CN101605627A - With the positioning disk of fluid bearings and be used to make the laser optics device to carry out the optical module of Laser Micro-Machining with respect to the device of the axle biasing of this positioning disk - Google Patents

With the positioning disk of fluid bearings and be used to make the laser optics device to carry out the optical module of Laser Micro-Machining with respect to the device of the axle biasing of this positioning disk Download PDF

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Publication number
CN101605627A
CN101605627A CNA2007800279910A CN200780027991A CN101605627A CN 101605627 A CN101605627 A CN 101605627A CN A2007800279910 A CNA2007800279910 A CN A2007800279910A CN 200780027991 A CN200780027991 A CN 200780027991A CN 101605627 A CN101605627 A CN 101605627A
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CN
China
Prior art keywords
positioning disk
substrate
axle
respect
optical head
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2007800279910A
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Chinese (zh)
Inventor
M·哈曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Eriken Bao Minthis Coating (uk) Ltd
Exitech Ltd
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Eriken Bao Minthis Coating (uk) Ltd
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Publication of CN101605627A publication Critical patent/CN101605627A/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/042Automatically aligning the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/1462Nozzles; Features related to nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing Optical Record Carriers (AREA)

Abstract

The present invention relates to a kind of laser optic assemblies, it comprises: optical head (12), it has imaging or condenser lens and lens control device and is suitable for providing laser beam (14), thereby produces mask image or beam focus (13) along the axle of beam (14) in the datum of assembly; Work station (W), it is suitable for making substrate work piece (15) to locate with respect to datum mark, thereby mask image or beam focus (13) edge are located perpendicular to the axle of the beam (14) of the substrate work piece (15) of locating by work station (W); This work station (W) also is suitable for making workpiece (15) in given direction (X, Y) axial displacement of middle crosscut beam (14); Positioning disk (11) and can be on the panel, location of the substrate work piece (15) on the work station (W) device of this positioning disk of fluid bearings; And jockey, it is connected positioning disk (11) with optical head, so that positioning disk (11) can make optical head (12) with respect to axially (X, Y) displacement; And bias unit (D), thus at least when positioning disk (11) during by fluid bearings, positioning disk (11) and positioning disk axle (P ') depart from the axle of laser beam (14) in the direction perpendicular to the axle of beam (14).

