CN101661923A - Electrode base plate of organic light-emitting device - Google Patents
Electrode base plate of organic light-emitting device Download PDFInfo
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- CN101661923A CN101661923A CN200910141684A CN200910141684A CN101661923A CN 101661923 A CN101661923 A CN 101661923A CN 200910141684 A CN200910141684 A CN 200910141684A CN 200910141684 A CN200910141684 A CN 200910141684A CN 101661923 A CN101661923 A CN 101661923A
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Abstract
The invention discloses an electrode base plate of an organic light-emitting device. A wire area structure comprises an electrode layer, an adhesive layer and a wire layer, wherein the wire layer is made of metal silver, silver alloy, mixture containing silver metal, metallic copper, copper alloy, mixture containing copper metal, metallic aluminium, aluminium alloy or mixture containing aluminiummetal. The electrode base plate is characterized in that the adhesive layer contains indium, tin, zinc, nickel or one or more elements of silver, copper and aluminium. The electrode base plate aims atsolving the problem that the adhesion of the low-resistance material and the electrode layer is poor when the low-resistance material is used for the wire layer; and the adhesive layer is arranged between the electrode layer and the wire layer, and the diffusion action leads the three layers to have good adhesion. In addition, after the adhesive layer is used, the surface appearance of the film of the wire layer can be better than that of the film of a single wire layer, thus being incapable of leading the wire layer from releasing from the electrode layer. Simultaneously, the adhesive layerand the wire layer can use same etching liquid; therefore, the manufacturing process is simple.
Description
Technical field
The present invention relates to a kind of electrode base board, relate in particular to a kind of electrode base board of organic light emitting display.
Background technology
Emerging in recent years display of organic electroluminescence (OLED) does not need backlight, the visual angle is big, power is low, its response speed can reach 1000 times of LCD, manufacturing cost but is lower than the LCD of equal resolution, therefore, display of organic electroluminescence (OLED) more and more is subjected to people's attention.
At present, the structure of the employed electrode base board of OLED display screen comprises substrate, electrode layer, conductor layer.The material that is used for substrate has glass, plastics etc.; Electrode layer is positioned on the substrate, and used material has ITO, IZO, ZnO etc., and these materials have characteristic transparent and conduction simultaneously, but these material conductances are not high, and electric current can produce a large amount of Joule heats through out-of-date, the luminous efficiency of influence screen body; Conductor layer is positioned on the electrode layer, is used to reduce the resistance of the resistance of electrode layer, particularly lead district, to improve the efficient of whole screen body.Using more at present, the conductor layer material is refractory metal materials such as chromium, molybdenum.Though these materials are more stable and make simply relatively, because they all have very high resistance, cause the luminous efficiency of display not high.
Therefore, the used material of conductor layer must have lower resistivity.Silver, copper, three kinds of metals of aluminium are very low materials of resistivity in the metal material, and have good ductility, get a good chance of being used for display floater.But adhesion is not strong between these three kinds metal conductor layer films and the electrode layer, particularly after long-time the use, because the heat that the energising back produces and the influence of atmosphere such as the oxygen in the environment, sulphur, the change of film morphology appears easily, make conductor layer come off or separate from electrode layer, and then cause the resistance of substrate to rise the decrease in efficiency of luminescent device.
Summary of the invention
The object of the present invention is to provide a kind of applicating property that can strengthen between conductor layer and the electrode layer that has, be etched easily, and the electrode base board of the organic light emitting display of its etching liquid adhesion layer identical with the conductor layer etching solution.
The objective of the invention is to be achieved by the following technical programs: its conductor section structure comprises electrode layer, conductor layer; Also be provided with adhesion layer between described electrode layer and the conductor layer, the material of described conductor layer is argent, silver alloy, contain the mixture of silver metal, metallic copper, copper alloy, the mixture that contains the copper metal, metallic aluminium, aluminium alloy or contain the mixture of aluminum metal, it is characterized in that, contain one or more elements in indium, tin, zinc, nickel or silver, copper, the aluminium in the described adhesion layer.
