis composed of light transmitting part, wherein, on the transparent substrate, a light semitransmitting film and a light shielding film are respectively formed on the the light semitransmitting partand the light shielding part, and in addition, an overmeasure area, which is fomed from the light semitransmitting film, is arranged on the periphery of the light shielding part and the light transmitting part.
Description
The application is based on denomination of invention for " gray mask and gray tone mask manufacturing method ", and the applying date is on July 12nd, 2005, and application number is dividing an application of 200510084068.3 application for a patent for invention.
Technical field
The present invention relates to be used in rightly the gray tone mask manufacturing method of thin film transistor base plate (hereinafter referred to as the TFT substrate) used in the manufacturing of thin-film transistor LCD device (Thin FilmTransistor Liquid Crystal Display).
Background technology
TFT-LCD compares with CRT (cathode-ray tube (CRT)), forms advantage slim and low in energy consumption easily owing to have, and makes progress just sharp aspect commercialization at present.TFT-LCD has at the TFT substrate that is arranged in the structure of having arranged TFT on each rectangular pixel and with the colour filter that each pixel has been arranged the pixel graphics of red, green and blue accordingly and is getting involved the schematic configuration that coincides together under the situation of liquid crystal phase.In TFT-LCD, the worker ordinal number is many, only makes the TFT substrate and will use 5～6 photomasks.
Under such situation, the method for carrying out the manufacturing of TFT substrate by means of with 4 photomasks has been proposed, that is, the method for photoresist figure of using 2 kinds of thickness is to reduce the method for photo-mask process number.
For example, in patent documentation 1, announced patent with operation of using following photoresist: between source electrode and drain electrode (groove) have the 1st thickness photoresist, have 2nd thickness thicker than the 1st thickness photoresist, have the photoresist of the 3rd thickness than the 1st thin thickness (comprise thickness be zero situation).
In addition, in patent documentation 1, have the method for the photoresist figure of these 2 kinds of thickness as formation, announced 2 kinds of methods, that is, (1) uses the method for the gray mask with transmittance section, light shielding part and semi light transmitting part and (2) to utilize the backflow of resist to make the method for resist distortion.
As above-mentioned gray mask, has the little figure of resolution that utilizes than the exposure device that uses mask, for example the figure of slit and grid form forms semi light transmitting part, or the method for semi-transparent film with the exposure of regulating light be set, under the situation of semi-transparent film, not exclusively remove light-proofness chromium layer and keep certain thickness, the exposure of the light that enters by this part is reduced.
Fig. 9 (a) is as light shielding part 204 with the zone corresponding with source electrode and drain electrode, with with they between the corresponding zone of groove as the example of the semi light transmitting part 203 of shape of slit, Fig. 9 (b) is the example that has formed the zone corresponding with above-mentioned groove with semi-transparent film.
Be called as conventional example 1 with the zone corresponding as the gray mask of semi light transmitting part described in the patent documentation 1 with groove.
On the other hand, as another example of the manufacture method of TFT substrate, for example, in patent documentation 2, announced the manufacture method of having taked to use the method for gray mask and having utilized the TFT substrate of the method both sides' combination that makes the resist distortion of refluxing.
Below, use the example that Figure 10 illustrates the method described in the patent documentation 2.
Shown in Figure 10 (a), on glass substrate 101, form gate electrode 102, on glass substrate 101, form gate insulating film 103 with covering grid electrode 102, on gate insulating film 103, the stacked silicon fiml 104 of deposit, n+ silicon fiml 105, metal film 106 successively.
Then, on metal film 106, apply positive light anti-etching agent, form resist film 107, shown in Figure 10 (b), across gray mask 201, to resist film 107 irradiation exposure light.Figure 11 is the vertical view of gray scale mask.Light shielding part 204 is opposed parts of source electrode and drain electrode, forms accordingly with the zone of groove adjacency, and the remainder of source electrode and drain electrode is formed by semi light transmitting part 203, and the groove between source electrode and drain electrode forms with transmittance section 205.
Then, as the positive light anti-etching agent after the exposure is developed, then thick resist pattern 107a part is dissolved hardly and is retained, and thin resist figure 107b partly has dissolving to a certain degree, and other parts are dissolved fully and disappeared.Consequently, shown in Figure 10 (c), the thin resist figure 107b that thick resist pattern 107a that thickness is thick and thickness are thin can form simultaneously.
Then, by carrying out etching as mask, shown in Figure 10 (d), on silicon fiml 104, form ohmic contact layer 105a, 105b and source electrode 106a, drain electrode 106b with thick resist pattern 107a and thin resist figure 107b.
After having formed ohmic contact layer 105a, 105b,, thick resist pattern 107a and thin resist figure 107b are refluxed by heating.Thus, each resist figure as organic resin is expanded on silicon fiml 104 planes, on the silicon fiml 104 between ohmic contact layer 105a and the ohmic contact layer 105b, thick resist pattern 107a and thin resist figure 107b link up, shown in the vertical view of Figure 10 (e) and Figure 12, form backflow resist figure 108.Have, Figure 10 (e) shows the x-x section of Figure 12 again.
Then, by with backflow resist figure 108 as mask, etching is removed silicon layer 104, and removes backflow resist figure 108, on semiconductor island, obtained forming the state (not shown) of ohmic contact layer 105a, 105b and source electrode 106a, drain electrode 106b., form passivating film, on source electrode 106a, drain electrode 106b, form contact hole respectively,, form the pixel electrode that is connected with source electrode 106a, the portion of terminal electrode (not shown) that is connected with drain electrode 106b in these contact hole bottoms thereafter.
Then, with Figure 13 another example described in the patent documentation 2 is described.
In this example, after having formed ohmic contact layer 105a, 105b and source electrode 106a, drain electrode 106b, for example, each resist figure is carried out Cement Composite Treated by Plasma by being exposed in the oxygen plasma atmosphere, shown in Figure 13 (a), remove thin resist figure 107b.
Then, under the state that has kept thick resist pattern 107a,, they are refluxed by heating.Thus, on silicon fiml 104 planes, expand as each resist figure of organic resin, on the silicon fiml 104 between ohmic contact layer 105a and the ohmic contact layer 105b, the thick resist pattern 107a of both sides contact.