Description

With the positioning disk of fluid bearings and be used to make the laser optics device to carry out the optical module of Laser Micro-Machining with respect to the device of the axle biasing of this positioning disk
Technical field
The present invention relates to positioner, this positioner makes the surface of laser projection or focus lamp and large-scale flat substrate maintain a certain distance exactly, purpose is always to keep mask image or focal spot to focus on the substrate surface exactly in processing procedure, and can make the laser beam substrate processing until its edge.
Background technology
In our previous BP 2400063 and the common unsettled UK Patent Application 0525111.1 (' in first to file ') a kind of ' localization method and device and products thereof ' described.The method of its wide region and aspect in, these provide a kind of in first to file and by means of laser workpiece are carried out micro-machined method, this method may further comprise the steps: workpiece is placed on the bearing part that is used to form a transfer system part, this bearing part can carry out displacement along the path of the X-axle that is parallel to this workpiece, described path of Y-axle crosscut and the described path of Z-axle crosscut; Make from the output beam of laser X with respect to workpiece, Y and Z axle are determined the reference position, and make this workpiece carry out displacement along the path by transfer system, thereby make workpiece can experience little process by laser, it is characterized in that this method may further comprise the steps: keeping at a distance between the position near this benchmark location on reference position and the surface of the work; And adapt to the localized variation of thickness of workpiece, thereby the distance that the reference position is maintained fixed with respect to the surface of workpiece.
Continuation is to doing concise and to the point the description in first to file, the step that adapts to the thickness of workpiece localized variation is by making the reference position displacement to follow the surface of workpiece.Be also noted that, the step of keeping at a distance is carried out by range unit, described range unit comprises the body member on the fluid cushion that is carried on the workpiece first surface, and described fluid cushion is set up by the fluid stream of carrying from body member, so that body member and first surface keep predetermined distance; If body member changes by its current position displacement because of thickness of workpiece, then utilize perpendicular to any change in location of the body member of first surface and come moving focal point or imaging len, so that current reference position correspondingly changes, thereby be its preset distance that keeps with respect to the workpiece first surface with the working standard position recovering.Preferably, be sidelong with respect to first of workpiece and put body member, and place another body member with respect to second side (relative) of workpiece with workpiece first side, when the local thickness of workpiece reduces, impel workpiece towards described body member with this another body member.
Thisly comprise that being carried on surface of the work top treats that the notion of the range unit of micro-machined body member now makes further progress.After this a kind of like this range unit is called " positioning disk (puck) ".This positioning disk can be a kind of in the several types, and in all situations, fluid layer is generally air or other gas, but the fluid that can be the downside that makes positioning disk in some cases separate with substrate surface.Positioning disk can have the carrying fluid, and this fluid enters the gap between positioning disk and the substrate on the zone that distributes towards the positioning disk outside.In this case, the power between positioning disk and the substrate surface always manages to impel them separately.Perhaps, can fluid be injected into gap between positioning disk and the substrate in the center of positioning disk.Fluid is radially outwards stretched by injection point and is produced Venturi effect (venturi effect) like this, and this effect causes forming low pressure below the positioning disk periphery.This vacuum state causes the suffered power of positioning disk towards substrate surface.The low pressure of the high pressure of positioning disk center and positioning disk edge balances each other, and makes positioning disk keep its height above substrate.Such positioning disk is called as " Bernoulli Jacob's positioning disk (Bernoulli puck) ".Also can use a kind of positioning disk that injects fluid around the outside and vacuum state is put on the center.A kind of like this positioning disk is known " vacuum preload (vacuum preloaded) ", and it has the following advantages: the mutual containing of vacuum and pressure, thus make the spacing of positioning disk and substrate stable.
Summary of the invention
According to the invention provides a kind of laser optic assemblies, it comprises:
Optical head (12), the lens control device that it has imaging or condenser lens and is suitable for providing laser beam (14), described laser beam produces mask image or beam focus (13) along the axle of beam (14) in the datum of assembly;
Work station (W), it is suitable for making substrate work piece (15) with respect to datum mark location, thereby makes mask image or beam focus (13) along spool locating perpendicular to the beam (14) of the substrate work piece (15) by work station (W) location; This work station (W) also be suitable for making workpiece (15) given direction (X, Y) in crosscut beam (14) the axle and displacement;
Positioning disk (11) and can be on the panel, location of the substrate work piece (15) on the work station (W) device of this positioning disk of fluid bearings; And
Jockey, it is connected positioning disk (11) with optical head, so that positioning disk (11) can make optical head (12) with respect to axially (X, Y) displacement;
It is characterized in that bias unit (D), thus at least when positioning disk (11) during by fluid bearings, positioning disk (11) and positioning disk axle (P ') depart from the axle of laser beam (14) in the direction perpendicular to the axle of beam (14).
