CN105086853B - Photovoltaic module fluid sealant and preparation method thereof - Google Patents
Photovoltaic module fluid sealant and preparation method thereof Download PDFInfo
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- CN105086853B CN105086853B CN201510606312.1A CN201510606312A CN105086853B CN 105086853 B CN105086853 B CN 105086853B CN 201510606312 A CN201510606312 A CN 201510606312A CN 105086853 B CN105086853 B CN 105086853B
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- 239000000565 sealant Substances 0.000 title claims abstract description 38
- 239000012530 fluid Substances 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 10
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims abstract description 30
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 claims abstract description 20
- 239000003822 epoxy resin Substances 0.000 claims abstract description 19
- 229940018564 m-phenylenediamine Drugs 0.000 claims abstract description 19
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 19
- 239000002994 raw material Substances 0.000 claims abstract description 18
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 claims abstract description 15
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical group O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229920001021 polysulfide Polymers 0.000 claims abstract description 15
- 239000005077 polysulfide Substances 0.000 claims abstract description 15
- 150000008117 polysulfides Polymers 0.000 claims abstract description 15
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical group [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 claims abstract description 15
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 claims abstract description 13
- DGXAGETVRDOQFP-UHFFFAOYSA-N 2,6-dihydroxybenzaldehyde Chemical compound OC1=CC=CC(O)=C1C=O DGXAGETVRDOQFP-UHFFFAOYSA-N 0.000 claims abstract description 11
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical group O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229920005989 resin Polymers 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 11
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical group NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 claims abstract description 10
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical group C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 claims abstract description 9
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 claims description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 5
- UWFRVQVNYNPBEF-UHFFFAOYSA-N 1-(2,4-dimethylphenyl)propan-1-one Chemical compound CCC(=O)C1=CC=C(C)C=C1C UWFRVQVNYNPBEF-UHFFFAOYSA-N 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- 229910052757 nitrogen Inorganic materials 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 238000010792 warming Methods 0.000 claims description 4
- 150000001412 amines Chemical group 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims 4
- 239000004593 Epoxy Substances 0.000 claims 2
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 2
- 239000000843 powder Substances 0.000 claims 2
- 229910052623 talc Inorganic materials 0.000 claims 2
- 235000012222 talc Nutrition 0.000 claims 2
- 239000000454 talc Substances 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 7
- 230000008595 infiltration Effects 0.000 abstract description 3
- 238000001764 infiltration Methods 0.000 abstract description 3
- 230000007774 longterm Effects 0.000 abstract description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 230000032683 aging Effects 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 238000003483 aging Methods 0.000 description 3
- -1 651 Versamids Chemical compound 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 150000001408 amides Chemical group 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 235000009508 confectionery Nutrition 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000001033 ether group Chemical group 0.000 description 2
- 235000013312 flour Nutrition 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229920001610 polycaprolactone Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 239000013535 sea water Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- POAXRNROGRXJKW-UHFFFAOYSA-N C(CCC)OC(=O)CCCC.C1=CC=CC=C1 Chemical group C(CCC)OC(=O)CCCC.C1=CC=CC=C1 POAXRNROGRXJKW-UHFFFAOYSA-N 0.000 description 1
- 239000004425 Makrolon Substances 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 210000003739 neck Anatomy 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Sealing Material Composition (AREA)
- Photovoltaic Devices (AREA)
Abstract
Invention belongs to fluid sealant technical field, is related to photovoltaic module fluid sealant, it is characterised in that by weight, it is made by following raw material：51 epoxy resin of E：100 parts, 201 polysulfide rubber：15 parts, m-phenylene diamine (MPD)：10 parts, dibutyl phthalate (DBP)：10 parts, diethylenetriamine：1 part, talcum powder：30 parts, maleic anhydride：10 parts, 651 Versamids：15 parts, stannous octoate：4 parts, propylene oxide phenyl ether or resorcinolformaldehyde resin or ethylene glycol diglycidylether：20 parts.Present invention further teaches preparation methods.The present invention has following main advantageous effect：Easy to operate, hardening time is short, and adhesiveness is good；Steam and gas infiltration are low, and leakproofness/weather-proof/anti-ultraviolet property is good；Applicable temperature range is wide；Keep long-term behaviour.
Description
The application is entitled：Photovoltaic module fluid sealant and preparation method thereof, application No. is：201410451406.1、
The divisional application for the patent of invention that the applying date is on 09 07th, 2014.
