CN101629989A - Method for testing reliability of intelligent card - Google Patents

Method for testing reliability of intelligent card Download PDF

Info

Publication number
CN101629989A
CN101629989A CN200810116656A CN200810116656A CN101629989A CN 101629989 A CN101629989 A CN 101629989A CN 200810116656 A CN200810116656 A CN 200810116656A CN 200810116656 A CN200810116656 A CN 200810116656A CN 101629989 A CN101629989 A CN 101629989A
Authority
CN
China
Prior art keywords
test
card
icc1
test card
icc2
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN200810116656A
Other languages
Chinese (zh)
Other versions
CN101629989B (en
Inventor
艾伟伟
欧阳秋笙
吴彩峰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Beijing CEC Huada Electronic Design Co Ltd
Original Assignee
Beijing CEC Huada Electronic Design Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Beijing CEC Huada Electronic Design Co Ltd filed Critical Beijing CEC Huada Electronic Design Co Ltd
Priority to CN2008101166564A priority Critical patent/CN101629989B/en
Publication of CN101629989A publication Critical patent/CN101629989A/en
Application granted granted Critical
Publication of CN101629989B publication Critical patent/CN101629989B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Abstract

The invention provides a method for testing reliability of an intelligent card by aiming at the phenomenon of product performance degradation or function failure caused by unstable application environment in the process of production, manufacturing and application. The method comprises the following testing processes of: (1) generating a test card; (2) applying stable DC voltage offset to measure current ICC1 on power supply pins of the test card through card reading equipment; then inputting an interference signal to the power supply pins of the test card by an interference circuit to measure current ICC2, and if the ICC2 exceeds five times of the normal current value ICC1, stopping the test, and judging the test is failed; and if the ICC2 is within five times of the normal current value ICC1, continuing the following inspection steps; and (3) after an interference test is completed, inspecting the performance and the function of the test card, and if the test card has the performance degradation or the function failure, judging that a sample does not pass the test by the testing result; and if the performance and the function of the test card are normal, judging that the sample passes the test by the testing result.