According to first preferred version of the present invention, this assembly is characterised in that, bias unit (D) can make positioning disk (11) locate, so that beam (14) is in the edge (17 of the workpiece (15) on positioning disk (11) and the work station (W), 17 ') or between the corner (16), thereby can make laser beam (14) at least stably navigate to the edge (17,17 ') or the corner (16) of workpiece (15) by positioning disk (11).
According to the present invention or second preferred version of its first preferred version, this assembly is characterised in that, jockey can make positioning disk (11) around one or two axle (X perpendicular to beam (14), Y) do the rotation of little degree, thereby positioning disk (11) automatically is pivoted, so that the downside of positioning disk (11) is parallel to the surface of substrate (15) and locatees.
According to the present invention or the 3rd preferred version of aforementioned its arbitrary preferred version, this assembly is characterised in that, positioning disk (11) is suitable in the plane on the surface that is parallel to substrate (15) and is being parallel to direction (X, Y) move with respect to optical head (12) in the direction, wherein, substrate (15) is moved.
According to the present invention or the 4th preferred version of aforementioned its arbitrary preferred version, this assembly is characterised in that, positioning disk (11) is suitable in the plane on the surface that is parallel to substrate (15) and is moving with respect to optical head (12) in the hoop perpendicular to the axle of substrate surface (P ').
According to the present invention or the 5th preferred version of aforementioned its arbitrary preferred version, this assembly is characterised in that, positioning disk (41, Fig. 4) by independent jockey and above optical head (42,42 ') connect one by one, thereby positioning disk (41) can make all this optical heads (42,42 ') with respect to axially (X Y) carries out displacement.
More broadly, the invention is characterized in, be suitable between positioning disk and workpiece, predetermined gap being arranged, if the gap changes with respect to the positioning disk that surface of the work suspends, change such as the variation with workpiece size, positioning disk then plays the effect of reduction predetermined gap.Positioning disk is fixedly connected to lens in perpendicular to the direction of substrate surface, guarantees that reference position as the laser beam of micromachining device keeps the distance of being scheduled to by positioning disk.Typical control can be:
Comprise that any positioning disk that causes because of change of workpiece moves, cause related imaging or condenser lens to carry out corresponding displacement to keep the reference position constant; Perhaps
Positioning disk and reference position are fixed, and workpiece carries out displacement with respect to positioning disk, thereby keep predetermined distance.
The many typical embodiment of body member has been made detailed description with reference to the accompanying drawing 1 to 13 of the positioning disk that shows a series of types in GB0525111.1.Shown a kind of positioning disk in most of example, it has open-work (openwork) center, is guided through this open-work center from the beam of processing laser.
Under many circumstances, must carry out laser machining operation until its edge to flat substrate.In the case, can not operate satisfactorily around the positioning disk of laser beam because the part positioning disk has been avoided the edge of substrate, thereby and the integrality of fluid cushion can be damaged and cause the distance between substrate surface and the reference position to change.
The new puck arrangements that we describe in this application can overcome this problem.The idea of being discussed among proposed idea and the GB0525111.1 is very inequality, and reason is the not center by positioning disk of laser beam, but is displaced to the side of positioning disk.
In the present invention, the positioning disk of fluid bearings is connected with imaging or condenser lens by coupling arrangement, and coupling arrangement is positioned to and the laser beam a certain distance of being separated by positioning disk, and carries out displacement in being parallel to the plane of substrate surface from a direction of beam.That is to say that substrate can move with respect to laser beam, so that the surface that laser beam can substrate processing even up to an edge of substrate, this edge refers to the edge of beam to the offside of positioning disk.
If positioning disk is located with respect to laser beam, also can be worked into two neighboring edges of square or rectangular substrate and enter in two corners between the edge by this method and process so that the corner of substrate be at beam to the offside of positioning disk.
For large-scale flat substrate, usually can use a plurality of parallel optical projection and focusing system to come speed process rate.Like this, puck arrangements can be become with respect to laser beam displacement in different directions, make different optical modules can be used near different substrate edges.
The preferred number of optical module is a quadruplet, and they are arranged to 2 * 2 arrays, and wherein each optical module is used to handle 1/4th zones of square or rectangular substrate.In the case, positioning disk on whole four optical heads inwardly is moved to the edge towards the center line or the central point of substrate with 45 degree diagonally, so that under without any the situation of positioning disk near substrate edges, whole four edges of substrate can be processed by laser beam.
For the substrate of handling square or rectangle, making positioning disk be moved to substrate edges with 45 degree is preferable angle, because this can make positioning disk reduce to minimum from the lateral displacement of beam.This is very important, because the variation of substrate height is not compensated between beam spot and positioning disk, so offset distance should keep as far as possible little.If words more easily, the angle beyond 45 degree also is possible, as long as when laser beam treatment during to substrate edges, the lower surface of positioning disk remains on fully on the upper surface of substrate and gets final product.If pending substrate is not square or rectangle, and do not have the square corner, then can use 45 degree other angles in addition.In general, optical module just is worked into effectively in the corner of substrate and means that positioning disk approaches to make angle between the substrate dual-side abutment of substrate corner (promptly) to halve from the optimum displacement direction of laser beam.