Technical field
The invention belongs to fluid sealant technical fields, and more particularly, to photovoltaic module fluid sealant and preparation method thereof, this is close
Sealing is mainly used for the sealing of solar cell module.
Background technology
With the continuous improvement of environmentally protective solar photoelectric conversion ratio, the demand of solar photovoltaic assembly is got in market
Come bigger, assembly collection between solar photovoltaic assembly achievement seems of crucial importance, common two-component condensation in the prior art
It is integrated to be not applied for the solar photovoltaic assembly assembly for having special strict demand to bonding, ageing-resistant etc. for type fluid sealant
In.Existing two-component condensation fluid sealant in terms of ageing-resistant, UV resistant, bonding and flame retardant property there are larger defect,
It is not suitable for photovoltaic component seal gum field and the field more demanding to bonding.
Currently used in the market is common single-component organic silicon photovoltaic fluid sealant；The major defect of the glue is solid
Change needs certain time length of about 24 hours, and sealing performance is not perfect, has certain corrosiveness to metal.
Invention content
To solve the above-mentioned problems, an object of the present invention is to disclose a kind of novel photovoltaic module fluid sealant, into
And the present invention will also disclose the preparation method of the fluid sealant；They are realized using following technical scheme.
Photovoltaic module fluid sealant, it is characterised in that by weight, it is made by following raw material：E-
51 epoxy resin：100 parts, 201 polysulfide rubber：15~25 parts, m-phenylene diamine (MPD)：10~15 parts, dibutyl phthalate：10~
20 parts, diethylenetriamine：1~3 part, talcum powder：30~50 parts, maleic anhydride：10~15 parts, 651 Versamids：
15~20 parts, stannous octoate：4~6 parts, propylene oxide phenyl ether or resorcinolformaldehyde resin or ethylene glycol two shrink sweet
Oily ether：20~30 parts.
The present invention most preferred embodiment be：Photovoltaic module fluid sealant, it is characterised in that by weight, it be by
What following raw material were made：E-51 epoxy resin：100 parts, 201 polysulfide rubber：20 parts, m-phenylene diamine (MPD)：13 parts, adjacent benzene
Dibutyl carboxylic acid：15 parts, diethylenetriamine：2 parts, talcum powder：40 parts, maleic anhydride：13 parts, 651 low molecule polyamides
Amine：18 parts, stannous octoate：5 parts, propylene oxide phenyl ether or resorcinolformaldehyde resin or ethylene glycol diglycidyl
Ether：25 parts.
The present invention the second preferred embodiment be：Photovoltaic module fluid sealant, it is characterised in that by weight, it is
It is made by following raw material：E-51 epoxy resin：100 parts, 201 polysulfide rubber：15 parts, m-phenylene diamine (MPD)：10 parts, neighbour
Dibatyl phithalate：10 parts, diethylenetriamine：1 part, talcum powder：30 parts, maleic anhydride：10 parts, 651 low molecular weight polycaprolactones
Amide：15 parts, stannous octoate：4 parts, propylene oxide phenyl ether or resorcinolformaldehyde resin or ethylene glycol diglycidyl
Ether：20 parts.
The present invention third preferred embodiment be：Photovoltaic module fluid sealant, it is characterised in that by weight, it is
It is made by following raw material：E-51 epoxy resin：100 parts, 201 polysulfide rubber：25 parts, m-phenylene diamine (MPD)：15 parts, neighbour
Dibatyl phithalate：20 parts, diethylenetriamine：3 parts, talcum powder：50 parts, maleic anhydride：15 parts, 651 low molecular weight polycaprolactones
Amide：20 parts, stannous octoate：6 parts, propylene oxide phenyl ether or resorcinolformaldehyde resin or ethylene glycol diglycidyl
Ether：30 parts.
The preparation method of photovoltaic module fluid sealant, it is characterised in that it is comprised the steps of：
The first step：Each raw material are weighed by weight, and are individually stored, based on the weight of E-51 epoxy resin,
Its raw material weighs after being converted；
Second step：The m-phenylene diamine (MPD) obtained in the first step is melted, E-51 epoxy resin, which is added, and is stirred continuously keeps it molten
It is integrated, forms melt；
Third walks：By 201 polysulfide rubber weighed in the first step, dibutyl phthalate, diethylenetriamine, cunning
Mountain flour, maleic anhydride, 651 Versamids, stannous octoate sequentially add in the melt in second step, and being stirred continuously makes
It is uniformly mixed, insulated and stirred 2~4 hours after being warming up to 115~125 DEG C, and propylene oxide phenyl ether or isophthalic two is then added
Phenol diglycidyl ether or ethylene glycol diglycidylether are diluted and stir evenly, then it is evacuated to -0.03~-
0.07Mpa, quantitative package is up to photovoltaic module fluid sealant finished product after being passed through nitrogen to normal pressure after cooling.
