CN110449732A - A kind of laser-processing system and laser processing - Google Patents
A kind of laser-processing system and laser processing Download PDFInfo
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- CN110449732A CN110449732A CN201810426586.6A CN201810426586A CN110449732A CN 110449732 A CN110449732 A CN 110449732A CN 201810426586 A CN201810426586 A CN 201810426586A CN 110449732 A CN110449732 A CN 110449732A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
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Abstract
The invention discloses a kind of laser-processing system and laser processings, it is related to technical field of laser processing, it include: that processing platform places workpiece to be processed and workpiece to be processed is driven to move along a straight line, laser emits laser beam, light beam rotation system is set in the transmission optical path of the laser beam, the rotation axis and optical axis coincidence of the light beam rotation system, and the light beam rotation system is carried out rotation using the optical axis as rotary shaft and will deviate predetermined angle by the transmission direction of the laser beam of the light beam rotation system；Focus lamp is for focusing the laser beam to workpiece to be processed；Wherein, the linear motion of the rotary motion of the light beam rotation system and workpiece to be processed cooperates, so that the laser beam forms spiral machining locus on workpiece to be processed.Under the premise of can guaranteeing that light spot energy density is constant, expand the width of machining locus and can be realized abundant processing, to improve the processing yield of product.
Description
Technical field
The present invention relates to technical field of laser processing, more particularly to a kind of laser-processing system and laser processing side
Method.
Background technique
During laser processing, control laser beam and object to be processed generate relative motion so that laser beam to
Processing object surface or inside are processed according to certain track, and laser beam and material interact to form machining locus.
In a current application, need to process a wider groove using laser beam, width is about several hundred micro-
Rice, and the focal beam spot of laser beam generally only has ten a few to tens of microns, then, linear type is carried out using single focal beam spot
Processing be unable to satisfy the demand of big line width.
For this problem, a settling mode is swept back and forth toward multiple line using galvanometer progress, and process velocity is fast, but deposits
In acceleration and deceleration and pause, cause process velocity unstable, beam energy is caused to accumulate or unevenly, fail so that processing；
Another settling mode for increasing line width is the size for changing focal beam spot by adjusting the size of focal length, with big light
Beam directly carries out processing big line width, and increases spot size and will lead to the reduction of laser energy density, to be unable to fully add
Work goes out desired effect.
It is therefore desirable to propose the new laser processing mode of one kind to balance processing line width and guarantee higher machining energy density
Method.
Summary of the invention
It is an object of the invention to be directed to technical problem of the existing technology, provides a kind of laser-processing system and swash
Light processing method solves in current laser processing procedure, not can guarantee higher machining energy density while processing line width
The problem of.
In order to solve posed problems above, the technical solution adopted by the present invention are as follows:
The present invention provides a kind of laser-processing systems, comprising:
Processing platform for placing workpiece to be processed, and drives workpiece to be processed to move along a straight line；
Laser, for emitting laser beams；
Light beam rotation system is set in the transmission optical path of the laser beam, the rotation axis of the light beam rotation system with
Optical axis coincidence, and the light beam rotation system is rotated using the optical axis as rotary shaft, for that will turn by the light beam
The transmission direction of the laser beam of dynamic system deviates predetermined angle；
Focus lamp, laser beam focus for will be emitted via the light beam rotation system to workpiece to be processed；
Wherein, the linear motion of the rotary motion of the light beam rotation system and workpiece to be processed cooperates, so that institute
It states laser beam and forms spiral machining locus on workpiece to be processed.
As a further improvement of the present invention, the light beam rotation system includes wedge, for will turn from the wedge
The transmission direction of the laser beam of moving axis incidence deviates predetermined angle；
The light beam rotation system further includes the driving device connecting with the wedge, for driving the wedge with described
Optical axis is rotated as rotary shaft, so that being rotated by the laser beam of the wedge, circle is formed on workpiece to be processed
The machining locus of shape.