When needs come treatment substrate more than four optical heads, also positioning disk can be arranged to avoid the problem at edge with respect to each laser beam.For example, if use six or eight optical heads, be arranged in 3 * 2 or 4 * 2 array, then the quadruplet optical module of outermost corner make them related positioning disk inwardly towards the center or the center line displacement diagonally of substrate, and the related positioning disk that the optical module in the middle of all the other two covers or the quadruplet makes them on perpendicular to the line of substrate edges towards inwardly laterally displacement of substrate center.
If the many covers optical module that only uses two cover optical modules or be in line comes treatment substrate, then positioning disk can be arranged to be installed between a pair of optical module, to control the datum mark of handling two optical heads by single positioning disk in the position with respect to the surface.But the scope of treatment substrate reaches two edges perpendicular with the connecting line of positioning disk and laser beam in this case.
But two substrate edges that are parallel to the connecting line of positioning disk and laser beam can not be too approaching, because positioning disk will cover these edges.This problem is solved: positioning disk is contained on the suitable slide mechanism, cause positioning disk with respect to beam away from perpendicular to the direction of substrate edges in move because the optical module of this delegation is near any substrate edges in parallel.
The mechanism that positioning disk is connected to optical module must be such: it only allows positioning disk to move in the plane that is parallel to substrate surface exactly with respect to beam.Clearly, avoiding, because this will cause the beam reference point location to change with respect to substrate surface perpendicular to any the moving in the direction on this plane.
Use a simple case of running fix dish to be: use two cover optical modules and single positioning disk are supported in imaging or the condenser lens from substrate surface one correct distance place.In this case, in away from the direction of pending substrate edges, positioning disk is moved in perpendicular to the direction of the connecting line of two laser beams by suitable control system.Because moving substrate or optical module make laser beam near the substrate edges that is parallel to the line between the beam, thereby cause this moving automatically to be taken place.When substrate or optical head moved to opposite side edge near substrate, positioning disk slided in the opposite direction.In all situations, the moving direction of positioning disk all is away from continuous approaching edge, to avoid the fluid bearings failure.Like this, keep off at positioning disk under the situation at any edge, two beams can cover the Zone Full of square or rectangular substrate.
In delegation, have if desired more than two beams and handle large-area substrate, then positioning disk is placed between the paired adjacent optical assembly.For example, delegation has eight cover optical modules to come treatment substrate if desired, then will use four mobile positioning disks.A positioning disk is between optical head 1 and 2.Second positioning disk is between optical head 3 and 4, and the 3rd positioning disk is between optical head 5 and 6, and the 4th positioning disk is between optical head 7 and 8.In all situations, positioning disk only is supported in two optical heads of its each side, so that four positioning disks are mobile separately in perpendicular to the direction of substrate surface, and purpose is to make the variation that the substrate surface height takes place in the positioning disk compensation deals process.
Description of drawings
Accompanying drawing referring now to laser module is made description to embodiment of the present invention:
Fig. 1 is the perspective view with first embodiment of single laser module;
Figure 2 shows that second embodiment, the quadruplet laser module is wherein arranged, every suit is by independent positioning disk support;
Fig. 3 is the plane with the 3rd embodiment of eight cover laser modules;
Figure 4 shows that the 4th embodiment of supporting two cover laser modules by single positioning disk; And
Figure 5 shows that the 5th embodiment, wherein eight the cover laser modules be in line, each to assembly by single positioning disk support.
The specific embodiment
Fig. 1 illustrates single positioning disk 11 is supporting to contain focusing or imaging len by bias unit D single optical module 12, and the focus of laser beam 14 or the plane of delineation 13 are remained on the surface of substrate 15 exactly, wherein positioning disk 11 away from the corner 16 of substrate 15 to the angular direction in remove a segment distance from laser beam 14.Work station W can move substrate 15 on two axle X and Y.Positioning disk 11 and optical module 12 can move on vertical axis Z, with the variation of compensation substrate height generation.By this layout, to keep off at positioning disk 11 under the situation on any one side 17,17 ', beam 14 can be close to the edge 17,17 ' of substrate.
Fig. 2 illustrates the quadruplet similar laser optical module 21 in the whole zone that is used to handle rectangular substrate 25,22,23, the vertical view of 24 layout, this substrate can be moving along X and y-axis shift, as shown in the figure, wherein related with each optical module positioning disk 26 inwardly carries out displacement towards the center of substrate diagonally with respect to each laser beam 27, so that the connecting line of its corresponding laser beam of each positioning disk becomes 45 degree with the edge of substrate.In the case, all the quadruplet optical module all is connected to the scaffold (not shown), it is constant to cause these optical modules to be kept at a distance in X and Y direction in gamut processing substrate process, but can in perpendicular to the direction Z of substrate surface, move separately, with the variation of compensation substrate surface height generation.