The present invention has the advantageous effects such as the equipment that production method is simple, needs is cheap, Production Time is short, power consumption is low.
The photovoltaic module fluid sealant of the present invention, when in use, when curing longest when the thickness of coating is 6mm, at 80 DEG C
Between be at 3.5 hours, 130 DEG C cure maximum duration be 2 hours；The fluid sealant temperature in use use scope -70~+80 of the present invention
℃；There is stable chemical property, water-fast, seawater and oil, colloid not to corrode to aluminum material for it, be especially suitable for aluminium alloy type
In solar components plate.
The fluid sealant of the present invention has following main advantageous effect：Easy to operate, hardening time is short, to aluminium, glass, connects
Wire box plastics have good adhesiveness；With vibrationproof and fixed effect, the damage of panel and component in transportational process can avoid
It is bad；Extremely low steam and gas infiltration, good seal performance；Weather resistance is good；There is higher ultraviolet light resistance, and can be very
It is used within the scope of wide temperature；It is applicable in the sealant of various thickness；It is not influenced by frame and plate thickness；Non-conductive and permission
It is in direct contact with conductor, keeps long-term behaviour.
Specific implementation mode
Embodiment 1
Photovoltaic module fluid sealant, it is characterised in that by weight, it is made by following raw material：E-
51 epoxy resin：100 parts, 201 polysulfide rubber：15~25 parts, m-phenylene diamine (MPD)：10~15 parts, dibutyl phthalate：10~
20 parts, diethylenetriamine：1~3 part, talcum powder：30~50 parts, maleic anhydride：10~15 parts, 651 Versamids：
15~20 parts, stannous octoate：4~6 parts, propylene oxide phenyl ether or resorcinolformaldehyde resin or ethylene glycol two shrink sweet
Oily ether：20~30 parts.
Embodiment 2
Photovoltaic module fluid sealant, it is characterised in that by weight, it is made by following raw material：E-
51 epoxy resin：100 parts, 201 polysulfide rubber：20 parts, m-phenylene diamine (MPD)：13 parts, dibutyl phthalate：15 parts, divinyl
Triamine：2 parts, talcum powder：40 parts, maleic anhydride：13 parts, 651 Versamids：18 parts, stannous octoate：5 parts, epoxy
Propane phenyl ether or resorcinolformaldehyde resin or ethylene glycol diglycidylether：25 parts.
Embodiment 3
Photovoltaic module fluid sealant, it is characterised in that by weight, it is made by following raw material：E-
51 epoxy resin：100 parts, 201 polysulfide rubber：15 parts, m-phenylene diamine (MPD)：10 parts, dibutyl phthalate：10 parts, divinyl
Triamine：1 part, talcum powder：30 parts, maleic anhydride：10 parts, 651 Versamids：15 parts, stannous octoate：4 parts, epoxy
Propane phenyl ether or resorcinolformaldehyde resin or ethylene glycol diglycidylether：20 parts.
Embodiment 4
Photovoltaic module fluid sealant, it is characterised in that by weight, it is made by following raw material：E-
51 epoxy resin：100 parts, 201 polysulfide rubber：25 parts, m-phenylene diamine (MPD)：15 parts, dibutyl phthalate：20 parts, divinyl
Triamine：3 parts, talcum powder：50 parts, maleic anhydride：15 parts, 651 Versamids：20 parts, stannous octoate：6 parts, epoxy
Propane phenyl ether or resorcinolformaldehyde resin or ethylene glycol diglycidylether：30 parts.
Photovoltaic module fluid sealant described in any of the above-described embodiment, it is characterised in that preparation method includes following
Step：
The first step：Each raw material are weighed by weight, and are individually stored, based on the weight of E-51 epoxy resin,
Its raw material weighs after being converted；
Second step：The m-phenylene diamine (MPD) obtained in the first step is melted, E-51 epoxy resin, which is added, and is stirred continuously keeps it molten
It is integrated, forms melt；
Third walks：By 201 polysulfide rubber weighed in the first step, dibutyl phthalate, diethylenetriamine, cunning
Mountain flour, maleic anhydride, 651 Versamids, stannous octoate sequentially add in the melt in second step, and being stirred continuously makes
It is uniformly mixed, insulated and stirred 2~4 hours after being warming up to 115~125 DEG C, and propylene oxide phenyl ether or isophthalic two is then added
Phenol diglycidyl ether or ethylene glycol diglycidylether are diluted and stir evenly, then it is evacuated to -0.03~-
0.07Mpa, quantitative package is up to photovoltaic module fluid sealant finished product after being passed through nitrogen to normal pressure after cooling.