As a further improvement of the present invention, the quantity of the wedge setting is at least one.
As a further improvement of the present invention, one is formed between the laser beam of the wedge incidence and the laser beam of outgoing
Deflection angle, the deflection angle determine that the laser beam forms the size of machining locus on workpiece to be processed.
As a further improvement of the present invention, the wave-length coverage of the laser is 200-11000nm.
The present invention also provides a kind of laser processings, suitable for above-mentioned laser-processing system, comprising:
Workpiece to be processed is placed on processing platform；
It controls laser and emits laser beam, the laser beam is to be processed via focusing to after light beam rotation system and focus lamp
On workpiece；
Driving device is controlled the light beam rotation system and is rotated using optical axis as rotary shaft, and passes through moving parts control
Making the processing platform drives workpiece to be processed to move along a straight line, so that the laser beam forms spiral on workpiece to be processed
The machining locus of shape.
As a further improvement of the present invention, when the driving device drives all numbers of the light beam rotation system rotation big
Yu Yizhou, and when workpiece to be processed is kept fixed, the machining locus that the laser beam is formed on workpiece to be processed is circle.
As a further improvement of the present invention, when the driving device drives all numbers of the light beam rotation system rotation big
Yu Yizhou, and when workpiece to be processed is moved along a straight line under the drive of the processing platform, the laser beam is in work to be processed
The machining locus formed on part is spiral shape.
Compared with prior art, the beneficial effects of the present invention are:
In an embodiment of the present invention, the laser-processing system and laser processing are by being arranged the driving device
It drives the wedge to be rotated, forms circular machining locus on workpiece to be processed after the focus lamp；It is same with this
When, the moving parts drive the processing platform and workpiece to be processed to move along a straight line, and transport with the rotation of the wedge
Dynamic cooperation, can form spiral helicine machining locus, to swash with wider machining locus to workpiece on workpiece to be processed
Light processing.Under the premise of technical solution provided in an embodiment of the present invention can guarantee that light spot energy density is constant, expand machining locus
Width and can be realized abundant processing, to improve the processing yield of product.
Detailed description of the invention
It to describe the technical solutions in the embodiments of the present invention more clearly, below will be to needed in the embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for ability
For the those of ordinary skill of domain, without creative efforts, it can also be obtained according to these attached drawings other attached
Figure.
Fig. 1 is the structural block diagram of laser-processing system described in one embodiment of the invention；
Fig. 2 is the schematic diagram of wedge described in the embodiment of the present invention；
Fig. 3 is the schematic diagram of the double wedges of another embodiment of the present invention；
Fig. 4 is the machining locus schematic diagram of laser-processing system described in the embodiment of the present invention；
Fig. 5 is the step flow chart of laser processing described in the embodiment of the present invention.
Description of symbols:
| 100 | Processing platform |
| 200 | Laser |
| 300 | Light beam rotation system |
| 310 | Wedge |
| 311 | First wedge |
| 312 | Second wedge |
| 320 | Rotating device |
| 400 | Focus lamp |
| 500 | Beam expanding lens |
| 600 | Plane mirror |
| 700 | Moving parts |
Specific embodiment
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention
Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described.Obviously, described embodiment is only
A part of the embodiment of the present invention gives presently preferred embodiments of the present invention instead of all the embodiments in attached drawing.The present invention can
To realize in many different forms, however it is not limited to embodiment described herein, on the contrary, provide the mesh of these embodiments
Be to make the disclosure of the present invention more thorough and comprehensive.Based on the embodiments of the present invention, the common skill in this field
Art personnel every other embodiment obtained without creative efforts belongs to the model that the present invention protects
It encloses.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that in the limitation present invention.In description and claims of this specification and above-mentioned attached drawing
Term " includes " and " having " and their any deformations, it is intended that cover and non-exclusive include.Such as contain a system
The process, method, system, product or equipment of column step or unit are not limited to listed step or unit, but optional
Ground further includes the steps that not listing or unit, or optionally further comprising intrinsic for these process, methods, product or equipment
Other step or units.
