CN101656259A - 影像感测器封装结构、封装方法及相机模组 - Google Patents
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- 239000011521 glass Substances 0.000 claims abstract description 53
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Abstract
本发明涉及一种影像感测器封装结构，其包括具有相对第一表面和第二表面的玻璃基板、设置在所述第一表面上硅层、设置在所述硅层上的感测区和设置在所述第二表面上的彩色滤光单元，所述感测区具有受光面和底面，所述受光面靠近所述玻璃基板以接受透过所述玻璃基板的光线。玻璃基板可以作为影像感测器封装结构的视窗，因此，不需要额外的其它封装。
Description
技术领域
本发明涉及一种半导体技术，特别是涉及一种影像感测器封装结构、影像感测器封装结构的封装方法及相机模组。
背景技术
影像感测器因可以在空间中检测光信号并将其转换为电信号，已经被广泛应用在各种光电产品中，而成为关键零组件之一。
目前，影像感测器封装结构的封装方式大都采用板上芯片封装(COB，chip on board)封装方式，感测器芯片粘结在印刷电路板上，然后用金线将感测器芯片连接到印刷电路板上，再将融化后具有特殊保护功能的有机材料覆盖到感测器芯片上来完成后期封装。
感测器芯片与焊接区在同一平面上，焊区周边均匀分布，由于COB封装方式的焊区是周边分布，所以输入/输出的增长数受到一定限制，特别是它在焊接时采用线焊，实现焊区与印刷电路板焊盘相连接，因此，印刷电路板焊盘应有相应的焊盘数，并也是周边排列，才能与之相适应，所以，印刷电路板制造工艺难度也相对增大。而且，还需要其他的后期封装，使得生产成本较高。
发明内容
有鉴于此，提供一种不需要额外封装的影像感测器封装结构及封装方法实为必要。
本发明还提供一种相机模组。
一种影像感测器封装结构，包括具有相对第一表面和第二表面的玻璃基板、设置在所述第一表面上感测区和设置在所述第二表面上的彩色滤光单元，所述感测区具有受光面和底面，所述受光面靠近所述玻璃基板以接受透过所述玻璃基板的光线。
一种影像感测器封装结构的封装方法，包括：提供玻璃基板，所述玻璃基板具有相对的第一表面和第二表面；在玻璃基板的第一表面上形成硅层；在硅层上形成感测区，所述感测区具有受光面和底面，所述受光面靠近所述玻璃基板；在玻璃基板的第二表面上形成彩色滤光单元。
一种相机模组，包括镜筒、容纳在所述镜筒内的镜片组及固定在所述镜筒一端的影像感测器封装结构，所述影像感测器封装结构包括具有相对第一表面和第二表面的玻璃基板、设置在所述第一表面上的的硅层、设置在所述硅层上的感测区和设置在所述第二表面上的彩色滤光单元，所述彩色滤光单元靠近所述镜筒，所述感测区具有受光面和底面，所述受光面靠近所述玻璃基板以接受透过所述玻璃基板的光线。与现有技术相比，本发明实施例的影像感测器封装结构的玻璃基板可以作为影像感测器封装结构的视窗，因此，不需要额外的其它封装，使得生产成本较低。
附图说明
图1是本发明第一实施例影像感测器封装结构的示意图。
图2是本发明第二实施例影像感测器封装机构封装方法之提供玻璃基板示意图，玻璃基板具有相对的第一表面和第二表面。
图3是在图2中玻璃基板的第一表面上形成感测区的示意图。
图4是在图3中感测区上形成光学单元的示意图。
图5是在图2中玻璃基板的第二表面上形成彩色滤光单元的示意图。
图6是在图5中彩色滤光单元上形成微透镜阵列的示意图。
图7是本发明第三实施例相机模组的示意图。
具体实施方式
下面将结合附图，对本发明实施例进行详细描述。
如图1所示，本发明实施例的影像感测器封装结构10包括玻璃基板11、硅层12、感测区13、反射单元14、彩色滤光单元15及微透镜阵列16。
玻璃基板11的大小可根据具体需要进行选择，其可为派热克斯玻璃(pyrex glass，又名百丽耐热玻璃，由美国康宁公司研发，为耐热玻璃的通用性商标)。玻璃基板11具有相对的第一表面111和第二表面112。
在玻璃基板11的第一表面111上设置有单晶硅层12，其厚度在1微米((m)至10微米之间。通过半导体技术在硅层12上形成阵列分布的感测区13。通过在硅层12中掺杂使得硅层12为p型、需要形成感测区13的区域为n型，从而在硅层12与感测区13之间形成p-n节。
在硅层12上感测区13之间的区域处设置有电极18，第一表面111上硅层12之外的区域设置有焊点17，电极18用来将感测区13与焊点17连接，影像感测器封装结构10通过焊点17与电路板电性相连。
当然，也可以使硅层12为n型、感测区13为p型。
感测区13具有受光面131和底面132，该受光面131靠近玻璃基板11，底面132远离玻璃基板11，受光面131接受透过玻璃基板11的光线，而玻璃基板11还作为影像感测器封装结构10的视窗。
反射单元14设置在感测区13的底面132上，透过感测区13的光线被反射单元15反射会聚到感测区13以增加感测区13的受光能力与光感度。反射单元14可由光阻剂所形成。
玻璃基板11的第二表面112上对应感测区13的位置处设置彩色滤光单元15。彩色滤光单元15包括规则排列的红颜色层151、绿颜色层152及蓝颜色层153。