Various raw material used in the present invention are all commercial product, can be purchased in the market by name.
After testing, the photovoltaic module fluid sealant in all embodiments of the present invention, tensile strength is >=12Mpa, with base
Adhesive strength >=4.5Mpa of material, 6mm thickness spontaneously dry time≤6 hour, 80 DEG C of drying time≤3.5 hour, 130 DEG C it is dry
Xanthochromia and cracking do not occur for dry time≤2 hour, elongation at break >=350%, 120 DEG C, the experiment of 1600h air agings；25 DEG C of guarantors
Matter phase >=2 year；It is tested by GB/T7762-2003 ozone aging test methods, crackle is had no with 5 times of amplification sem observations；
Applicant location open air uses 806 days, and 450 PV templates have no crackle.
The present invention has the advantageous effects such as the equipment that production method is simple, needs is cheap, Production Time is short, power consumption is low.
The fluid sealant of the present invention has following main advantageous effect：Easy to operate, hardening time is short, to aluminium, glass, connects
Wire box plastics have good adhesiveness；With vibrationproof and fixed effect, the damage of panel and component in transportational process can avoid
It is bad；Extremely low steam and gas infiltration, good seal performance；Weather resistance is good；There is higher ultraviolet light resistance, and can be very
It is used within the scope of wide temperature；It is applicable in the sealant of various thickness；It is not influenced by frame and plate thickness；Non-conductive and permission
It is in direct contact with conductor, keeps long-term behaviour.
Therefore, fluid sealant of the invention can significantly improve the yield rate of photovoltaic module, and be compatible with various Common Component materials
Material, such as aluminium alloy, glass, glass, backboard and makrolon.
The photovoltaic module fluid sealant of the present invention, when in use, when curing longest when the thickness of coating is 6mm, at 80 DEG C
Between be at 3.5 hours, 130 DEG C cure maximum duration be 2 hours；The fluid sealant temperature in use use scope -70~+80 of the present invention
℃；There is stable chemical property, water-fast, seawater and oil, colloid not to corrode to aluminum material for it, be especially suitable for aluminium alloy type
In solar components plate.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalent structure or equivalent flow shift made by bright description is applied directly or indirectly in other relevant technology necks
Domain is included in the scope of patent protection of the present invention.
Claims (2)
1. photovoltaic module fluid sealant, it is characterised in that by weight, it is made by following raw material：E-51
Epoxy resin：100 parts, 201 polysulfide rubber：15 parts, m-phenylene diamine (MPD)：10 parts, dibutyl phthalate：10 parts, divinyl three
Amine：1 part, talcum powder：30 parts, maleic anhydride：10 parts, 651 Versamids：15 parts, stannous octoate：4 parts, epoxy third
Alkane phenyl ether or resorcinolformaldehyde resin or ethylene glycol diglycidylether：20 parts；The photovoltaic module sealing
Glue, it is characterised in that preparation method comprises the steps of：
The first step：Each raw material are weighed by weight, and are individually stored, based on the weight of E-51 epoxy resin, Qi Tayuan
Material weighs after being converted；
Second step：The m-phenylene diamine (MPD) obtained in the first step is melted, E-51 epoxy resin is added and is stirred continuously that so that it is melted be one
Body forms melt；
Third walks：201 polysulfide rubber, dibutyl phthalate, diethylenetriamine, the talcum that will be weighed in the first step
Powder, maleic anhydride, 651 Versamids, stannous octoate sequentially add in the melt in second step, and being stirred continuously makes it
It is uniformly mixed, insulated and stirred 2~4 hours after being warming up to 115~125 DEG C, propylene oxide phenyl ether or resorcinol is then added
Diglycidyl ether or ethylene glycol diglycidylether are diluted and stir evenly, then it is evacuated to -0.03~-
0.07Mpa, quantitative package is up to photovoltaic module fluid sealant finished product after being passed through nitrogen to normal pressure after cooling.