Referenced herein " embodiment " is it is meant that a particular feature, structure, or characteristic described can wrap in conjunction with the embodiments
Containing at least one embodiment of the present invention.Each position in the description occur the phrase might not each mean it is identical
Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and
Implicitly understand, embodiment described herein can be combined with other embodiments.
It is a kind of structural block diagram of laser-processing system disclosed in the embodiment of the present invention, in diagram shown in referring to Fig.1
Arrow is the transmission direction of laser beam.
The laser-processing system includes processing platform 100, laser 200, light beam rotation system 300 and focus lamp
400；Workpiece to be processed is placed on the processing platform 100, and workpiece to be processed is driven to move along a straight line, it can be to work to be processed
Part is laser machined；For emitting laser beams, the light beam rotation system 300 is set to the laser to the laser 200
In the transmission optical path of beam, the rotation axis and optical axis coincidence of the light beam rotation system 300, and the light beam rotation system 300 with
The optical axis is rotated as rotary shaft, inclined for that will pass through the transmission direction of laser beam of the light beam rotation system 300
Move predetermined angle；The focus lamp 400 for will the laser beam focus that be emitted via the light beam rotation system 300 to be processed
On workpiece；Wherein, the linear motion of the rotary motion of the light beam rotation system 300 and workpiece to be processed cooperates, so that
The laser beam forms spiral machining locus on workpiece to be processed, to use the laser beam pair by machining locus
Workpiece to be processed is laser machined.
In the one or more possible embodiments of the present invention, workpiece to be processed be can be for display, solar-electricity
Glass, the semiconductor wafer in pond etc. etc..Specifically, workpiece to be processed can be the thin plate applied to display device etc., may be used also
To be the large-area substrates etc. applied to display device etc., but the not restriction to workpiece to be processed progress in the present embodiment,
I.e. laser-processing system described in the present embodiment can laser machine all workpiece that can be used for laser machining.In addition, ability
The technical staff in domain is it is to be appreciated that laser 200 described in the present embodiment can not pass through according to the selection of specific laser processing demand
The laser of type, including but not limited to gas, liquid, solid and semiconductor laser etc.；And the wavelength of the laser 200
Different types of laser is selected according to demand, specifically, the wave-length coverage of laser described in the present embodiment is 200-
11000nm.Certainly, the wavelength of the laser 200 is including but not limited to ultraviolet, visible light, near-infrared, far infrared etc., this hair
It is not intended to limit in bright.
In the one or more possible embodiments of the present invention, the light beam rotation system 300 includes wedge 310, described
Wedge 310 is used to the transmission direction of the laser beam of the rotation axis incidence from the wedge deviating predetermined angle.In addition, the light
Beam rotation system 300 further includes the driving device 320 connecting with the wedge 310, for driving the wedge 310 with the light
Axis is rotated as rotary shaft, so that being rotated by the laser beam of the wedge 310, and flat being placed in the processing
Circular machining locus is formed on the workpiece to be processed of platform 100.Driving device 320 described in the present embodiment is flat for hollow rotating
Platform, compared with the prior art used in DDMOTOR motor and Cam splitter, the hollow rotating platform has working efficiency
Height, precision is high, and rigidity is high, the high advantage of sexual valence；And the hollow rotating platform can allow servo motor or stepper motor is appointed
Angle of anticipating segmentation, can both meet the numerical digit control that Cam splitter is unable to reach, and positioning accuracy ratio DDMOTOR motor is more preferable.
It itself is rotated at high speed specifically, the driving device 320 passes through, and drives the wedge 310 connected to it
High speed rotation, and the laser beam of the outgoing of wedge 310 described in the present embodiment can generate certain angular deflection, and the wedge
The laser beam of 310 outgoing cooperates the focus lamp 340, also with high speed rotation to form machining locus on workpiece to be processed.