Consequently, shown in Figure 13 (b) and shown in the vertical view of Figure 14, be the zone at center to form by the position of the raceway groove of ohmic contact layer 105a and ohmic contact layer 105b clamping, form backflow resist figure 109.Backflow resist figure 109 is formed the width of being wider than source electrode 106a, drain electrode 106b.Have, Figure 13 (b) shows the Y-Y section of Figure 14 again.
With source electrode 106a, the drain electrode 106b in backflow resist figure 109 and the zone that not by backflow resist figure 109 covered as mask etching silicon layer 104, form semiconductor island (not shown) thereafter.
Thereafter, with above-mentioned example similarly, form passivating film, on source electrode 106a, drain electrode 106b, form contact hole respectively, form the pixel electrode that is connected with source electrode 106a, the portion of terminal electrode (not shown) that is connected with drain electrode 106b in these contact hole bottoms.
The gray mask that patent documentation 2 described zones of removing the opposed part of source electrode and drain electrode are become semi light transmitting part is called conventional example 2.
[patent documentation 1] spy opens the 2000-165886 communique
[patent documentation 2] spy opens the 2002-261078 communique
As described in the above-mentioned conventional example 2, become the gray mask of semi light transmitting part because the shared area of its semi light transmitting part is wide except the zone of the opposed part of source electrode and drain electrode, so form semi light transmitting part by means of the Micropicture littler than the resolution of the exposure device that uses mask, if can not get the high-precision Micropicture in the wide region, then there is the problem of even transmissivity distribution variation in semi light transmitting part.
On the other hand, under the situation of the semi light transmitting part that constitutes by above-mentioned Micropicture, form the Micropicture shape owing to will form the light-proofness chromium film of light shielding part, so can in 1 photo-mask process (describe, resist develops, etching), carry out the formation of semi light transmitting part and the formation of light shielding part, but under with the situation of semi light transmitting part as semi-transparent film, the formation of semi light transmitting part and the formation of light shielding part must be adopted photo-mask process separately.Like this, though when carrying out describing for 2 times, carry out describing and take for the 1st time the aligning measure and make it not cause and describe for the 2nd time of map migration that alignment precision has a boundary, it is difficult eliminating alignment offset fully.Thereby, under with the situation of semi light transmitting part,, have the problem that often can not get good figure for the reasons of describing for 2 times such as alignment offset as semi-transparent film.
Figure 15 illustrates the vertical view that semi light transmitting part 203 and light shielding part 204 have caused the example of offset with regard to the gray mask of conventional example 2.Shown in this example, when semi light transmitting part has caused under situation about being offset about the directions X position, produce and the width of the corresponding transmittance section 205 of the groove bad situation that characteristic different with design load, the TFT substrate changes that becomes.Like this, exist and often can not get and to form problem with high precision the gray mask of the groove of TFT particular importance.
Summary of the invention
The present invention In view of the foregoing carries out, its purpose is, a kind of gray mask is provided, as gray mask in above-mentioned conventional example 2, promptly has the formed above-mentioned thick resist pattern formation of the opposed part with source electrode source electrode and drain electrode graph of a correspondence and drain electrode on the thin film transistor base plate portion, the formed above-mentioned thin resist figure formation of part beyond the thick resist pattern formation portion of source electrode and drain electrode portion, and comprising all the other zones formed above-mentioned non-resist region formation portion of the part corresponding with groove, employed gray mask in manufacturing process with the thin film transistor base plate that makes the operation that forms the formed thick resist pattern distortion of portion by above-mentioned thick resist pattern at least, the transmissivity of semi light transmitting part distributes good, and it is good with the pattern precision of groove graph of a correspondence.
In addition, the present invention also aims to, a kind of gray tone mask manufacturing method is provided, gray tone mask manufacturing method as above-mentioned conventional example 2, promptly has the formed above-mentioned thick resist pattern formation of the opposed part with source electrode source electrode and drain electrode graph of a correspondence and drain electrode on thin film transistor base plate portion, the formed above-mentioned thin resist figure formation of part beyond the thick resist pattern formation portion of source electrode and drain electrode portion, and comprising all the other zones formed above-mentioned non-resist region formation portion of the part corresponding with groove, employed gray tone mask manufacturing method in manufacturing process with the thin film transistor base plate that makes the operation that forms the formed thick resist pattern distortion of portion by above-mentioned thick resist pattern at least, the transmissivity of making semi light transmitting part distributes good, and the gray mask good with the pattern precision of groove graph of a correspondence.
In order to solve above-mentioned problem, the present invention has following formation.
(constituting 1) a kind of gray mask, on substrate to be copied, has the thick resist pattern of being used to form, the thick resist pattern formation portion of thin resist figure and non-resist region, thin resist figure formation portion and non-resist region formation portion, described thin resist figure formation portion is made of semi light transmitting part, described thick resist pattern formation portion is made of light shielding part, described non-resist region formation portion is made of the transmittance section, it is characterized in that, on transparency carrier, on described semi light transmitting part, be formed with semi-transparent film, on described light shielding part, be formed with photomask, and, boundary portion in described light shielding part and described transmittance section is provided with the allowance zone, and this allowance zone is formed by semi-transparent film pattern.
(constituting 2) a kind of gray mask, on substrate to be copied, have the thick resist pattern formation portion that is used to form thick resist pattern, thin resist figure and non-resist region, thin resist figure formation portion and non-resist region formation portion, described thin resist figure formation portion is made of semi light transmitting part, described thick resist pattern formation portion is made of light shielding part, described non-resist region formation portion is made of the transmittance section, it is characterized in that, on transparency carrier, have: light shielding part, it is laminated with semi-transparent film pattern and photomask figure; Semi light transmitting part, its part beyond described light shielding part is formed with semi-transparent film pattern; And not only do not formed semi-transparent film but also do not formed the transmittance section of photomask, described light shielding part has in described transmittance section side to be vacated the allowance zone and is formed on photomask figure on the described semi-transparent film pattern.