彩色滤光单元15上设置有微透镜阵列16。微透镜阵列14可由光阻剂所形成。
由于感测区13被反射单元14所覆盖，所以感测区13不会受到灰尘、其他脏物的污染。另外，玻璃基板11可以作为影像感测器封装结构10的视窗，因此，不需要额外的其它封装。
请参阅图2至图6，其为影像感测器封装结构10之封装方法示意图。
如图2所示，提供玻璃基板11，其可为pyrex玻璃。玻璃基板11具有相对的第一表面111和第二表面112。
如图3所示，在玻璃基板11的第一表面111上形成单晶硅层12，然后在硅层12上通过半导体技术形成感测区13，感测区13呈矩阵分布。如，在硅层12中掺杂使得硅层12为p型、需要形成感测区13的区域为n型，从而在硅层12与感测区13之间形成p-n节。
在硅层12上除感测区13之外的区域处设置电极18。
如图4所示，在硅层12及感测区13上涂布光阻剂，保留感测区13上的光阻剂而除去其它区域的光阻剂以形成反射单元14。
如图5所示，在第二表面112上通过溅镀、喷墨等方法形成规则排列的红颜色层151、绿颜色层152及蓝颜色层153，从而形成彩色滤光单元15。
如图6所示，在彩色滤光单元15上形成微透镜阵列16。
请再次参阅图1，在第一表面111上硅层12之外的区域设置焊点17，然后将电极18与焊点17相连，使得影像感测器封装结构10可与电路板电性相联。
如图7所示，本发明第三实施例的相机模组22包括镜筒21、镜片组22及影像感测器封装结构10。
镜片组22容纳在镜筒21中，影像感测器封装结构10固定在镜筒21的一端，且感测区13远离镜筒21。
光线通过镜片组22，入射到影像感测器封装结构10的微透镜阵列16、彩色滤光片15上，然后穿过玻璃基板11，成像在感测区13，透过感测区13的光线被反射单元15反射再次会聚到感测区13。
另外，对于本领域的普通技术人员来说，可以根据本发明的技术方案和技术构思做出其他各种相应的变化，而所有这些变化都应属于本发明权利要求的保护范围。
Claims (12)
1.一种影像感测器封装结构，其特征在于：包括具有相对第一表面和第二表面的玻璃基板、设置在所述第一表面上的硅层、设置在所述硅层上的感测区和设置在所述第二表面上的彩色滤光单元，所述感测区具有受光面和底面，所述受光面靠近所述玻璃基板以接受透过所述玻璃基板的光线。
2.如权利要求1所述的影像感测器封装结构，其特征在于：所述底面上设置有反射单元。
3.如权利要求1所述的影像感测器封装结构，其特征在于：所述彩色滤光单元包括规则排布的红颜色层、绿颜色层及蓝颜色层。
4.如权利要求1至3任一项所述的影像感测器封装结构，其特征在于：所述彩色滤光单元上设置有微透镜阵列，所述彩色滤光单元位于所述玻璃基板与所述微透镜阵列之间。
5.一种相机模组，包括镜筒、容纳在所述镜筒内的镜片组及固定在所述镜筒一端的影像感测器封装结构，其特征在于：所述影像感测器封装结构包括具有相对第一表面和第二表面的玻璃基板、设置在所述第一表面上的的硅层、设置在所述硅层上的感测区和设置在所述第二表面上的彩色滤光单元，所述彩色滤光单元靠近所述镜筒，所述感测区具有受光面和底面，所述受光面靠近所述玻璃基板以接受透过所述玻璃基板的光线。
6.如权利要求5所述的相机模组，其特征在于：所述底面上设置有反射单元。
7.如权利要求5所述的相机模组，其特征在于：所述彩色滤光单元上设置有微透镜阵列，所述彩色滤光单元位于所述玻璃基板与所述微透镜阵列之间。
8.一种影像感测器封装结构的封装方法，包括：
提供玻璃基板，所述玻璃基板具有相对的第一表面和第二表面；
在玻璃基板的第一表面上形成硅层；
在硅层上形成感测区，所述感测区具有受光面和底面，所述受光面靠近所述玻璃基板在玻璃基板的第二表面上形成彩色滤光单元。
9.如权利要求8所述的影像感测器封装结构的封装方法，其特征在于：进一步包括在所述底面上形成反射单元之步骤。
10.如权利要求8所述的影像感测器封装结构的封装方法，其特征在于：进一步包括在所述彩色滤光单元上形成微透镜阵列之步骤。
11.如权利要求8至10任一项所述的影像感测器封装结构的封装方法，其特征在于：进一步包括在非感测区形成电极之步骤。
12.如权利要求11所述的影像感测器封装结构的封装方法，其特征在于：进一步包括在所述玻璃基板上形成焊点的步骤。
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| KR20150023907A (ko) | 2012-06-28 | 2015-03-05 | 펠리칸 이매징 코포레이션 | 결함있는 카메라 어레이들, 광학 어레이들 및 센서들을 검출하기 위한 시스템들 및 방법들 |
| US20140002674A1 (en) | 2012-06-30 | 2014-01-02 | Pelican Imaging Corporation | Systems and Methods for Manufacturing Camera Modules Using Active Alignment of Lens Stack Arrays and Sensors |