In the one or more possible embodiments of the present invention, between the laser beam of the incident laser beam and outgoing of the wedge 310
A deflection angle is formed, the deflection angle determines that the laser beam forms the size of machining locus on workpiece to be processed.
As shown in Fig. 2, the deflection angle is the angle between the extended line and shoot laser beam of the incoming laser beam of the wedge 310
A, in the present embodiment, the angle a can select the wedge of different angle of wedge sizes according to the specific requirements of the machining locus size,
It is defined in embodiments of the present invention not to this.Certainly, when the driving device 320 drives the light beam rotation system
All numbers of 300 rotations are greater than one week, and when workpiece to be processed is kept fixed, and what the laser beam was formed on workpiece to be processed adds
Work track is circle.
In the one or more possible embodiments of the present invention, in order to make the predetermined angle of the light beam rotation system 300
Deviate it is bigger, use is more flexible, wedge 310 described in the present embodiment setting quantity be at least one, such as can for two,
Three etc..As shown in figure 3, the quantity that the wedge 310 is arranged is two, the first wedge 311 and the second wedge are specifically included
322, it will be understood that first wedge 311 and the second wedge 322 are connected separately with the driving device 320, and pass through respectively
The driving device 320 drives first wedge 311 and the second wedge 322 to rotate together at high speed, first described in the present embodiment
Wedge 311 and the second wedge 322 are rotated by direction of rotation b, thus make finally from the second wedge 322 be emitted laser beam with
The incident direct deflection angle of laser beam of first wedge 311 is bigger, i.e., the described laser beam forms circle on workpiece to be processed
Machining locus diameter it is bigger.
In the one or more possible embodiments of the present invention, the laser-processing system further includes being set to the laser
In the transmission optical path of beam, and it is located at beam expanding lens 500 and plane mirror 600 before the light beam rotation system 300；It is described
Beam expanding lens 500 receives the laser beam that the laser 200 emits, and laser beam is expanded and collimated；The beam expanding lens 500
The laser beam received is imported into the plane mirror 600, the plane mirror 600 is used for the transmission direction to laser beam
It is reflected, the laser beam after reflection is imported the wedge 310 by the plane mirror 600, and right by the wedge 310
The incident angle of laser beam is deflected, and the plane mirror 600 adjusts the light of the laser beam with the wedge 310 cooperation
Road path；Laser beam after deflection is imported the focus lamp 340 by the wedge 310, and passes through the focus lamp 340 for laser
Beam is focused, and is applied on workpiece to be processed.
In an embodiment of the present invention, expanded by the laser beam that the beam expanding lens 500 emits the laser 200
After beam and collimation, smaller focal beam spot can be obtained, so that the laser 200 carries out accurate add on workpiece to be processed
Work；In order to obtain suitable focal beam spot, the quantity that the beam expanding lens 500 is arranged is multiple, and can be by multiple described
Independent assortment between beam expanding lens 500 obtains the focal beam spot for laser machining required suitable dimension；Therefore, of the invention
In the remaining embodiments, it if it is including technical effect that multiple beam expanding lens 500 equally realize the present embodiment, is considered to be pair
The deformation of beam expanding lens 500 described in the present embodiment, also belongs in the protection scope of the embodiment of the present invention.Certainly, the skill of this field
Art personnel it is to be appreciated that and in practical applications, the light channel structure of the laser-processing system is likely more complexity, such as: a variety of
Light channel structure in identical or different optical element combination cost implementation, and Fig. 1 example be it is of the invention it is a kind of compared with
Simple embodiment, and be not to be construed as being defined the light channel structure of the laser-processing system.
In the one or more possible embodiments of the present invention, laser beam can be carried out by the plane mirror 600
The reflection in direction, so that laser beam can import in the wedge 310 after reflection along the central axes of the wedge 310.
