CN101594749A - The manufacture method of electric conductor for interlayer connection - Google Patents
The manufacture method of electric conductor for interlayer connection Download PDFInfo
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- CN101594749A CN101594749A CNA2009101389641A CN200910138964A CN101594749A CN 101594749 A CN101594749 A CN 101594749A CN A2009101389641 A CNA2009101389641 A CN A2009101389641A CN 200910138964 A CN200910138964 A CN 200910138964A CN 101594749 A CN101594749 A CN 101594749A
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Abstract
The invention provides the manufacture method of the electric conductor for interlayer connection (5) in a kind of through hole (4) that is configured in the insulating barrier (1).Fill the mixed powder of silver particles and tin particle in the enclosure space that is made of mould parts (21) and moving-member (22), these mould parts have and the corresponding slot part of electric conductor shape that will form; Described moving-member is relatively moved with near described mould parts, to being filled into the mixed powder pressurization in the described enclosure space and being pressed into the slot part of described mould parts; Make at the mixed powder of side members (20) on remaining in described mould parts surface that constitutes described enclosure space between described mould parts and the described moving-member and on described mould parts, slide, thereby will fail to enter the slot part of described mould parts and the mixed powder that remains on the described mould parts surface cuts off from the mixed powder of the slot part that is pressed into described mould parts; Take out electric conductor for interlayer connection from the slot part of described mould parts.
Description
Technical field
The present invention relates to the manufacture method of the electric conductor in a kind of through hole that is disposed in the insulating barrier, be used for multilayer printed board at alternately laminated wiring layer and insulating barrier and adjacent wiring layer is carried out interlayer be connected.
Background technology
In multilayer printed board in the past, for example as U.S. Patent bulletin 6,889, it is such that 433 (corresponding to TOHKEMY 2001-24323 communiques) are put down in writing, filled conductive cream in the through hole that in resin molding, forms as insulating barrier, the interlayer that uses this conductive paste to carry out adjacent wiring layer (circuit pattern layer) connects, and this conductive paste is to be mixed into to stir in the solvent and to form add material that electroconductive stuffing, resin particle obtain in the conductivity metallic.
Wherein, when filled conductive cream in through hole, paste diaphragm on the surface that is packed into the resin molding of oral-lateral as conductive paste of through hole, so that on the surface of the non-cohesive resin molding beyond through hole of conductive paste.In order on the resin molding of having pasted diaphragm like this, to form through hole, for example from diaphragm side irradiating laser.By the irradiation of this laser, form the circuit pattern layer that forms on the face with resin molding and stickup face opposition side diaphragm the bottom outlet that has as the bottom surface.This there is bottom outlet as through hole, filled conductive cream in this through hole.And, behind filled conductive cream, peel off diaphragm from resin molding, obtain having filled in the through hole resin molding of conductive paste.
As in the past, under the situation of using diaphragm filled conductive cream in through hole, at first need on diaphragm and resin molding, to form the bottom outlet that has as through hole by laser processing etc.Certainly lead to the processing bits when this has bottom outlet in formation.At this, conductive paste is coated on the diaphragm, utilize bristle etc. to be pressed in the through hole and fill.Therefore, if on the surface of processing bits attached to diaphragm, then when filled conductive cream in through hole, might be brought in the conductive paste by these processing bits.If this processing bits are sneaked in the conductive paste that is filled in the through hole, will become the reason of the reliability that reduces the interlayer connection.Therefore, must frequently change conductive paste, cause manufacturing cost to raise.
And, when peeling off diaphragm, have to produce bursting apart and possibility that conductive paste drops of conductive paste on resin molding.In this case, can expect to reduce the connection reliability that interlayer connects, or produce problem such as poor short circuit.
Summary of the invention
The present invention proposes in view of this problem, and its purpose is, a kind of manufacture method of electric conductor for interlayer connection is provided, and can improve the connection reliability that interlayer connects on multilayer printed board.
Manufacture method based on the electric conductor for interlayer connection of a mode of the present invention, in the multilayer printed board of alternately laminated wiring layer and insulating barrier, this electric conductor for interlayer connection is configured in the interior through hole of insulating barrier, be used for that adjacent wiring layer is carried out interlayer and connect, the manufacture method of described electric conductor for interlayer connection comprises filling work procedure, the operation of pressurizeing, cut off operation and take out operation.At filling work procedure, in enclosure space, fill the mixed powder of silver particles and tin particle, the one side of described enclosure space is made of the mould parts of the corresponding slot part of the electric conductor shape that has and will form, and the face relative with these mould parts is by constituting with respect to the moving-member that described mould parts relatively move.In the pressurization operation, described moving-member is relatively moved with near described mould parts, the mixed powder that is filled in the described enclosure space is pressurizeed, and be pressed into the slot part of described mould parts.Cutting off operation, after described pressurization operation, make at the mixed powder of side members on remaining in described mould parts surface that constitutes described enclosure space between described mould parts and the described moving-member and on described mould parts, slide, thereby will not enter the slot part of described mould parts fully and the mixed powder that remains on the described mould parts surface cuts off from the mixed powder of the slot part that is pressed into described mould parts.Taking out operation, taking out the electric conductor that constitutes by the shape described mixed powder corresponding with this slot part from the slot part of described mould parts.