The thickness of described adhesion layer is 1nm～20nm.
The thickness of described conductor layer is 100nm～600nm.
The present invention is based on the alloy of silver, copper, aluminum metal or argentiferous, copper, aluminium, when this class low electrical resistant material of mixture is used for conductor layer, propose with this problem of electrode layer tack difference, one deck adhesion layer is set between electrode layer and conductor layer, makes by diffusion to have good adhesive between three layers.In addition, behind the use adhesion layer, the surface topography of conductor layer film can be better than independent conductor layer film, is unlikely to make conductor layer to come off from electrode layer.Adhesion layer, conductor layer can use with a kind of etching solution simultaneously, and manufacturing process is simple.
Description of drawings
Fig. 1 is the structural representation before the embodiment of the invention 1-6 etching;
Fig. 2 is the structural representation after the embodiment of the invention 1-6 etching.
Embodiment
The present invention will be further described below in conjunction with drawings and Examples.
With reference to Fig. 1,2.The organic light-emitting display device electrode substrate of present embodiment comprises the ITO (150nm) that serves as electrode layer 1, adopt the method for sputter that steel, silver-colored mixture target are prepared into adhesion layer 2 (5nm) thereon, prepare silver-colored conductor layer 3 with silver-colored target as sputter, film thickness is 160nm.
It is phosphoric acid that argent conductor layer 3 and indium metal, silver-colored mixture adhesion layer 2 can adopt volume ratio: nitric acid: the etching solution of water=9: 1: 3 carries out the while etching, and etch-rate is 40A/s.It is nitric acid that ITO under it adopts volume ratio: hydrochloric acid: the etching solution of water=1: 10: 10 carries out etching, and etch-rate is 10A/s.By above-mentioned condition, can prepare structure as Fig. 2.Conductor layer 3 surface sides hinder and are 0.1ohm/sq, and heating is 30 minutes under 120 degree, and surface side hinders and is 0.11ohm/sq, and it is good to examine under a microscope film surface appearance, do not have tangible projection and peel off, and present the good stable performance.
With reference to Fig. 1,2.The organic light-emitting display device electrode substrate of present embodiment comprises the ITO (150nm) that serves as electrode layer 1, the method that adopts sputter thereon is prepared into adhesion layer 2 (5nm) with the sn-ag alloy target of stanniferous 2%, prepare silver-colored conductor layer 3 with silver-colored target as sputter, film thickness is 160nm.
It is phosphoric acid that argent conductor layer 3 and metallic tin silver alloy adhesion layer 2 can adopt volume ratio: nitric acid: the etching solution of water=9: 2: 3 carries out the while etching, and etch-rate is 60A/s.It is nitric acid that ITO under it adopts volume ratio: hydrochloric acid: the etching solution of water=1: 10: 10 carries out etching, and etch-rate is 10A/s.By above-mentioned condition, can prepare structure as Fig. 2.Resulting electrode base board sheet resistance is 0.11ohm/sq, and 80 degrees centigrade were heated 30 minutes down, and sheet resistance is 0.12ohm/sq, and resistance variations is less than 15% before and after the heating; Heating is after 1 hour under 200 degrees centigrade, and sheet resistance is 0.16ohm/sq, and it is good to examine under a microscope film surface appearance, does not have tangible projection and peels off, and presents good stable.
With reference to Fig. 1,2.The organic light-emitting display device electrode substrate of present embodiment comprises the IZO (180nm) that serves as electrode layer 1, adopt the method for sputter that zinc, silver-colored mixture target are prepared into adhesion layer 2 (5nm) thereon, prepare silver-colored conductor layer 3 with silver-colored target as sputter, film thickness is 160nm.