(constituting 3) a kind of gray mask, on substrate to be copied, have the thick resist pattern formation portion that is used to form thick resist pattern, thin resist figure and non-resist region, thin resist figure formation portion and non-resist region formation portion, described thin resist figure formation portion is made of semi light transmitting part, described thick resist pattern formation portion is made of light shielding part, described non-resist region formation portion is made of the transmittance section, it is characterized in that, on transparency carrier, have: light shielding part, it is formed by photomask and the semi-transparent film that is layered on this photomask; Semi light transmitting part, its part beyond light shielding part is formed with semi-transparent film pattern; And not only do not formed semi-transparent film but also do not formed the transmittance section of photomask, described light shielding part has in the transmittance section side to be vacated the allowance zone and is formed on photomask figure on the described semi-transparent film pattern.
(constituting 4) a kind of gray tone mask manufacturing method, described gray tone mask has the thick resist pattern of being used to form on substrate to be copied, the thick resist pattern formation portion of thin resist figure and non-resist region, thin resist figure formation portion and non-resist region formation portion, described thin resist figure formation portion is made of semi light transmitting part, described thick resist pattern formation portion is made of light shielding part, described non-resist region formation portion is made of the transmittance section, it is characterized in that described gray tone mask manufacturing method has: preparation is laminated with the operation of the blank of semi-transparent film and photomask at least on transparency carrier; The light shielding part figure forms operation, comprises: describe the 1st generating writing pattern on the 1st resist film of photomask figure and with its development, form the 1st resist figure being used to form, come the operation of etching photomask with the 1st resist figure as mask; And semi-transparent film pattern forms operation, comprise: describe the 2nd generating writing pattern on the 2nd resist film of semi-transparent film pattern and with its development being used to form, form the 2nd resist figure, come the operation of the semi-transparent film of etching as mask with the 2nd resist figure, described the 1st generating writing pattern is the figure that is used to form the light shielding part corresponding with the position of vacating desirable allowance zone in the transmittance section side, and described the 2nd generating writing pattern is and described semi light transmitting part graph of a correspondence.
(constituting 5) as constituting the gray tone mask manufacturing method described in 4, is characterized in that, between the semi-transparent film and photomask of described blank, setting is used to protect the buffer film of semi-transparent film when removing photomask by etching.
(constituting 6) a kind of gray tone mask manufacturing method, described gray tone mask has the thick resist pattern of being used to form on substrate to be copied, the thick resist pattern formation portion of thin resist figure and non-resist region, thin resist figure formation portion and non-resist region formation portion, described thin resist figure formation portion is made of semi light transmitting part, described thick resist pattern formation portion is made of light shielding part, described non-resist region formation portion is made of the transmittance section, it is characterized in that described gray tone mask manufacturing method has: preparation is formed with the operation of the blank of photomask at least on transparency carrier; The light shielding part figure forms operation, comprises: describe the 1st generating writing pattern on the 1st resist film of photomask figure and with its development, form the 1st resist figure being used to form, come the operation of etching photomask with the 1st resist figure as mask; Form the operation of semi-transparent film on the transparency carrier after forming described light shielding part; And semi-transparent film pattern forms operation, comprise: on the 2nd resist film that is used to form on the described semi-transparent film of being formed on of described semi-transparent film pattern, describe the 2nd generating writing pattern and its development, form the 2nd resist figure, come the operation of the semi-transparent film of etching as mask with the 2nd resist figure, described the 1st generating writing pattern is the figure that is used to form the light shielding part corresponding with the position of vacating the allowance zone in the transmittance section side, and described the 2nd generating writing pattern is and described semi light transmitting part graph of a correspondence.
(constituting 7) a kind of gray tone mask manufacturing method, the gray tone mask of manufacturing has the thick resist pattern of being used to form on substrate to be copied, the thick resist pattern formation portion of thin resist figure and non-resist region, thin resist figure formation portion and non-resist region formation portion, and above-mentioned thin resist figure formation portion is made of semi light transmitting part, thick resist pattern and non-resist region formation portion are that light shielding part or the transmittance section that eurymeric or minus determine constitutes by the resist of basis on substrate to be copied respectively, it is characterized in that, above-mentioned gray mask has: the formed above-mentioned thick resist pattern formation of the opposed part with source electrode source electrode and drain electrode graph of a correspondence and drain electrode on thin film transistor base plate portion, the formed above-mentioned thin resist figure formation of part beyond the thick resist pattern formation portion of source electrode and drain electrode portion, and comprising all the other zones formed above-mentioned non-resist region formation portion of the part corresponding with groove, and be used for having and make the manufacturing process of thin film transistor base plate that forms the operation of portion's formed thick resist pattern distortion by above-mentioned thick resist pattern at least, have: the operation of on transparency carrier, preparing to have formed at least the blank of photomask; The light shielding part figure forms operation, is included in and describes the 1st generating writing pattern on the 1st resist film that is used to form the photomask figure and with its development, form the 1st resist figure, with the operation of the 1st resist figure as the mask etching photomask; Then, on the transparency carrier that has formed above-mentioned light shielding part, form the operation of semi-transparent film; Then, semi-transparent film pattern forms operation, on the 2nd resist film that has formed on the above-mentioned semi-transparent film, describe the 2nd generating writing pattern in order to form semi-transparent film pattern and with its development, form the 2nd resist figure, with the operation of the 2nd resist figure as the semi-transparent film of mask etching, above-mentioned the 1st generating writing pattern is the opposed part of above-mentioned source electrode and drain electrode, be to be used to form and the figure of having vacated the corresponding thick resist pattern formation portion in the position in desirable allowance zone at least in groove one side, above-mentioned the 2nd generating writing pattern is and above-mentioned source electrode and drain electrode graph of a correspondence.
According to gray mask of the present invention, a kind of gray mask can be provided, has the formed above-mentioned thick resist pattern formation of the opposed part with source electrode source electrode and drain electrode graph of a correspondence and drain electrode on thin film transistor base plate portion, the formed above-mentioned thin resist figure formation of part beyond the thick resist pattern formation portion of source electrode and drain electrode portion, and comprising all the other zones formed above-mentioned non-resist region formation portion of the part corresponding with groove, be used for having and make the manufacturing process of thin film transistor base plate that forms the operation of portion's formed thick resist pattern distortion by above-mentioned thick resist pattern at least, form by semi-transparent film by means of semi light transmitting part, the transmissivity of semi light transmitting part distributes good, and by semi light transmitting part is formed by semi-transparent film, by opposed part as above-mentioned source electrode and drain electrode, form the thick resist pattern formation portion vacated desirable allowance zone at least in groove one side, suppressed the problem of debatable and pattern precision variation groove graph of a correspondence that cause because of the alignment offset described for 2 times.