In the manufacture method of this electric conductor, make the corresponding electric conductor of shape in advance with the through hole of insulating barrier.And, in each through hole of insulating barrier, dispose 1 electric conductor of making so respectively.Therefore, the processing bits can not sneaked in the electric conductor.And, do not use diaphragm in the through hole of insulating barrier, to dispose electric conductor, so the conductive paste that also can not produce when peeling off diaphragm bursts apart etc.Therefore, can suppress the reliability decrease that interlayer connects.
Manufacture method based on the electric conductor of other modes of the present invention, this electric conductor is configured in the interior through hole of insulating barrier, be used for multilayer printed board at alternately laminated wiring layer and insulating barrier and adjacent wiring layer is carried out interlayer be connected, described manufacture method comprises printing process, heating process and recovery process.At printing process, the conductive paste that printing makes silver particles and tin mix particles in the solvent on refractory plate, the electric conductor shape corresponding shape that makes it have and will form.In heating process, utilize steam-type solder reflow soldering device, will be printed with the temperature of time more than the fusing point of described tin particle of the refractory plate heating several seconds level of described conductive paste.At recovery process, reclaim the electric conductor that solidifies by described heating from described refractory plate.
In the manufacture method of this electric conductor, make the corresponding electric conductor of shape in advance with the through hole of insulating barrier.In each through hole of insulating barrier, dispose 1 electric conductor of making so respectively.Therefore, the processing bits can not sneaked in the electric conductor.And, do not use diaphragm in the through hole of insulating barrier, to dispose electric conductor, so the conductive paste that also can not produce when peeling off diaphragm bursts apart etc.Therefore, can suppress the reliability decrease that interlayer connects.
Description of drawings
Above-mentioned purpose of the present invention and other purposes, feature and advantage, it will be clearer and more definite reaching following concrete record with reference to the accompanying drawings.
Figure 1A～1F is each process profile that is used to illustrate each manufacturing process of multilayer printed board.
Fig. 2 is the profile that is used to illustrate based on the powder filled operation of the manufacture method of the electric conductor for interlayer connection of the 1st execution mode of the present invention.
Fig. 3 is the profile that is used to illustrate the pressurization operation.
Fig. 4 is expression by the be shaped profile of state of mixed powder of described pressurization operation.
Fig. 5 is used to illustrate the profile that cuts off operation.
The figure of Fig. 6 state that to be expression unload the particle mould from housing.
Fig. 7 is the profile that is used to illustrate heating process.
Fig. 8 is used to illustrate that particle takes out the profile of operation.
Fig. 9 A, Fig. 9 B are the figure of expression by the electric conductor 5 of each operation manufacturing of Fig. 2～Fig. 8.
Figure 10 is the figure that is used to illustrate based on the printing process of the manufacture method of the electric conductor for interlayer connection of the 2nd execution mode.
Figure 11 is the figure of the state finished of expression printing process.
Figure 12 is the state of sheet mask is taken off in expression from refractory plate figure.
Figure 13 is that expression is used for the reflux figure of steam-type solder reflow soldering device of heating of the refractory plate that is printed with conductive paste.
Figure 14 is the figure that expression is used for separating and reclaiming from refractory plate the device of electric conductor.
Figure 15 A is the figure of the electric conductor that obtains when adopting terpinol as the 1st solvent of expression.
Figure 15 B is the figure of the electric conductor that obtains when adopting solder flux (flux) as the 1st solvent of expression.
Figure 16 A is the enlarged drawing of the electric conductor shown in the presentation graphs 15A.
Figure 16 B is the enlarged drawing of the electric conductor shown in the presentation graphs 15B.
Figure 17 A is the figure that is illustrated in section when using the electric conductor that obtains when adopting terpinol as the 1st solvent that circuit pattern interlayer adjacent in the multilager base plate is connected, electric conductor.
Figure 17 B is the figure that is illustrated in section when using the electric conductor that obtains when adopting solder flux as the 1st solvent that circuit pattern interlayer adjacent in the multilager base plate is connected, electric conductor.
Embodiment
At first, use Figure 1A～Fig. 1 F explanation to use a example according to manufacture method electric conductor for interlayer connection, multilayer printed board of each execution mode manufacturing according to the present invention.
Shown in Figure 1A, at first prepare on a side surface, to have pasted film as the metal level 2 of conductor as the resin molding 1 of insulating properties base material.Resin molding 1 for example is the thick thermoplastic resin films of 25～75 μ m, and it comprises the polyether-ether-ketone resin of 65～35 weight % and the polyetherimide resin of 35～65 weight %.Metal level 2 for example utilizes the thick Copper Foil of 18 μ m to form.
Then, implement circuit pattern and form operation, form the circuit pattern 3 that utilizes conductor to constitute on the surface of resin molding 1.Circuit pattern forms operation and can be undertaken by etching, printing, evaporation, plating etc., in the present embodiment, shown in Figure 1B, metal level on the resin molding 1 that sticks on Figure 1A 2 is carried out etching, make metal level 2 form desired pattern 3, form the 1st circuit pattern layer (wiring layer) 10 in one side.