Description

A kind of method of testing reliability of smart card
Technical field
The present invention relates to a kind of method of testing reliability of smart card.
Background technology
Along with the continuous development of computer software technology and integrated circuit, the range of application of smart card more and more widely, bank card from the personal mobile phone SIM card to financial circles and authentication, smart card is being brought into play important effect.Along with the development of semiconductor fine process technology, increasing emerging manufacturing technology and device application are in the intelligent card chip system, and the application of new technology and new material brings new problem to product reliability.Simultaneously, the applied environment of smart card also becomes increasingly complex, and therefore stability and the reliability testing to smart card system become a very important job.
Existing measuring technology and method mostly are to carry out under the situation of intelligent card chip system stability power supply, such as test of memory data retentivity and erasing and writing life test.But, in production test and on-the-spot use, because the widespread use of more and more complicated integrated circuit, the applied environment of intelligent card chip system is subjected to a large amount of noise, and these noises mainly come from the instability, switching on and shutting down, Electrostatic Discharge of other electronic equipments etc.So power supply, or I/O pins such as (I/O) exist unpredictable instantaneous excitation to cause the generation of similar latch-up (Latch up), disturb serious with the power supply fast transient especially.In actual production test or user's use,, the power supply fast transient cause smart card product performance degradation or disabler problem to happen occasionally because disturbing.And the ESD that industry standard adopted test and Latch up test, its method and excitation can not cover with the simulated field environment in interference cases, can not find the product failure that caused by the fast transient interference to power supply because of chip system.
Summary of the invention
Not enough and actual test at above-mentioned existing measuring technology needs, and the present invention proposes a kind of method of testing reliability of smart card, can improve the coverage rate of test, avoids product that potential quality problems take place owing to test is not enough.
In order to address the above problem, the present invention proposes a kind of method of testing of smart card, comprising:
(1) generates test card;
(2) by card-reading apparatus, apply the stable DC voltage bias, measure normal current ICC1 in the test card power pin; By interfered circuit the test card power pin is imported undesired signal then, measure electric current I CC2, if ICC2 surpasses 5 times of normal current ICC1, then end test, the judgement test crash; If ICC2 then continues the checking procedure of back in 5 times of normal electrical flow valuve ICC1;
(3) after disturbed test is finished, the performance of verification test card and function, if the performance degradation of test card or disabler, then test result is judged to be sample not by test; If test card performance and function are normal, then test result is judged to be sample by test.
As preferably, in order to enlarge test coverage to guarantee product reliability, according to method of testing disclosed in this invention smart card is carried out disturbed test, verifying smart is stuck in whether electric current is excessive under the situation that power supply is interfered, whether performance degradation or disabler after the disturbed test, the antijamming capability of examination smart card.
As preferably, described step (1) is specially: choose normally functioning scale, by the static electrology characteristic of testing apparatus test card, determine that unit for electrical property parameters is in the product specification range of definition;
As preferably, described step (2) is specially: apply the stable DC voltage bias in the test card power pin, measure electric current I CC1, as the reference value of implementing qualified criterion in the test process.
As preferably, described step (2) is specially: the smart card power pin directly is connected with the output of power supply interfered circuit, reometer is connected on the power pin, by change power supply interfered circuit parameter, produce different interference waveforms, to smart card power end input undesired signal in various degree, measure the current value I CC2 under every kind of undesired signal.If ICC2 surpasses 5 times of normal electrical flow valuve ICC1, then end test, judge test crash; Otherwise continue the back checking procedure.
Step (3) is specially: after the disturbed test, test the static electrology characteristic of scale again, and verify its function, if the performance degradation of test card or disabler, then test result is judged to be sample not by test; If test card performance and function are normal, then test result is judged to be sample by test.
The smart card method of testing that the present invention proposes, the manufacture process and the user that test are pressed close to more and simulated the product complexity use site environment, can find in advance because the not enough more weak problem of product antijamming capability that causes of chip system design, for improving reliability design and providing reference for aspects such as applied environment reliability designs.
Description of drawings
Fig. 1 is the preferred implementing procedure figure of method of testing of the smart card that proposes of the present invention.
Fig. 2 is the interfered circuit synoptic diagram of using in the test process of the present invention
Embodiment
The present invention is described in further detail below in conjunction with accompanying drawing.
The preferred implementing procedure figure of the present invention comprises following content as shown in Figure 1:
(1) generates test card;
(2) apply the stable DC voltage bias in the test card power pin, measure electric current I CC1; By interfered circuit the test card power pin is disturbed then, measured electric current I CC2,, then end test, judge test crash if ICC2 surpasses 5 times of normal electrical flow valuve ICC1; If ICC2 then continues the checking procedure of back in 5 times of normal electrical flow valuve ICC1;
(3) after disturbed test is finished, the performance of verification test card and function, if the performance degradation of test card or disabler, then test result is judged to be sample not by test; If test card performance and function are normal, then test result is judged to be sample by test.
As preferably, described step (1) is specially: choose normally functioning scale, by the static electrology characteristic of testing apparatus test card, determine that unit for electrical property parameters is in the product specification range of definition;
As preferably, disturbed test in the described step (2) is carried out the power supply disturbed test to smart card, verifying smart is stuck in whether electric current is excessive under the situation that power supply is interfered, whether performance degradation or disabler after the disturbed test, the antijamming capability of examination smart card, enlarged test coverage like this to guarantee product reliability, avoided performance degradation or disabler occurring in the actual use that is stuck in the user through test.
As preferably, described step (2) is specially: smart card power pin VCC directly is connected with interfered circuit (as shown in Figure 2) output 1, reometer 2 is connected on the power pin VCC.At first cut-off switch S0 with selector switch S4 and inductance gating, applies 5V stable DC voltage bias in the test card power pin, measures electric current I CC1, as the reference value of implementing qualified criterion in the test process; Then, Closing Switch S0, the different choice combination by S1, S2, S3 and S4, change interfered circuit parameter produces different interference waveforms, and the smart card power end is carried out in various degree interference, and proper as far as possible actual environment for use is with the raising test coverage.Under the situation that power supply is disturbed, measure current value I CC2.If ICC2 surpasses 5 times of normal electrical flow valuve ICC1, then end test, judge test crash; Otherwise continue the back checking procedure.
As preferably, described step (3) is specially: after test is finished, and the electrical property of verification test card and function.At first, utilize card-reading apparatus that test card is resetted then, the card internal storage is carried out read-write operation by the static electrology characteristic of testing apparatus test card.If the test card unit for electrical property parameters exceeds the product specification range of definition, reset answer mistake or cisco unity malfunction, then test crash; If the test card unit for electrical property parameters meets the product specification definition, and working properly, then test successfully.
The method of the testing reliability of smart card that provides in according to the present invention, the manufacture process and the user that test are pressed close to more and simulated the product complexity use site environment, can find in advance because the not enough more weak problem of product antijamming capability that causes of chip system design, for improving reliability design and providing reference for aspects such as applied environment reliability designs.
For a person skilled in the art, under the situation that does not break away from the spirit and scope of the present invention, can also make various conversion or variation, so all technical schemes that are equal to also should belong to category of the present invention, all within protection scope of the present invention.

