CN101640125B - Encapsulating method of colour loop inductance product - Google Patents
Encapsulating method of colour loop inductance product Download PDFInfo
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- CN101640125B CN101640125B CN2009100410537A CN200910041053A CN101640125B CN 101640125 B CN101640125 B CN 101640125B CN 2009100410537 A CN2009100410537 A CN 2009100410537A CN 200910041053 A CN200910041053 A CN 200910041053A CN 101640125 B CN101640125 B CN 101640125B
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- lacquer
- loop inductance
- encapsulating method
- colour loop
- inductance product
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Abstract
The invention discloses an encapsulating method of colour loop inductance product, including the step that repeated encapsulating and curing are carried out on magnetic core stack by ultraviolet light curing paint UV paint, wherein the magnetic core stack is divided into a body in the middle and groove shape baffle ends with a lead at the two ends of the body, the body is wound with an enameled wire, the initial end of the enameled wire is respectively connected with the leads at the two ends, and complete encapsulating processing is carried out on the groove shape baffle ends at the two ends of the body by the UV paint in a primary encapsulating. The initial end of the enameled wire is respectively welded on the leads at the two ends of the body, and the UV paint also encapsulates a welding spot. The method can reduce pinhole on an encapsulating layer and improve tensile strength of the enameled wire at the welding point.
Description
Technical field
The present invention relates to a kind of encapsulating method of lead type electronic devices and components, relate in particular to a kind of encapsulating method of colour loop inductance product.
Background technology
The encapsulating process overwhelming majority of present domestic colour coding inductor product all is: carry out 2 road UV glue earlier and seal, and then carry out enamel-cover envelope outside 3 roads.This technological development time is longer, and technology is comparatively ripe, but has following two weak points: the technology that can eliminate them is not found all the time for the pin hole that occurs in the encapsulation process, bubble phenomenon in (1).(2) product is in the client during clubfoot moulding (particularly the clubfoot pin is apart from more in short-term), solder joint place enamelled wire because of stressed disconnected easily occurs opening a way bad.
Existing process characteristic:
(1) sealing effect receives site environment to influence greatly the influence of particularly on-the-spot temperature dilution.Transition period in season (like the April and the November in every year), the pin hole that encapsulation process occurs, bubble rate are up to 3%, and production efficiency is low, and loss is big;
(2) the non-halogen propelling of coating makes and seals before effect is not so good as, and pin hole and bubble rate increase;
(3) solder joint of quite a few product is not sealed by UV glue fully, and the tensile strength of solder joint place enamelled wire is on the low side.
Summary of the invention
The technical problem that the present invention need solve provides the encapsulating method of colour loop inductance product that a kind ofly reduces the encapsulated layer pinhole number, increases the tensile strength of solder joint place enamelled wire.
The technical problem that the present invention will solve realizes through following technical scheme: a kind of encapsulating method of colour loop inductance product; Comprise with UV paint magnetic core array is sealed and step of curing repeatedly; The groove shaped baffle plate end of body in the middle of said magnetic core array is divided into and body two ends band lead-in wire; Twine enamelled wire on the described body; The initiating terminal of enamelled wire links to each other with the lead-in wire at two ends respectively, when sealing for the first time, with the UV lacquer body two ends groove shaped baffle plate end is sealed processing completely.
Further: at the encapsulating method of above-mentioned colour loop inductance product, the initiating terminal of enamelled wire is welded on respectively on the lead-in wire at two ends, and the UV lacquer has also been sealed solder joint.Also be added with rare dose in the described UV lacquer, UV coats with lacquer and rare dose percentage by weight is 100: 1-3.It is epoxy acrylate 33wt%, glycol diacrylate 36wt%, phenyl-phosphonite diethylester 20% that described UV lacquer weight percent is formed, and surplus is a hexanediyl ester.Described rare dose is in xylenes, butanols, acetone, the polyurethane one or more.This UV lacquer has if any characteristics:
1, penetration is strong: because the colour coding inductor product is wound on the magnetic core with enamelled wire; Form a lot of gaps between the enamelled wire coil; Have only the strong UV lacquer of penetration just can be seeped in these gaps; And drive the air of its intermediate gap away, can avoid so just that residual air forms pin hole, bubble at the UV lacquer with painting the setting up period expanded by heating outward in the gap.