In addition, according to gray tone mask manufacturing method of the present invention, a kind of gray tone mask manufacturing method can be provided, the gray mask of manufacturing has the formed above-mentioned thick resist pattern formation of the opposed part with source electrode source electrode and drain electrode graph of a correspondence and drain electrode on the TFT substrate portion, the formed above-mentioned thin resist figure formation of part beyond the thick resist pattern formation portion of source electrode and drain electrode portion, and comprising all the other zones formed above-mentioned non-resist region formation portion of the part corresponding with groove, be used for having and make the manufacturing process of thin film transistor base plate that forms the operation of portion's formed thick resist pattern distortion by above-mentioned thick resist pattern at least, and, by means of forming semi light transmitting part with semi-transparent film, the transmissivity of semi light transmitting part distributes good, and form by semi-transparent film by semi light transmitting part, by opposed part as above-mentioned source electrode and drain electrode, form at least in thick resist pattern formation portion that groove one side has been vacated desirable allowance zone as light shielding part, can suppress the problem of debatable and pattern precision variation groove graph of a correspondence that cause because of the alignment offset described for 2 times.
Description of drawings
Fig. 1 is the sectional view of the gray mask of embodiment 1.
Fig. 2 is the vertical view of the gray mask of embodiment 1.
Fig. 3 is the manufacturing procedure picture of the gray mask of embodiment 1.
Fig. 4 is the figure that the effect of embodiment 1 is shown.
Fig. 5 is the manufacturing procedure picture of the gray mask of embodiment 2.
Fig. 6 is the vertical view of the gray mask of embodiment 3.
Fig. 7 is the manufacturing procedure picture of the gray mask of embodiment 3.
Fig. 8 is the vertical view of the gray mask of embodiment 4.
Fig. 9 is the vertical view of existing gray mask.
Figure 10 is the manufacturing procedure picture of existing TFT substrate.
Figure 11 is the vertical view of existing gray mask.
Figure 12 is the vertical view of the TFT substrate in the existing fabrication phase.
Figure 13 is the manufacturing procedure picture of existing TFT substrate.
Figure 14 is the vertical view of the TFT substrate in the existing fabrication phase.
Figure 15 is the figure that the problem of existing gray mask is shown.
Embodiment
Below, explain the present invention by embodiment.Have again, in the following embodiments, use the eurymeric resist to be prerequisite, illustrate with thick resist pattern formation portion as light shielding part, with the gray mask of non-resist region formation portion as the transmittance section with the resist on the substrate to be copied.
(embodiment 1)
Fig. 1 is the source electrode on the TFT substrate of gray mask of expression an embodiment of the invention and near the sectional view of the figure the drain electrode, and Fig. 2 is its vertical view.
As depicted in figs. 1 and 2, in embodiment 1, on transparency carriers such as quartz 11, have with the corresponding regional formed semi-transparent film pattern 12a of source electrode and drain electrode and form with the corresponding zone of the opposed part of source electrode and drain electrode and vacating desirable allowance regional 18 with corresponding transmittance section 17 1 sides of groove on above-mentioned semi-transparent film pattern 12a formed photomask figure 13a.That is, the part that photomask figure 13a and semi-transparent film pattern 12a are stacked is a light shielding part, and the zone that has formed the semi-transparent film beyond the light shielding part is a semi light transmitting part, and the zone that has not only formed semi-transparent film 12a but also do not formed photomask 13a is the transmittance section.
Then, with Fig. 3 the method for making above-mentioned gray mask is described.
Employed in the present embodiment blank 14 is shown in Fig. 3 (a), is of a size of on the large-scale transparency carrier 11 of 450mm * 550mm at the first type surface that is made of quartz etc., has formed the blank of semi-transparent film 12 and photomask 13 successively.
,, preferably in film, obtain the material of high light-proofness herein, for example can enumerate Cr, Si, W, Al etc. as the material of photomask 13.Have, photomask 13 also can be the photomask that the two sides for example has the anti-reflecting layer that the oxide by above-mentioned metal constitutes in surface or table again.In addition, material as semi-transparent film 12, preferably in film, the transmissivity of transmittance section is decided to be and obtained the material that transmissivity is about 50% semi-transparency at 100% o'clock, for example can enumerate Cr compound (oxide of Cr, nitride, oxynitride, fluoride etc.), MoSi, Si, W, Al etc.Si, W, Al etc. are to obtain material high light transmission or that obtain semi-transparency according to its thickness.In addition, because the light shielding part of formed mask is semi-transparent film 12 and the lamination of photomask 13, so even light-proofness deficiency when using photomask separately, as long as when merging use, obtain light-proofness with semi-transparent film.Have, herein, so-called transmissivity is meant the transmissivity of for example large LCD being used the exposure light wavelength of exposure machine of using gray mask again.In addition, the transmissivity of semi-transparent film also not exclusively must be defined in about 50%.The transmittance of semi light transmitting part be set at which kind of degree be the design on problem.
In addition, about the combination of above-mentioned photomask 13 with the material of semi-transparent film 12, the characteristic of film must be different, in a kind of etching environment of film, wishes that another kind of film has tolerance.For example, forming photomask 13, forming under the situation of semi-transparent film 12 with Cr with MoSi, as to adopt chlorine be gas dry etching Cr photomask, or adopt the etching liquid cerous nitrate ammonium is mixed with peroxy salt and diluted etc. to carry out wet etching, then because and the semi-transparent film of MoSi of substrate between obtain high etching selection ratio, so the semi-transparent film of MoSi can only be removed the Cr photomask by etching to damaged hardly.In addition, wish that above-mentioned photomask 13 and semi-transparent film 12 have good tight contact during film forming on substrate.
Aforementioned mask blank 14 obtains by form semi-transparent film 12 and photomask 13 successively on transparency carrier 11, but film build method is as long as suitably select vapour deposition method, sputtering method, CVD (chemical vapor deposition) method etc. to be suitable for the method for film kind.In addition,, there is no special restriction, in a word as long as form so that obtain good light-proofness or semi-transparency with best thickness about thickness.