Fig. 3 illustrates the design of 8 cover similar laser arrangement of components, and each assembly all has the focusing or the imaging len 32 of its own supporting positioning disk 31 and association, and they are used to handle large-scale flat substrate 33, can move in illustrated two axle X and Y.In this case, the positioning disk of the optical module 34,35,36,37 of quadruplet corner is moved to substrate edges with 45 degree, and the positioning disk of the optical module 38,39,40,41 of quadruplet the inside then is moved to substrate edges with 90 degree.In this case, whole eight cover optical modules are connected with the scaffold (not shown), it is constant that this bearing support can make each optical module keep at a distance in X and Y direction in gamut processing substrate process, but can in perpendicular to the Z direction of substrate surface, move separately, with the variation of compensation substrate surface height generation.
Fig. 4 illustrates two cover optical modules 42 by single positioning disk 41 supportings, 42 ' layout, two cover optical modules all contain the lens that lay respectively at each side of positioning disk, and described lens make laser beam 43,43 ' locates to focus on or imaging at the lip-deep point 44,44 ' of flat substrate 45.Positioning disk is connected to slide mechanism 46, and this slide mechanism can make positioning disk move in direction Y in being parallel to the plane of substrate surface, and direction Y is perpendicular to the connecting line of two laser beams.Substrate can move in illustrated X and Y direction.Positioning disk is connected to mechanism on the balladeur train of sliding unit and also can makes positioning disk center on the rotation that X and Y-axis are made little degree, with the local dip of compensation substrate surface, and can make positioning disk do self-control, so that its lower surface always is parallel to substrate surface.The whole suite of being made up of positioning disk and two lens units can move in perpendicular to the direction Z of substrate surface, the variation that takes place because of substrate moves with the compensation substrate height.
Fig. 5 illustrates the vertical view that 8 laser beams that are in line are used for the layout of mint-mark parallel lines on the surface of flat substrate 51.The optical module 52,52 ' of alternating pairs is by single positioning disk 53 supportings, therefore by four groups of independent suites of being made up of single positioning disk and two cover optical modules respectively.Whole four groups of optics suites are connected with framework 54, so that the inter-module in the directions X is every remaining unchanged, but allow to move separately in perpendicular to the direction Z of substrate surface.Substrate can move in illustrated two axle X and Y.By substrate is moved to be parallel to the mint-mark of Y direction in overall length Y direction, make the distance that it is suitable that substrate is moved one's steps in directions X, and then in the Y direction, move.Repeat this operation repeatedly, till groove is finished on all surfaces at substrate.
This illustrates a registration dish is how to locate with respect to the optical head of embarking on journey when the center of substrate is handled.In this case, each positioning disk is located on the connecting line of illustrated optical head.When substrate was mobile in the Y direction, the edge parallel at the optical head place of this delegation was gradually near the laser beam of this delegation, and positioning disk moves with respect to the optical head of this delegation.When substrate is mobile in the Y direction, make the optical head of this delegation move closer to the right-hand side of substrate, positioning disk carries out displacement away from right hand edge, and as shown in the figure 55.When substrate is mobile in opposite Y direction, make the optical head of this delegation gradually near the left-hand side of substrate, positioning disk carries out displacement away from left hand edge, and as shown in the figure 56.
By using many cover optical modules, also can make the mechanism that is used to make positioning disk to be connected with balladeur train on the sliding unit, so that each positioning disk is done the rotation of little degree around X and Y-axis, local dip with the compensation substrate, and can make positioning disk do self-control, so that their lower surface always is parallel to substrate surface.
All these figure have shown substrate that moves and the optical module of fixing in the plane that substrate moves in two axles.The layout of alternate manner also is possible.Substrate can be maintained fixed, and optical module can be connected with the balladeur train on the traveling table above the substrate, and optical module is moved in two axles.Perhaps, substrate can move in a direction, and the optical module that is connected with balladeur train on the traveling table above the substrate can move in other direction.
All these figure have shown that substrate remains on the horizontal plane and the laser beam situation of vertical orientation from top to bottom.When substrate be level and also when being transparent for laser beam, also can use the present invention, laser beam described here is a vertical orientation from the bottom to top, beam with substrate surface on rapidoprint interact before by this transparency carrier.
All these figure have shown that substrate remains on the horizontal plane and the laser beam situation of vertical orientation from top to bottom.When substrate remains on non-level some orientation, the present invention that also can use in this discussion.Specifically, people may expect substrate remain in the perpendicular and laser beam in a kind of like this layout of its surface level orientation.In this case, substrate moves in two axles vertically and flatly with the optical module of fixing.In preferable layout, substrate is maintained fixed, and the balladeur train on the automation on optical module and travelling carriage or substrate next door is connected, so that optical module vertically and flatly mobile in two axles.Perhaps, substrate moves in a horizontal direction, and the balladeur train on the stand on optical module and substrate next door is connected and is mobile in vertical direction.
In each above-mentioned embodiment, quote the laser beam that the some X on surface of the work focuses on.The present invention is not limited to surface work.When action need, an X can be positioned in the workpiece.