2, good fluidity: because spiral welding article are under the situation of rolling under the drive of sprocket, it to be carried out UV to seal; And curing time lack very much (about 15s); So need the UV of good fluidity; Thereby form the good and ganoid encapsulated layer of compactness, lay the foundation for forming the measured external coating of matter.
3, shrinkage is little: shrinkage is an important indicator of liquid envelope material, shrinkage is bigger than normal seal be prone to after material solidifies pin hole with seal inhomogeneous grade seal bad, so need the little UV of shrinkage;
4, approaching with the thermal coefficient of expansion of magnetic core, enamelled wire and outer japanning: general UV adhesive curing temperature is about 160 ℃, and the curing temperature of painting outward is about 175 ℃, so different materials wants good combination to need thermal coefficient of expansion separately quite approaching together;
5, tensile strength is big: colour coding inductor product tensile strength depends primarily on spiral welding article tensile strength and UV glue tensile strength, under the situation of set spiral welding article tensile strength, uses the big UV glue of tensile strength can increase the tensile strength of finished product.
Further again: as in the encapsulating method of above-mentioned colour loop inductance product, to comprise also with outer lacquer and curing agent and sealing repeatedly and step of curing that the percentage by weight of described outer lacquer and curing agent is 100: 30.It is bisphenol A epoxide resin 70%, %, titanium white powder 5%, diglycidyl ether 14.5%, antifoaming agent 0.5% that the weight percent of described outer lacquer is formed; Described mill base and antifoaming agent are art technology materials commonly used, produce the special-purpose epoxy insulation of a large amount of magnet rings like new day rising sun Electron Material Co., Ltd of Jiangmen city Xinhui District and seal lacquer.The percentage by weight of described curing agent is phenmethylol 15%, hexylene glycol monobutyl ether 15%, n-butanol 25%, xylenes 25%, hexone 20%.Temperature when described UV lacquer is sealed with outer lacquer and curing agent repeatedly is 25 ± 5 ℃, and humidity is 50 ± 5%RH.Main lacquer and curing agent require as follows:
1.. outward appearance is good: solution should be fine and smooth, glossy, do not allow to exist impurity, corase particles or caking phenomenon; Surperficial free from admixture, spot after the product packaging, smooth in appearance is glossy, does not have bad phenomenon such as bubble, crack or cracking;
2.. adjustable property: solution does not allow to occur granule, and is easy to stir, and viscosity changes should be evenly, stablize;
3.. but application property: viscosity is suitable, and flowing at capacitor surface should be suitable, and sealing should be full; Solid content is suitable, and upward the inductor of full japanning also should be full after solidifying; Can be under conventional condition of cure completion of cure;
4.. thermal endurance: after sealing the product pin was immersed in the tin liquor of 270 ± 5 ℃ of tin temperature after 10 ± 0.5 seconds, the product packaging film should not have obvious damage and ruckbildung;
Compared with prior art; The present invention adopts existing technology, but when the first time, the UV enamel-cover sealed, the UV lacquer only applied the part enamelled wire and the solder joint at magnetic core baffle plate and edge thereof; To fill and lead up and drive residual air wherein away near the enamelled wire recess at magnetic core two side guard places; Avoid the pin hole rate being controlled near 3 ‰, enhance productivity and reduce the manufacturing loss because of the residual air expanded by heating forms pin hole.Can increase the tensile strength of solder joint place enamelled wire, avoid product in the customers' place because of the stressed open circuit bad phenomenon that occurs of clubfoot moulding process.Change the former technology UV first time and seal the position, improved greatly and sealed effect.Sealing bad phenomenon such as glossy, its bubble of back smooth in appearance, pin hole, crack or cracking reduces greatly.