Then, shown in Fig. 1 C,, thereby form a plurality of with the through hole that the end is arranged 4 (through hole formation operation) of circuit pattern 3 as the bottom surface at resin molding 1 to the surface irradiation carbon dioxide laser of the side that circuit pattern layer 10 is not set of resin molding 1.The opening diameter of each through hole 4 for example is about 100 μ m～150 μ m, is that the electric conductor (particle) 5 that will be in the back disposes in the electric conductor arrangement step of narration is accommodated in the size in the through hole 4.That is, the opening size of through hole 4 forms slightly greater than the maximum gauge part that forms columned electric conductor 5.
The position of the bottom surface that becomes through hole 4 of circuit pattern 3 becomes the position of the electrode that is used for interlayer connecting circuit pattern 3 with a plurality of resin molding 1 multiple stratification the time.When forming through hole 4, output by suitable adjustment carbon dioxide laser and irradiation time etc. make circuit pattern 3 not perforates.
When forming through hole 4, except that using carbon dioxide laser, can also use excimer laser etc.Though also can adopt the through hole formation methods such as brill processing beyond the laser, add the hole that can form minute diameter man-hour in the perforate of adopting laser beam, cause excessive damage for circuit pattern 3, so be preferred.
Then, shown in Fig. 1 D, dispose an electric conductor 5 (electric conductor arrangement step) respectively at each through hole 4.Electric conductor 5 for example can use the metal mask that has through hole in the formation position of through hole 4 to be configured in the through hole 4.Specifically, on metal mask, place a plurality of electric conductors 5, utilize the such bristle of rubber rollers that electric conductor 5 is moved.At this moment, in the position that is formed with through hole of metal mask, electric conductor 5 falls into through hole 4.Thus, can dispose an electric conductor 5 respectively to each through hole 4.And,, also can not use metal mask, and utilize bristle etc. that electric conductor 5 is moved on resin molding 1, and reclaim residual unnecessary electric conductor 5 for configuration electric conductor 5 in through hole 4.
The electric conductor 5 of the state of preferred this electric conductor arrangement step configuration is and the surperficial identical height of the opening edge portion of through hole 4 or outstanding a little, so that when stacked each resin molding 1, can carry out reliably and being electrically connected of the circuit pattern of adjacent resin molding 1.And, in through hole 4, preferably between the outer peripheral face of the inner peripheral surface of through hole 4 and electric conductor 5, be formed with the gap.This is for configuration electric conductor 5 in through hole 4 easily, and when electric conductor 5 was out of shape, electric conductor 5 can be out of shape with the above-mentioned gap of landfill.
Then, shown in Fig. 1 E, stacked a plurality of resin moldings of making by the operation of Figure 1A～Fig. 1 D 1, this resin molding 1 is formed with circuit pattern 3 in one side, and disposes electric conductor 5 in through hole 4.And, utilize not shown heating in vacuum stamping machine, under vacuum condition, heat and pressurization from the duplexer of upper and lower surface to stacked a plurality of resin moldings 1.In this heating and pressurizing operation, for example the duplexer with resin molding 1 is heated to 250～350 ℃, and with the exert pressure of 1～10MPa 10～20 minutes.
By above-mentioned heating and pressurizing operation, a plurality of resin molding 1 mutual hot melt adhesions become one.In addition, the electric conductors 5 in the through hole 4 are sintered, and with circuit pattern 3 metal bond that are positioned at its two ends.Specifically, silver particles in the electric conductor 5 and tin particle alloying, and the mutual solid-state diffusion of copper component of the Copper Foil of the tin composition of electric conductor 5 and forming circuit pattern 3 are at the interface formation solid-state diffusion layer of electric conductor 5 with circuit pattern 3.Thus, obtain the multilayer printed board 100 that adjacent circuit pattern 3 is connected by electric interlayer by electric conductor 5.
(the 1st execution mode)
Below, the manufacture method of the electric conductor for interlayer connection 5 of the 1st execution mode of the present invention is described.At first, use Fig. 2 that the manufacturing installation of electric conductor 5 is described.
In Fig. 2, punch die 20 forms roughly tubular.Comprise the mixed powder of silver particles and tin particle inner input of this tubular, and keep this mixed powder.The mixed powder of Shi Yonging comprises silver particles and tin particle as mentioned above in the present embodiment.But silver particles silver particles under its original state is fixed easily each other, so in the hard ester acid of its surface applied as dispersion.Thus, the mixed powder that has mixed silver particles and tin particle can keep good flowability.In addition, do not need in the present embodiment to make the mixed powder pasteization, so mixed powder does not comprise any solvent etc.
But as hereinafter described, punch die 20 need be along sliding on the surface of particle mould 21 with the surperficial parallel direction of particle mould 21.Therefore, between housing 25 and punch die 20, be provided with gap 26 along this glide direction.