Claims (3)

1, a kind of method of testing reliability of smart card is characterized in that described method, may further comprise the steps:
(1) generates test card;
(2) by card-reading apparatus, apply the stable DC voltage bias, measure normal current ICC1 in the test card power pin; By the power supply interfered circuit test card power pin is imported undesired signal then, measure electric current I CC2, if ICC2 surpasses 5 times of normal current ICC1, then end test, the judgement test crash; If ICC2 then continues the checking procedure of back in 5 times of normal current ICC1;
(3) after disturbed test is finished, the static electrology characteristic of verification test card, and verify its function, if the performance degradation of test card or disabler, then test result is judged to be sample not by test; If test card performance and function are normal, then test result is judged to be sample by test.
2, the method for a kind of testing reliability of smart card according to claim 1 and 2 is characterized in that, described step (1) is specially: choose normally functioning scale, by the static electrology characteristic of testing apparatus test card, determine unit for electrical property parameters.
3, the method for a kind of testing reliability of smart card according to claim 1 and 2, it is characterized in that, described step (2) is specially: apply the stable DC voltage bias in the test card power pin, measure normal current ICC1, as the reference value of implementing qualified criterion in the test process; Then the test card power pin directly is connected with interfered circuit output, reometer is connected on the power pin, by change interfered circuit parameter, produce different interference waveforms, the smart card power end is carried out in various degree interference, measure the current value I CC2 under every kind of interference, if ICC2 surpasses 5 times of normal electrical flow valuve ICC1, then end test, judge test crash; Otherwise continue the back checking procedure.
CN2008101166564A 2008-07-15 2008-07-15 Method for testing reliability of intelligent card Expired - Fee Related CN101629989B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2008101166564A CN101629989B (en) 2008-07-15 2008-07-15 Method for testing reliability of intelligent card

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2008101166564A CN101629989B (en) 2008-07-15 2008-07-15 Method for testing reliability of intelligent card

Publications (2)

Publication Number Publication Date
CN101629989A true CN101629989A (en) 2010-01-20
CN101629989B CN101629989B (en) 2011-11-02

Family

ID=41575164

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008101166564A Expired - Fee Related CN101629989B (en) 2008-07-15 2008-07-15 Method for testing reliability of intelligent card

Country Status (1)

Country Link
CN (1) CN101629989B (en)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101963636A (en) * 2009-07-24 2011-02-02 北京圣涛平试验工程技术研究院有限责任公司 Method for evaluating long life of component
CN105788439A (en) * 2016-03-25 2016-07-20 佛山市新恒萃材料科技有限公司 Anti-interference technology teaching platform
CN106646039A (en) * 2016-12-02 2017-05-10 北京中电华大电子设计有限责任公司 Non-contact intelligent card testing device and method
WO2017143917A1 (en) * 2016-02-24 2017-08-31 中兴通讯股份有限公司 Noise generator, method for testing electronic device using the same, and storage medium
CN108254669A (en) * 2016-12-29 2018-07-06 瑞昱半导体股份有限公司 IC testing method
CN109959858A (en) * 2017-12-26 2019-07-02 新智数字科技有限公司 A kind of method, apparatus of bluetooth card power consumption test
CN110320460A (en) * 2018-03-29 2019-10-11 北京华虹集成电路设计有限责任公司 A kind of method and apparatus of SIM card robustness testing
CN110568346A (en) * 2019-10-08 2019-12-13 东信和平科技股份有限公司 Aging test method and system for smart card
CN114978378A (en) * 2022-04-14 2022-08-30 北京中电华大电子设计有限责任公司 Communication interference testing off-line device for telecommunication user identification card
WO2023077718A1 (en) * 2021-11-02 2023-05-11 中兴通讯股份有限公司 Immunity test switching switch, immunity test system, test method, and storage medium

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105652107B (en) * 2014-12-04 2019-04-05 国家电网公司 A kind of reliability checking method of direct-current transmission converter valve triggering monitoring unit

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100392411C (en) * 2005-10-11 2008-06-04 上海华虹集成电路有限责任公司 Non-contacting intelligent card noise detecting method and detecting circuit thereof