Then, on this blank, for example apply the eurymeric resist that electron beam or laser are described usefulness, cure, be formed for forming the 1st resist film 15 (with reference to Fig. 3 (b)) of photomask figure.Then, describing machine etc. with electron beam drawing machine or laser describes.As shown in Figure 1, describe data (the 1st describes data) and be opposed part, the graph data of the photomask figure 13a corresponding with the position of having vacated desirable allowance zone in groove one side at source electrode and drain electrode.After describing, it is developed, on blank, form the 1st resist figure 15a (with reference to Fig. 3 (c)) corresponding with light shielding part.Have, this allowance zone preferably is decided to be the big width apart from groove one side of alignment offset than imagination after considering the alignment precision of describing for 2 times, under the situation of present embodiment, preferably be decided to be the allowance zone of 0.1～1 μ m left and right sides width again.
Then, as mask,, form the photomask figure 13a corresponding (with reference to Fig. 3 (c)) with formed resist figure 15a with light shielding part with dry etching photomask 13.Under the situation that photomask 13 is made of the Cr based material, can adopt the dry etching that has used chlorine.Beyond the zone corresponding, be the state that the etching by photomask is exposed the semi-transparent film 12 of substrate with light shielding part.Residual resist figure 15a causes ashing or removes (with reference to Fig. 3 (d)) with concentrated sulphuric acid etc. with oxygen.
Then, the above-mentioned resist of coating on whole forms the 2nd resist film 16 (with reference to Fig. 3 (e)) again.Then, carrying out the 2nd time describes.The data (the 2nd describes data) of describing of this moment are shown in Figure 1 and source electrode and drain electrode graph of a correspondence data.After describing, it is developed, be formed for forming the resist figure 16a (with reference to Fig. 3 (f)) of semi-transparent film pattern.
Have again, in the use of present embodiment in the TFT substrate manufacturing process of gray mask, the same with the gray mask of conventional example 2, because the interval with regulation forms source electrode and drain electrode on gate electrode, be essential owing to carrying out gate electrode with aiming at of source and drain electrode again, relate to and the mark of aiming at of gate electrode (alignment mark during exposure, positional precision confirm with mark etc.) so be necessary on mask to be provided with.At this moment, since will by the groove of source electrode and drain electrode clamping and gate electrode exactly contraposition be important, so preferably will be arranged on the graphics field of photomask at the relevant mark of being got of the film pattern of the most close groove one side formation of source electrode and drain electrode beyond.In the present invention, the film pattern that forms in the most close groove one side of source electrode and drain electrode is semi-transparent film pattern.Thereby, for present embodiment, in above-mentioned operation, will be referred to be contained in and be used to form the describing in the data (the 2nd describes data) of semi-transparent film pattern with the marks packets of aiming at of gate electrode, also carry out the formation of mark in the same manner with the formation of semi-transparent film pattern, in following operation, with semi-transparent film pattern similarly, can form and utilize the formed marker graphic of semi-transparent film.
Then, as mask, remove the semi-transparent film 12 in the zone that becomes the transmittance section with formed resist figure 16a by etching.Thus, semi light transmitting part is depicted as the transmittance section, forms semi light transmitting part and transmittance section (with reference to Fig. 3 (g)).Then, residual resist figure is removed (with reference to Fig. 3 (h)) with oxygen ashing etc.
As mentioned above, the gray mask shown in Figure 1 10 of present embodiment is manufactured comes out.
Fig. 4 is the example of situation of describing to have caused alignment offset with the 2nd generating writing pattern described of having imagined the 1st generating writing pattern in said method, Fig. 4 (a) is the 2nd generating writing pattern with respect to the example of the 1st generating writing pattern skew to the directions X left side, Fig. 4 (b) be the 2nd generating writing pattern with respect to the 1st generating writing pattern at X side's skew example to the right.As shown in these figures, for the gray mask in the present embodiment, owing to the allowance zone is set, form photomask figure 13a, so, also can not make with groove graph of a correspondence dimensional accuracy and worsen even alignment offset takes place in groove one side.
Thereby, according to present embodiment, owing to can form figure important on the TFT characteristic with high precision, so high-quality gray mask can be provided.
Have again, the light shielding part of the gray mask among the present invention is owing to use the manufacture method of conventional example 2, the resist figure that utilizes light shielding part and form is owing to reflux, even the position in the gray mask of the position of light shielding part and conventional example 2 has some different, also do not have what problem.
Have, in the present embodiment, employed gray mask also can be the gray mask that has formed buffer film between semi-transparent film 12 and photomask 13 again.Promptly, between semi-transparent film 12 and photomask 13, the buffer film that has etching suspension layer function by setting is in the 1st photo-mask process, when removing the photomask in the zone that does not form the resist figure, can prevent the reduction equivalent damage of the semi-transparent film of lower floor by etching.Like this, owing to be provided with buffer film, photomask 13 can be used the similar material of etching characteristic, for example formations such as film of the film of same material or major component identical materials with semi-transparent film 12.Have, the material of buffer film can have from the environment to etching photomask 13 material of tolerance to be selected again.In addition, under the situation that must remove the buffer film in the semi light transmitting part, also requiring is with methods such as dry etchings the semi-transparent film 12 of substrate not to be caused damage and removable material.As buffer film, for example can adopt SiO
2Or SOG (Spin on Glass: be coated with in commentaries on classics on glass) etc.Constituting under the situation of photomask desirable high etching selection ratio between these materials and photomask with the Cr based material.In addition, the transmittance of these materials is good, does not also damage its transmissison characteristic even get involved semi light transmitting part, thereby also can remove in advance.
In addition, as blank, need not be stacked the blank of semi-transparent film and photomask, and with the blank that has formed its transmissivity photomask relevant with thickness, as the operation (with reference to Fig. 3 (c)) that the etching photomask exposes semi-transparent film, also replaceable is that the etching photomask is to the operation that obtains the such thickness of desirable transmissivity.
(embodiment 2)
Embodiment 2 is to use with embodiment 1 diverse ways to have made example with the same gray mask of embodiment 1.
Below, with Fig. 5 this method is described.
Preparation used blank 14 (with reference to Fig. 5 (a)) in embodiment 1.