Claims (6)

1. laser optic assemblies, it comprises:
Optical head (12), it has imaging or condenser lens and lens control device and is suitable for providing laser beam (14), thereby produces mask image or beam focus (13) along the axle of beam (14) in the datum of this assembly;
Work station (W), it is suitable for making substrate work piece (15) to locate with respect to datum mark, thereby mask image or beam focus (13) are located along the axle of beam (14), and the axle of beam (14) is perpendicular to the substrate work piece (15) of locating by work station (W); This work station (W) also be suitable for making workpiece (15) given direction (X, Y) in crosscut beam (14) axle and carry out displacement;
Positioning disk (11) and the device that is used for this positioning disk of fluid bearings above the positioning disk zone of the substrate work piece (15) on work station (W); And
Jockey, it is connected positioning disk (11) with optical head, so that positioning disk (11) can make optical head (12) with respect to axially (X Y) carries out displacement;
It is characterized in that bias unit (D), thus at least when positioning disk (11) during by fluid bearings, positioning disk (11) and positioning disk axle in perpendicular to the direction of the axle of beam (14) (P ') are from certain skew that spool has of laser beam (14).
2. laser optic assemblies as claimed in claim 1, it is characterized in that, bias unit (D) makes positioning disk (11) can be located such that beam (14) is in the edge (17 of the workpiece (15) on positioning disk (11) and the work station (W), 17 ') or between the corner (16), thereby make laser beam (14) at least stably navigate to the edge (17,17 ') or the corner (16) of workpiece (15) by positioning disk (11).
3. laser optic assemblies as claimed in claim 1 or 2, it is characterized in that, jockey makes positioning disk (11) round one or two axle (X perpendicular to beam (14), Y) do the rotation of little degree, thereby positioning disk (11) automatically is pivoted, so that the bottom surface of positioning disk (11) can be parallel to the surface of substrate (15) and locate.
4. the described laser optic assemblies of each claim as described above, it is characterized in that, positioning disk (11) is suitable in the plane on the surface that is parallel to substrate (15) and is being parallel to direction (X, Y) move with respect to optical head (12) in the direction, wherein, substrate (15) is that (X moves in Y) in direction in the process that relates to positioning disk (11) and handle with beam (14).
5. the described laser optic assemblies of each claim as described above, it is characterized in that, positioning disk (11) is suitable in the plane on the surface that is parallel to substrate (15) and is moving with respect to optical head (12) in the circumferential direction of axle (P '), and axle (P ') is perpendicular to the surface of substrate.
6. the described laser optic assemblies of each claim as described above, it is characterized in that, positioning disk (41, Fig. 4) by being used for the independent jockey of each optical head (42,42 '), with more than one optical head (42,42 ') connect, thereby positioning disk (41) can make all this optical heads (42,42 ') with respect to axially (X Y) carries out displacement.
CNA2007800279910A 2006-06-12 2007-05-25 With the positioning disk of fluid bearings and be used to make the laser optics device to carry out the optical module of Laser Micro-Machining with respect to the device of the axle biasing of this positioning disk Pending CN101605627A (en)