Like this, although between housing 25 and punch die 20, be provided with gap 26, when making the slip that punch die 20 slides, from the left and right sides both direction movable rod 24 is inserted housings 25, so that punch die 20 can be remained on the housing 25.The front end butt of this movable rod 24 is to the outer surface of punch die 20, so even there is gap 26, punch die 20 also can be kept so that its position does not misplace by housing 25 (movable rod 24).Movable rod 24 for example is threaded in the thread groove that is formed at housing 25, and to a direction rotation time, leading section deeper enters in the housing 25, retreats when rotating round about.
The method of the manufacturing installation manufacturing electric conductor 5 that uses the electric conductor 5 that constitutes as mentioned above is described.
At first, as shown in Figure 2, the front end butt of movable rod that makes the left and right sides remains on punch die 20 on the housing 25 securely to punch die 20.And,,, then drift 22 is inserted punch dies 20 (powder filled operation) with the inside that the mixed powder of silver particles and tin particle drops into punch die 20 from the peristome of drift 22 insertion punch dies 20.Thus, the formation mixed powder is filled into the state in the enclosure space that is formed by punch die 20, particle mould 21 and drift 22.
Utilize the manufacturing installation of not shown decompressor,, drift 22 relative particle moulds 21 are relatively moved, the mixed powder (pressurization operation) of pressurization enclosure space inside according to shown in Figure 3 from above-below direction clamping electric conductor 5.Thus, the mixed powder in the enclosure space is pressed into the slot part of particle mould 21.At this moment, for example the load that mixed powder is applied more than the 150MPa compresses, and keeps about 90 seconds.As a result, mixed powder is compressed by brute force, and therefore as shown in Figure 4, mixed powder is shaped densely very close to each otherly and engages.Therefore, can fully guarantee to utilize the mechanical strength and the shape retention of the formed electric conductor 5 of slot part of particle mould 21, the conductivity in the time of can improving electric conductor and be configured in the through hole.
When above-mentioned pressurization operation finishes, the manufacturing installation of electric conductor 5 is unloaded from decompressor.And, according to shown in Figure 5, make movable rod 24 rotations, make punch die 20 move several millimeters relative to particle mould 21.At this moment, punch die 20 is to being limited by housing 25 with the moving of direction of the Surface Vertical of particle mould 21, so do not sliding mobile on the surface of particle mould 21 from particle mould 21 when punch die 200 with rising.And, when punch die 20 is moved, still be in the state that drift 22 is inserted into punch die 20, so drift 22 is also along moving with the surperficial parallel direction of particle mould 21.
Like this, when punch die 20 moves with the surperficial parallel direction of particle mould 21 with drift 22 edges, 22 that keeping by punch die 20 and drift, as to remain in particle mould 21 lip-deep mixed powder, with punch die 20 and drift 22 together along moving with the surperficial parallel direction of particle mould 21.
At this, in above-mentioned pressurization operation, drift 22 pressurizations are filled in the mixed powder integral body in the enclosure space.Therefore, mixed powder can be pressed into densely the slot part of particle mould 21, but then, the interior mixed powder of slot part that causes being pressed into particle mould 21 becomes one with the lip-deep mixed powder that remains in particle mould 21.
Therefore, in the present embodiment as mentioned above, implement to cut off operation, make punch die 20 move (slip) with the mixed powder that is keeping edge together with the surperficial parallel direction of particle mould 21 with drift 22.Thus, mixed powder in the slot part that become one, particle mould 21 in the pressurization operation and the lip-deep mixed powder that remains in particle mould 21 can be cut off.
Especially in the present embodiment, under the state that utilizes drift 22 pressurization mixed powders, implement the above-mentioned operation that cuts off, so in slot part, rise cutting off the mixed powder that operation can suppress in the slot part of particle mould 21.As a result, can be roughly the lip-deep mixed powder of mixed powder in the slot part and particle mould 21 be cut off along the surface of particle mould 21.
After implementing to cut off operation, as shown in Figure 6, particle mould 21 is taken out from housing 25 each pedestal 23.The particle mould 21 that takes out is placed in as shown in Figure 7 and heats (heating process) on the heater 30.This heating process was for example carried out 3～5 minutes under fusing point (the about 70 ℃) temperature high, 120～150 ℃ than hard ester acid.
As mentioned above, silver particles is because particle is fixed easily each other, so silver particles descends easily as the mobile of powder under its original state.Therefore, in the present embodiment,, guarantee the flowability of mixed powder in the hard ester acid of the surface applied of silver particles as dispersion.But, when the pressurization mixed powder becomes one it, on the contrary might be because this hard ester acid makes engaging force weaken.Therefore,, after cutting off operation, implement heating process, particle mould 21 is heated to the temperature that can make hard ester acid fusion according to top described.Thus, in mixed powder, can promote each other fixed of silver particles,, can further improve mechanical strength and shape-retaining force so the engaging force of mixed powder strengthens.
After heating process, according to shown in Figure 8, from the slot part taking-up electric conductor (particle) 5 of particle mould 21.This taking-up operation for example under the state that particle mould 21 is installed on the particle assembling supporting member 31, applies external force and makes 21 bendings of particle mould.In the present embodiment,, be formed with a plurality of slot parts at particle mould 21 in order to improve productivity, and the diameter of each slot part (size of electric conductor) very little (for example diameter 100 μ m～150 μ m).Therefore, compare each electric conductor (particle) 5 and apply certain external force it is taken out from particle mould 21, apply external force and make 21 bendings of particle mould take out electric conductor 5 easier enforcements and effectively.