Then, on blank 14, for example apply the eurymeric resist that electron beam or laser are described usefulness, cure, be formed for forming the resist film 16 (with reference to Fig. 5 (b)) of semi-transparent film pattern.Then, describing machine etc. with electron beam drawing machine or laser describes.Describe data (the 1st describes data) and be shown in Figure 1 and source electrode and drain electrode graph of a correspondence data.After describing,, on blank, form resist figure 16a (with reference to Fig. 5 (c)) with its development.
Have again, about relating to the formation with the mark of aiming at of gate electrode, in above-mentioned operation, will be referred to be contained in and be used to form the describing in the data (the 1st describes data) of semi-transparent film pattern with the marks packets of aiming at of gate electrode, then in the etching of the etching of photomask and semi-transparent film, can form marker graphic.Have, do not kept by not removing in the operation of formation photomask figure described later at the photomask on the semi-transparent film that forms marker graphic, its detection sensitivity increases than the detection sensitivity of the mark that is made of semi-transparent film, so comparatively desirable.Then, with formed resist figure 16a as mask, etching photomask 13, the semi-transparent film 12 of etching (with reference to Fig. 5 (d)) then.Residual resist figure 16a causes ashing with oxygen or removes with concentrated sulphuric acid etc.
Then, the above-mentioned resist of coating on whole forms resist film 15 (with reference to Fig. 5 (e)) again.Then, carrying out the 2nd time describes.The data (the 2nd describes data) of describing of this moment are opposed parts at source electrode and drain electrode, the graph data of the photomask 13a corresponding with the position of vacating desirable allowance zone in groove one side.After describing, it is developed, be formed for forming the resist figure 15b (with reference to Fig. 5 (f)) of photomask figure.Have, the width in this allowance zone is identical with embodiment 1 again.
Then, as mask, remove the photomask on the semi-transparent film that has exposed by dry etching with formed resist figure 15b.Thus, light shielding part is depicted as semi light transmitting part, forms semi light transmitting part and light shielding part (with reference to Fig. 5 (g)).Then, residual resist figure is removed (with reference to Fig. 5 (h)) with oxygen ashing etc.
In the present embodiment, also the same with embodiment 1, owing to can form figure important on the TFT characteristic with high precision, so high-quality gray mask can be provided.
Have again, also the same in the present embodiment with embodiment 1, can adopt the mask blank that between semi-transparent film 12 and photomask 13, has formed buffer film.
In addition, as blank, need not be stacked the blank of semi-transparent film and photomask, and with the blank that has formed its transmissivity photomask relevant with thickness, as the operation (with reference to Fig. 5 (c)) that the etching photomask exposes semi-transparent film, also replaceable is that the etching photomask is to the operation that obtains the such thickness of desirable transmissivity.
(embodiment 3)
The gray mask of embodiment 1 is to form photomask figure 13a on semi-transparent film pattern 12a, light shielding part is by semi-transparent film and the film formed gray mask of shading on it, and embodiment 3 as shown in Figure 6, but be to form semi-transparent film pattern 12a on photomask figure 13a, light shielding part is by photomask and the semi-transparent film formed gray mask 20 on it.Have again, the vertical view of the gray mask 20 of present embodiment since in light shielding part except being identical with Fig. 2 the turning upside down of photomask figure 13a and semi-transparent film pattern 12a, so give omission.
Below, the manufacture method of the gray mask 20 of present embodiment is described with Fig. 7.
In the present embodiment, at first, shown in Fig. 7 (a), with the same transparency carrier 11 of embodiment 1 on, use the blank 24 that has formed photomask 13.
On this blank, for example apply the eurymeric resist that laser or electron beam drawing are used, cure, be formed for forming the 1st resist film 15 (with reference to Fig. 7 (b)) of photomask figure.Then, describing machine etc. with electron beam drawing machine or laser describes.Describing data (the 1st describes data) is the opposed part at source electrode and drain electrode shown in Figure 2, the graph data of the light shielding part 13a corresponding with the position of vacating desirable allowance zone in groove one side.After describing, it is developed, on blank, form the 1st resist figure 15a corresponding with light shielding part.Have, the width in this allowance zone is identical with embodiment 1 again.
Then,,, form and light shielding part graph of a correspondence 13a (with reference to Fig. 7 (c)) as mask with formed the 1st resist figure 15a with wet method or dry etching photomask 13.Under the situation that photomask 13 is made of the Cr based material, for wet etching, can adopt etching liquid that the cerous nitrate ammonium is mixed with peroxy salt and diluted etc., for dry etching, can adopt to contain Cl
2+ O
2Deng chlorine be the dry etching gas of gas.Residual resist figure 15a causes ashing or removes (with reference to Fig. 7 (d)) with concentrated sulphuric acid etc. with oxygen.
Then, on whole, form semi-transparent film 12 (with reference to Fig. 7 (e)).Then, on semi-transparent film 12, apply resist, be formed for forming the 2nd resist film 16 (with reference to Fig. 7 (f)) of semi-transparent film pattern.Then, carrying out the 2nd time describes.The data (the 2nd describes data) of describing of this moment are shown in Figure 1 and source electrode and drain electrode graph of a correspondence data.After describing, it is developed, form corresponding with semi light transmitting part at least the 2nd resist figure 16a (with reference to Fig. 7 (g)).
Have again, about relating to the formation with the mark of aiming at of gate electrode, in above-mentioned operation, will be referred to be contained in and be used to form the describing in the data (the 2nd describes data) of semi-transparent film pattern with the marks packets of aiming at of gate electrode, with the formation of semi-transparent film pattern in also carry out the formation of mark, in the operation afterwards, the same with semi-transparent film pattern, can form the marker graphic that has formed with semi-transparent film.
Then, as mask, remove the semi-transparent film 12 in the zone that becomes the transmittance section with formed the 2nd resist figure 16a with wet method or dry etching.Thus, semi light transmitting part is depicted as the transmittance section, forms semi light transmitting part and transmittance section.Have, residual resist figure is removed (with reference to Fig. 7 (h)) with oxygen ashing etc. again.
In the present embodiment, also the same with embodiment 1, owing to can form figure important on the TFT characteristic with high precision, so high-quality gray mask can be provided.