It is phosphoric acid that argent conductor layer 3 and metallic zinc, silver-colored mixture adhesion layer 2 can adopt volume ratio: nitric acid: the etching solution of water=9: 3: 4 carries out the while etching, and etch-rate is 50A/s.It is nitric acid that IZO under it adopts volume ratio: hydrochloric acid: the etching solution of water=1: 10: 10 carries out etching, and etch-rate is 20A/s.By above-mentioned condition, can prepare structure as Fig. 2.Resulting electrode base board sheet resistance is 0.11ohm/sq, and 80 degrees centigrade were heated 30 minutes down, and sheet resistance is 0.12ohm/sq, and resistance variations is less than 15% before and after the heating; Heating is after 1 hour under 200 degrees centigrade, and sheet resistance is 0.15ohm/sq, and it is good to examine under a microscope film surface appearance, does not have tangible projection and peels off, and presents good stable.
Embodiment 4
With reference to Fig. 1,2.The organic light-emitting display device electrode substrate of present embodiment comprises the ITO (180nm) that serves as electrode layer 1, and contain 1% nickel therein, adopt the method for sputter to prepare the nickeline mixed layer thereon, prepare silver-colored conductor layer 3 (180nm) with silver-colored target as sputter as adhesion layer 2 (5nm).
It is phosphoric acid that argent conductor layer 3 and metal nickeline mixing adhesion layer 2 can adopt volume ratio: nitric acid: the etching solution of water=8: 2: 3 carries out the while etching, and etch-rate is 50A/s.It is nitric acid that ITO under it adopts volume ratio: hydrochloric acid: the etching solution of water=1: 10: 10 carries out etching, and etch-rate is 10A/s.By above-mentioned condition, can prepare structure as Fig. 2.Resulting electrode base board sheet resistance is 0.11ohm/sq, and 80 degrees centigrade were heated 30 minutes down, and sheet resistance is 0.11ohm/sq, and resistance variations is less than 15% before and after the heating; Heating is after 1 hour under 200 degrees centigrade, and sheet resistance is 0.14ohm/sq, and it is good to examine under a microscope film surface appearance, does not have tangible projection and peels off, and presents good stable.
Embodiment 5
With reference to Fig. 1,2.The organic light-emitting display device electrode substrate of present embodiment comprises the ITO (150nm) that serves as electrode layer 1, adopt the method for sputter that the indium target is prepared into adhesion layer 2 (5nm) thereon, prepare silver alloy conductor layer 3 with the aluminium indium alloy target as sputter that contains 0.5% indium, film thickness is 160nm.
It is phosphoric acid that aluminium indium alloy conductor layer 3 and indium metal adhesion layer 2 can adopt volume ratio: nitric acid: the etching solution of water=8: 1: 3 carries out the while etching, and etch-rate is 30A/s.It is nitric acid that ITO under it adopts volume ratio: hydrochloric acid: the etching solution of water=1: 10: 10 carries out etching, and etch-rate is 10A/s.By above-mentioned condition, can prepare structure as Fig. 2.Conductor layer 3 surface sides resistances is 0.3ohm/sq, 120 ℃ of heating 30 minutes down, surface side resistance is 0.33ohm/sq, it is good to examine under a microscope film surface appearance, do not have significantly protruding with peel off, present the good stable performance.
Embodiment 6
With reference to Fig. 1,2.The organic light-emitting display device electrode substrate of present embodiment comprises the ITO (150nm) that serves as electrode layer 1, adopt the method for sputter that the tin target is prepared into adhesion layer 2 (5nm) thereon, prepare chromium ashbury metal conductor layer 3 with the chromium ashbury metal target as sputter that contains 2% tin, film thickness is 250nm.