By implementing each above-mentioned operation, can obtain to be used to carry out that the interlayer of multilayer printed board connects, with the corresponding electric conductor 5 of shape of the through hole of resin molding 1.
At this, Fig. 9 A, Fig. 9 B represent the example by the electric conductor 5 of above-mentioned each operation manufacturing.Can observe the mixed powder that comprises silver particles and tin particle according to Fig. 9 A, Fig. 9 B and form very fine and close cylindrical shape.Learn thus and can obtain reliability of electrical connection, the equal favorable conductive body 5 of durability.
As mentioned above, in the manufacture method of the electric conductor 5 of present embodiment, unlike in the past,, but made the corresponding electric conductor of shape with the through hole of insulating barrier in advance, so that can be to adjacent wiring layer interlayer connection at the through hole filled conductive cream of resin molding (insulating barrier).The electric conductor of Zhi Zaoing disposes one respectively in each through hole of insulating barrier like this.Therefore, the processing bits can not be blended in the electric conductor.And, owing to do not use diaphragm in the through hole of insulating barrier, to dispose electric conductor, so can not produce bursting apart of conductive paste when peeling off diaphragm yet.Based on this reason, the electric conductor of the shape by using corresponding through hole in advance can suppress the reliability decrease that interlayer connects.
(the 2nd execution mode)
Below, the manufacture method of the electric conductor for interlayer connection 5 of the 2nd execution mode of the present invention is described.
At first, as shown in figure 10, sheet mask 122 is placed on the refractory plate 121, this sheet mask 122 is formed with a plurality of hole portions 123 corresponding with the shape of the electric conductor 5 that will form.For example, sheet mask 122 utilizes metal metal mask to constitute, and refractory plate utilizes the peucinous plate of fluororesin and teflon (registered trade mark) resin etc. to constitute.
And, as shown in figure 10, using the such bristle 124 of rubber rollers, the conductive paste 125 that will make silver particles and tin mix particles in the 1st solvent is filled in a plurality of hole portion 123 of sheet mask 122.Amount of contraction when the opening diameter of the hole portion 123 of sheet mask 122 and thickness are for example considered heating is made as Φ 150 μ m * 60 μ m.And conductive paste 125 is to be to make in the terpinol silver particles and tin mix particles a kind of of monoterpenol.Applied the dispersion that comprises hard ester acid for silver particles, fixed each other to prevent silver particles.Thus, silver particles and tin particle are distributed in the 1st solvent equably.
As shown in figure 11, after the filling of the hole of sheet mask 122 one 123 is finished, as shown in figure 12, sheet mask 122 is moved at conductive paste 125 along the vertical direction of the printing surface with conductive paste 125 of refractory plate 121.Like this, when sheet mask 122 is finished in the filling of conductive paste 125, removed from refractory plate 121.As a result, printing forms the shape conductive paste 125 corresponding with desired electric conductor shape on refractory plate 121.
Utilize steam-type solder reflow soldering device (VPS device) 130 shown in Figure 13, the refractory plate 121 that has printed conductive paste 125 is implemented the heating that refluxes.That is, when conductive paste 125 was heated, sheet mask 122 was removed, and also exposed the side of conductive paste 125.VPS device 130 can be as known, make its gasification by utilizing heater 131 heating fluorine class inert fluids 132, and as thermal medium, heating refluxes under the temperature corresponding to the boiling point of fluorine class inert fluid 132 this steam.In addition, in this VPS device 130, can be according to the type change backflow heating-up temperature of the liquid that uses.And,, thereby also can regulate the backflow heating-up temperature by amount according to the temperature change steam of the heater 131 of heating fluorine class inert fluid 132.Because when the amount increase and decrease of steam, the heat that offers workpiece by steam also increases and decreases, so can regulate the backflow heating-up temperature.
In the present embodiment, the refractory plate 121 that utilizes VPS device 130 will print conductive paste 125 in the short time of several seconds level is heated to the temperature more than the fusing point (about 232 ℃) of tin.At this, said several seconds level refer to more than or equal to 1 second less than 10 seconds, for example 3 seconds.
As mentioned above, form at laminated resin film 1 in the heating and pressurizing operation of multilager base plate 100, the electric conductor 5 that is configured in the through hole 4 of resin molding 1 need be with resin molding 1 distortion.In other words, refer to that in electric conductor 5 tin and silver needs are respectively so that independently composition is residual.This be because if tin and silver so that independently composition is residual, then in being used to form the heating and pressurizing operation of multilager base plate 100, the fusion of tin composition is so electric conductor 5 can be out of shape.If the roughly whole alloy that comprises tin and silver of electric conductor 5, then its fusing point becomes very high (more than 400 ℃), and electric conductor 5 becomes stone.Therefore, in above-mentioned heating and pressurizing operation, the distortion of electric conductor 5 becomes difficulty, and can not with circuit pattern 3 metal bond, connection reliability obviously descends.