(embodiment 4)
In embodiment 4, as shown in Figure 8, also consider alignment offset to the Y direction, be the Y direction of light shielding part one side with the boundary portion transmittance section in also be provided with the example in allowance zone 19.The width in the allowance zone 18 of groove one side in the width in this allowance zone 19 and the embodiment 1 is same.By formation like this,, can prevent that also photomask from exceeding the design configuration of source electrode and drain electrode even produced the situation of alignment offset in the Y direction.
Claims (12)
1. gray mask, on substrate to be copied, have the thick resist pattern formation portion that is used to form thick resist pattern, thin resist figure and non-resist region, thin resist figure formation portion and non-resist region formation portion, described thin resist figure formation portion is made of semi light transmitting part, described thick resist pattern formation portion is made of light shielding part, described non-resist region formation portion is made of the transmittance section, it is characterized in that
On transparency carrier, on described semi light transmitting part, be formed with semi-transparent film, on described light shielding part, be formed with photomask, and the boundary portion in described light shielding part and described transmittance section is provided with the allowance zone, this allowance zone is formed by semi-transparent film pattern.
2. gray mask, on substrate to be copied, have the thick resist pattern formation portion that is used to form thick resist pattern, thin resist figure and non-resist region, thin resist figure formation portion and non-resist region formation portion, described thin resist figure formation portion is made of semi light transmitting part, described thick resist pattern formation portion is made of light shielding part, described non-resist region formation portion is made of the transmittance section, it is characterized in that
On transparency carrier, have: light shielding part, it is laminated with semi-transparent film pattern and photomask figure; Semi light transmitting part, its part beyond described light shielding part is formed with semi-transparent film pattern; And not only do not formed semi-transparent film but also do not formed the transmittance section of photomask,
Described light shielding part has in described transmittance section side to be vacated allowance zone and is formed on photomask figure on the described semi-transparent film pattern.
3. gray mask, on substrate to be copied, have the thick resist pattern formation portion that is used to form thick resist pattern, thin resist figure and non-resist region, thin resist figure formation portion and non-resist region formation portion, described thin resist figure formation portion is made of semi light transmitting part, described thick resist pattern formation portion is made of light shielding part, described non-resist region formation portion is made of the transmittance section, it is characterized in that
On transparency carrier, have: light shielding part, it is formed by photomask and the semi-transparent film that is layered on this photomask; Semi light transmitting part, its part beyond light shielding part is formed with semi-transparent film pattern; And not only do not formed semi-transparent film but also do not formed the transmittance section of photomask,
Described light shielding part has in the transmittance section side to be vacated allowance zone and is formed on photomask figure on the described semi-transparent film pattern.
4. as each described gray mask in the claim 1 to 3, it is characterized in that the width in described allowance zone is 0.1～1 μ m.
5. as each described gray mask in the claim 1 to 3, it is characterized in that described photomask is made of the Cr based material.
6. gray mask as claimed in claim 1 or 2 is characterized in that, in the etching environment of described photomask and described semi-transparent film a kind of film therein, another kind of film has tolerance.
7. gray mask as claimed in claim 1 or 2 is characterized in that described photomask has Cr, and described semi-transparent film has MoSi.
8. gray mask as claimed in claim 1 or 2 is characterized in that, the film with etching suspension layer function is set between described semi-transparent film and photomask.
9. gray mask as claimed in claim 8 is characterized in that, the film with described etching suspension layer function adopts SiO
2Or SOG.
10. gray tone mask manufacturing method, described gray tone mask has the thick resist pattern formation portion that is used to form thick resist pattern, thin resist figure and non-resist region, thin resist figure formation portion and non-resist region formation portion on substrate to be copied, described thin resist figure formation portion is made of semi light transmitting part, described thick resist pattern formation portion is made of light shielding part, described non-resist region formation portion is made of the transmittance section, it is characterized in that described gray tone mask manufacturing method has:
Preparation is laminated with the operation of the blank of semi-transparent film and photomask at least on transparency carrier;
The light shielding part figure forms operation, comprises: describe the 1st generating writing pattern on the 1st resist film of photomask figure and with its development, form the 1st resist figure being used to form, come the operation of etching photomask with the 1st resist figure as mask; And
Semi-transparent film pattern forms operation, comprises: describe the 2nd generating writing pattern on the 2nd resist film of semi-transparent film pattern and, form the 2nd resist figure being used to form its development, and the operation of coming the semi-transparent film of etching as mask with the 2nd resist figure,
Described the 1st generating writing pattern is the figure that is used to form the light shielding part corresponding with the position of vacating desirable allowance zone in the transmittance section side,
Described the 2nd generating writing pattern is and described semi light transmitting part graph of a correspondence.
11. gray tone mask manufacturing method as claimed in claim 10 is characterized in that, between the semi-transparent film and photomask of described blank, setting is used to protect the buffer film of semi-transparent film when removing photomask by etching.