Specifically, the quantity that the plane mirror 600 is arranged is one or more, one or more plane mirrors are imported
After 600 laser beam is by reflection, the wedge 310 is imported along the central axes of the wedge 310；Referring to shown in Fig. 2, for this
A kind of structural block diagram of laser-processing system disclosed in another embodiment of invention, the quantity that plane mirror is arranged in the example shown
It is three, specifically, the plane mirror 600 includes the first plane mirror, second plane mirror and third plane
Reflecting mirror, it is anti-that laser beam successively imports first plane mirror, the second plane mirror and the third plane
After penetrating mirror, is reflected by the third plane mirror and import the wedge 310 along the central axes of the wedge 310.In addition,
It the position of first plane mirror, the second plane mirror and the third plane mirror can be according to the light
The position of wedge 310 is arranged, and can be arranged according to specific demand first plane mirror, the second plane mirror with
And the third plane mirror respectively with the tilt angle of horizontal plane.Certainly, those skilled in the art is it is to be appreciated that Fig. 2
Exemplary embodiment is another better embodiment of the invention, rather than is carried out to the quantity of plane mirror setting
It limits.
In the one or more possible embodiments of the present invention, the laser-processing system further includes moving parts 700, institute
It states moving parts 700 to connect with the processing platform 100, for controlling the processing platform 100 respectively along x-axis, y-axis or z
Axis direction linear motion, and drive the workpiece to be processed for being placed in the processing platform 100 respectively along x-axis, y-axis or z-axis side
To linear motion.Specifically, the moving parts 700 drive the processing platform 100 and are placed in the processing platform 100
Workpiece to be processed respectively along x-axis, y-axis or z-axis direction move along a straight line, cooperate the driving device 320 to drive the wedge
310 high speed rotations can form a spiral helicine machining locus (as shown in Figure 4) on workpiece to be processed.
Certainly, in the present embodiment, when the driving device drives all numbers of the light beam rotation system rotation to be greater than one
Week, and when workpiece to be processed is moved along a straight line under the drive of the processing platform, the laser beam is on workpiece to be processed
The machining locus of formation is spiral shape；Specifically, the speed of service of the moving parts 700 is less than the driving device 320
The speed of service, so that the shoot laser beam of the wedge 310 can form multiple circular machining locus on workpiece to be processed,
To make multiple circular machining locus combine to form spiral helicine machining locus, the laser processing to workpiece to be processed is realized.
In the one or more possible embodiments of the present invention, the laser beam that the laser 200 emits is after over-focusing
Wider machining locus can be obtained under the premise of not losing focal beam spot energy density in the size of the focal beam spot of formation, with
Workpiece to be processed is laser machined.For example, the focusing light that the laser beam that the laser 200 emits is formed after over-focusing
Spot size is 20um, and after the wedge 310, the size of the focal beam spot can reach 100um, and the driving device 320
It drives the wedge 310 and workpiece to be processed to move along a straight line respectively with described 700 the two of moving parts, it is folded to obtain uniform hot spot
Add effect, that is, forms spiral helicine machining locus；At this point, what the laser beam that the laser 200 emits was formed after over-focusing
The energy density of focal beam spot is constant, and directly expands the working (finishing) area of focal beam spot, can also carry out to workpiece to be processed abundant
Ground laser processing.Further, since driving device 320 employed in the embodiment of the present invention is hollow rotating platform, it can be very big
Degree eliminates the process of acceleration, deceleration, and its movement velocity is stablized, to guarantee consistent laser processing effect.