2. photovoltaic module fluid sealant, it is characterised in that by weight, it is made by following raw material：E-51
Epoxy resin：100 parts, 201 polysulfide rubber：25 parts, m-phenylene diamine (MPD)：15 parts, dibutyl phthalate：20 parts, divinyl three
Amine：3 parts, talcum powder：50 parts, maleic anhydride：15 parts, 651 Versamids：20 parts, stannous octoate：6 parts, epoxy third
Alkane phenyl ether or resorcinolformaldehyde resin or ethylene glycol diglycidylether：30 parts；The photovoltaic module sealing
Glue, it is characterised in that preparation method comprises the steps of：
The first step：Each raw material are weighed by weight, and are individually stored, based on the weight of E-51 epoxy resin, Qi Tayuan
Material weighs after being converted；
Second step：The m-phenylene diamine (MPD) obtained in the first step is melted, E-51 epoxy resin is added and is stirred continuously that so that it is melted be one
Body forms melt；
Third walks：201 polysulfide rubber, dibutyl phthalate, diethylenetriamine, the talcum that will be weighed in the first step
Powder, maleic anhydride, 651 Versamids, stannous octoate sequentially add in the melt in second step, and being stirred continuously makes it
It is uniformly mixed, insulated and stirred 2~4 hours after being warming up to 115~125 DEG C, propylene oxide phenyl ether or resorcinol is then added
Diglycidyl ether or ethylene glycol diglycidylether are diluted and stir evenly, then it is evacuated to -0.03~-
0.07Mpa, quantitative package is up to photovoltaic module fluid sealant finished product after being passed through nitrogen to normal pressure after cooling.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510606312.1A CN105086853B (en) | 2014-09-07 | 2014-09-07 | Photovoltaic module fluid sealant and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510606312.1A CN105086853B (en) | 2014-09-07 | 2014-09-07 | Photovoltaic module fluid sealant and preparation method thereof |
| CN201410451406.1A CN104178040B (en) | 2014-09-07 | 2014-09-07 | Photovoltaic module seal gum and preparation method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410451406.1A Division CN104178040B (en) | 2014-09-07 | 2014-09-07 | Photovoltaic module seal gum and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105086853A CN105086853A (en) | 2015-11-25 |
| CN105086853B true CN105086853B (en) | 2018-10-19 |
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| CN201410451406.1A Active CN104178040B (en) | 2014-09-07 | 2014-09-07 | Photovoltaic module seal gum and preparation method thereof |
| CN201510606312.1A Expired - Fee Related CN105086853B (en) | 2014-09-07 | 2014-09-07 | Photovoltaic module fluid sealant and preparation method thereof |
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|---|---|---|---|---|
| CN105838306A (en) * | 2016-04-26 | 2016-08-10 | 安徽康瑞鑫电子科技有限公司 | LED (light-emitting diode) packaging adhesive |
| CN106318236A (en) * | 2016-08-22 | 2017-01-11 | 广西南宁荣威德新能源科技有限公司 | Novel solar photovoltaic cell encapsulating material |
| CN106318237A (en) * | 2016-08-22 | 2017-01-11 | 广西南宁荣威德新能源科技有限公司 | Novel solar photovoltaic cell encapsulating environment-friendly material |
| CN106318235A (en) * | 2016-08-22 | 2017-01-11 | 广西南宁荣威德新能源科技有限公司 | Environment-friendly solar photovoltaic cell packaging material |
| CN110982388B (en) * | 2020-01-02 | 2021-06-01 | 中国科学院兰州化学物理研究所 | Room-temperature curing coating with abradable sealing function and preparation method thereof |
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| US6787606B1 (en) * | 2001-07-02 | 2004-09-07 | Henkel Corporation | Electrochromic device with composition of epoxy resin, toughener and latent curative |
| CN101985547A (en) * | 2010-11-03 | 2011-03-16 | 烟台德邦科技有限公司 | Single-component epoxy electronic potting adhesive capable of being stored at room temperature and preparation method thereof |
| CN102952509A (en) * | 2011-08-20 | 2013-03-06 | 朱云利 | Preparation method of epoxy resin sealant |
| CN103614106A (en) * | 2013-11-21 | 2014-03-05 | 安徽康瑞鑫电子科技有限公司 | High-strength strong-acid/alkali-resistant epoxy resin sealant |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105086853A (en) | 2015-11-25 |
| CN104178040B (en) | 2016-01-20 |
| CN104178040A (en) | 2014-12-03 |
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