It is cerous ammonium nitrate that chromium ashbury metal conductor layer 2 and metallic tin adhesion layer 3 can adopt weight ratio: nitric acid: the etching solution of water=10: 6: 45 carries out the while etching, and etch-rate is 200A/s.It is nitric acid that ITO under it adopts volume ratio: hydrochloric acid: the etching solution of water=1: 10: 10 carries out etching, and etch-rate is 10A/s.By above-mentioned condition, can prepare structure as Fig. 2.Resulting electrode base board sheet resistance is 0.80ohm/sq, and 80 degrees centigrade were heated 30 minutes down, and sheet resistance is 0.85ohm/sq, and resistance variations is less than 15% before and after the heating; Heating is after 1 hour under 200 degrees centigrade, and sheet resistance is 0.88ohm/sq, and it is good to examine under a microscope film surface appearance, does not have tangible projection and peels off, and presents good stable.
About the reason that adhesive force improves, be that the cohesion energy that adheres to energy and main body under the situation of interface disappearance is approaching, reaches maximum because the elements such as tin, zinc, nickel or indium of formation adhesion layer 2 of the present invention are diffused on electrode layer 1ITO or the IZO with denier; On the other hand, elements such as the silver in the adhesion layer 2, copper, aluminium also are diffused on the conductor layer 3 with denier, and under the situation of interface disappearance, the cohesion energy that adheres to energy and main body is approaching, reaches maximum equally.If contain element total in electrode layer 1 and the conductor layer 3 in the adhesion layer 2, for example, contain indium in the adhesion layer 2, electrode layer 1 is ITO, conductor layer 3 is an AI alloy, phosphide element is diffused on the electrode layer 1ITO with denier, and the cohesion energy that adheres to energy and main body under the situation of interface disappearance is approaching, reaches maximum; Phosphide element also is diffused on the conductor layer 3 with denier simultaneously, and under the situation of interface disappearance, the cohesion energy that adheres to energy and main body is approaching, reaches maximum equally.So make and have good adhesive between three layers by diffusion.
Though more than described most preferred embodiment of the present invention, technical scope of the present invention is not limited to the scope of above-mentioned discussion.The above-mentioned embodiment that provides just only is used for further explaining the present invention on the basis of summary of the invention.It should be understood that those skilled in the art can make multiple improvement to said process, but this all class improvement belongs to all in the scope of the present invention also.
Claims (4)
1. the electrode base board of an organic light emitting display, its conductor section structure comprises electrode layer, conductor layer; Also be provided with adhesion layer between described electrode layer and the conductor layer, the material of described conductor layer is argent, silver alloy, contain the mixture of silver metal, metallic copper, copper alloy, the mixture that contains the copper metal, metallic aluminium, aluminium alloy or contain the mixture of aluminum metal, it is characterized in that, contain one or more elements in indium, tin, zinc, nickel or silver, copper, the aluminium in the described adhesion layer.
2. the electrode base board of organic light emitting display according to claim 1 is characterized in that, the thickness of described adhesion layer is 1nm～20nm.
3. the electrode base board of organic light emitting display according to claim 1 is characterized in that, the thickness of described conductor layer is 100nm～600nm.
4. the electrode base board of organic light emitting display according to claim 1 is characterized in that, described adhesion layer, conductor layer are shaped by etching liquid preparation of the same race.
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| CN200910141684A CN101661923A (en) | 2006-11-30 | 2006-11-30 | Electrode base plate of organic light-emitting device |
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| CN200910141684A CN101661923A (en) | 2006-11-30 | 2006-11-30 | Electrode base plate of organic light-emitting device |
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| CN 200610098143 Division CN1964061A (en) | 2006-11-30 | 2006-11-30 | Electrode substrate for organic light-emitting display device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104597632A (en) * | 2015-01-29 | 2015-05-06 | 中国电子科技集团公司第二十六研究所 | Large-aperture acousto-optical device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104597632A (en) * | 2015-01-29 | 2015-05-06 | 中国电子科技集团公司第二十六研究所 | Large-aperture acousto-optical device |
| CN104597632B (en) * | 2015-01-29 | 2017-09-01 | 中国电子科技集团公司第二十六研究所 | Large aperture acousto-optical device |
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Application publication date: 20100303 |