Certainly, in one or more possible embodiments of the invention, the laser-processing system further includes being arranged in institute
The blowning installation (not shown) on processing platform 100 is stated, compressed air, oxygen or nitrogen can be passed through by the external world in the blowning installation
Gas etc..In actual laser processing procedure, the blowning installation is toward blowing compressed air, oxygen or nitrogen on workpiece to be processed
Deng dedusting on workpiece to be processed.In addition, the blowning installation is toward being blown into compressed air and nitrogen also on workpiece to be processed
Cooling effect can be played, the blowning installation may also function as the work of accelerated material removal toward being blown into oxygen on workpiece to be processed
With.And gas is passed through by the external world in the blowning installation and is not limited to compressed air, oxygen or nitrogen etc., it can be also passed through helium etc.,
Also it can reach identical technical effect.
In one or more possible embodiments of the invention, the laser-processing system is by being arranged the driving device
320 drive the wedge 310 to be rotated, and form circular processing rail on workpiece to be processed after the focus lamp 340
Mark；At the same time, the moving parts 700 drive the processing platform 100 and workpiece to be processed to move along a straight line, and with institute
The rotary motion cooperation for stating wedge 310, can form spiral helicine machining locus, thus with wider processing on workpiece to be processed
Track laser machines workpiece.Technical solution provided in an embodiment of the present invention can guarantee the constant premise of light spot energy density
Under, expand the width of machining locus and can be realized abundant processing, to improve the processing yield of product.
Referring to Figure 5, for another embodiment of the present invention provides a kind of laser processing step flow chart, it is described
Laser processing is suitable for laser-processing system described in above-described embodiment.The laser processing includes:
S1: workpiece to be processed is placed on processing platform 100.
In this step, workpiece to be processed is placed on processing platform 100, and laser can be carried out to workpiece to be processed and is added
Work.Wherein, moving parts 700 connected to it are provided on the processing platform 100, the moving parts 700 are for controlling
The processing platform 100 moves along a straight line respectively along x-axis, y-axis or z-axis direction, and drives and be placed in the processing platform 100
Workpiece to be processed moves along a straight line respectively along x-axis, y-axis or z-axis direction.
S2: control laser emit laser beam, the laser beam via focused to after light beam rotation system and focus lamp to
In workpieces processing.
In this step, the laser beam that control laser 200 emits, and pass sequentially through light beam rotation system 300 and focus
It is focused on workpiece to be processed after mirror 400.Wherein, the light beam rotation system 300 is set to the transmission optical path of the laser beam
In, the rotation axis and optical axis coincidence of the light beam rotation system 300, and the light beam rotation system 300 using the optical axis as
Rotary shaft is rotated, and deviates predetermined angle for that will pass through the transmission direction of laser beam of the light beam rotation system 300；Institute
State focus lamp 400 for will the laser beam focus that is emitted via the light beam rotation system 300 to workpiece to be processed.
In the one or more possible embodiments of the present invention, the light beam rotation system 300 includes wedge 310, described
Wedge 310 is used to the transmission direction of the laser beam of the rotation axis incidence from the wedge deviating predetermined angle.In addition, the light
Beam rotation system 300 further includes the driving device 320 connecting with the wedge 310, for driving the wedge 310 with the light
Axis is rotated as rotary shaft, so that being rotated by the laser beam of the wedge 310.Certainly, institute is worked as in the present embodiment
It states all numbers that driving device 320 drives the light beam rotation system 300 to rotate to be greater than one week, and workpiece to be processed is kept fixed
When, the machining locus that the laser beam is formed on workpiece to be processed is circle.
In the one or more possible embodiments of the present invention, in order to make the predetermined angle of the light beam rotation system 300
Deviate it is bigger, use is more flexible, wedge 310 described in the present embodiment setting quantity be at least one, such as can for two,
Three etc..As shown in figure 3, the quantity that the wedge 310 is arranged is two, the first wedge 311 and the second wedge are specifically included
322, it will be understood that first wedge 311 and the second wedge 322 are connected separately with the driving device 320, and pass through respectively
The driving device 320 drives first wedge 311 and the second wedge 322 to rotate together at high speed, first described in the present embodiment
Wedge 311 and the second wedge 322 are rotated by direction of rotation b, thus make finally from the second wedge 322 be emitted laser beam with
The incident direct deflection angle of laser beam of first wedge 311 is bigger, i.e., the described laser beam forms circle on workpiece to be processed
Machining locus diameter it is bigger.