About this point, in the present embodiment, utilize VPS device 130 with 125 of the conductive pastes short time of heating several seconds, so with the part that is only limited to the tin particle of silver particles alloying.Therefore, in the electric conductor 5 that utilizes VPS device 130 electric conduction of heating cream 125 to make, outside the alloy part of detin and silver, tin and silver are respectively as independently composition is residual.Therefore, above-mentioned electric conductor 5 was configured in state in the through hole 4 of resin molding 1 as electric conductor for interlayer connection under, when a plurality of resin moldings 1 became one by heating and pressurization, electric conductor 5 can be with resin molding 1 distortion.And, the tin composition of electric conductor 5 can with the Cu composition of circuit pattern 3 counterdiffusion and metal bond mutually.Thus, can utilize the adjacent circuit pattern 3 of electric conductor 5 interlayer connection well.
At this, tin particle its surperficial oxidized tin usually covers.Therefore, when the part of the tin particle that makes conductive paste 125 and silver particles alloying are made electric conductor 5, need when refluxing heating, destroy this tin oxide.In the present embodiment, by using VPS device 130 to solve this problem as reflow soldering apparatus.That is, in VPS device 130, as steam liquefaction when contacting low-temperature workpieces (conductive paste 25) of thermal medium, and the rapid contraction (quick-fried contracting) on the generation volume.This quick-fried energy that contracts is broken through the tin oxide of tin particle surface.As a result, the tin of fusion flows out from the ruined position of tin oxide, thus can with the silver particles alloying.Like this, in electric conductor 5, the part of tin particle and silver particles alloying, thus can guarantee sufficient intensity as electric conductor for interlayer connection.
Utilize VPS device 130 to reflux after the heating, cooling off and dry, using device shown in Figure 14 140 to reclaim electric conductors 5 then.Device 140 shown in Figure 14 has been filled the 2nd solvent 142 as cleaning fluid in inside.And, ultrasonic oscillator 141 is installed in the one side of device 140.At this, the 2nd solvent 142 is different with the 1st solvent, and its application target is to prevent that in order to transmit ultrasonic involving particle from dispersing.As the 2nd solvent 142, as long as the quality of particle is not influenced, then can adopt any solvent, for example can use ethanol.
The refractory plate 121 that electric conductor 5 has been installed is impregnated in the 2nd solvent 142 of device shown in Figure 14 140.The 2nd solvent 142 drives ultrasonic oscillator 141 under this state, thereby refractory plate 121 vibrates by the ultrasonic wave that transmits via the 2nd solvent 142.By this vibration, the electric conductor 5 that is installed on the refractory plate 121 separates and is discharged into the 2nd solvent 142 from refractory plate 121.Electric conductor 5 swims in the 2nd solvent 142, thereby can remove attached to the impurities such as coal on the electric conductor 5.Like this, device 140 shown in Figure 14 is also brought into play the cleaning action of electric conductor 5.Then, the not shown filter (filter) of use reclaims the electric conductor 5 in the 2nd solvent 142.
According to above-described manufacture method, can make the corresponding electric conductor 5 of shape with the through hole 4 of resin molding 1.In each through hole 4 of resin molding 1, dispose an electric conductor 5 of making so respectively.Therefore, can as in the past, in electric conductor 5, not sneak into the processing bits.Based on this reason, the electric conductor of the shape by using corresponding through hole 4 in advance can suppress the reliability decrease that interlayer connects.
Especially in the present embodiment, as mentioned above, the conductive paste 25 that uses 130 pairs in VPS device to comprise silver particles and tin particle is implemented the heating that refluxes, thereby has made electric conductor 5.Therefore, can make and kept printing to be formed at the shape of the conductive paste 125 on the refractory plate 121 and possess electric conductor 5 as the essential intensity of electric conductor for interlayer connection.
For example, reflow soldering apparatus does not use above-mentioned VPS device 130 and when using the atmosphere temperature utilize heater and infrared ray to improve workpiece to reflux the device of heating, even be heated to 260 ℃, can not obtain essential intensity as electric conductor for interlayer connection.This is because only rely on the atmosphere temperature that improves workpiece, can not destroy the tin oxide (fusing point of tin oxide is above 1000 ℃) of above-mentioned tin particle surface, owing to this tin oxide has hindered the alloying of tin with silver.
In addition, in the present embodiment,, use terpinol as the 1st solvent in order to make the conductive paste that comprises tin particle and silver particles.Except that terpinol, also can use the solder flux that for example comprises rosin and activating agent as the 1st solvent.But when using solder flux, by the effect of this activating agent, the oxide film thereon on the surface of tin particle is removed, and the wetability of tin particle and silver particles strengthens.Therefore, when utilizing VPS device 130 electric conduction of heating cream 125, the shape when being difficult to make conductive paste 125 keep being printed on the refractory plate 121.By contrast, because terpinol does not have the such active function of solder flux, so can former state keep the shape ground of conductive paste 125 to make electric conductor 5 basically.