Description of drawings
Fig. 1 is original encapsulating method, the product structure sketch map when applying for the first time the UV lacquer;
Product structure sketch map when Fig. 2 applies the UV lacquer for the first time for the present invention.
Wherein, 1 body, 2 lead-in wires, 3 baffle plate ends, 4 solder joints, 5 enamelled wires, 6 bonding agents, 7UV enamelled coating
Embodiment
The present invention adopts existing technology, but the first time UV enamel-cover envelope be part enamelled wire and the solder joint that UV only applies magnetic core baffle plate and edge thereof, so the investment of invention is less.Owing to only need on the encapsulating process basis of original colour coding inductor product, to improve, promptly the japanning equipment of the first road UV glue is done certain technological transformation and just can realize, so technology is prone to realize.Below in conjunction with embodiment content of the present invention is done further to detail, mentioned content is not to qualification of the present invention among the embodiment, and temperature, time and material chosen can be suited measures to local conditions and the result is not had substantial effect among the preparation method.
With reference to Fig. 1; A kind of encapsulating method of colour loop inductance product comprises with ultraviolet light polymerization lacquer UV magnetic core array is sealed and step of curing repeatedly, the groove shaped baffle plate end 3 of body 1 in the middle of said magnetic core array is divided into and body two ends band lead-in wire 2; Twine enamelled wire 5 on the described body 1; The initiating terminal of enamelled wire 5 links to each other with the lead-in wire at two ends respectively, and with UV lacquer to whole magnetic core array completely seal processing when sealing the said first time.At the bottom of groove, also fix with will go between 2 terminal of bonding agent 6.The outer full coat of whole magnetic core array has covered one deck UV enamelled coating 7.But this process solder joint place enamelled wire easily disconnectedly occurs opening a way bad because of stressed, and bubble appears in whole encapsulated layer easily.
With reference to Fig. 2; A kind of encapsulating method of colour loop inductance product comprises with ultraviolet light polymerization lacquer UV magnetic core array is sealed and step of curing repeatedly, the groove shaped baffle plate end 3 of body 1 in the middle of said magnetic core array is divided into and body two ends band lead-in wire 2; Twine enamelled wire 5 on the described body 1; The initiating terminal of enamelled wire 5 links to each other with the lead-in wire 2 at two ends respectively, and with UV lacquer to body two ends groove shaped baffle plate end 3 completely seal processing when sealing the said first time.At the bottom of groove, also fix with will go between 2 terminal of bonding agent 6.The initiating terminal of enamelled wire 5 links to each other with the lead-in wire at two ends through solder joint 4 respectively, and the UV lacquer has also been sealed solder joint 4.When promptly sealing for the first time with the UV enamel-cover, its body 1 and on enamelled wire 5 do not sealed.Comprise also in this encapsulating method also and sealing repeatedly and step of curing that the percentage by weight of described outer lacquer and curing agent is 100: 30 with outer lacquer and curing agent.
Embodiment
First test: select a temperature (T) near 25 ℃ weather, keep humidity RH (about 50%) and main lacquer and curing agent ratio (100: 30), observe the effect of sealing with UV glue and diluent ratio variation, table one is experiment condition and result.
Table 1
Second test: keep humidity RH (about 50%) and main lacquer and curing agent ratio (100: 30), observation correspondingly adjust with variations in temperature UV glue and diluent ratio to seal effect as shown in table 2:
Table 2
More than two experiments show: for the effect of sealing that obtains, fibrous root correspondingly changes UV glue and diluent ratio according to scene temperature, and under the constant situation of other conditions, confirm following optimum temperature and corresponding UV glue thereof: diluent ratio is as shown in table 3
Table 3
| UV lacquer: diluent | 100∶0 | 100∶0.4 | 100∶1 |
| Scene temperature T (℃) | 22～24 | 25～28 | 29～34 |
It is epoxy acrylate 33wt%, glycol diacrylate 36wt%, phenyl-phosphonite diethylester 20% that above-mentioned UV lacquer weight percent is formed, and surplus is a hexanediyl ester.Described rare dose is in xylenes, butanols, acetone, the polyurethane one or more.Comprise also with outer lacquer and curing agent and sealing repeatedly and step of curing that it is bisphenol A epoxide resin 70%, mill base %, titanium white powder 5%, diglycidyl ether 14.5%, antifoaming agent 0.5% that the weight percent of above-mentioned outer lacquer is formed.Such material is the material that those skilled in the art use always.The percentage by weight of described curing agent is phenmethylol 15%, hexylene glycol monobutyl ether 15%, n-butanol 25%, xylenes 25%, hexone 20%.