| CN107346061B (zh) | 2012-08-21 | 2020-04-24 | 快图有限公司 | 用于使用阵列照相机捕捉的图像中的视差检测和校正的系统和方法 |
| WO2014032020A2 (en) | 2012-08-23 | 2014-02-27 | Pelican Imaging Corporation | Feature based high resolution motion estimation from low resolution images captured using an array source |
| EP2901671A4 (en) | 2012-09-28 | 2016-08-24 | Pelican Imaging Corp | CREATING IMAGES FROM LIGHT FIELDS USING VIRTUAL POINTS OF VIEW |
| US9143711B2 (en) | 2012-11-13 | 2015-09-22 | Pelican Imaging Corporation | Systems and methods for array camera focal plane control |
| WO2014130849A1 (en) | 2013-02-21 | 2014-08-28 | Pelican Imaging Corporation | Generating compressed light field representation data |
| US9374512B2 (en) | 2013-02-24 | 2016-06-21 | Pelican Imaging Corporation | Thin form factor computational array cameras and modular array cameras |
| WO2014138697A1 (en) | 2013-03-08 | 2014-09-12 | Pelican Imaging Corporation | Systems and methods for high dynamic range imaging using array cameras |
| US8866912B2 (en) | 2013-03-10 | 2014-10-21 | Pelican Imaging Corporation | System and methods for calibration of an array camera using a single captured image |
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| US9578259B2 (en) | 2013-03-14 | 2017-02-21 | Fotonation Cayman Limited | Systems and methods for reducing motion blur in images or video in ultra low light with array cameras |
| US9100586B2 (en) | 2013-03-14 | 2015-08-04 | Pelican Imaging Corporation | Systems and methods for photometric normalization in array cameras |
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| US10122993B2 (en) | 2013-03-15 | 2018-11-06 | Fotonation Limited | Autofocus system for a conventional camera that uses depth information from an array camera |
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| EP3075140B1 (en) | 2013-11-26 | 2018-06-13 | FotoNation Cayman Limited | Array camera configurations incorporating multiple constituent array cameras |
| US10089740B2 (en) | 2014-03-07 | 2018-10-02 | Fotonation Limited | System and methods for depth regularization and semiautomatic interactive matting using RGB-D images |
| US9521319B2 (en) * | 2014-06-18 | 2016-12-13 | Pelican Imaging Corporation | Array cameras and array camera modules including spectral filters disposed outside of a constituent image sensor |