Figure 15 A is the figure that is illustrated in the electric conductor 5 that obtains when adopting terpinol as the 1st solvent, Figure 16 A is the enlarged drawing of the electric conductor 5 shown in Figure 15 A, and Figure 17 A is illustrated in to use this electric conductor 5 adjacent circuit pattern 3 to be carried out the figure of interlayer section when connecting, electric conductor 5 in multilager base plate 100.On the other hand, Figure 15 B is the figure that is illustrated in the electric conductor 5 that obtains when adopting solder flux as the 1st solvent, Figure 16 B is the enlarged drawing of the electric conductor 5 shown in Figure 15 B, and Figure 17 B is illustrated in to use this electric conductor 5 adjacent circuit pattern 3 to be carried out the figure of interlayer section when connecting, electric conductor 5 in multilager base plate 100.
As confirming according to Figure 15 B, Figure 16 B, when using solder flux as the 1st solvent, electric conductor 5 can not keep the cylindrical shape of conductive paste 125, and near semi-spherical shape.By contrast, when using terpinol as the 1st solvent, as confirming according to Figure 15 A, Figure 16 A, the electric conductor 5 basic cylindrical shapes that keep.As a result, the electric conductor 5 when using solder flux is the interior space of through hole 4 of landfill resin molding 1 fully, so shown in Figure 17 B, when carrying out the interlayer connection, produce emptying aperture at each position, and the electric conductor 5 when using terpinol is shown in Figure 17 A, carry out interlayer when connecting emptying aperture few.Distinguish in view of the above when making the electric conductor of interlayer connection usefulness, preferably use terpinol as the 1st solvent.
(other embodiment)
Abovely recorded and narrated the present invention, the invention is not restricted to this execution mode and structure but be construed as with reference to preferred implementation.The present invention also comprises the distortion in various variation and the impartial scope.In addition, preferred various combinations and mode or comprise only comprises one of them key element, more key elements or still less other combinations and the mode of key element, also is construed as to belong to category of the present invention and thought range.
For example, in the above-described embodiment, adopted the thermoplastic resin film of the polyetherimide resin of the polyether-ether-ketone resin that comprises 65～35 weight % and 35～65 weight % as resin molding 1.But resin molding is not limited thereto, and also can be the film of having filled non-conductive filler to polyether-ether-ketone resin and polyetherimide resin, can also use polyether-ether-ketone (PEEK), Polyetherimide (PEI), liquid crystal film etc.
And, in the above-described embodiment, in the manufacture method of electric conductor 5, after cutting off operation, implement heating process, but the flowability of mixed powder is also no problem not using dispersion, silver particles does not apply under the situation of dispersion, can omit heating process.
Claims (11)
1. the manufacture method of an electric conductor for interlayer connection (5), in the multilayer printed board (100) of alternately laminated wiring layer (10) and insulating barrier (1), this electric conductor for interlayer connection (5) is disposed in the interior through hole (4) of described insulating barrier (1), be used for that adjacent described wiring layer (10) is carried out interlayer and connect, the manufacture method of described electric conductor for interlayer connection (5) comprising:
Filling work procedure, fill the mixed powder of silver particles and tin particle at enclosure space, this enclosure space is: face is made of the mould parts (21) of the corresponding slot part of electric conductor shape that has and will form, and the face relative with these mould parts (21) is by constituting with respect to the moving-member (22) that described mould parts (21) relatively move;
The pressurization operation relatively moves with approaching described mould parts (21) described moving-member (22), to mixed powder pressurization that is filled in described enclosure space and the slot part that is pressed into described mould parts (21);
Cut off operation, after described pressurization operation, make the side members (20) that between described moving-member (22), constitutes described enclosure space at described mould parts (21) go up at described mould parts (21) and slide, remain in the lip-deep mixed powder of described mould parts (21) will not entering the slot part of described mould parts (21) fully and cut off from the mixed powder of the slot part that is pressed into described mould parts (21) with remaining in the lip-deep mixed powder of described mould parts (21); And
Take out operation, take out the electric conductor for interlayer connection (5) that constitutes by shape and the corresponding described mixed powder of this slot part from the slot part of described mould parts (21).
2. the manufacture method of electric conductor for interlayer connection according to claim 1 (5), wherein,
Described mould parts (21) have a plurality of slot parts.
3. the manufacture method of electric conductor for interlayer connection according to claim 1 and 2 (5), wherein,
The silver particles that comprises in the described mixed powder surperficial coated is used to the dispersion that prevents that silver particles is fixed each other;
Described manufacture method comprises: heating process, described cut off operation after and before the described taking-up operation, by heating described mould parts (21), melt described dispersion, thereby make the mixed powder in the groove of described mould parts (21) fixed.
4. the manufacture method of electric conductor for interlayer connection according to claim 3 (5), wherein,
Described dispersion contains stearic acid.
5. the manufacture method of electric conductor for interlayer connection according to claim 1 and 2 (5), wherein,
In described taking-up operation, described mould parts (21) are applied external force make its bending, thereby take out described electric conductor for interlayer connection from the slot part of described mould parts (21).
6. the manufacture method of electric conductor for interlayer connection according to claim 1 and 2 (5), wherein,
Described moving-member (22) slides at the inner surface of described side members (20), thereby relatively moves with respect to described mould parts (21);
Cut off in the operation described, make described moving-member (22) and described side members (20) together with the surperficial parallel direction of described mould parts (21) on move.