Applications Claiming Priority (2)

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GB0611546.3 2006-06-12
GB0611546A GB2439529A (en) 2006-06-12 2006-06-12 Positioning device for laser micro-machining

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EP (1) EP2032302A1 (en)
JP (1) JP2010500173A (en)
KR (1) KR20090037994A (en)
CN (1) CN101605627A (en)
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TW (1) TW200819241A (en)
WO (1) WO2007144566A1 (en)

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PT2139049E (en) * 2008-06-25 2012-01-06 Atec Holding Ag Device for structuring a solar module
US8288678B2 (en) 2008-12-18 2012-10-16 Ppg Industries Ohio, Inc. Device for and method of maintaining a constant distance between a cutting edge and a reference surface
EP2347852A1 (en) * 2010-01-26 2011-07-27 ProLas GmbH Laser welding device for laser welding flat materials
CN103495805A (en) * 2013-09-27 2014-01-08 苏州德龙激光股份有限公司 Laser point printing device

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DE19627450C1 (en) * 1996-07-08 1997-07-10 Wemhoener Heinrich Gmbh Co Method for foil coating on one or both sides of plate-shaped workpieces in press
FR2802308B1 (en) * 1999-12-09 2002-03-08 Gc Comm LASER MACHINING METHOD AND DEVICE FOR LIGHT GUIDES, LIGHT GUIDES OBTAINED AND BACKLIGHT SCREENS INCORPORATING THESE GUIDES
FR2832945A1 (en) * 2001-11-30 2003-06-06 Technifor DEVICE FOR MACHINING WORKPIECES USING A LASER BEAM
GB2400063B (en) * 2003-04-03 2006-02-15 Exitech Ltd Positioning method and apparatus and a product thereof
EP1508428A1 (en) * 2003-08-22 2005-02-23 Leister Process Technologies Device for welding flat plastic materials
DE102004009950A1 (en) * 2004-03-01 2005-09-22 Innolas Gmbh Laser machining system has sheet metal workpieces held flat by creation of a cushion of compressed air
GB0427104D0 (en) * 2004-12-10 2005-01-12 Exitech Ltd Positioning device

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GB2439529A (en) 2008-01-02
GB0611546D0 (en) 2006-07-19
EP2032302A1 (en) 2009-03-11
WO2007144566A1 (en) 2007-12-21
TW200819241A (en) 2008-05-01
JP2010500173A (en) 2010-01-07
KR20090037994A (en) 2009-04-17

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