Claims (8)
1. the encapsulating method of a colour loop inductance product; Comprise with UV paint magnetic core array is sealed and step of curing repeatedly; The groove shaped baffle plate end (3) of body (1) in the middle of said magnetic core array is divided into and body two ends band lead-in wire (2); Described body (1) is gone up and is twined enamelled wire, and the initiating terminal of enamelled wire links to each other with the lead-in wire (2) at two ends respectively, it is characterized in that: when sealing for the first time; With UV lacquer body two ends groove shaped baffle plate ends (3) are sealed processing completely, body (1) and on enamelled wire (5) do not sealed;
It is epoxy acrylate 33wt%, glycol diacrylate 36wt%, phenyl-phosphonite diethylester 20% that described UV lacquer weight percent is formed, and surplus is a hexanediyl ester.
2. the encapsulating method of colour loop inductance product according to claim 1, it is characterized in that: the initiating terminal of enamelled wire is welded on respectively on the lead-in wire at two ends, and the UV lacquer has also been sealed solder joint (4).
3. the encapsulating method of colour loop inductance product according to claim 2 is characterized in that: also be added with rare dose in the described UV lacquer, the percentage by weight of UV lacquer and rare dose is 100: 1-3.
4. the encapsulating method of colour loop inductance product according to claim 3 is characterized in that: described rare dose is in xylenes, butanols, acetone, the polyurethane one or more.
5. the encapsulating method of colour loop inductance product according to claim 1 is characterized in that: comprise also with outer lacquer and curing agent and sealing repeatedly and step of curing that the percentage by weight of described outer lacquer and curing agent is 100: 30.
6. the encapsulating method of colour loop inductance product according to claim 5 is characterized in that: it is bisphenol A epoxide resin 70%, mill base 10%, titanium white powder 5%, diglycidyl ether 14.5%, antifoaming agent 0.5% that the weight percent of described outer lacquer is formed.
7. the encapsulating method of colour loop inductance product according to claim 6, it is characterized in that: the percentage by weight of described curing agent is phenmethylol 15%, hexylene glycol monobutyl ether 15%, n-butanol 25%, xylenes 25%, hexone 20%.
8. according to the encapsulating method of each described colour loop inductance product of claim 5-7, it is characterized in that: the temperature when described UV lacquer is sealed with outer lacquer and curing agent repeatedly is 25 ± 5 ℃, and humidity is 50 ± 5%RH.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100410537A CN101640125B (en) | 2009-07-09 | 2009-07-09 | Encapsulating method of colour loop inductance product |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009100410537A CN101640125B (en) | 2009-07-09 | 2009-07-09 | Encapsulating method of colour loop inductance product |
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| CN101640125A CN101640125A (en) | 2010-02-03 |
| CN101640125B true CN101640125B (en) | 2012-01-11 |
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| CN2009100410537A Expired - Fee Related CN101640125B (en) | 2009-07-09 | 2009-07-09 | Encapsulating method of colour loop inductance product |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112478273A (en) * | 2021-01-06 | 2021-03-12 | 南京利莱贝贸易有限公司 | Relay packaging equipment with protective pins for improving film utilization rate |
| CN113249034B (en) * | 2021-05-10 | 2022-07-01 | 广东风华高新科技股份有限公司 | Film covering agent and application thereof |
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Granted publication date: 20120111 |