7. the manufacture method of an electric conductor for interlayer connection (5), in the multilayer printed board (100) of alternately laminated wiring layer (10) and insulating barrier (1), this electric conductor for interlayer connection (5) is disposed in the interior through hole of described insulating barrier (1), be used for that adjacent described wiring layer (10) is carried out interlayer and connect, the manufacture method of described electric conductor for interlayer connection (5) comprising:
Printing process, refractory plate (121) go up printing with silver particles and tin mix particles in first solvent and the conductive paste (125) that produces, so that it has and the corresponding shape of electric conductor shape that will form;
Heating process by steam-type solder reflow soldering device (130), will have been printed the temperature of time more than the fusing point that reaches described tin particle of refractory plate (121) the heating several seconds level of described conductive paste (125); And
Recovery process reclaims the described electric conductor for interlayer connection (5) that solidifies by described heating from described refractory plate (121).
8. the manufacture method of electric conductor for interlayer connection according to claim 7 (5), wherein,
In described printing process, sheet mask (122) in the corresponding a plurality of hole portions of the electric conductor shape that will be formed with and will form (123) puts under the state on the described refractory plate (121), described conductive paste (125) is filled by a plurality of hole portions (123) to described sheet mask (122), thereby upward prints the conductive paste (125) that has with the corresponding shape of described electric conductor shape at described refractory plate (121).
9. the manufacture method of electric conductor for interlayer connection according to claim 8 (5), wherein,
Before carrying out described heating process, remove described sheet mask (122) from described refractory plate (121).
10. according to the manufacture method of claim 7 or 8 described electric conductor for interlayer connection (5), wherein,
Described recovery process comprises following operation: under the state that described refractory plate (121) be impregnated in the 2nd solvent (142), utilize ultrasonic wave to make this refractory plate (121) vibration, thereby described electric conductor for interlayer connection (5) is separated from described refractory plate (121).
11. according to the manufacture method of each described electric conductor for interlayer connection (5) in the claim 7～9, wherein,
Described the 1st solvent contains terpinol.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP135864/2008 | 2008-05-23 | ||
| JP2008135864A JP4483981B2 (en) | 2008-05-23 | 2008-05-23 | Method for manufacturing conductor for interlayer connection |
| JP179400/2008 | 2008-07-09 | ||
| JP2008179400A JP4561891B2 (en) | 2008-07-09 | 2008-07-09 | Method for manufacturing conductor for interlayer connection |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101594749A true CN101594749A (en) | 2009-12-02 |
| CN101594749B CN101594749B (en) | 2012-06-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009101389641A Expired - Fee Related CN101594749B (en) | 2008-05-23 | 2009-05-21 | Manufacture method of a electric conductor for interlayer connection |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4483981B2 (en) |
| CN (1) | CN101594749B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102313762A (en) * | 2010-07-09 | 2012-01-11 | 株式会社电装 | Gas sensor element and gas sensor |
| CN102573335A (en) * | 2010-12-23 | 2012-07-11 | 北大方正集团有限公司 | Method for manufacturing core plate of initial layer |
| CN104538175A (en) * | 2014-12-19 | 2015-04-22 | 深圳顺络电子股份有限公司 | Method for manufacturing laminated electronic chip component |
| CN109509569A (en) * | 2017-09-14 | 2019-03-22 | 株式会社田村制作所 | The connection method of electrode and the manufacturing method of electric substrate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4941411B2 (en) * | 2008-06-17 | 2012-05-30 | 株式会社デンソー | Method for manufacturing conductor for interlayer connection |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100370398B1 (en) * | 2000-06-22 | 2003-01-30 | 삼성전자 주식회사 | Method for surface mountable chip scale packaging of electronic and MEMS devices |
| US20070244267A1 (en) * | 2006-04-10 | 2007-10-18 | Dueber Thomas E | Hydrophobic crosslinkable compositions for electronic applications |
-
2008
- 2008-05-23 JP JP2008135864A patent/JP4483981B2/en not_active Expired - Fee Related
-
2009
- 2009-05-21 CN CN2009101389641A patent/CN101594749B/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102313762A (en) * | 2010-07-09 | 2012-01-11 | 株式会社电装 | Gas sensor element and gas sensor |
| CN102313762B (en) * | 2010-07-09 | 2014-09-17 | 株式会社电装 | Gas sensor element and gas sensor |
| CN102573335A (en) * | 2010-12-23 | 2012-07-11 | 北大方正集团有限公司 | Method for manufacturing core plate of initial layer |
| CN104538175A (en) * | 2014-12-19 | 2015-04-22 | 深圳顺络电子股份有限公司 | Method for manufacturing laminated electronic chip component |
| CN109509569A (en) * | 2017-09-14 | 2019-03-22 | 株式会社田村制作所 | The connection method of electrode and the manufacturing method of electric substrate |
| CN109509569B (en) * | 2017-09-14 | 2022-03-15 | 株式会社田村制作所 | Method for connecting electrodes and method for manufacturing electronic substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2009283782A (en) | 2009-12-03 |
| JP4483981B2 (en) | 2010-06-16 |
| CN101594749B (en) | 2012-06-20 |
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