12. gray tone mask manufacturing method, described gray tone mask has the thick resist pattern formation portion that is used to form thick resist pattern, thin resist figure and non-resist region, thin resist figure formation portion and non-resist region formation portion on substrate to be copied, described thin resist figure formation portion is made of semi light transmitting part, described thick resist pattern formation portion is made of light shielding part, described non-resist region formation portion is made of the transmittance section, it is characterized in that described gray tone mask manufacturing method has:
Preparation is formed with the operation of the blank of photomask at least on transparency carrier;
The light shielding part figure forms operation, comprises: describe the 1st generating writing pattern on the 1st resist film of photomask figure and with its development, form the 1st resist figure being used to form, come the operation of etching photomask with the 1st resist figure as mask;
Form the operation of semi-transparent film on the transparency carrier after forming described light shielding part; And
Semi-transparent film pattern forms operation, comprise: on the 2nd resist film that is used to form on the described semi-transparent film of being formed on of described semi-transparent film pattern, describe the 2nd generating writing pattern and its development, form the 2nd resist figure, come the operation of the semi-transparent film of etching as mask with the 2nd resist figure
Described the 1st generating writing pattern is the figure that is used to form the light shielding part corresponding with the position of vacating the allowance zone in the transmittance section side,
Described the 2nd generating writing pattern is and described semi light transmitting part graph of a correspondence.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004205306 | 2004-07-12 | ||
| JP2004205306A JP2006030319A (en) | 2004-07-12 | 2004-07-12 | Gray tone mask and method for manufacturing gray tone mask |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100840683A Division CN100562803C (en) | 2004-07-12 | 2005-07-12 | Gray mask and gray tone mask manufacturing method |
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| CN101673049A true CN101673049A (en) | 2010-03-17 |
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| CNB2005100840683A Expired - Fee Related CN100562803C (en) | 2004-07-12 | 2005-07-12 | Gray mask and gray tone mask manufacturing method |
| CN200910179767A Pending CN101673049A (en) | 2004-07-12 | 2005-07-12 | Gray tone mask and method for manufacturing gray tone mask |
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| JP (1) | JP2006030319A (en) |
| KR (1) | KR100965181B1 (en) |
| CN (2) | CN100562803C (en) |
| TW (1) | TW200608579A (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111367142A (en) * | 2018-12-26 | 2020-07-03 | 聚灿光电科技（宿迁）有限公司 | Novel optical mask plate with different light transmission |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006030320A (en) | 2004-07-12 | 2006-02-02 | Hoya Corp | Gray tone mask and method for manufacturing gray tone mask |
| JP4786359B2 (en) | 2006-02-07 | 2011-10-05 | 株式会社エヌ・ティ・ティ・ドコモ | Mobile station, radio access network apparatus, and resource request method |
| JP2007248802A (en) * | 2006-03-16 | 2007-09-27 | Hoya Corp | Pattern forming method and manufacturing method for gray tone mask |
| JP2008102465A (en) * | 2006-10-23 | 2008-05-01 | Sk Electronics:Kk | Halftone mask and method for manufacturing the same |
| JP5429590B2 (en) * | 2007-07-10 | 2014-02-26 | Ｎｌｔテクノロジー株式会社 | Halftone mask |
| JP5336226B2 (en) * | 2008-02-26 | 2013-11-06 | Ｈｏｙａ株式会社 | Multi-tone photomask manufacturing method |
| CN101546733B (en) * | 2008-03-28 | 2011-07-27 | 北京京东方光电科技有限公司 | Method for manufacturing TFT-LCD array substrate and color film substrate |
| KR101295235B1 (en) * | 2008-08-15 | 2013-08-12 | 신에쓰 가가꾸 고교 가부시끼가이샤 | Gray tone mask blank, gray tone mask, and method for forming product processing mark or product information mark |
| CN101656233B (en) * | 2008-08-22 | 2012-10-24 | 群康科技(深圳)有限公司 | Method for manufacturing thin film transistor substrate |
| CN101661907B (en) * | 2008-08-27 | 2011-12-28 | 北京京东方光电科技有限公司 | Method for manufacturing array substrate of liquid crystal display device |
| JP5510947B2 (en) * | 2008-09-19 | 2014-06-04 | Ｈｏｙａ株式会社 | Photomask manufacturing method and photomask |
| JP2010191310A (en) * | 2009-02-20 | 2010-09-02 | Hoya Corp | Method for manufacturing multilevel grayscale photomask and method for manufacturing semiconductor transistor |
| JP2009294682A (en) * | 2009-09-24 | 2009-12-17 | Hoya Corp | Mask blank and photomask |
| JP5123349B2 (en) * | 2010-04-19 | 2013-01-23 | Ｈｏｙａ株式会社 | Multi-tone mask manufacturing method |
| CN102331637A (en) * | 2011-09-28 | 2012-01-25 | 深圳市华星光电技术有限公司 | Special visor and manufacturing method thereof, and method for manufacturing liquid crystal panel |
| JP6186719B2 (en) * | 2011-12-21 | 2017-08-30 | 大日本印刷株式会社 | Large phase shift mask and manufacturing method of large phase shift mask |
| CN104407496A (en) * | 2014-10-28 | 2015-03-11 | 京东方科技集团股份有限公司 | Mask plate |
| CN108563098A (en) * | 2018-01-17 | 2018-09-21 | 京东方科技集团股份有限公司 | A kind of mask plate and preparation method thereof |
| CN109634052A (en) * | 2018-12-05 | 2019-04-16 | 惠科股份有限公司 | Photomask and manufacturing method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2917879B2 (en) * | 1995-10-31 | 1999-07-12 | 日本電気株式会社 | Photomask and manufacturing method thereof |
| JP3429125B2 (en) * | 1995-12-21 | 2003-07-22 | 沖電気工業株式会社 | Phase shift mask and method of forming resist pattern using the mask |
| KR100219079B1 (en) * | 1996-06-29 | 1999-09-01 | 김영환 | Phase shift mask |
| JP3619664B2 (en) * | 1997-03-24 | 2005-02-09 | 株式会社ルネサステクノロジ | Manufacturing method of semiconductor integrated circuit device |
| JP3178391B2 (en) * | 1997-10-24 | 2001-06-18 | 日本電気株式会社 | Photomask design method |
| KR100601168B1 (en) * | 1999-05-13 | 2006-07-13 | 삼성전자주식회사 | Thin film transistor substrate and manufacturing method thereof |
| JP4410951B2 (en) * | 2001-02-27 | 2010-02-10 | Ｎｅｃ液晶テクノロジー株式会社 | Pattern forming method and manufacturing method of liquid crystal display device |
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2004
- 2004-07-12 JP JP2004205306A patent/JP2006030319A/en active Pending
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2005
- 2005-07-11 TW TW094123347A patent/TW200608579A/en unknown
- 2005-07-12 CN CNB2005100840683A patent/CN100562803C/en not_active Expired - Fee Related
- 2005-07-12 CN CN200910179767A patent/CN101673049A/en active Pending
- 2005-07-12 KR KR1020050062864A patent/KR100965181B1/en active IP Right Grant
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111367142A (en) * | 2018-12-26 | 2020-07-03 | 聚灿光电科技（宿迁）有限公司 | Novel optical mask plate with different light transmission |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI355080B (en) | 2011-12-21 |
| TW200608579A (en) | 2006-03-01 |
| KR100965181B1 (en) | 2010-06-24 |
| KR20060050099A (en) | 2006-05-19 |
| CN1721988A (en) | 2006-01-18 |
| JP2006030319A (en) | 2006-02-02 |
| CN100562803C (en) | 2009-11-25 |
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