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| US9942474B2 (en) | 2015-04-17 | 2018-04-10 | Fotonation Cayman Limited | Systems and methods for performing high speed video capture and depth estimation using array cameras |
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| TWI600321B (zh) | 2016-12-13 | 2017-09-21 | 財團法人工業技術研究院 | 複合陣列相機鏡頭模組 |
| US10482618B2 (en) | 2017-08-21 | 2019-11-19 | Fotonation Limited | Systems and methods for hybrid depth regularization |
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| WO2021154459A1 (en) | 2020-01-30 | 2021-08-05 | Boston Polarimetrics, Inc. | Systems and methods for synthesizing data for training statistical models on different imaging modalities including polarized images |
| US11953700B2 (en) | 2020-05-27 | 2024-04-09 | Intrinsic Innovation Llc | Multi-aperture polarization optical systems using beam splitters |
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| US11290658B1 (en) | 2021-04-15 | 2022-03-29 | Boston Polarimetrics, Inc. | Systems and methods for camera exposure control |
| US11689813B2 (en) | 2021-07-01 | 2023-06-27 | Intrinsic Innovation Llc | Systems and methods for high dynamic range imaging using crossed polarizers |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6429036B1 (en) * | 1999-01-14 | 2002-08-06 | Micron Technology, Inc. | Backside illumination of CMOS image sensor |
| JP4318007B2 (ja) * | 1999-10-07 | 2009-08-19 | 富士フイルム株式会社 | 固体撮像素子 |
| JP2006126652A (ja) * | 2004-10-29 | 2006-05-18 | Canon Inc | 撮像装置 |
| JP2007311454A (ja) * | 2006-05-17 | 2007-11-29 | Sony Corp | 固体撮像装置 |
| US7888159B2 (en) * | 2006-10-26 | 2011-02-15 | Omnivision Technologies, Inc. | Image sensor having curved micro-mirrors over the sensing photodiode and method for fabricating |
-
2008
- 2008-08-20 CN CN200810304077.2A patent/CN101656259A/zh active Pending
-
2009
- 2009-05-17 US US12/467,295 patent/US20100044815A1/en not_active Abandoned
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105097854A (zh) * | 2014-05-12 | 2015-11-25 | 原相科技股份有限公司 | 具有改良光吸收效率的前感光式半导体结构及其制作方法 |
| CN107360347A (zh) * | 2016-05-09 | 2017-11-17 | 富港电子（东莞）有限公司 | 影像模组结构 |
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