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101963636A (en) * 2009-07-24 2011-02-02 北京圣涛平试验工程技术研究院有限责任公司 Method for evaluating long life of component
CN101963636B (en) * 2009-07-24 2012-06-27 北京圣涛平试验工程技术研究院有限责任公司 Method for evaluating long life of component
WO2017143917A1 (en) * 2016-02-24 2017-08-31 中兴通讯股份有限公司 Noise generator, method for testing electronic device using the same, and storage medium
CN105788439A (en) * 2016-03-25 2016-07-20 佛山市新恒萃材料科技有限公司 Anti-interference technology teaching platform
CN106646039A (en) * 2016-12-02 2017-05-10 北京中电华大电子设计有限责任公司 Non-contact intelligent card testing device and method
CN108254669B (en) * 2016-12-29 2020-12-25 瑞昱半导体股份有限公司 Integrated circuit testing method
CN108254669A (en) * 2016-12-29 2018-07-06 瑞昱半导体股份有限公司 IC testing method
CN109959858A (en) * 2017-12-26 2019-07-02 新智数字科技有限公司 A kind of method, apparatus of bluetooth card power consumption test
CN110320460A (en) * 2018-03-29 2019-10-11 北京华虹集成电路设计有限责任公司 A kind of method and apparatus of SIM card robustness testing
CN110568346A (en) * 2019-10-08 2019-12-13 东信和平科技股份有限公司 Aging test method and system for smart card
WO2023077718A1 (en) * 2021-11-02 2023-05-11 中兴通讯股份有限公司 Immunity test switching switch, immunity test system, test method, and storage medium
CN114978378A (en) * 2022-04-14 2022-08-30 北京中电华大电子设计有限责任公司 Communication interference testing off-line device for telecommunication user identification card
CN114978378B (en) * 2022-04-14 2023-10-13 北京中电华大电子设计有限责任公司 Communication interference test off-line device for telecom subscriber identity module card

Also Published As

Publication number Publication date
CN101629989B (en) 2011-11-02

Similar Documents

Publication Publication Date Title
CN101629989B (en) Method for testing reliability of intelligent card
US7890819B2 (en) Method and apparatus for storing failing part locations in a module
CN100541206C (en) The testing fixture of semiconductor devices
CN104035023B (en) The method of testing of MCU and system
CN102841831A (en) System and method for testing server memory
CN101413986B (en) Method for testing reliability of smart card
CN105824730A (en) Method and device for diagnosing and repairing hardware
CN104751875B (en) Fail bit figure analysis method applied to NVM chips
CN111175641B (en) Electrostatic discharge immunity testing method and assembly for processor chip
TWI392884B (en) Method and circuit for testing a multi-chip package
CN115219940A (en) Power supply noise test method and device of memory chip, storage medium and equipment
US20120210179A1 (en) Memory interface with selectable evaluation modes
WO2010076687A1 (en) Method and system to verify the reliability of electronic devices
US7793186B1 (en) System and method for increasing the extent of built-in self-testing of memory and circuitry
CN109215724A (en) The method and device of memory automatic detection and rehabilitation
Jeon et al. A new method of component-level ESD test to assess system-level ESD risk for ICs
Hsu et al. Novel Built-In Current-Sensor-Based $ I_ {\rm DDQ} $ Testing Scheme for CMOS Integrated Circuits
CN103197222B (en) The method of testing of transistor drain current
CN113496758A (en) Memory operation capability prediction method
KR100996091B1 (en) Semiconductor memory device for outputting internal detection signals in test mode
Kraft et al. Efficient coding scheme for DDR4 memory subsystems
CN106124832A (en) The method for measurement of a kind of components and parts saturation current and measurement system
Bolchini et al. A fault analysis and classifier framework for reliability-aware SRAM-based FPGA systems
CN109817270A (en) A kind of test method of 8 MCU chips of embedded OTP
CN216902264U (en) Aging test device for high-speed EEPROM (electrically erasable programmable read-Only memory)

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C56 Change in the name or address of the patentee
CP02 Change in the address of a patent holder

Address after: 102209 Beijing, Beiqijia, the future of science and technology in the south area of China electronic network security and information technology industry base C building,

Patentee after: Beijing CEC Huada Electronic Design Co., Ltd.

Address before: 100015 Beijing city Chaoyang District Gaojiayuan No. 1

Patentee before: Beijing CEC Huada Electronic Design Co., Ltd.

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20111102

Termination date: 20190715

CF01 Termination of patent right due to non-payment of annual fee