In the one or more possible embodiments of the present invention, the laser-processing system further includes being set to the laser
In the transmission optical path of beam, and it is located at beam expanding lens 500 and plane mirror 600 before the light beam rotation system 300；It is described
Beam expanding lens 500 receives the laser beam that the laser 200 emits, and laser beam is expanded and collimated；The beam expanding lens 500
The laser beam received is imported into the plane mirror 600, the plane mirror 600 is used for the transmission direction to laser beam
It is reflected, the laser beam after reflection is imported the wedge 310 by the plane mirror 600, and right by the wedge 310
The incident angle of laser beam is deflected, and the plane mirror 600 adjusts the light of the laser beam with the wedge 310 cooperation
Road path.
S3: driving device is controlled the light beam rotation system and is rotated using optical axis as rotary shaft, and passes through exercise group
Part controls the processing platform and workpiece to be processed is driven to move along a straight line, so that the laser beam is formed on workpiece to be processed
Spiral machining locus.
In this step, the driving device 320 is controlled the light beam rotation system 300 and is carried out using optical axis as rotary shaft
Rotation, and control the processing platform 100 by moving parts 700 and workpiece to be processed is driven to move along a straight line, so that described
Laser beam forms spiral machining locus on workpiece to be processed.
Specifically, the laser-processing system further includes moving parts 700, the moving parts 700 and the processing are flat
Platform 100 connects, and moves along a straight line for controlling the processing platform 100 respectively along x-axis, y-axis or z-axis direction, and drive placement
It moves along a straight line in the workpiece to be processed of the processing platform 100 respectively along x-axis, y-axis or z-axis direction.Specifically, the movement
Component 700 drives the processing platform 100 and is placed in the workpiece to be processed of the processing platform 100 respectively along x-axis, y
Axis or z-axis direction linear motion, cooperate the driving device 320 to drive 310 high speed rotation of wedge, can be in work to be processed
A spiral helicine machining locus (as shown in Figure 4) is formed on part.Certainly, in the present embodiment, when the driving device drives
All numbers of the light beam rotation system rotation are greater than one week, and workpiece to be processed carries out straight line under the drive of the processing platform
When movement, the machining locus that the laser beam is formed on workpiece to be processed is spiral shape.Certainly, when the drive in the present embodiment
All numbers that dynamic device 320 drives the light beam rotation system 300 to rotate are greater than one week, and workpiece to be processed is in the processing platform
When being moved along a straight line under 100 drive, the machining locus that the laser beam is formed on workpiece to be processed is spiral shape.
In one or more possible embodiments of the invention, the laser processing is by placing workpiece to be processed
In on processing platform 100；It controls laser 200 and emits laser beam, the laser beam is via light beam rotation system 300 and focus lamp
It is focused on workpiece to be processed after 400；Driving device 320 control the light beam rotation system 300 using optical axis as rotary shaft into
Row rotation, and control the processing platform 100 and workpiece to be processed is driven to move along a straight line, so that the laser beam is to be processed
Spiral machining locus is formed on workpiece.Technical solution provided in an embodiment of the present invention can guarantee that light spot energy density is constant
Under the premise of, expand the width of machining locus and can be realized abundant processing, to improve the processing yield of product.
Display device provided by above-described embodiment can be performed in the processing unit (plant) of display device described in the embodiment of the present invention
Processing method, the processing unit (plant) of the display device has the corresponding function of processing method of display device described in above-described embodiment
Energy step and beneficial effect, referring specifically to the embodiment of the processing method of aforementioned display device part, the embodiment of the present invention is herein
It repeats no more.
In above-described embodiment provided by the present invention, it should be understood that disclosed system and method can pass through it
Its mode is realized.For example, system embodiment described above is only schematical, for example, the division of described device, only
Only a kind of logical function partition, there may be another division manner in actual implementation, for example, multiple devices or component can be tied
Another system is closed or is desirably integrated into, or some features can be ignored or not executed.
The device as illustrated by the separation member or component may or may not be physically separated, as
The component that device or component are shown may or may not be physical unit, both can be located in one place, or can also
To be distributed over a plurality of network elements.Some or all of device or component therein can be selected according to the actual needs real
The purpose of existing this embodiment scheme.
The above is only the embodiment of the present invention, are not intended to limit the scope of the patents of the invention, although with reference to the foregoing embodiments
Invention is explained in detail, still can be to aforementioned each specific reality for coming for those skilled in the art
It applies technical solution documented by mode to modify, or equivalence replacement is carried out to part of technical characteristic.It is all to utilize this
The equivalent structure that description of the invention and accompanying drawing content are done directly or indirectly is used in other related technical areas, similarly
Within the invention patent protection scope.
Claims (8)
1. a kind of laser-processing system characterized by comprising
Processing platform for placing workpiece to be processed, and drives workpiece to be processed to move along a straight line；
Laser, for emitting laser beams；
Light beam rotation system is set in the transmission optical path of the laser beam, the rotation axis and optical axis of the light beam rotation system
It is overlapped, and the light beam rotation system is rotated using the optical axis as rotary shaft, for the light beam rotation system will to be passed through
The transmission direction of the laser beam of system deviates predetermined angle；
Focus lamp, laser beam focus for will be emitted via the light beam rotation system to workpiece to be processed；
Wherein, the linear motion of the rotary motion of the light beam rotation system and workpiece to be processed cooperates, so that described swash
Light beam forms spiral machining locus on workpiece to be processed.
2. laser-processing system according to claim 1, which is characterized in that the light beam rotation system includes wedge, is used
In the transmission direction of the laser beam of the rotation axis incidence from the wedge is deviated predetermined angle；
The light beam rotation system further includes the driving device connecting with the wedge, for driving the wedge with the optical axis
It is rotated as rotary shaft, so that being rotated by the laser beam of the wedge, is formed on workpiece to be processed circular
Machining locus.
3. laser-processing system according to claim 2, which is characterized in that the quantity of the wedge setting is at least one
It is a.
4. laser-processing system according to claim 3, which is characterized in that the laser beam of the wedge incidence and outgoing
A deflection angle is formed between laser beam, the deflection angle determines that the laser beam forms processing rail on workpiece to be processed
The size of mark.
5. laser-processing system according to claim 1, which is characterized in that the wave-length coverage of the laser is 200-
11000nm。
6. a kind of laser processing is suitable for the described in any item laser-processing systems of claim 1-5, which is characterized in that
Include:
Workpiece to be processed is placed on processing platform；
It controls laser and emits laser beam, the laser beam is via focusing to workpiece to be processed after light beam rotation system and focus lamp
On；
Driving device is controlled the light beam rotation system and is rotated using optical axis as rotary shaft, and controls institute by moving parts
State processing platform drive workpiece to be processed move along a straight line so that the laser beam formed on workpiece to be processed it is spiral
Machining locus.
7. laser processing according to claim 6, it is characterised in that: when the driving device drives the light beam to turn
All numbers of dynamic system rotation are greater than one week, and when workpiece to be processed is kept fixed, the laser beam is formed on workpiece to be processed
Machining locus be circle.
8. laser processing according to claim 6, it is characterised in that: when the driving device drives the light beam to turn
All numbers of dynamic system rotation are greater than one week, and when workpiece to be processed is moved along a straight line under the drive of the processing platform, institute
Stating the machining locus that laser beam is formed on workpiece to be processed is spiral shape.
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| CN201810426586.6A CN110449732A (en) | 2018-05-07 | 2018-05-07 | A kind of laser-processing system and laser processing |
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